SiP packaging connection clamp

Abstract

The utility model relates to the field of connection clamps, and especially relates to a SiP packaging connection clamp. The technical problems that the position is easy to deviate and the packaging quality is reduced due to the fact that the packaging connection clamps are mostly manually integrated, connected and packaged are solved. According to the technical scheme, the SiP packaging connection clamp comprises a packaging connection clamp body. According to the utility model, the supporting and stabilizing pressure assembly has a supporting effect and applies pressure to the substrate and the crystal which are connected and integrated so as to facilitate better packaging, and the crystal limiting, adjusting and clamping assembly can adjust, limit, fix and stabilize the position of the crystal according to the size requirement of the crystal so as to facilitate later connection and packaging. The packaging adjusting and connecting assembly can adjust and clamp the substrate, adjust and stabilize the position of the substrate, ensure accurate alignment between a chip and the substrate, reduce errors and deviation, and improve the reliability and quality of packaging.

Description

Technical Field

[0001] The utility model relates to the field of connection clamps, in particular to a SiP packaging connection clamp. Background Art

[0002] The SiP package connection fixture is a tool used in the semiconductor packaging process. Its main function is to achieve a reliable connection between the chip and the substrate and ensure the smooth progress of the packaging process. Specifically, the SiP package connection fixture provides a physical contact point between the chip and the substrate, supports the fixation and positioning of the chip, and ensures the correct alignment and matching between the chip and the substrate. It is usually composed of multiple fixture components, each component corresponds to a specific stage or step in the packaging process. The importance of the SiP package connection fixture is mainly reflected in ensuring high-quality packaging: By using the SiP package connection fixture, the precise alignment between the chip and the substrate can be ensured, and errors and deviations can be reduced, thereby improving the reliability and quality of the packaging; improving production efficiency: The SiP package connection fixture can quickly and accurately achieve the positioning and Fixation reduces the possibility of human intervention and errors, and improves production efficiency; reduces costs: the use of SiP packaging connection fixtures can reduce the defective rate in the production process, reduce scrap and rework rates, and thus reduce production costs; adapts to chips of different types and sizes: Since the SiP packaging connection fixture is flexible and adaptable, it can adapt to chips of different types and sizes and meet the needs of different application scenarios. In short, the SiP packaging connection fixture plays a vital role in the semiconductor packaging process and is one of the key tools to ensure high-quality, high-efficiency and low-cost production. However, the existing packaging connection fixtures are mostly manually integrated and connected to the package, which leads to easy position deviation and reduced packaging quality. The utility model provides a packaging connection fixture that can automatically connect and clamp the package as needed. Utility Model Content

[0003] In order to overcome the problem that the package connection fixtures are mostly manually integrated and connected to the package, which causes the position to be easily offset and the package quality to be reduced.

[0004] The technical solution of the utility model is: a SiP packaging connection fixture, including a packaging connection fixture body, and also including a supporting and stabilizing pressure component, a crystal limit adjustment clamping component, and a packaging adjustment connection component; the packaging connection fixture body is divided into a supporting and stabilizing pressure component for packaging compression; the upper end part of the supporting and stabilizing pressure component is provided with a crystal limit adjustment clamping component for crystal stabilization; the supporting and stabilizing pressure component is provided with a packaging adjustment connection component.

[0005] Preferably, the supporting and stabilizing pressure component has a supporting function, applying pressure to the connected and integrated substrate and crystal to facilitate better packaging. The crystal limit adjustment clamping component can adjust the limit fixation according to the needs of the crystal size to stabilize the position of the crystal and facilitate subsequent connection and packaging. The packaging adjustment connection component can adjust and clamp the substrate to adjust and stabilize the position of the substrate to ensure precise alignment between the chip and the substrate, reduce errors and deviations, and thus improve the reliability and quality of packaging.

