Wafer clamping device

Abstract

The utility model provides a wafer clamping device. The wafer clamping device comprises a connecting beam, the bearing plate is arranged on the connecting beam in a sliding manner; the clamping plate is arranged on the connecting beam in a sliding manner; the connecting mechanism is connected between the bearing plate and the clamping plate; wherein when the gravity of the wafer extrudes the bearing plate, the bearing plate slides and pulls the clamping plate to slide through the connecting mechanism until the wafer is clamped between the bearing plate and the clamping plate, and when the bearing plate resets, the connecting mechanism pushes the clamping plate to move in the direction away from the wafer. According to the wafer clamping device provided by the utility model, the gravity of the wafer is supported by the bearing plate, and the clamping plate is pulled by the gravity of the wafer to further clamp the wafer. Abrasion between the clamping device and the surface of the wafer can be greatly reduced, so that the problem of wafer breakage is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer clamping device. Background Art

[0002] During the wafer processing, the wafer needs to be transported to different processing tables through a wafer transfer device. When transporting wafers, the wafer transfer device mostly clamps the wafer through a wafer clamping device and then transports it. However, at present, when the wafer clamping device clamps the wafer for transportation, the clamping device mostly clamps both sides of the wafer, which makes it easy for the clamping device and the wafer to wear, and then causes the problem of wafer breakage. Utility Model Content

[0003] In view of the shortcomings of the prior art mentioned above, the purpose of the utility model is to provide a wafer clamping device. The utility model supports the gravity of the wafer through a supporting plate, and uses the gravity of the wafer to pull the clamping plate to further clamp the wafer, which can greatly reduce the wear between the clamping device and the wafer surface, thereby greatly reducing the problem of wafer breakage.

[0004] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a wafer clamping device, comprising:

[0005] Connecting beams;

[0006] A receiving plate, slidably disposed on the connecting beam;

[0007] A clamping plate slidably disposed on the connecting beam; and

[0008] A connecting mechanism connected between the receiving plate and the clamping plate;

[0009] When the gravity of the wafer squeezes the receiving plate, the receiving plate slides and pulls the clamping plate to slide through the connecting mechanism until the wafer is clamped between the receiving plate and the clamping plate, and when the receiving plate is reset, the connecting mechanism pushes the clamping plate to move in a direction away from the wafer.

[0010] In one embodiment of the present invention, the connecting mechanism comprises:

[0011] A first elastic member, one end of which is connected to the connecting beam, and the other end of which is connected to the receiving plate;

[0012] A second elastic member, one end of which is connected to the connecting beam, and the other end of which is connected to the clamping plate; and

[0013] A rotating wheel rotatably disposed on the connecting beam, wherein the rotating wheel is divided into a first end and a second end;

[0014] A first connection rope is wrapped around the first end, and one end of the first connection rope is connected to the receiving plate; a second connection rope is wrapped around the second end, and one end of the second connection rope is connected to the clamping plate.

[0015] In an embodiment of the present invention, the diameter of the first end is greater than the diameter of the second end.

[0016] In one embodiment of the utility model, when one side of the wafer squeezes the receiving plate, the first elastic member is in a stretched state and the second elastic member is in a compressed state; when one side of the wafer does not squeeze the receiving plate, the first elastic member and the second elastic member are reset.

[0017] In one embodiment of the utility model, the clamping plate, the second elastic member, the second connecting rope, the rotating wheel and the first connecting rope are respectively arranged in at least one pair, a pair of the second elastic members are respectively connected to a pair of the clamping plates, a pair of the clamping plates are respectively connected to the second ends of a pair of the rotating wheels through a pair of the second connecting ropes, and the supporting plate is respectively connected to the first ends of a pair of the rotating wheels through a pair of the first connecting ropes, wherein the straight-line distances between the pair of the clamping plates and the center of the wafer are equal.

[0018] In an embodiment of the present invention, the receiving plate is located at the bottom of the wafer, and a pair of clamping plates are respectively located on both sides of the upper part of the wafer.

