Power amplifier and power amplification device

Abstract

The utility model discloses a power amplifier and a power amplification device. The power amplifier comprises a packaging piece, wherein a carrier power amplifier module, at least one peak power amplifier module, an input pre-matching module and an output matching module are packaged in the packaging piece; wherein the input pre-matching module is electrically connected with the input end of the carrier power amplifier module and the input end of the peak power amplifier module, and the output matching module is electrically connected with the output end of the carrier power amplifier module and the output end of the peak power amplifier module. According to the utility model, the debugging flexibility of the power amplifier can be improved, and the debugging sensitivity is reduced.

Description

Technical Field

[0001] The utility model relates to the field of electronic technology, in particular to a power amplifier and a power amplifier device. Background Art

[0002] Power amplifiers, such as Doherty architecture power amplifiers, have higher power back-off efficiency and are more suitable for working environments with high peak-to-average ratio signals. Therefore, they have important applications in modern 5G communications and other technical fields.

[0003] However, the existing power amplifier design has problems such as unstable RF performance and high matching sensitivity. At the same time, the design is relatively complicated, and the size is limited, resulting in low gain and low debugging flexibility. Utility Model Content

[0004] The utility model provides a power amplifier and a power amplifier device, so as to improve the debugging flexibility of the power amplifier and reduce the debugging sensitivity.

[0005] According to one aspect of the utility model, a power amplifier is provided, the power amplifier comprising a package, the package encapsulating a carrier power amplifier module, at least one peak power amplifier module, an input pre-matching module and an output matching module;

[0006] The input pre-matching module is electrically connected to the input ends of the carrier power amplifier module and the peak power amplifier module, and the output matching module is electrically connected to the output ends of the carrier power amplifier module and the peak power amplifier module.

[0007] Optionally, the package further includes a substrate, and the carrier power amplifier module, the peak power amplifier module, the input pre-matching module and the output matching module are arranged on the substrate.

[0008] Optionally, the input pre-matching module is an integrated passive device.

[0009] Optionally, the integrated passive device includes a GaAs substrate, a metal layer and an insulating layer arranged on the GaAs substrate; the input pre-matching module includes a resistor, a capacitor, an inductor and a transmission line formed by the metal layer and the insulating layer.

[0010] Optionally, the output matching module includes one or more devices selected from the group consisting of resistors, transmission lines, capacitors and inductors fabricated on the surface of the substrate.

[0011] Optionally, the substrate is an organic substrate.

[0012] Optionally, the input pre-matching module includes a first input pre-matching unit electrically connected to the carrier power amplifier module, and at least one second input pre-matching unit electrically connected to the at least one peak power amplifier module in a one-to-one correspondence.

[0013] According to another aspect of the present invention, a power amplification device is provided, comprising an input matching module and the power amplifier as described above; the input matching module is electrically connected to the input pre-matching module.

[0014] Optionally, the power amplifying device includes a printed circuit board, and the input matching module and the power amplifier are arranged on the printed circuit board.

[0015] Optionally, the input matching module is composed of discrete components arranged on the printed circuit board.

[0016] The technical solution of the embodiment of the utility model adopts a power amplifier including a package, wherein the package encapsulates a carrier power amplifier module, at least one peak power amplifier module, an input pre-matching module and an output matching module; wherein the input pre-matching module is electrically connected to the input ends of the carrier power amplifier module and the peak power amplifier module, and the output matching module is electrically connected to the output ends of the carrier power amplifier module and the peak power amplifier module. A semi-integrated approach is adopted, that is, the input pre-matching module and the output matching module are integrated in the package, so that the matching sensitivity can be optimized. The input matching module is not integrated in the package, but is a discrete component relative to the package, and its design flexibility can be used to obtain a higher gain, and the design complexity is greatly reduced compared to the fully integrated design solution.

[0017] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of the structure of a power amplifier provided by an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of a power amplifier device provided in an embodiment of the utility model;

[0021] Figure 3 A cross-sectional view of a power amplifier provided by an embodiment of the utility model;

[0022] Figure 4 A cross-sectional view of a power amplifier device provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0024] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0025] Figure 1 A schematic diagram of the structure of a power amplifier provided by an embodiment of the utility model is shown in FIG. Figure 2 A schematic diagram of a power amplifier device provided by an embodiment of the utility model, referring to Figure 1 and Figure 2 The power amplifier includes a package 1, which encapsulates a carrier power amplifier module 12, at least one peak power amplifier module 13, an input pre-matching module 11 and an output matching module 14; wherein the input pre-matching module 11 is electrically connected to the input ends of the carrier power amplifier module 12 and the peak power amplifier module 13, and the output matching module 14 is electrically connected to the output ends of the carrier power amplifier module 12 and the peak power amplifier module 13.

[0026] Specifically, the power amplifier of this embodiment is used to prepare a power amplifier device, and a complete Doherty architecture power amplifier is formed by connecting the input pre-matching module 11 to the external input matching module 2. Of course, structures such as power dividers can also be connected. Among them, the input pre-matching module 11 can realize the pre-matching between the power amplifier module and the front-stage circuit. For example, if the input impedance of the power amplifier module is 1 ohm, and it needs to be matched to 50 ohms, the input impedance can be matched to a value between 1 ohm and 50 ohms through the input pre-matching module 11, for example, matched to 10 ohms, and then matched to 50 ohms through the input matching module 2. The complexity of the input matching module 2 can be reduced by setting the input pre-matching module 11. The specific circuit structure of the Doherty architecture power amplifier is well known to those skilled in the art. For example, each power amplifier module includes a power transistor, an output matching module 14 for realizing output impedance matching (such as matching to 50 ohms), etc., and its specific working principle is not repeated here. This embodiment only explains the integration method of the Doherty architecture power amplifier.