[0006] Preferably, the supporting and stabilizing pressure assembly includes a wear-resistant and non-slip base plate, an adjusting groove table, a first pressure spring, an installing and moving block, a limiting groove vertical plate, a supporting horizontal plate, a pneumatic lifting column and a pressure plate. The adjusting groove table is fixedly installed on the upper end of the wear-resistant and non-slip base plate; the first pressure spring is arranged inside the adjusting groove table, and the installing and moving block placed at the lower end of the adjusting plate is adjusted and moved in the adjusting groove table according to the size of the crystal, thereby driving the first pressure spring to contract, thereby further firmly clamping the crystal.

[0007] Preferably, the side end of the first pressure spring is fixedly connected with an installation moving block; the upper end of the adjusting groove table is fixedly installed with a limiting groove vertical plate; the upper end of the limiting groove vertical plate is fixedly installed with a supporting horizontal plate; an air pressure lifting column is arranged inside the supporting horizontal plate; a pressure plate is installed at the movable end of the air pressure lifting column, and the movable lifting block is limited in the limiting groove vertical plate for lifting and lowering to connect the crystal and the substrate, and finally the air pressure lifting column on the upper end of the supporting horizontal plate is adjusted so that its movable end drives the pressure plate to apply pressure, which is convenient for later packaging.

[0008] Preferably, the crystal limit adjustment clamping assembly includes a placement adjustment plate, a second pressure spring, a movable block, a U-shaped clamp, a rubber protective strip and an adjustment clamp; a placement adjustment plate is fixedly installed on the upper end of the movable block; a second pressure spring is arranged inside the placement adjustment plate, and the crystal is placed on the placement adjustment plate, close to the U-shaped clamp to reduce errors and deviations. The rubber protective strip can protect the crystal and prevent excessive clamping force from causing damage to the crystal.

[0009] Preferably, the front end of the second pressure spring is connected to a movable block; a U-shaped clamp is fixedly installed on the upper end of the adjustment plate; a rubber protective strip is provided on the side end of the U-shaped clamp; an adjusting clamp is fixedly installed on the upper end of the movable block, and the movable block is pushed to contract the second pressure spring, so that the adjusting clamp at the upper end of the movable block firmly clamps the crystal according to the size of the crystal.

[0010] Preferably, the packaging adjustment connection assembly includes a movable lifting block, an installation and connection vertical plate, an electric telescopic rod, an adjustment groove plate, a fixed clamp and a limited movable adjustment plate; the movable lifting block is slidably connected inside the limiting groove vertical plate; the side end of the movable lifting block is fixedly installed with an installation and connection vertical plate, and the electric telescopic rod at the side end of the installation and connection vertical plate is adjusted to extend and retract, so as to place the substrate on the side end of the adjustment groove plate.

[0011] Preferably, an electric telescopic rod is provided at the side end of the vertical plate; an adjustment slot plate is fixedly installed at the movable end of the electric telescopic rod; a fixed clamping plate is fixedly installed at the side end of the adjustment slot plate; a limited movable adjustment plate is slidably connected inside the adjustment slot plate, the base plate is placed close to the fixed clamping plate, and the limited movable adjustment plate moves in the adjustment slot plate to firmly clamp the base plate.

[0012] Beneficial effects of the utility model:

[0013] 1. During use, the supporting and stabilizing pressure component has a supporting function, exerting pressure on the connected and integrated substrate and crystal to facilitate better packaging. The crystal limit adjustment clamping component can adjust the limit fixation according to the needs of the crystal size to stabilize the position of the crystal, which is convenient for later connection and packaging. The packaging adjustment connection component can adjust and clamp the substrate to adjust and stabilize the position of the substrate to ensure accurate alignment between the chip and the substrate, reduce errors and deviations, and thus improve the reliability and quality of packaging;

[0014] 2. The installation moving block placed at the lower end of the adjustment plate is adjusted and moved in the adjustment groove table according to the size of the crystal, driving the first pressure spring to contract, further firmly clamping the crystal, and the movable lifting block is limited in the limit groove vertical plate to lift and lower, connecting the crystal and the substrate, and finally adjusting the air pressure lifting column on the upper end of the supporting horizontal plate so that its movable end drives the pressure plate to apply pressure, which is convenient for later packaging;

[0015] 3. Place the crystal on the placement adjustment plate, close to the U-shaped clamping plate to reduce errors and deviations. The rubber protection strip can protect the crystal and prevent excessive clamping force from causing damage to the crystal. Push the movable block to shrink the second pressure spring, so that the adjustment clamping plate at the upper end of the movable block can firmly clamp the crystal according to the size of the crystal.

