Power module heat dissipation device

Abstract

A power module heat dissipation device comprises a substrate, a flow guide plate and a heat dissipation plate. The substrate is provided with a cooling fluid inlet hole and a cooling fluid outlet hole which are mutually spaced, an inlet flow channel communicated with the cooling fluid inlet hole, and an outlet flow channel communicated with the cooling fluid outlet hole. A guide-in flow hole and at least one guide-out flow hole are formed in the guide plate, the guide-in flow hole and the guide-out flow hole are spaced from each other and are respectively in a long hole shape, the length direction of the guide-in flow hole and the length direction of the guide-out flow hole extend in the second direction, and the guide-in flow hole and the guide-out flow hole are communicated with the flow inlet channel and the flow outlet channel respectively. A plurality of long-groove-shaped heat dissipation grooves are formed in the side, attached to the flow guide plate, of the heat dissipation plate, the length directions of the heat dissipation grooves extend in the direction perpendicular to the second direction, and the heat dissipation grooves communicate with the flow guide-in hole and the flow guide-out hole. Therefore, the cooling fluid can uniformly flow in the heat dissipation grooves, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a power module heat dissipation device, in particular to a power module heat dissipation device suitable for installing a power module and dissipating heat for the power module. Background Art

[0002] Existing power modules, for example, use a COB (Chip On Board) packaging process (also known as a chip on board packaging process) for LED chips, which solves the problem that when LED crystals are directly exposed to the air, they are easily contaminated or damaged by human factors, thereby affecting or destroying the function of the LED crystals. The COB packaging process encapsulates the LED crystals and bonding wires with a packaging glue to protect the LED crystals. Compared with existing direct-insert or SMD (Surface Mount device) packaging LED chips, COB-packaged LED chips are characterized by saving space and simplifying packaging work. However, when operating, existing COB-packaged LED chips may have excessive temperatures due to the small space, causing damage to the LED crystals, thereby affecting the brightness of the COB-packaged LED chips. Utility Model Content

[0003] The utility model aims to provide a power module heat dissipation device which can overcome at least one disadvantage of the prior art.

[0004] The utility model power module heat dissipation device comprises a substrate, a guide plate, and a heat sink. The substrate is formed with a cooling fluid inlet hole and a cooling fluid outlet hole spaced apart from each other, an inlet channel connected to the cooling fluid inlet hole, and an outlet channel connected to the cooling fluid outlet hole. The guide plate is attached to the substrate and is formed with inlet holes and at least one outlet hole spaced apart from each other, the inlet hole and the outlet hole pass through the guide plate and are respectively connected to the inlet channel and the outlet channel. The heat sink is attached to the side of the guide plate opposite to the substrate, and the heat sink is formed with at least one heat sink, and the heat sink is connected to the inlet hole and the outlet hole.

[0005] In the power module heat dissipation device of the utility model, the heat dissipation slot is in the shape of a long slot and its length extends along a first direction, and the inlet flow holes and the outlet flow holes of the guide plate are arranged at intervals along the first direction.

[0006] The power module heat dissipation device described in the utility model, the heat dissipation plate is formed with a plurality of heat dissipation grooves arranged at intervals along a second direction, the second direction is perpendicular to the first direction, the inlet flow hole and the outlet flow hole are each in the shape of a long hole and their long direction extends along the second direction, and the inlet flow hole and the outlet flow hole are each connected to the heat dissipation groove.

[0007] In the power module heat dissipation device described in the utility model, the guide plate is formed with two outlet flow holes which are spaced apart and located on opposite sides of the inlet flow hole, the inlet flow hole corresponds to the middle part of each of the heat dissipation slots, and the outlet flow holes correspond to opposite sides of each of the heat dissipation slots along the longitudinal extension direction of the heat dissipation slots.

[0008] In the power module heat dissipation device described in the utility model, the inlet flow hole has a first short end portion adjacent to the cooling fluid inlet hole, and a second short end portion spaced apart from the first short end portion of the inlet flow hole along the second direction, and the width of the first short end portion of the inlet flow hole along the first direction is smaller than the width of the second short end portion of the inlet flow hole along the first direction.

[0009] In the power module heat dissipation device of the utility model, the cooling fluid inlet hole and the cooling fluid outlet hole are spaced apart along the second direction, and the inlet channel is in the shape of a long groove and its length extends along the second direction.

