High-power SMD (Surface Mount Device) diode

Abstract

The utility model discloses a high-power surface-mounted diode which comprises a chip, copper particles are symmetrically and fixedly connected to the upper side and the lower side of the chip, pins are fixedly connected to the copper particles respectively, a packaging body is arranged outside the chip and the copper particles, and the pins extend to the left side and the right side of the packaging body. A heat dissipation groove is formed in the bottom of the packaging body, a heat conduction plate is installed in the heat dissipation groove, the bottom of the heat conduction plate is connected with a heat absorption plate, and the diode is subjected to solid heat conduction and heat dissipation treatment through the heat conduction plate and the heat absorption plate. Bolts are arranged on the left and right sides of the bottom of the packaging body in a penetrating manner, the ends of the bolts are connected with clamping grooves in a clamping manner, and the clamping grooves are correspondingly formed in the left and right sides of the heat conducting plate. When the high-power surface-mounted diode is used, heat generated by the diode can be timely, effectively and rapidly conducted out and dissipated, heat loss is avoided, the heat dissipation component can be rapidly and conveniently installed on the packaging body, and the installation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diodes, in particular to a high-power chip diode. Background Art

[0002] SMD diodes are electronic devices that conduct current in one direction. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has the transduction property of unidirectional current according to the direction of the applied voltage. High-power SMD diodes are made by welding the chip and two copper pins together and then encapsulating them with packaging materials.

[0003] In a high-power SMD diode disclosed in publication number CN220290798U, a heat dissipation groove is provided at the bottom of the package body, and there is space for air flow between the heat dissipation groove and the circuit board. It is not tightly fitted on the surface of the circuit board, but a heat conduction groove is provided at the center of the bottom of the package body. The heat conduction groove is used to fix and connect the heat conduction plate. The heat conduction plate is provided with bolt holes, and the bottom of the heat conduction groove is provided with bolt fixing holes. The bolt fixing holes and the bolt holes are arranged correspondingly in the vertical direction. Therefore, the heat conduction plate can be detachably installed on the bottom of the package body by bolts;

[0004] However, the above scheme still has the following problems during use: when in use, heat dissipation is performed by setting up heat dissipation grooves and heat conduction plates, and the heat conduction plate conducts the heat emitted from the heat dissipation grooves to the heat conduction plate through gas and then performs heat dissipation, and does not directly contact the heat source, so the efficiency of heat conduction is low, thereby affecting the heat dissipation effect, and during installation, the heat conduction plate is connected to the diode by threaded connection, which needs to be screwed one by one, which is time-consuming and labor-intensive, and is not convenient for convenient installation of the heat dissipation components.

[0005] So we proposed a high-power chip diode to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a high-power SMD diode to solve the problem that the existing high-power SMD diodes on the market at present, when in use, are heat-dissipating through the provision of heat dissipating grooves and heat-conducting plates, and the heat-conducting plates are heat-dissipating plates after the heat emitted from the heat dissipating grooves is conducted to the heat-conducting plates through gas, and do not directly contact the heat source, so the efficiency of heat conduction is low, thereby affecting the heat dissipation effect, and during installation, the heat-conducting plates are connected to the diodes through threaded connections, which need to be screwed one by one, which is time-consuming and labor-intensive, and is not convenient for convenient installation of heat dissipating components.

[0007] To achieve the above object, the utility model provides the following technical solution: a high-power SMD diode, comprising a chip, wherein copper particles are symmetrically fixedly connected to the upper and lower sides of the chip, and the copper particles are respectively fixedly connected to pins, and a package is arranged outside the chip and the copper particles, and the pins extend to the left and right sides of the package;

[0008] The invention also includes: a heat dissipation groove is provided at the bottom of the package body, a heat conduction plate is installed in the heat dissipation groove, a heat absorption plate is connected to the bottom of the heat conduction plate, and the diode is subjected to solid heat conduction and heat dissipation treatment through the heat conduction plate and the heat absorption plate;

[0009] The left and right sides of the bottom of the packaging body are penetrated with latches, and the ends of the latches are engaged with the card slots, and the card slots are correspondingly opened on the left and right sides of the heat conducting plate.