[0019] In an embodiment of the utility model, a first sliding groove is provided on the connecting beam, a first sliding block is slidably connected in the first sliding groove, and the first sliding block is fixedly connected to the receiving plate.

[0020] In an embodiment of the utility model, a pair of second sliding grooves are provided on the connecting beam, and second sliding blocks are slidably connected in the pair of second sliding grooves respectively, and the pair of second sliding blocks are fixedly connected to the pair of clamping plates respectively.

[0021] In an embodiment of the present invention, the first elastic member is a tension spring, and the second elastic member is a compression spring.

[0022] In an embodiment of the utility model, a receiving groove is formed on the receiving plate, and the receiving groove is in contact with the outer surface of the wafer.

[0023] In an embodiment of the utility model, the surface of the receiving groove is covered with a friction reducing member.

[0024] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0025] As described above, the utility model provides a wafer clamping device, which supports the weight of the wafer through a receiving plate, and uses the weight of the wafer to pull the clamping plate to further clamp the wafer. The unexpected effect is that the wear between the clamping device and the wafer surface can be greatly reduced through the cooperation of the receiving plate and the clamping plate, thereby greatly reducing the problem of wafer breakage. In addition, the clamping plate and the receiving plate can accommodate wafers of different sizes, thereby improving the adaptability of the clamping device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 This is a schematic structural diagram of a wafer clamping device in one embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of a wafer clamping device for clamping a wafer in one embodiment of the utility model;

[0029] Figure 3 The figure is a schematic diagram of the slide groove structure of the wafer clamping device in one embodiment of the utility model.

[0030] In the figure: 10, connecting beam; 20, receiving plate; 30, clamping plate; 40, connecting mechanism; 41, first elastic member; 42, second elastic member; 43, rotating wheel; 44, first connecting rope; 45, second connecting rope; 46, first end; 47, second end; 50, receiving groove; 51, first slide groove; 52, first slider; 53, second slide groove; 54, second slider. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] See also Figure 1-3It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the utility model, and the drawings only show the components related to the utility model rather than the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0033] See also Figure 1 , Figure 1 A wafer clamping device is provided for an embodiment of the utility model. The wafer clamping device may include a connecting beam 10, a receiving plate 20, a clamping plate 30 and a connecting mechanism 40. The connecting beam 10 can be used to be connected to a wafer transmission device, thereby driving the wafer clamping device to move. The receiving plate 20 can be used to place a wafer. The clamping plate 30 can be used to cooperate with the receiving plate 20, so that the wafer is clamped between the receiving plate 20 and the clamping plate 30. Further, the receiving plate 20 and the clamping plate 30 can be slidably arranged on the connecting beam 10, and the connecting mechanism 40 can be connected between the receiving plate 20 and the clamping plate 30. When the receiving plate 20 moves, the clamping plate 30 can be driven to move by the connecting mechanism 40. Specifically, when the wafer needs to be transported, the wafer can be grabbed and placed on the receiving plate 20. At this time, the gravity of the wafer presses the receiving plate 20, and then the receiving plate 20 slides and pulls the clamping plate 30 to slide through the connecting mechanism 40 until the wafer is clamped between the clamping plate 30 and the receiving plate 20. When the wafer transmission device drives the wafer clamping device to be transported to another processing table, the wafer transmission device drives the receiving plate 20 of the wafer clamping device to be placed on the processing table. At this time, the receiving plate 20 is squeezed by the supporting force of the processing table and can slide to its original position. At this time, the connecting mechanism 40 is not pulled by the receiving plate 20, and can also be gradually reset to push the clamping plate 30 to move in the direction away from the wafer, so that the wafer is no longer clamped, and the wafer can be grabbed and processed. This clamping method supports the weight of the wafer through the receiving plate 20, and uses the weight of the wafer to pull the clamping plate 30 to further clamp the wafer, which can greatly reduce the wear between the clamping device and the wafer surface, thereby greatly reducing the problem of wafer breakage.

