Semiconductor optical chip packaging positioning clamp

Abstract

The utility model discloses a semiconductor optical chip packaging positioning clamp, and relates to the technical field of chip packaging. The device comprises a supporting assembly, the supporting assembly comprises a supporting plate; a positioning assembly; the positioning assembly comprises a knob connected to one side of the upper end of the supporting plate, a rotating shaft connected to the bottom end of the knob, a rotating disc connected to the bottom end of the rotating shaft, a connecting rod connected to one side of the rotating disc, a gear connected to the other end of the connecting rod, and racks placed on the two sides of the bottom end of the supporting plate. The sliding block is connected to one side of the upper end of the rack; the positioning strip is connected to the upper end of the sliding block; and the prompting assembly is connected to the outer end of the positioning strip. According to the utility model, the positioning device is arranged, so that the problems that the semiconductor optical chip is usually directly placed at the upper end of the supporting plate during packaging, the chip cannot be positioned in the middle of the supporting plate when the semiconductor optical chip is positioned and clamped, and a packaging mechanism needs to be adjusted during packaging are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a semiconductor optical chip packaging positioning fixture. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resins are used to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit; then the independent chips are encapsulated and protected with a plastic shell, and positioning fixtures are needed in this process for auxiliary operations.

[0003] A Chinese patent discloses a semiconductor optical chip packaging positioning fixture (authorization announcement number CN215451368U), which includes a carrier plate, mounting blocks are fixedly connected on both sides of the carrier plate, an adjustment mechanism is arranged on the upper surface of the carrier plate, a main body is arranged on the upper surface of the carrier plate, and a moving mechanism is arranged on the upper surface of the carrier plate. The semiconductor optical chip packaging positioning fixture is provided with a main body, a moving mechanism and an adjustment mechanism. When the position of the chip needs to be adjusted, the slider is driven to move the internal sliding connection connection block when the threaded rod is rotated to slide the slider, and a limit plate is arranged on the top of the connection block, and a main body is arranged inside the limit plate, so when the threaded rod is rotated to slide the slider, the main body is also driven to move, and the device is convenient for adjusting the position of the chip.

[0004] However, there are still some shortcomings in this patent. When the semiconductor optical chip is packaged, it is usually placed directly on the upper end of the support plate. When positioning and supporting it, the chip position cannot be in the middle of the support plate, and the packaging mechanism needs to be adjusted during packaging. Therefore, those skilled in the art provide a semiconductor optical chip packaging positioning fixture to solve the problems raised in the above background technology. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] The utility model aims to provide a semiconductor optical chip packaging positioning fixture, which solves the above-mentioned problem that, during use, the semiconductor optical chip is usually placed directly on the upper end of a support plate during packaging. When positioning and supporting it, the chip cannot be positioned in the middle of the support plate, and the packaging mechanism needs to be adjusted during packaging.

[0007] 2. Technical solution

[0008] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0009] The utility model is a semiconductor optical chip packaging positioning fixture, comprising:

[0010] Support assembly; the support assembly includes a support plate;

[0011] Positioning assembly; the positioning assembly includes a knob connected to one side of the upper end of the support plate, a rotating shaft connected to the bottom end of the knob, a turntable connected to the bottom end of the rotating shaft, a connecting rod connected to one side of the turntable, a gear connected to the other end of the connecting rod, racks placed on both sides of the bottom end of the support plate, a slider connected to one side of the upper end of the rack, and a positioning strip connected to the upper end of the slider;

[0012] The prompt component is connected to the outer end of the positioning bar.

[0013] Furthermore, the support assembly further comprises a through hole provided at one side of the upper end of the support plate and slide grooves provided at both sides of the upper end of the support plate;

[0014] Specifically, the through hole is used to place the rotating shaft, and the sliding groove is used to place the sliding block.

[0015] Further, the rack is meshed with the gear, and the rotating shaft is placed inside the through hole;

[0016] Specifically, when the gear rotates, it drives the rack to move horizontally.

[0017] Furthermore, the slider is a cross-shaped structure, and the slide groove is opened relative to the slider;

[0018] Specifically, the slider can move horizontally inside the slide groove, and the rack can drive the slider to move.