[0010] Preferably, the heat conducting plate and the heat absorbing plate are respectively arranged at equal intervals in the horizontal direction and at equal intervals in the vertical direction, and the heat conducting plate is in close contact with the heat source of the diode.

[0011] Preferably, the heat absorbing plate is located outside the bottom of the package body, and a first air channel is longitudinally opened on the heat absorbing plate, and second air channels are horizontally opened at equal intervals on the side of the heat absorbing plate, and the first air channel and the second air channel are mutually connected.

[0012] Preferably, a connecting plate is provided at the connection between the heat conducting plate and the heat absorbing plate, and the connecting plate is arranged in an "L"-shaped structure, and a first protrusion and a second protrusion are respectively fixed on the top and the side of the connecting plate, and the first protrusion and the second protrusion are respectively engaged and connected with the first embedding groove and the second embedding groove.

[0013] Preferably, the first embedding groove and the second embedding groove are respectively correspondingly opened at the bottom of the heat conducting plate and the side of the heat absorbing plate, and the first embedding groove and the second embedding groove are both configured as rectangular structures.

[0014] Preferably, pull plates are symmetrically arranged on the left and right sides of the bottom of the packaging body, and latches are fixedly installed at equal intervals on the sides of the pull plates, and a spring is installed between the latches and the packaging body.

[0015] Preferably, the end of the latch extends into the heat dissipation slot, and the heat conducting plate forms a convenient installation structure through the latch and the slot.

[0016] Compared with the prior art, the utility model has the following beneficial effects: when in use, the heat generated by the diode can be quickly and effectively dissipated to avoid heat loss, and the heat dissipation component can be quickly and conveniently installed on the package body, improving the installation efficiency. The specific contents are as follows:

[0017] 1. Through the setting of heat conduction plate and heat absorption plate, the heat generated by the diode during use can be quickly and promptly discharged to avoid heat loss caused by heat accumulation;

[0018] Furthermore, after the heat conduction plate absorbs the heat, it conducts it to the heat absorbing plate, and the heat absorbing plate contacts the outside air, and the first air channel and the second air channel opened thereon can increase the circulation space of the air on the heat absorbing plate, thereby improving the efficiency of heat dissipation;

[0019] 2. By setting the connecting plate, the heat conducting plate and the heat absorbing plate can be connected and fixed, thereby increasing the stability of the connection. The first protrusion is engaged with the first embedding groove at the bottom of the heat conducting plate, and the second protrusion is engaged with the second embedding groove on the side of the heat absorbing plate, thereby increasing the stability of the connection between the heat conducting plate and the heat absorbing plate;

[0020] 3. Through the setting of the latch and the slot, the heat conducting plate and the heat sink can be quickly and conveniently installed and fixed. After the latch and the slot are connected, the heat conducting plate and the heat sink are firmly connected. In the later maintenance, it can be completed by separating the latch and the slot, which is convenient to operate.

[0021] Furthermore, when the pull plate drives the latch to move outward, the spring will be compressed, thereby making room for the heat sink to connect. The heat conducting plate is then plugged into the heat conducting plate. When the pull plate is released, the spring will drive the latch to reset and engage with the card slot on the outside of the heat conducting plate, thereby allowing for convenient and stable installation of the heat conducting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall front section structure of the utility model;

[0023] Figure 2 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of the heat conducting plate and the heat absorbing plate connected to the utility model;

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the heat conducting plate, the connecting plate and the heat absorbing plate of the utility model;

[0026] Figure 5 For this utility model Figure 1 The enlarged structural diagram at B in the middle;

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the pull plate, latch and spring connection of the utility model.