[0016] 4. Adjust and install the electric telescopic rod connected to the side end of the vertical plate to extend and retract it, place the base plate on the side end of the adjustment slot plate, close to the fixed clamping plate, adjust the limit movable adjustment plate to move in the adjustment slot plate, and firmly clamp the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 What is shown is a three-dimensional structural schematic diagram of the connection clamp of the utility model;

[0018] Figure 2 Shown is a schematic diagram of the supporting and stabilizing pressure component structure of the connection fixture of the utility model;

[0019] Figure 3 Shown is a schematic diagram of the structure of the crystal limit adjustment clamping assembly of the connection clamp of the utility model;

[0020] Figure 4 What is shown is a schematic diagram of the packaging and adjusting connection component structure of the connection fixture of the utility model.

[0021] Explanation of the reference numerals in the accompanying drawings: 1. Encapsulation and connection fixture body; 2. Support and stabilize pressure component; 3. Crystal limit adjustment clamping component; 4. Encapsulation and adjustment connection component; 201. Wear-resistant and anti-slip bottom plate; 202. Adjustment groove table; 203. First pressure spring; 204. Installation moving block; 205. Limit groove vertical plate; 206. Support horizontal plate; 207. Pneumatic lifting column; 208. Pressing plate; 301. Placement adjustment plate; 302. Second pressure spring; 303. Movable block; 304. U-shaped splint; 305. Rubber protection strip; 306. Adjustment splint; 401. Movable lifting block; 402. Installation and connection vertical plate; 403. Electric telescopic rod; 404. Adjustment groove plate; 405. Fixed splint; 406. Limit movable adjustment plate. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0023] See also Figure 1 The utility model provides an embodiment: a SiP packaging connection fixture, including a packaging connection fixture body 1, and also including a supporting and stabilizing pressure component 2, a crystal limit adjustment clamping component 3, and a packaging adjustment connection component 4; the packaging connection fixture body 1 is divided into a supporting and stabilizing pressure component 2 for packaging compression; the upper end of the supporting and stabilizing pressure component 2 is provided with a crystal limit adjustment clamping component 3 for crystal stabilization; the supporting and stabilizing pressure component 2 is provided with a packaging adjustment connection component 4, the supporting and stabilizing pressure component 2 has a supporting function, and applies pressure to the connected and integrated substrate and crystal to facilitate better packaging, the crystal limit adjustment clamping component 3 can adjust and limit the position according to the needs of the crystal size, stabilize the position of the crystal, and facilitate later connection and packaging, the packaging adjustment connection component 4 can adjust and clamp the substrate, adjust and stabilize the position of the substrate, ensure the precise alignment between the chip and the substrate, reduce errors and deviations, and thus improve the reliability and quality of packaging.

[0024] See also Figure 2In this embodiment, the supporting and stabilizing pressure assembly 2 includes a wear-resistant and anti-skid bottom plate 201, an adjusting groove platform 202, a first pressure spring 203, an installation moving block 204, a limiting groove vertical plate 205, a supporting horizontal plate 206, a gas pressure lifting column 207 and a pressing plate 208. The upper end of the wear-resistant and anti-skid bottom plate 201 is fixedly installed with an adjusting groove platform 202; a first pressure spring 203 is arranged inside the adjusting groove platform 202, and a side end of the first pressure spring 203 is fixedly connected with an installation moving block 204; a limiting groove vertical plate 205 is fixedly installed on the upper end of the adjusting groove platform 202; and a limiting groove vertical plate 205 is fixedly installed on the upper end of the limiting groove vertical plate 205. A supporting transverse plate 206 is provided; an air pressure lifting column 207 is arranged inside the supporting transverse plate 206; a pressure plate 208 is installed at the movable end of the air pressure lifting column 207, and the installation moving block 204 placed at the lower end of the adjustment plate 301 is adjusted and moved in the adjustment groove table 202 according to the size of the crystal, driving the first pressure spring 203 to contract, further clamping the crystal firmly, and the movable lifting block 401 is limited in the limit groove vertical plate 205 to lift and lower, connecting the crystal and the substrate, and finally adjusting the air pressure lifting column 207 at the upper end of the supporting transverse plate 206 so that its movable end drives the pressure plate 208 to apply pressure, which is convenient for later packaging.