[0019] Further, the positioning bar is located at the upper end of the support plate, and the turntable and the gear are located at the lower end of the support plate;

[0020] Specifically, by rotating the turntable, the gear can be driven by the connecting rod to keep synchronous rotation with the turntable.

[0021] Furthermore, the prompt component includes a stopper connected to the outer end of the positioning bar, a pressure sensor connected to the inner side of the positioning bar, a telescopic spring connected to the outer side of the pressure sensor, a rubber pad connected to the outer end of the telescopic spring, and a warning light connected to the other side of the upper end of the support plate;

[0022] Specifically, the stopper is used to limit the chip, the pressure sensor is used to measure the elastic force of the telescopic spring, the rubber pad is used to contact the side of the chip, and the warning light is used to warn the outside world.

[0023] Furthermore, the pressure sensor is electrically connected to the warning light through a circuit, and the rubber pad is located outside the positioning strip;

[0024] Specifically, when the pressure value on the pressure sensor reaches the set value, the warning light lights up green, and when the pressure value on the pressure sensor reaches the set value or exceeds the set value, the warning light lights up red.

[0025] 3. Beneficial effects

[0026] Compared with the prior art, the advantages of the present invention are:

[0027] The utility model sets a positioning assembly so that the gear can keep synchronous rotation with the turntable under the drive of the connecting rod, and the rack can move horizontally under the drive of the gear, so that the positioning bar moves towards each other under the drive of the slider and the rack, and the moving distance of the positioning bar on the upper end of the support plate is the same, so that the chip placed on the upper end of the support plate can be kept at the central position of the upper end of the support plate under the drive of the positioning bar;

[0028] At the same time, by setting up a prompt component, the rubber pad clamps both sides of the chip, and because the force is mutual, the chip will generate elastic force on the telescopic spring, and the pressure sensor measures the elastic force of the telescopic spring to prevent the rubber pad from clamping the chip too much under the drive of the positioning bar and causing damage to the chip.

[0029] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is the front view of the utility model;

[0032] Figure 2 This is a structural diagram of the support assembly of the utility model;

[0033] Figure 3 This is a structural diagram of the positioning component of the utility model;

[0034] Figure 4This is a structural diagram of the prompt component of the utility model.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] 100, support assembly; 110, support plate; 120, through hole; 130, slide groove; 200, positioning assembly; 210, knob; 220, rotating shaft; 230, turntable; 240, connecting rod; 250, gear; 260, rack; 270, slider; 280, positioning bar; 300, prompt assembly; 310, block; 320, pressure sensor; 330, telescopic spring; 340, rubber pad; 350, warning light. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0038] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0039] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0040] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0041] Example 1

[0042] See also Figure 1-3 As shown, this embodiment is a semiconductor optical chip packaging positioning fixture, comprising:

[0043] Support assembly 100; the support assembly 100 includes a support plate 110;

[0044] Positioning assembly 200; the positioning assembly 200 includes a knob 210 connected to one side of the upper end of the support plate 110, a rotating shaft 220 connected to the bottom end of the knob 210, a rotating disk 230 connected to the bottom end of the rotating shaft 220, a connecting rod 240 connected to one side of the rotating disk 230, a gear 250 connected to the other end of the connecting rod 240, a rack 260 placed on both sides of the bottom end of the support plate 110, a slider 270 connected to one side of the upper end of the rack 260, and a positioning bar 280 connected to the upper end of the slider 270;

[0045] The support assembly 100 further includes a through hole 120 disposed at one side of the upper end of the support plate 110 and slide grooves 130 disposed at both sides of the upper end of the support plate 110;

[0046] The rack 260 is meshed with the gear 250 , and the rotating shaft 220 is placed inside the through hole 120 ;

[0047] The slider 270 is a cross-shaped structure, and the slide slot 130 is opened relative to the slider 270;

[0048] The positioning bar 280 is located at the upper end of the support plate 110, and the rotating disk 230 and the gear 250 are located at the lower end of the support plate 110;

[0049] Performing the use of the positioning assembly 200;

[0050] Place the chip at the upper end of the support plate 110, apply a rotational force to the knob 210, so that the knob 210 drives the shaft 220 to rotate, and the rotation of the shaft 220 drives the turntable 230 and the connecting rod 240 to rotate, and the connecting rod 240 drives the gear 250 to rotate. The rack 260 moves horizontally at the lower end of the support plate 110 driven by the gear 250. At this time, the slider 270 moves toward each other at the upper end of the support plate 110 driven by the rack 260, so that the positioning bar 280 moves toward each other on the support plate 110, and the positioning bar 280 moves the same distance, so that the chip can be kept in the central position of the upper end of the support plate 110.

