Cleaning frame for semiconductor element processing

Abstract

The utility model discloses a cleaning rack for semiconductor element processing, which comprises support plates correspondingly arranged on two sides, first slots are uniformly arranged on the support plates, through holes corresponding to the first slots are arranged on the side surfaces of the support plates, first fan-shaped grooves are arranged on the support plates at one ends of the through holes, and second fan-shaped grooves are arranged on the support plates at the other ends of the first fan-shaped grooves. An insertion hole communicated with the through hole is formed in the supporting plate, an insertion column is movably connected to the insertion hole in an inserted mode, a fan-shaped block is fixedly connected to one end of the insertion column, a second fan-shaped groove matched with the first fan-shaped groove is formed in the fan-shaped block, a connecting plate is fixedly connected to the insertion column, and a connecting rod is fixedly connected to one side of the supporting plate. Compared with the prior art, the silicon wafer cleaning device has the advantages that silicon wafers of different specifications can be loaded for cleaning, the production efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor components, in particular to a cleaning rack used for processing semiconductor components. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches. The wafer goes through a series of process steps such as cutting, polishing and cleaning to form a flat silicon wafer with a specific crystal orientation. During the manufacturing process, different layers are formed on the silicon wafer, such as oxide layers, metal layers and semiconductor layers, which are used to build various parts of electronic devices.

[0003] When processing wafers, the wafers must first be cleaned to ensure that there are no impurities on the surface, otherwise it will cause circuit short circuits, circuit blockages, etc. In the prior art, the wafers are placed on a cleaning rack and then put into a slot in an ultrasonic cleaning solution for cleaning. The cleaning rack is generally fixed and can only load silicon wafers of a certain specification. For silicon wafers of other specifications, the cleaning rack needs to be replaced for cleaning, which reduces production efficiency and increases costs. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the above defects and provide a cleaning rack for semiconductor element processing, which can load wafers of different specifications for cleaning, improve production efficiency and reduce costs.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: a cleaning rack for semiconductor component processing, including support plates arranged correspondingly on both sides, the support plate is provided with evenly arranged first slots, the side of the support plate is provided with a through hole corresponding to the first slot, the support plate is provided with a first fan-shaped slot at one end of the through hole, the support plate is provided with a socket connected to the through hole, a plug column is movably inserted on the socket, one end of the plug column is fixedly connected with a fan-shaped block, the fan-shaped block is provided with a second fan-shaped slot matching the first fan-shaped slot, the plug column is fixedly connected with a connecting plate, a connecting rod is fixedly connected to one side of the support plate, the connecting rod is provided with a second slot, and the support plate on the other side is provided with a plug block matching the second slot, and the connecting rod is threadedly connected with a first bolt matching the plug block.

[0006] The advantages of the utility model compared with the prior art are:

[0007] The wafer is placed between the support plates through the first slot and the through hole on the support plate, the semiconductor silicon wafer is fixed on the support plate by adjusting the distance between the pins, and the distance between the plug and the second slot is changed by rotating the first bolt, thereby changing the size of the placed wafer.

[0008] As an improvement, one end of the support plate is provided with a third slot arranged correspondingly on both sides, and a plug plate corresponding to the third slot is fixedly connected to the connecting plate. Second bolts matching the plug plate are threadedly connected on both sides of the support plate to fix the connecting plate.

[0009] As an improvement, the support plate is provided with first support rods arranged correspondingly on both sides, the first support rods are provided with grooves, the second support rods are movably inserted into the grooves, the first support rods are threadedly connected with third bolts that cooperate with the second support rods, and the second support rods are fixedly connected with connecting blocks, so that the size of the support plate can be adjusted to adapt to the slots in the ultrasonic cleaning machine.

[0010] As an improvement, anti-collision pads are provided in the first fan-shaped groove and the second fan-shaped groove to prevent the wafer from being damaged.

[0011] As an improvement, a handle is fixedly connected to the first support rod for easy picking. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The utility model is a schematic diagram of the structure of a cleaning rack used for semiconductor element processing.

[0013] Figure 2 The utility model discloses an exploded view of a cleaning rack used for semiconductor component processing.

[0014] Figure 3 The utility model is a side view of a cleaning rack used for semiconductor element processing.

[0015] Figure 4 The utility model is a cross-sectional view of a cleaning rack used for semiconductor element processing.