[0034] See also Figure 1, the specific structure of the above-mentioned connecting mechanism 40 is not limited, and can be specifically designed based on actual needs. For example, the connecting mechanism 40 may include a first elastic member 41, a second elastic member 42, and a rotating wheel 43. One end of the first elastic member 41 is connected to the connecting beam 10, and the other end is connected to the receiving plate 20, so that when the receiving plate 20 slides, the first elastic member 41 is stretched or contracted accordingly. One end of the second elastic member 42 is connected to the connecting beam 10, and the other end is connected to the clamping plate 30, so that when the clamping plate 30 slides, the second elastic member 42 is stretched or contracted accordingly. The rotating wheel 43 can be rotatably connected to the connecting beam 10, and the first connecting rope 44 and the second connecting rope 45 can be wrapped around the rotating wheel 43, the first connecting rope 44 can be used to connect the receiving plate 20 and the rotating wheel 43, and the second connecting rope 45 can be used to connect the clamping plate 30 and the rotating wheel 43. Thus, when the receiving plate 20 slides, the first connecting rope 44 can be pulled to drive the rotating wheel 43 to rotate, and further drive the second connecting rope 45 to wind, and finally pull the clamping plate 30 to slide.

[0035] See also Figure 1 It should be noted that the compression method of the first elastic member 41 and the second elastic member 42 may not be restricted. For example, when the wafer is placed on the receiving plate 20, one side of the wafer presses the receiving plate 20, the first elastic member 41 may be in a stretched state, and the second elastic member 42 connected to the pulled clamping plate 30 is in a compressed state. When the receiving plate 20 is squeezed by the supporting force of the processing table and begins to reset, the first elastic member 41 will reset, and synchronously, the clamping plate 30 is no longer pulled, and the second elastic member 42 will reset. Further, the specific structure of the first elastic member 41 and the second elastic member 42 may not be restricted, as long as the stretching and resetting function is ensured. For example, the first elastic member 41 may be a helical tension spring, and the second elastic member 42 may be a helical compression spring.

[0036] See also Figure 1Specifically, when the wafer is grabbed and placed on the receiving plate 20, the gravity of the wafer drives the receiving plate 20 to move downward, thereby pulling the first connecting rope 44 and driving the rotating wheel 43 to rotate, and the rotating wheel 43 further drives the second connecting rope 45 to wind, and finally pulls the clamping plate 30 to slide close to the wafer, and the wafer can be clamped between the receiving plate 20 and the clamping plate 30. It should be noted that in order to ensure that the wafer can be stably clamped between the receiving plate 20 and the clamping plate 30, the rotating wheel 43 can be divided into a first end 46 and a second end 47, and the diameter of the first end 46 can be larger than the diameter of the second end 47. The first end 46 is surrounded by the first connecting rope 44, and one end of the first connecting rope 44 is connected to the receiving plate 20, and the second end 47 is surrounded by the second connecting rope 45, and one end of the second connecting rope 45 is connected to the clamping plate 30. Through this arrangement, when the receiving plate 20 moves downward to drive the first end 46 of the rotating wheel 43 to rotate a large circle, the second end 47 of the rotating wheel 43 will rotate a small circle, thereby driving the second connecting rope 45 to wind faster, so that the clamping plate 30 is quickly pulled to clamp the wafer, so that the wafer can be stably clamped between the clamping plate 30 and the receiving plate 20.

[0037] See also Figure 1 It should be noted that, in order to further reduce the wear between the wafer and the clamping device, a receiving groove 50 can be provided on the receiving plate 20 of the clamping device, so that the wafer can be stably placed on the receiving plate 20. The receiving groove 50 can be horizontally provided on the receiving plate 20, so that after the wafer is grasped, its lower end can be clamped into the receiving groove 50 and placed, thereby improving the stability of wafer clamping. The shape of the receiving groove 50 can be designed based on the outer surface of the wafer to ensure that the groove wall of the receiving groove 50 fits the outer surface of the wafer. Further, the groove wall surface of the receiving groove 50 can be covered with a friction reducing member to reduce the friction between the wafer and the receiving groove 50, thereby greatly reducing the possibility of wafer fragmentation. The material of the friction reducing member may not be restricted, for example, it may be a rubber film, a rubber pad or other materials. It should be noted that there will still be a certain friction between the wafer and the receiving groove 50, which will cause wear of the friction reducing member. Therefore, the friction reducing member and the receiving groove 50 can be designed to be detachable. When the friction reducing member is worn, the friction reducing member can be taken out from the receiving groove 50 for replacement. For example, a fitting groove can be provided at the bottom of the receiving groove 50 so that the friction reducing member can be fitted in the receiving groove 50. When replacement is required, the friction reducing member can be taken out from the fitting groove using a tool.