[0025] See also Figure 3-4304, a rubber protective strip 305 is provided on the side of the movable block 303, and the adjusting clamping plate 306 is fixedly installed on the upper end of the movable block 204; the second pressure spring 302 is arranged inside the placing and adjusting plate 301, and the front end of the second pressure spring 302 is connected with the movable block 303; the U-shaped clamping plate 304 is fixedly installed on the upper end of the placing and adjusting plate 301; the rubber protective strip 305 is provided on the side end of the U-shaped clamping plate 304; the adjusting clamping plate 306 is fixedly installed on the upper end of the movable block 303, and the crystal is placed on the placing and adjusting plate 301, close to the U-shaped clamping plate 304, to reduce errors and deviations, and the rubber protective strip 305 can protect the crystal and prevent the crystal from being damaged due to excessive clamping force, so as to push the movable block 303 to shrink the second pressure spring 302, thereby 06 According to the size of the crystal, the crystal is firmly clamped, and the packaging adjustment connection component 4 includes a movable lifting block 401, an installation connection vertical plate 402, an electric telescopic rod 403, an adjustment groove plate 404, a fixed clamping plate 405 and a limited movable adjustment plate 406; the movable lifting block 401 is slidably connected inside the limiting groove vertical plate 205; the side end of the movable lifting block 401 is fixedly installed with the installation connection vertical plate 402, and the side end of the installation connection vertical plate 402 is provided with an electric telescopic rod 403; the movable end of the electric telescopic rod 403 is fixedly installed with the adjustment groove plate 404; the side end of the adjustment groove plate 404 is fixedly installed with the fixed clamping plate 405; the adjustment groove plate 404 is internally slidably connected with the limited movable adjustment plate 406, and the electric telescopic rod 403 at the side end of the installation connection vertical plate 402 is adjusted to extend and retract, and the substrate is placed on the side end of the adjustment groove plate 404, close to the fixed clamping plate 405, and the limited movable adjustment plate 406 is adjusted to move in the adjustment groove plate 404 to firmly clamp the substrate.

[0026] When in use, first place the crystal on the placement adjustment plate 301, close to the U-shaped clamping plate 304, to reduce errors and deviations. The rubber protection strip 305 can protect the crystal and prevent the clamping force from being too large, which may cause damage to the crystal. The movable block 303 is pushed to shrink the second pressure spring 302, so that the adjustment clamping plate 306 at the upper end of the movable block 303 can firmly clamp the crystal according to the size of the crystal. At the same time, the installation moving block 204 at the lower end of the placement adjustment plate 301 is adjusted and moved in the adjustment groove table 202 according to the size of the crystal, driving the first pressure spring 203 to shrink, and further firmly clamping the crystal.

[0027] Next, adjust the electric telescopic rod 403 installed on the side end of the vertical plate 402 to extend and retract, place the substrate on the side end of the adjusting slot plate 404, and place it close to the fixed clamping plate 405, adjust the limited movable adjusting plate 406 to move in the adjusting slot plate 404, and firmly clamp the substrate, so that the movable lifting block 401 is limited in the limiting groove vertical plate 205 to be lifted and lowered, and the crystal and the substrate are connected, and finally adjust the air pressure lifting column 207 on the upper end of the supporting horizontal plate 206 so that its movable end drives the pressing plate 208 to apply pressure, which is convenient for later packaging.