[0010] The power module heat dissipation device described in the utility model, the guide plate is formed with two outlet flow holes respectively spaced apart and located on opposite sides of the inlet flow hole, the outlet flow channel is U-groove-shaped and has two side flow channel sections, and a confluence channel section connected to the side flow channel sections, the side flow channel sections are respectively connected to the outlet flow holes, and the confluence channel section is connected to the outlet flow hole and the cooling fluid outlet hole.

[0011] In the power module heat dissipation device described in the utility model, the depth of the bus channel section along the third direction is greater than the depth of each of the side channel sections along the third direction, and the third direction is perpendicular to the first direction and the second direction.

[0012] In the power module heat dissipation device described in the utility model, the inlet flow holes and the outlet flow holes of the guide plate are arranged at intervals along a first direction, the cooling fluid inlet holes and the cooling fluid outlet holes are spaced apart along a second direction, and the second direction forms an angle with the first direction.

[0013] In the power module heat dissipation device of the utility model, the maximum width of the inlet flow hole along the first direction is smaller than the maximum width of the inlet channel along the first direction.

[0014] The power module heat dissipation device of the utility model further comprises a first sealing gasket, which is arranged between the substrate and the guide plate and surrounds the outer periphery of the inlet channel.

[0015] The power module heat dissipation device described in the utility model also includes a frame plate and a second sealing gasket. The frame plate is arranged between the substrate and the heat dissipation plate and surrounds the outer periphery of the guide plate. The second sealing gasket is arranged between the substrate and the heat dissipation plate and surrounds the outer periphery of the guide plate.

[0016] The beneficial effect of the utility model is that the power module heat dissipation device can make the cooling fluid flow through each of the heat dissipation slots evenly to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of the first embodiment of the power module heat dissipation device of the utility model;

[0018] Figure 2 is a perspective exploded view of the first embodiment, illustrating the assembly relationship between a base plate, two sealing gaskets, a frame plate, a guide plate, and a heat sink;

[0019] Figure 3 is a three-dimensional exploded view of the first embodiment viewed from another angle, illustrating the relative relationship between an inlet flow hole and two outlet flow holes of the guide plate and a plurality of heat dissipation slots of the heat dissipation plate;

[0020] Figure 4 is an incomplete top view of the first embodiment, illustrating the flow direction of the cooling fluid in an inlet channel, the inlet flow hole, the outlet flow hole and an outlet channel;

[0021] Figure 5 is an incomplete bottom view of the first embodiment, illustrating the connection relationship between the inlet flow hole, the outlet flow hole and the heat dissipation groove;

[0022] Figure 6 is along Figure 4 The cross-sectional view taken along the VI-VI line in the figure illustrates the depth relationship between a flow channel section on one side of the outlet flow channel and a confluence channel section;

[0023] Figure 7 is along Figure 1 The cross-sectional view taken along line VII-VII in FIG. 1 illustrates that the cooling fluid flows into the heat dissipation slot from a cooling fluid inlet hole, the inlet channel and the introduction hole;

[0024] Figure 8 is along Figure 1 The cross-sectional view taken along the line VIII-VIII in FIG. 1 illustrates the flow direction of the cooling fluid from the inlet channel, the inlet flow hole, the heat dissipation slot, the outlet flow hole to the outlet channel;

[0025] Fig. 9 It is a three-dimensional exploded view of the second embodiment of the power module heat dissipation device of the utility model;

[0026] Fig.10 is a perspective exploded view of the second embodiment viewed from another viewing angle;

[0027] Fig.11 is an incomplete top view of the second embodiment, illustrating the flow direction of the cooling fluid in the inlet channel, the inlet flow hole, the outlet flow hole and the outlet channel;

[0028] Fig.12 is an incomplete bottom view of the second embodiment, illustrating the connection relationship between the inlet flow hole, the outlet flow hole and the heat dissipation groove;

[0029] Fig.13 is a cross-sectional view of the second embodiment;

[0030] Fig.14 It is an incomplete top view of the third embodiment of the power module heat dissipation device of the utility model;

[0031] Fig.15 It is an incomplete top view of the fourth embodiment of the power module heat dissipation device of the utility model. DETAILED DESCRIPTION

[0032] The utility model is described in detail below with reference to the accompanying drawings and embodiments.