[0051] Example 2

[0052] See also Figure 4 shown, and;

[0053] The prompt component 300 is connected to the outer end of the positioning bar 280;

[0054] The prompt assembly 300 includes a stopper 310 connected to the outer end of the positioning bar 280, a pressure sensor 320 connected to the inner side of the positioning bar 280, a telescopic spring 330 connected to the outer side of the pressure sensor 320, a rubber pad 340 connected to the outer end of the telescopic spring 330, and a warning light 350 connected to the other side of the upper end of the support plate 110;

[0055] The pressure sensor 320 is electrically connected to the warning light 350 through a circuit, and the rubber pad 340 is located outside the positioning strip 280;

[0056] Performing the use of the prompt component 300;

[0057] When the positioning bar 280 moves toward each other at the upper end of the support plate 110, the stopper 310 places the chip and deflects it outwards. The rubber pad 340 contacts the chip driven by the positioning bar 280. At this time, since the force is mutual, the rubber pad 340 clamps the chip, and the chip generates an outward force on the rubber pad 340. The rubber pad 340 drives the telescopic spring 330 to compress. The pressure sensor 320 measures the elastic force of the telescopic spring 330. When the elastic force reaches the set value, the warning light 350 lights up green, indicating that the chip has been clamped and the clamping force will not cause damage to the chip. When the warning light 350 lights up red, it means that the elastic force is small or large, and the chip is clamped stably or over-clamped.

[0058] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor optical chip packaging positioning fixture, characterized in that: include, A support assembly (100); the support assembly (100) comprises a support plate (110); A positioning assembly (200); the positioning assembly (200) comprises a knob (210) connected to one side of the upper end of a support plate (110), a rotating shaft (220) connected to the bottom end of the knob (210), a rotating disk (230) connected to the bottom end of the rotating shaft (220), a connecting rod (240) connected to one side of the rotating disk (230), a gear (250) connected to the other end of the connecting rod (240), a rack (260) placed on both sides of the bottom end of the support plate (110), a slider (270) connected to one side of the upper end of the rack (260), and a positioning bar (280) connected to the upper end of the slider (270); The prompt component (300) is connected to the outer end of the positioning strip (280).

2. A semiconductor optical chip packaging positioning fixture according to claim 1, characterized in that: The support assembly (100) further comprises a through hole (120) provided at one side of the upper end of the support plate (110) and sliding grooves (130) provided at both sides of the upper end of the support plate (110).

3. A semiconductor optical chip packaging positioning fixture according to claim 1, characterized in that: The rack (260) is meshed with the gear (250), and the rotating shaft (220) is placed inside the through hole (120).

4. A semiconductor optical chip packaging positioning fixture according to claim 1, characterized in that: The sliding block (270) is a cross-shaped structure, and the sliding groove (130) is opened relative to the sliding block (270).

5. The semiconductor optical chip packaging positioning fixture according to claim 1, characterized in that: The positioning bar (280) is located at the upper end of the support plate (110), and the rotating disk (230) and the gear (250) are located at the lower end of the support plate (110).

6. The semiconductor optical chip packaging positioning fixture according to claim 1, characterized in that: The prompt component (300) comprises a stopper (310) connected to the outer end of the positioning bar (280), a pressure sensor (320) connected to the inner side of the positioning bar (280), a telescopic spring (330) connected to the outer side of the pressure sensor (320), a rubber pad (340) connected to the outer end of the telescopic spring (330), and a warning light (350) connected to the other side of the upper end of the support plate (110).

7. A semiconductor optical chip packaging positioning fixture according to claim 6, characterized in that: The pressure sensor (320) is electrically connected to the warning light (350) via a circuit, and the rubber pad (340) is located outside the positioning strip (280).

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