[0028] In the figure: 1. chip; 2. copper particles; 3. pins; 4. package body; 5. heat sink; 6. heat conducting plate; 7. heat absorbing plate; 8. first air duct; 9. second air duct; 10. connecting plate; 11. first bump; 12. first embedding groove; 13. second bump; 14. second embedding groove; 15. pull plate; 16. latch; 17. spring; 18. slot. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1: In order to improve the heat dissipation efficiency of the diode during use, the following solution is proposed. For details, please refer to Figure 1-Figure 4 As shown,

[0031] The invention comprises a chip 1, and copper particles 2 are symmetrically fixedly connected to the upper and lower sides of the chip 1, and the copper particles 2 are respectively fixedly connected to pins 3, and a package body 4 is arranged outside the chip 1 and the copper particles 2, and the pins 3 extend to the left and right sides of the package body 4, and also comprises: a heat dissipation groove 5 is opened at the bottom of the package body 4, and a heat conduction plate 6 is installed in the heat dissipation groove 5, and a heat absorption plate 7 is connected to the bottom of the heat conduction plate 6, and the diode is subjected to solid heat conduction and heat dissipation treatment through the heat conduction plate 6 and the heat absorption plate 7. When in use, the copper particles 2 are installed on the outside of the chip 1, and the pins 3 are welded on the outside of the copper particles 2. The package body 4 is packaged outside, leaving only the pins 3 exposed for installation. The heat dissipation groove 5 at the bottom of the package body 4 is convenient for heat conduction and cooling of the heat generated during the use of the diode, and the heat conduction plate 6 and the heat absorption plate 7 will conduct and dissipate the generated heat in time, thereby avoiding heat loss of the diode when used for a long time;

[0032] Please refer to Figure 1-Figure 4 As shown, the heat conducting plate 6 and the heat absorbing plate 7 are respectively arranged at equal intervals in the horizontal direction and at equal intervals in the vertical direction, and the heat conducting plate 6 is in close contact with the heat source of the diode, the heat absorbing plate 7 is located at the bottom outer side of the package body 4, and a first air channel 8 is opened vertically through the heat absorbing plate 7, and second air channels 9 are opened horizontally at equal intervals on the side of the heat absorbing plate 7, and the first air channel 8 and the second air channel 9 are mutually connected. When the heat conducting plate 6 absorbs heat, it will be conducted to the heat absorbing plate 7, and the heat absorbing plate 7 is in contact with the outside air, and the first air channel 8 and the second air channel 9 opened thereon can increase the air circulation space on the heat absorbing plate 7, thereby improving the efficiency of heat dissipation.

[0033] Embodiment 2: In order to improve the stability of the connection between the heat dissipation components, the following solution is proposed. For details, please refer to Figure 1-Figure 4 As shown,

[0034] A connecting plate 10 is provided at the connection between the heat conducting plate 6 and the heat absorbing plate 7, and the connecting plate 10 is set to an "L"-shaped structure, and the top and side of the connecting plate 10 are respectively fixed with a first protrusion 11 and a second protrusion 13, and the first protrusion 11 and the second protrusion 13 are respectively engaged with the first embedding groove 12 and the second embedding groove 14, the first embedding groove 12 and the second embedding groove 14 are respectively correspondingly opened at the bottom of the heat conducting plate 6 and the side of the heat absorbing plate 7, and the first embedding groove 12 and the second embedding groove 14 are both set to a rectangular structure. When the heat conducting plate 6 and the heat absorbing plate 7 are connected, the heat conducting plate 6 is arranged on the top of the heat absorbing plate 7, and then the connecting plate 10 is placed at the connection between the heat conducting plate 6 and the heat absorbing plate 7, the first protrusion 11 on the top of the connecting plate 10 will be engaged with the first embedding groove 12 at the bottom of the heat conducting plate 6, and the second protrusion 13 on the side of the connecting plate 10 will be engaged with the second embedding groove 14 on the side of the heat absorbing plate 7, thereby increasing the stability of the connection between the heat conducting plate 6 and the heat absorbing plate 7.