[0033] Before the present invention is described in detail, it should be noted that similar elements are represented by the same reference numerals in the following description.

[0034] See also Figure 1 and Figure 2 , which is the first embodiment of the power module heat dissipation device 100 of the utility model. The power module heat dissipation device 100 comprises a substrate 1, a guide plate 2, a frame plate 3, a heat dissipation plate 4, a first sealing gasket 5, and a second sealing gasket 6. The power module heat dissipation device 100 is used for installing a power module (not shown) to dissipate heat for the power module. In the first embodiment, the power module is a chip on board (COB) LED power module as an example but is not limited thereto.

[0035] For the convenience of subsequent description, a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to the first direction X and the second direction Y of the power module heat dissipation device 100 are defined. Figure 1 The first direction X is the direction indicated by the arrow as right, and the opposite direction is left. Figure 1 The second direction Y is the direction indicated by the arrow as forward, and the opposite direction is backward. Figure 1 The third direction Z is the direction indicated by the arrow as upward, and the opposite direction is downward.

[0036] See also Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 The substrate 1 has a bottom surface 101 and a top surface 102 opposite to the bottom surface 101. The bottom surface 101 of the substrate 1 is recessed upward to form a cooling fluid inlet hole 11 and a cooling fluid outlet hole 12 spaced apart from each other. The cooling fluid inlet hole 11 and the cooling fluid outlet hole 12 are spaced apart along the second direction Y. The top surface 102 of the substrate 1 is recessed downward to form an inlet channel 13, an outlet channel 14, and four screw holes 15. The inlet channel 13 is connected to the cooling fluid inlet hole 11. The inlet channel 13 is in the shape of a long groove and its length extends along the second direction Y. The inlet channel 13 has a first short end 131 adjacent to the cooling fluid inlet hole 11, and a second short end 132 spaced apart from the first short end 131 along the second direction Y and adjacent to the cooling fluid outlet hole 12. The outlet channel 14 is connected to the cooling fluid outlet hole 12. The outlet channel 14 is in a U-groove shape and surrounds the outer periphery of the inlet channel 13. The outlet channel 14 has two side channel sections 141, and a confluence channel section 142 connected to the side channel sections 141 and located between the side channel sections 141. The confluence channel section 142 is connected to the cooling fluid outlet hole 12. The depth of the confluence channel section 142 along the third direction Z is greater than the depth of each of the side channel sections 141 along the third direction Z. The screw holes 15 are respectively adjacent to the four corners of the substrate 1.

[0037] See also Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 8, the guide plate 2 is attached to the top surface 102 of the substrate 1. The guide plate 2 is formed with an inlet flow hole 21 and two outlet flow holes 22 arranged at intervals along the first direction X. The inlet flow hole 21 and the outlet flow hole 22 are each in the shape of a long hole and their length extends along the second direction Y. The outlet flow holes 22 are respectively located on the opposite side of the inlet flow hole 21. The maximum width of the inlet flow hole 21 along the first direction X is smaller than the maximum width of the inlet channel 13 along the first direction X. The inlet flow hole 21 passes through the guide plate 2 and is connected to the inlet channel 13. The inlet flow hole 21 is located above the inlet channel 13 and partially overlaps with the inlet channel 13. The outlet flow holes 22 pass through the guide plate 2 and are connected to the confluence channel section 142 of the outlet channel 14 and are respectively connected to the side channel sections 141. The inlet hole 21 has a first short end 211 adjacent to the cooling fluid inlet hole 11, and a second short end 212 spaced apart from the first short end 211 along the second direction Y and adjacent to the cooling fluid outlet hole 12. The width of the first short end 211 of the inlet hole 21 along the first direction X is smaller than the width of the second short end 212 along the first direction X, and the width of the inlet hole 21 along the first direction X gradually increases from the first short end 211 toward the second short end 212.

[0038] The frame plate 3 is disposed on the top surface 102 of the base plate 1 and surrounds the outer periphery of the guide plate 2. The frame plate 3 is formed with four through holes 31. The through holes 31 penetrate the frame plate 3 and are connected to the screw holes 15 respectively.