[0028] Through the above steps, the supporting and stabilizing pressure component 2 is set to have a supporting function, and pressure is applied to the connected and integrated substrate and crystal to facilitate better packaging. The crystal limit adjustment clamping component 3 can adjust the limit fixation according to the needs of the crystal size to stabilize the position of the crystal and facilitate subsequent connection and packaging. The packaging adjustment connection component 4 can adjust and clamp the substrate to adjust and stabilize the position of the substrate to ensure precise alignment between the chip and the substrate, reduce errors and deviations, and thus improve the reliability and quality of packaging.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A SiP packaging connection fixture, comprising a packaging connection fixture body (1); characterized in that: It also includes a supporting and stabilizing pressure component (2), a crystal limit adjustment clamping component (3), and a packaging adjustment connection component (4); the packaging connection fixture body (1) is divided into a supporting and stabilizing pressure component (2) for packaging compression; the upper end of the supporting and stabilizing pressure component (2) is provided with a crystal limit adjustment clamping component (3) for crystal stabilization; and the packaging adjustment connection component (4) is provided inside the supporting and stabilizing pressure component (2).

2. The SiP packaging connection fixture according to claim 1, characterized in that: The supporting and stabilizing pressure assembly (2) comprises a wear-resistant and anti-skid bottom plate (201), an adjusting groove platform (202), a first pressure spring (203), an installation moving block (204), a limiting groove vertical plate (205), a supporting horizontal plate (206), a gas pressure lifting column (207) and a pressure plate (208); the adjusting groove platform (202) is fixedly installed on the upper end of the wear-resistant and anti-skid bottom plate (201); and the first pressure spring (203) is arranged inside the adjusting groove platform (202).

3. The SiP packaging connection fixture according to claim 2, characterized in that: The side end of the first pressure spring (203) is fixedly connected to a mounting moving block (204); the upper end of the adjusting groove platform (202) is fixedly mounted with a limiting groove vertical plate (205); the upper end of the limiting groove vertical plate (205) is fixedly mounted with a supporting horizontal plate (206); a pneumatic lifting column (207) is arranged inside the supporting horizontal plate (206); and a pressing plate (208) is mounted on the movable end of the pneumatic lifting column (207).

4. The SiP packaging connection fixture according to claim 2, characterized in that: The crystal limit adjustment clamping assembly (3) comprises a placement adjustment plate (301), a second pressure spring (302), a movable block (303), a U-shaped clamping plate (304), a rubber protection strip (305) and an adjustment clamping plate (306); the placement adjustment plate (301) is fixedly mounted on the upper end of the installation movable block (204); and the second pressure spring (302) is arranged inside the placement adjustment plate (301).

5. The SiP packaging connection fixture according to claim 4, characterized in that: The front end of the second pressure spring (302) is connected to a movable block (303); a U-shaped clamping plate (304) is fixedly installed on the upper end of the placement adjustment plate (301); and a rubber protection strip (305) is provided on the side end of the U-shaped clamping plate (304); An adjusting clamping plate (306) is fixedly mounted on the upper end of the movable block (303).

6. The SiP packaging connection fixture according to claim 2, characterized in that: The encapsulated adjustment connection assembly (4) comprises a movable lifting block (401), an installation connection vertical plate (402), an electric telescopic rod (403), an adjustment groove plate (404), a fixed clamping plate (405) and a limit movable adjustment plate (406); the movable lifting block (401) is slidably connected inside the limit groove vertical plate (205); and the installation connection vertical plate (402) is fixedly installed on the side end of the movable lifting block (401).

7. The SiP packaging connection fixture according to claim 6, characterized in that: An electric telescopic rod (403) is arranged at the side end of the mounting and connecting vertical plate (402); an adjusting slot plate (404) is fixedly installed at the movable end of the electric telescopic rod (403); a fixing clamping plate (405) is fixedly installed at the side end of the adjusting slot plate (404); and a limited movable adjusting plate (406) is slidably connected inside the adjusting slot plate (404).

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