[0035] Embodiment 3: In order to improve the installation efficiency of the heat dissipation component, the following solution is proposed. For details, please refer to Figure 1 and Figure 3-Figure 6 As shown,

[0036] The left and right sides of the bottom of the packaging body 4 are penetrated with latches 16, and the ends of the latches 16 are engaged with the card slots 18, and the card slots 18 are correspondingly opened on the left and right sides of the heat conducting plate 6, and the left and right sides of the bottom of the packaging body 4 are symmetrically provided with pull plates 15, and the sides of the pull plates 15 are fixedly installed with latches 16 at equal intervals, and a spring 17 is installed between the latch 16 and the packaging body 4, and the ends of the latch 16 extend into the heat dissipation slot 5, and the heat conducting plate 6 forms a convenient installation structure through the latch 16 and the card slots 18. When the heat conducting plate 6 is installed and connected with the packaging body 4, the pull plates 15 on both sides are pulled, and the pull plates 15 will drive the latch 16 to move outward, thereby compressing the spring 17, thereby making room for the insertion space of the heat dissipation slot 5, and then the heat conducting plate 6 is inserted into the heat dissipation slot 5, and the pull plates 15 are released, and the spring 17 will drive the latch 16 to reset, and then engage with the card slots 18 on the outside of the heat conducting plate 6, so as to conveniently and stably install the heat conducting component.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-power surface mount diode, comprising a chip (1), wherein copper particles (2) are symmetrically fixedly connected to the upper and lower sides of the chip (1), and the copper particles (2) are respectively fixedly connected to pins (3), and a package (4) is arranged outside the chip (1) and the copper particles (2), and the pins (3) extend to the left and right sides of the package (4); Features: Also includes: The bottom of the package body (4) is provided with a heat dissipation groove (5), a heat conduction plate (6) is installed in the heat dissipation groove (5), and the bottom of the heat conduction plate (6) is connected to a heat absorption plate (7), and the diode is subjected to solid heat conduction and heat dissipation treatment through the heat conduction plate (6) and the heat absorption plate (7); A latch (16) is provided through the left and right sides of the bottom of the packaging body (4), and the end of the latch (16) is engaged with a slot (18), and the slot (18) is correspondingly opened on the left and right sides of the heat conducting plate (6).

2. A high-power chip diode according to claim 1, Features: The heat conducting plate (6) and the heat absorbing plate (7) are respectively arranged at equal intervals in the horizontal direction and at equal intervals in the vertical direction, and the heat conducting plate (6) is in close contact with the heat source of the diode.

3. A high-power chip diode according to claim 1, Features: The heat absorbing plate (7) is located at the bottom outer side of the packaging body (4), and a first air channel (8) is longitudinally opened on the heat absorbing plate (7), and second air channels (9) are horizontally opened at equal intervals on the side of the heat absorbing plate (7), and the first air channel (8) and the second air channel (9) are mutually connected.

4. A high-power chip diode according to claim 1, Features: A connecting plate (10) is provided at the connection between the heat conducting plate (6) and the heat absorbing plate (7), and the connecting plate (10) is provided in an "L"-shaped structure, and a first protrusion (11) and a second protrusion (13) are respectively fixed on the top and side of the connecting plate (10), and the first protrusion (11) and the second protrusion (13) are respectively engaged and connected with the first embedding groove (12) and the second embedding groove (14).

5. A high-power chip diode according to claim 4, Features: The first embedding groove (12) and the second embedding groove (14) are respectively correspondingly opened at the bottom of the heat conducting plate (6) and the side of the heat absorbing plate (7), and the first embedding groove (12) and the second embedding groove (14) are both arranged as rectangular structures.

6. A high-power chip diode according to claim 1, Features: Pull plates (15) are symmetrically arranged on the left and right sides of the bottom of the packaging body (4), and latches (16) are fixedly installed at equal intervals on the sides of the pull plates (15), and a spring (17) is installed between the latches (16) and the packaging body (4).

7. A high-power chip diode according to claim 6, Features: The end of the latch (16) extends into the heat dissipation slot (5), and the heat conduction plate (6) forms a convenient installation structure through the latch (16) and the slot (18).

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