[0039] See also Figure 2 , Figure 3 , Figure 5 , Figure 7 and Figure 8 , the heat sink 4 is arranged above the top surface of the guide plate 2 and the top surface 102 of the substrate 1 and is attached to the guide plate 2. The heat sink 4 includes a bearing surface 41 for bearing the power module (not shown) and a bottom surface 42 opposite to the bearing surface 41. The bottom surface 42 is attached to the side of the guide plate 2 opposite to the substrate 1 and the frame plate 3. The bottom surface 42 of the heat sink 4 is recessed upward to form a plurality of heat sinks 421 arranged at intervals along the second direction Y. Each of the heat sinks 421 is in the shape of a long groove and its length extends along the first direction X. The inlet flow hole 21 and the outlet flow hole 22 are respectively connected to the heat sink 421. The inlet flow hole 21 corresponds to the middle part of each of the heat sinks 421. The outlet flow holes 22 correspond to the opposite sides of the longitudinal extension direction of each of the heat sinks 421, that is, the outlet flow holes 22 correspond to the parts adjacent to the two short sides of each of the heat sinks 421. The heat dissipation plate 4 is formed with four through holes 43 extending between the supporting surface 41 and the bottom surface 42 . The through holes 43 are connected to the through holes 31 respectively.

[0040] The first sealing gasket 5 is disposed between the substrate 1 and the guide plate 2 and surrounds the outer periphery of the inlet channel 13. The second sealing gasket 6 is disposed between the substrate 1 and the heat dissipation plate 4 and surrounds the outer periphery of the guide plate 2.

[0041] See also Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 When the power module heat sink 100 is in use, the cooling fluid inlet hole 11 and the cooling fluid outlet hole 12 are connected via a water-cooling fluid circulation device (not shown in the figure, for example, a water-cooling liquid circulation machine). The cooling fluid 9, for example, water, supplied by the water-cooling fluid circulation device enters the inlet channel 13 through the cooling fluid inlet hole 11. After the cooling fluid 9 flows into the inlet channel 13, it flows from the first short end 131 toward the second short end 132. Since the maximum width of the inlet channel 13 along the first direction X is greater than the maximum width of the inlet flow hole 21 along the first direction X, the flow velocity of the cooling fluid 9 in the inlet channel 13 will increase after it flows into the inlet flow hole 21. In addition, since the first short end 211 of the inlet flow hole 21 is adjacent to the cooling fluid inlet hole 11, and the width of the inlet flow hole 21 along the first direction X gradually increases from the first short end 211 toward the second short end 212, the flow velocity of the cooling fluid 9 in the inlet channel 13 flowing into the inlet flow hole 21 will gradually decrease from the first short end 211 toward the second short end 212, thereby improving the flow uniformity of the cooling fluid 9 flowing into the heat sink 421 through the inlet flow hole 21, thereby achieving the effect of equal flow. After the cooling fluid 9 flows into the middle part of the heat sink 421 through the inlet flow hole 21 and hits the heat sink 4, the cooling fluid 9 will flow evenly along the first direction X toward the left and right sides of each heat sink 421. During the process of flowing in the heat sink 421, the cooling fluid 9 will exchange heat with the heat sink 4 to absorb the heat conducted to the heat sink 4 by the power module. Next, the cooling fluid 9 is discharged from the two short sides of each heat dissipation slot 421 and flows into the outlet flow hole 22. Subsequently, the cooling fluid 9 flows into the side flow channel section 141 and the converging flow channel section 142 of the outlet flow channel 14 through the outlet flow hole 22. Finally, the cooling fluid 9 flows back to the water-cooling fluid circulation device through the cooling fluid outlet hole 12, and then the next round of fluid circulation is carried out.

[0042] See also Figure 4 , Figure 5 , Figure 6 and Figure 8The cooling fluid inlet hole 11 of the substrate 1 is connected to the inlet channel 13, the inlet channel 13 is connected to the inlet hole 21 of the guide plate 2, the inlet hole 21 is connected to the heat dissipation slot 421 of the heat dissipation plate 4, the heat dissipation slot 421 is connected to the outlet hole 22 of the guide plate 2, the outlet hole 22 is respectively connected to the side channel section 141 of the outlet channel 14 and the confluence channel section 142, the confluence channel section 142 is connected to the cooling fluid outlet hole 12, so that the cooling fluid 9 can flow through the heat dissipation slot 421 and exchange heat with the heat dissipation plate 4 to cool and dissipate the heat of the heat dissipation plate 4.