[0038] See also Figure 1In order to increase the clamping stability of the clamping device, when the clamping plate 30 is set as one, the clamping plate 30 can be set at the middle of the upper end of the wafer, and the receiving plate 20 can be set at the middle of the lower end of the wafer, so that the wafer is clamped between the clamping plate 30 and the receiving plate 20. When the clamping plate 30 is set as a pair, the pair of clamping plates 30 can stably clamp the wafer from both sides. Specifically, when the clamping plate 30 is set as a pair, the second elastic member 42, the second connecting rope 45, the rotating wheel 43 and the first connecting rope 44 are respectively provided with at least one pair, at this time, the pair of second elastic members 42 are respectively connected to the pair of clamping plates 30, the pair of clamping plates 30 are respectively connected to the second ends 47 of the pair of rotating wheels 43 through a pair of second connecting ropes 45, and the receiving plate 20 is respectively connected to the first ends 46 of the pair of rotating wheels 43 through a pair of first connecting ropes 44. Thus, when the wafer is grabbed and placed on the receiving plate 20, the gravity of the wafer drives the receiving plate 20 to move downward, thereby pulling the pair of first connecting ropes 44 and driving the pair of rotating wheels 43 to rotate respectively, and the pair of rotating wheels 43 further drives the pair of second connecting ropes 45 to wind, and finally synchronously pulls the clamping plate 30 to slide close to the wafer, and the wafer can be clamped between the receiving plate 20 and the pair of clamping plates 30. Thus, the wafer can be clamped in the clamping device more stably. It should be noted that the linear distance between the pair of clamping plates 30 and the center of the wafer should be kept equal, so that the pair of clamping plates 30 can be synchronously attached to both sides of the wafer.

[0039] See also Figure 2 It should be noted that, in order to make the gravity of the wafer better squeeze the receiving plate 20, the receiving plate 20 can be set at the bottom of the wafer. Furthermore, in order to stably clamp the wafer, when the clamping plate 30 is set as a pair, the specific positions of the pair of clamping plates 30 can be distributed on both sides of the wafer. For example, a pair of clamping plates 30 can be set on both sides of the upper part of the wafer, a pair of clamping plates 30 can also be set on both sides of the middle part of the wafer, or a pair of clamping plates 30 can be set at any other clamping position to ensure that the wafer can be stably clamped.

[0040] See also Figure 3In order to ensure that the receiving plate 20 can slide stably on the connecting beam 10, a first slide groove 51 can be provided on the connecting beam 10, and a first slider 52 can be slidably arranged in the first slide groove 51, and the first slider 52 can be fixedly connected to the receiving plate 20, so that the receiving plate 20 can slide on the connecting beam 10. It should be noted that the length of the first slide groove 51 can be set based on the required moving length of the receiving plate 20, so that the receiving plate 20 can slide a corresponding distance. In order to ensure that the clamping plate 30 can slide stably on the connecting beam 10, a pair of second slide grooves 53 can be provided on the connecting beam 10, and a second slider 54 can be slidably connected in the pair of second slide grooves 53, respectively, and the pair of second sliders 54 can be fixedly connected to a pair of clamping plates 30, respectively, so that the clamping plate 30 can slide on the connecting beam 10. The length of the second slide groove 53 can be set based on the required moving length of the clamping plate 30, so that the clamping plate 30 can slide a corresponding distance. Under the above conditions, it can be known that the distance between the clamping plate 30 and the receiving plate 20 has a certain variability, so some wafers of different sizes can be accommodated between the clamping plate 30 and the receiving plate 20, thereby improving the adaptability of the clamping device. It is worth noting that in order to improve the integration of the clamping device, one end of the first elastic member 41 can be connected to the inner wall of the first slide groove 51, and the other end of the first elastic member 41 can be connected to the first slider 52. Similarly, one end of the second elastic member 42 can be connected to the inner wall of the second slide groove 53, and the other end of the second elastic member 42 can be connected to the second slider 54.