[0016] As shown in the figure: 1. Support plate; 2. First slot; 3. Through hole; 4. First fan-shaped slot; 5. Plug hole; 6. Plug column; 7. Connecting plate; 8. Connecting rod; 9. Second slot; 10. Plug block; 11. First bolt; 12. Fan-shaped block; 13. Second fan-shaped slot; 14. Third slot; 15. Plug plate; 16. Second bolt; 17. First support rod; 18. Groove; 19. Second support rod; 20. Third bolt; 21. Connecting block; 22. Handle. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0018] like Figures 1 to 4 As shown, a cleaning rack for semiconductor component processing includes a support plate 1 arranged correspondingly on both sides, the support plate 1 is provided with a first support rod 17 arranged correspondingly on both sides, the first support rod 17 is provided with a groove 18, the second support rod 19 is movably inserted in the groove 18, the first support rod 17 is threadedly connected with a third bolt 20 that cooperates with the second support rod 19, the second support rods 19 are fixedly connected with a connecting block 21, the first support rod 17 is fixedly connected with a handle 22, the support plate 1 is provided with uniformly arranged first slots 2, the side of the support plate 1 is provided with a through hole 3 corresponding to the first slot 2, the support plate 1 is provided with a first fan-shaped groove 4 at one end of the through hole 3, the support plate 1 is provided with a socket 5 connected to the through hole 3, and the socket 5 is provided with a A plug-in column 6 is movably inserted, and one end of the plug-in column 6 is fixedly connected to a fan-shaped block 12, and the fan-shaped block 12 is provided with a second fan-shaped groove 13 that cooperates with the first fan-shaped groove 4, and the first fan-shaped groove 4 and the second fan-shaped groove 13 are both provided with anti-collision pads, and the plug-in column 6 is fixedly connected to a connecting plate 7, and one end of the support plate 1 is provided with a third slot 14 arranged correspondingly on both sides, and a plug-in plate 15 corresponding to the third slot 14 is fixedly connected to the connecting plate 7, and second bolts 16 that cooperate with the plug-in plate 15 are threadedly connected to both sides of the support plate 1, and a connecting rod 8 is fixedly connected to one side of the support plate 1, and a second slot 9 is provided on the connecting rod 8, and a plug-in block 10 that cooperates with the second slot 9 is provided on the other side of the support plate 1, and a first bolt 11 that cooperates with the plug-in block 10 is threadedly connected to the connecting rod 8.

[0019] In specific use, the semiconductor wafer is placed between the first slots 2 on both sides, the first fixing bolt is loosened, and the support plates 1 on both sides are adjusted to a suitable distance, so that the two sides of the semiconductor wafer pass through the first slots 2 and extend into the through holes 3, and the distance between the support plates 1 on both sides is fine-tuned again, so that the two sides of the lower end of the semiconductor wafer are respectively placed on the upper ends of the two first fan-shaped slots 4, and the first fixing bolt is tightened to fix the spacing between the support plates 1 on both sides, and then the second bolt 16 is loosened, and the connecting plate 7 is pushed to drive the plug 6 to slide downward, and the plug 6 pushes the fan-shaped block 12 to slide downward along the first slot 2, and the semiconductor wafer The two sides of the upper end are respectively stuck in the two second fan-shaped grooves 13. The cross-sections of the first fan-shaped groove 4 and the second fan-shaped groove 13 are both quarter-circular arcs, which can be more closely stuck on the outer wall of the wafer. After the adjustment is completed, tighten the second fixing bolts on both sides. At this time, the first fan-shaped groove 4 and the second fan-shaped groove 13 fix the four corners of the wafer. The handles 22 on both sides are used to place the two support plates 1 in the cleaning tank of the ultrasonic cleaning machine. The second support plates 1 on both sides are adjusted to extend outward so that the connecting blocks 21 on both sides are against the inner walls on both sides of the cleaning tank of the ultrasonic cleaning machine. The cleaning force is too large and the device moves.

[0020] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0022] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A cleaning rack for semiconductor component processing, comprising support plates (1) arranged correspondingly on two sides, characterized in that: The support plate (1) is provided with uniformly arranged first slots (2), the side of the support plate (1) is provided with a through hole (3) corresponding to the first slot (2), the support plate (1) is provided with a first fan-shaped slot (4) at one end of the through hole (3), the support plate (1) is provided with a plug hole (5) connected to the through hole (3), the plug hole (5) is movably plugged with a plug post (6), one end of the plug post (6) is fixedly connected with a fan-shaped block (12), the fan-shaped block (12) is provided with a second fan-shaped slot (13) matching with the first fan-shaped slot (4), the plug post (6) is fixedly connected with a connecting plate (7), one side of the support plate (1) is fixedly connected with a connecting rod (8), the connecting rod (8) is provided with a second slot (9), the other side of the support plate (1) is provided with a plug block (10) matching with the second slot (9), and the connecting rod (8) is threadedly connected with a first bolt (11) matching with the plug block (10).

2. A cleaning rack for semiconductor component processing according to claim 1, characterized in that: One end of the support plate (1) is provided with a third slot (14) arranged correspondingly on both sides, a plug plate (15) corresponding to the third slot (14) is fixedly connected to the connecting plate (7), and both sides of the support plate (1) are threadedly connected with a second bolt (16) matching the plug plate (15).

3. A cleaning rack for semiconductor component processing according to claim 1, characterized in that: The support plate (1) is provided with first support rods (17) arranged correspondingly on both sides, the first support rod (17) is provided with a groove (18), a second support rod (19) is movably inserted in the groove (18), the first support rod (17) is threadedly connected with a third bolt (20) matched with the second support rod (19), and a connecting block (21) is fixedly connected between the second support rods (19).

4. A cleaning rack for semiconductor component processing according to claim 1, characterized in that: Anti-collision pads are provided in the first sector-shaped groove (4) and the second sector-shaped groove (13).

5. A cleaning rack for semiconductor component processing according to claim 3, characterized in that: A handle (22) is fixedly connected to the first support rod (17).

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