[0043] Each heat dissipation slot 421 is in the form of a long slot and its length extends along the first direction X, and the inlet flow hole 21 and the outlet flow hole 22 of the guide plate 2 are arranged at intervals along the first direction X, so that the cooling fluid 9 can flow along the length of the heat dissipation slot 421 after flowing into the heat dissipation slot 421 from the inlet flow hole 21, and then the cooling fluid 9 flows out of the heat dissipation slot 421 and flows into the outlet flow hole 22. In this way, the area of ​​heat exchange between the cooling fluid 9 and the heat dissipation plate 4 can be increased, thereby improving the heat dissipation efficiency.

[0044] In addition, the cooling slots 421 are arranged at intervals along the second direction Y, the inlet flow hole 21 and the outlet flow hole 22 are each in the shape of a long hole and their long direction extends along the second direction Y, and the inlet flow hole 21 and the outlet flow hole 22 are each connected to the cooling slot 421, so that the cooling fluid 9 can flow into all the cooling slots 421 through the inlet flow hole 21, and the cooling fluid 9 in all the cooling slots 421 after absorbing heat can be discharged through the outlet flow hole 22. In this way, it is ensured that the cooling fluid 9 can flow into all the cooling slots 421 to absorb heat and then be discharged from the cooling slots 421, thereby improving the heat dissipation efficiency.

[0045] Furthermore, by virtue of the design that the outlet flow holes 22 are located at the opposite side of the inlet flow holes 21, the inlet flow holes 21 correspond to the middle part of each heat dissipation slot 421, and the outlet flow holes 22 correspond to the opposite sides of each heat dissipation slot 421, the cooling fluid 9 can flow into the middle part of each heat dissipation slot 421 through the inlet flow holes 21 and then evenly split and flow toward the left and right sides of each heat dissipation slot 421, and finally be discharged from the heat dissipation slot 421 and flow into the outlet flow holes 22. In this way, the time spent in the entire flow process of the cooling fluid 9 flowing from the inlet flow holes 21 into the heat dissipation slot 421 and being discharged from the corresponding outlet flow holes 22 after splitting can be shortened, so as to avoid the temperature rise of the cooling fluid 9 after absorbing heat affecting the heat dissipation effect, thereby effectively improving the heat dissipation efficiency.

[0046] By designing that the cooling fluid inlet hole 11 and the cooling fluid outlet hole 12 are spaced apart along the second direction Y, the cooling fluid inlet hole 11 and the cooling fluid outlet hole 12 are spaced apart from each other, so that the temperature of the cooling fluid 9 flowing into the cooling fluid inlet hole 11 can be reduced from being affected by the temperature of the cooling fluid 9 after absorbing heat discharged from the cooling fluid outlet hole 12, which causes the temperature to rise. By designing that the first short end 131 and the second short end 132 of the inlet channel 13 are spaced apart along the second direction Y and are respectively adjacent to the cooling fluid inlet hole 11 and the cooling fluid outlet hole 12, after the cooling fluid 9 flows into the inlet channel 13 from the cooling fluid inlet hole 11, it will flow from the first short end 131 to the second short end 132, so as to avoid the cooling fluid 9 flowing into the inlet channel 13 being immediately affected by the temperature of the cooling fluid 9 after absorbing heat flowing to the cooling fluid outlet hole 12, which causes the temperature to rise.

[0047] The U-groove-shaped design of the outlet channel 14 enables the outlet channel 14 to be connected to the outlet flow hole 22 and the cooling fluid outlet hole 12 and to be located between the outlet flow hole 22 and the cooling fluid outlet hole 12, thereby achieving the effect of converging the cooling fluid 9 discharged from the outlet flow hole 22 and then converging them to the cooling fluid outlet hole 12. In addition, the depth of the converging channel section 142 along the third direction Z is greater than the depth of each of the side channel sections 141 along the third direction Z, so that the cooling fluid 9 in the side channel section 141 can automatically flow toward the converging channel section 142 and converge into the converging channel section 142.

[0048] See also Figure 2 and Figure 3 The first sealing gasket 5 is arranged and tightly fitted between the substrate 1 and the guide plate 2 and surrounds the outer periphery of the inlet channel 13, and the second sealing gasket 6 is arranged and tightly fitted between the substrate 1 and the heat sink 4 and surrounds the outer periphery of the guide plate 2, so that the cooling fluid 9 can completely flow from the inlet channel 13 through the inlet flow hole 21 into the heat sink 421, and can completely flow from the heat sink 421 to the outlet channel 14 through the outlet flow holes 22 respectively, and will not overflow from the gap between the frame plate 3 and the substrate 1 and the gap between the frame plate 3 and the bottom surface of the heat sink 4.