[0041] In summary, the wafer clamping device provided by the utility model supports the weight of the wafer through the receiving plate, and uses the weight of the wafer to pull the clamping plate to further clamp the wafer. The unexpected effect is that the wear between the clamping device and the wafer surface can be greatly reduced through the cooperation of the receiving plate and the clamping plate, thereby greatly reducing the problem of wafer breakage. In addition, wafers of different sizes can be accommodated between the clamping plate and the receiving plate, thereby improving the adaptability of the clamping device.

[0042] The embodiments of the utility model disclosed above are only used to help illustrate the utility model. The embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer clamping device, It is characterized in that include: Connecting beams; A receiving plate, slidably disposed on the connecting beam; A clamping plate, slidably disposed on the connecting beam; as well as A connecting mechanism connected between the receiving plate and the clamping plate; When the gravity of the wafer squeezes the receiving plate, the receiving plate slides and pulls the clamping plate to slide through the connecting mechanism until the wafer is clamped between the receiving plate and the clamping plate, and when the receiving plate is reset, the connecting mechanism pushes the clamping plate to move in a direction away from the wafer.

2. A wafer clamping device according to claim 1, It is characterized in that The connecting mechanism comprises: A first elastic member, one end of which is connected to the connecting beam, and the other end of which is connected to the receiving plate; A second elastic member, one end of which is connected to the connecting beam, and the other end of which is connected to the clamping plate; and A rotating wheel rotatably disposed on the connecting beam, wherein the rotating wheel is divided into a first end and a second end; A first connection rope is wrapped around the first end, and one end of the first connection rope is connected to the receiving plate; a second connection rope is wrapped around the second end, and one end of the second connection rope is connected to the clamping plate.

3. A wafer clamping device according to claim 2, It is characterized in that The diameter of the first end is greater than the diameter of the second end.

4. A wafer clamping device according to claim 2, It is characterized in that When one side of the wafer presses the receiving plate, the first elastic member is in a stretched state and the second elastic member is in a compressed state. When one side of the wafer does not press the receiving plate, the first elastic member and the second elastic member are reset.

5. A wafer clamping device according to claim 2, It is characterized in that The clamping plate, the second elastic member, the second connecting rope, the rotating wheel and the first connecting rope are respectively arranged in at least one pair, a pair of the second elastic members are respectively connected to a pair of the clamping plates, a pair of the clamping plates are respectively connected to the second ends of a pair of the rotating wheels through a pair of the second connecting ropes, and the supporting plate is respectively connected to the first ends of a pair of the rotating wheels through a pair of the first connecting ropes, wherein the straight-line distances between the pair of clamping plates and the center of the wafer are equal.

6. A wafer clamping device according to claim 5, It is characterized in that The receiving plate is located at the bottom of the wafer, and a pair of clamping plates are respectively located at both sides of the upper part of the wafer.

7. The wafer clamping device according to claim 1, It is characterized in that The connecting beam is provided with a first sliding groove, a first sliding block is slidably connected in the first sliding groove, and the first sliding block is fixedly connected to the receiving plate.

8. The wafer clamping device according to claim 5, It is characterized in that A pair of second sliding grooves are provided on the connecting beam, and second sliding blocks are slidably connected in the pair of second sliding grooves respectively, and the pair of second sliding blocks are fixedly connected to a pair of clamping plates respectively.

9. The wafer clamping device according to claim 2, It is characterized in that The first elastic member is a tension spring, and the second elastic member is a compression spring.

10. The wafer clamping device according to claim 1, It is characterized in that The receiving plate is provided with a receiving groove, the receiving groove is in contact with the outer surface of the wafer, and the surface of the receiving groove is covered with a friction reducing member.

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