[0049] See also Figure 1 , Figure 2 and Figure 3, through four fixing members 7 (such as screws but not limited thereto), each fixing member 7 is inserted through the corresponding through hole 43 and the corresponding through hole 31 and screwed into the corresponding screw hole 15, so that the heat sink 4 and the base plate 1 can have a clamping force to clamp the guide plate 2 and the first sealing gasket 5 and the second sealing gasket 6, and the frame plate 3 can position the guide plate 2 in the center of the heat sink 4 through the corresponding second sealing gasket 6. In this way, the base plate 1, the guide plate 2, the frame plate 3, the heat sink 4, the first sealing gasket 5, and the second sealing gasket 6 can be firmly fixed together.

[0050] See also Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 , is a second embodiment of the power module heat sink 100 of the utility model, and its overall structure is roughly the same as the first embodiment, except that the inlet flow hole 21 has a middle hole section 213 and two end hole sections 214 respectively connected to the opposite ends of the middle hole section 213. The end hole sections 214 respectively have the first short end 211 and the second short end 212. The width of the middle hole section 213 along the first direction X is greater than the width of each of the end hole sections 214 along the first direction X.

[0051] See also Fig.14 , which is the third embodiment of the power module heat dissipation device 100 of the utility model, and its overall structure is roughly the same as the first embodiment, except that the bottom surface 101 of the substrate 1 is recessed upward to form two cooling fluid outlet holes 12 arranged at intervals from each other along the first direction X, and the cooling fluid outlet holes 12 are spaced apart from the cooling fluid inlet hole 11.

[0052] See also Fig.15 , is the fourth embodiment of the power module heat sink 100 of the utility model, and its overall structure is roughly the same as the first embodiment, except that the inlet hole 21 has the middle hole section 213 and two end hole sections 214 respectively connected to the opposite ends of the middle hole section 213. The end hole sections 214 respectively have the first short end 211 and the second short end 212. The width of the inlet hole 21 along the first direction X gradually decreases from the middle of the middle hole section 213 toward the first short end 211 and the second short end 212.

[0053] It should be noted that in another embodiment of all the above-mentioned embodiments, the number of the outlet flow holes 22 and the number of the side flow channel sections 141 of the outlet flow channel 14 can also be one each, and the guide plate 2 can be designed so that the inlet flow hole 21 and the outlet flow hole 22 correspond to the opposite side of each heat dissipation slot 421 respectively, so that the cooling fluid 9 flows along the extension direction of each heat dissipation slot 421. In addition, in another embodiment of the above-mentioned first embodiment and the second embodiment, the number of the heat dissipation slot 421 can also be one. Furthermore, in another embodiment of the above-mentioned first embodiment and the second embodiment, as long as the maximum width of the inlet flow hole 21 along the first direction X is smaller than the maximum width of the inlet flow channel 13 along the first direction X, the shape of the inlet flow hole 21 is not limited to the above-mentioned embodiments.

[0054] It is particularly important to mention that the power module heat dissipation device 100 of the present invention can also be installed in power modules other than COB LEDs (such as MOSFET circuits), and is not limited to the above-mentioned embodiments.

[0055] In summary, the power module heat dissipation device 100 of each embodiment is designed in such a way that the inlet channel 13 and the outlet channel 14 of the substrate 1 respectively connect the cooling fluid inlet hole 11 and the cooling fluid outlet hole 12, the inlet hole 21 and the outlet hole 22 of the guide plate 2 respectively connect the inlet channel 13 and the outlet channel 14, and the heat dissipation slot 421 of the heat sink 4 connects the inlet hole 21 and the outlet hole 22, so as to separate the inlet path for the cooling fluid 9 to be guided into the heat sink 4 and the outlet path for the cooling fluid 9 to be guided out of the heat sink 4, thereby reducing the mutual influence of the cooling fluid 9 flowing in the aforementioned two paths, so that the cooling fluid 9 flowing into the heat dissipation slot 421 can dissipate heat to the heat sink 4 at a temperature lower than that of the cooling fluid 9 after absorbing heat discharged from the cooling fluid outlet hole 12, thereby effectively improving the heat dissipation efficiency of the power module heat dissipation device 100 for the power module, so that the purpose of the present utility model can be achieved.

[0056] However, the above is only an embodiment of the present invention and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made according to the claims and description of the present invention are still within the scope of the present invention.

Claims

1. A power module heat dissipation device, characterized in that: The power module heat dissipation device comprises: A substrate is formed with a cooling fluid inlet hole and a cooling fluid outlet hole spaced apart from each other, an inlet channel connected to the cooling fluid inlet hole, and an outlet channel connected to the cooling fluid outlet hole; A guide plate, attached to the substrate and formed with an inlet flow hole and at least one outlet flow hole spaced apart from each other, wherein the inlet flow hole and the outlet flow hole penetrate the guide plate and are respectively connected to the inlet flow channel and the outlet flow channel; and The heat dissipation plate is attached to a side of the guide plate opposite to the substrate, and the heat dissipation plate is formed with at least one heat dissipation groove, and the heat dissipation groove is connected to the inlet flow hole and the outlet flow hole.

2. The power module heat dissipation device according to claim 1, characterized in that: The heat dissipation slot is in the shape of a long slot and its length direction extends along a first direction. The inlet flow holes and the outlet flow holes of the guide plate are arranged at intervals along the first direction.

3. The power module heat dissipation device according to claim 2, characterized in that: The heat sink is formed with a plurality of heat dissipation grooves arranged at intervals along a second direction, the second direction is perpendicular to the first direction, the inlet flow hole and the outlet flow hole are each in the shape of a long hole and their long direction extends along the second direction, and the inlet flow hole and the outlet flow hole are each connected to the heat dissipation groove.

4. The power module heat dissipation device according to claim 3, characterized in that: The guide plate is formed with two outlet flow holes which are spaced apart and located on opposite sides of the inlet flow hole, the inlet flow hole corresponds to the middle part of each heat dissipation slot, and the outlet flow holes correspond to opposite sides of each heat dissipation slot along the longitudinal extension direction of the heat dissipation slot.

5. The power module heat dissipation device according to claim 4, characterized in that: The inlet flow hole has a first short end portion adjacent to the cooling fluid inlet hole, and a second short end portion spaced apart from the first short end portion of the inlet flow hole along the second direction, and a width of the first short end portion of the inlet flow hole along the first direction is smaller than a width of the second short end portion of the inlet flow hole along the first direction.

6. The power module heat dissipation device according to claim 3, characterized in that: The cooling fluid inlet hole and the cooling fluid outlet hole are spaced apart along the second direction, and the inlet channel is in the shape of a long groove and its length extends along the second direction.

7. The power module heat dissipation device according to claim 6, characterized in that: The guide plate is formed with two outlet flow holes which are spaced apart and located on opposite sides of the inlet flow hole. The outlet flow channel is U-groove-shaped and has two side flow channel sections and a confluence channel section connected to the side flow channel sections. The side flow channel sections are respectively connected to the outlet flow holes, and the confluence channel section is connected to the outlet flow hole and the cooling fluid outlet hole.

8. The power module heat dissipation device according to claim 7, characterized in that: A depth of the confluence channel section along a third direction is greater than a depth of each of the side channel sections along the third direction, and the third direction is perpendicular to the first direction and the second direction.

9. The power module heat dissipation device according to claim 1, characterized in that: The inlet flow holes and the outlet flow holes of the guide plate are arranged at intervals along a first direction, the cooling fluid inlet holes and the cooling fluid outlet holes are arranged at intervals along a second direction, and the second direction forms an angle with the first direction.

10. The power module heat dissipation device according to claim 1, characterized in that: The maximum width of the inlet flow hole along the first direction is smaller than the maximum width of the inlet channel along the first direction.

11. The power module heat dissipation device according to claim 1, characterized in that: The power module heat dissipation device further includes a first sealing gasket, which is disposed between the substrate and the guide plate and surrounds the outer periphery of the inlet channel.

12. The power module heat dissipation device according to claim 1, characterized in that: The power module heat dissipation device further includes a frame plate, and a second sealing gasket, wherein the frame plate is arranged between the substrate and the heat dissipation plate and surrounds the outer periphery of the guide plate, and the second sealing gasket is arranged between the substrate and the heat dissipation plate and surrounds the outer periphery of the guide plate.

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