[0027] In the related art, the impedance matching of the Doherty architecture power amplifier adopts discrete components or fully integrated devices. In the discrete component design, the input matching module and the output matching module are not encapsulated inside the package 1, but are arranged outside the package in the form of discrete components. However, such a design has problems such as long wiring length and more connection points between discrete components and integrated devices, and between discrete components, so the consistency of different power amplifiers is low, and certain device stability problems will occur. In the fully integrated device design, the input matching module and the output matching module are integrated inside the package. Although it can achieve small size, high integration, good stability and other effects, but because of the small size, its design is more complicated, and the values ​​of internal components cannot be flexibly adjusted, which makes the gain of the power amplifier low.

[0028] In this embodiment, a semi-integrated approach is adopted, that is, the input pre-matching module 11 and the output matching module 14 are integrated in the package 1, so that the matching sensitivity can be optimized and the debugging sensitivity is low. The input matching module 2 is not integrated in the package 1, but is a discrete component relative to the package 1, and its design flexibility can be used to obtain a higher gain, and the design complexity is greatly reduced compared to the fully integrated design solution, that is, the debugging flexibility can be greatly improved.

[0029] In addition, the matching performance of the output matching module has a greater impact on the stability of the performance of the power amplifier tube in the power amplifier module. In this embodiment, the semi-integrated design is that the output matching module 14 is integrated and the input matching module 2 is discrete, rather than the input matching module 2 being integrated and the output matching module 14 being discrete. This setting can maximize the stability, sensitivity and consistency of the performance of the power amplifier tube in the power amplifier module.

[0030] The technical solution of this embodiment adopts a power amplifier including a package, wherein the package encapsulates a carrier power amplifier module, at least one peak power amplifier module, an input pre-matching module and an output matching module; wherein the input pre-matching module is electrically connected to the input ends of the carrier power amplifier module and the peak power amplifier module, and the output matching module is electrically connected to the output ends of the carrier power amplifier module and the peak power amplifier module. A semi-integrated approach is adopted, i.e., the input pre-matching module and the output matching module are integrated in the package, so that the matching sensitivity can be optimized, that is, the debugging sensitivity can be reduced. The input matching module is not integrated in the package, but is a discrete component relative to the package, and its design flexibility can be used to obtain a higher gain, and the design complexity is greatly reduced compared to the fully integrated design solution, that is, the debugging flexibility can be improved.

[0031] Alternatively, if Figure 1 and Figure 2 As shown, the input pre-matching module 11 includes a first input pre-matching unit 111 electrically connected to the carrier power amplifier module 12 and a second input pre-matching unit 112 electrically connected to at least one peak power amplifier module 13 in a one-to-one correspondence.

[0032] Specifically, the first input pre-matching unit 111 may include one or more of a capacitor, a resistor, an inductor, and a transmission line, and the first input pre-matching unit 111 is used for input impedance pre-matching of the carrier power amplifier module 12. The second input pre-matching unit 112 may also include one or more of a capacitor, a resistor, an inductor, and a transmission line, and the second input pre-matching unit 112 is used for input impedance pre-matching of the peak power amplifier module 13. The structures of the first input pre-matching unit 111 and the second input pre-matching unit 112 may be completely the same.

[0033] Optionally, Figure 3 A cross-sectional view of a power amplifier provided by an embodiment of the utility model, referring to Figure 3 The package further includes a substrate 20 , on which the carrier power amplifier module 12 , the peak power amplifier module 13 , the input pre-matching module 11 and the output matching module 14 are disposed.

[0034] Specifically, the package may include a substrate 20 and a package shell 21, and the material of the package shell 21 is, for example, ceramic or plastic. On the one hand, the substrate 20 may carry the carrier power amplifier module 12, the peak power amplifier module 13, the input pre-matching module 11, and the output matching module 14; on the other hand, a wiring layer may be provided inside the substrate 20, and each module realizes electrical connection between modules and / or between components inside the module through the wiring layer.

[0035] Optionally, the substrate 20 can be divided into an organic substrate, an inorganic substrate, a composite substrate, etc. according to the electrical insulation or mechanical support material. The substrate 20 can adopt any of the above substrates. Preferably, the substrate 20 can adopt an organic substrate, so as to achieve high performance, high reliability, high frequency, thinness, high thermal conductivity, etc.

[0036] Furthermore, in the above-mentioned embodiment, the output matching module 14 includes one or more devices of resistors, capacitors, inductors and transmission lines made on the surface of the substrate 20. In this embodiment, the substrate 20 can be understood as a PCB (Printed Circuit Board) with higher performance or special functions. The various components of the output matching module 14 are directly made on the substrate 20. Since the output side of the power amplifier module has a higher voltage, the configuration of this embodiment enables the output matching module 14 to achieve the matching function using the material of the substrate 20, and thus can withstand higher voltages and currents. Therefore, in this embodiment, the various components of the output matching module 14 are directly made on the substrate 20, so that the output matching module can obtain better voltage resistance and current resistance; and compared with the use of integrated passive devices (IPD), the loss is relatively low.

[0037] Further, continue to refer to Figure 3 , the input pre-matching module 11 is an integrated passive device. Compared with the output matching module 14, the voltage and current that the input pre-matching module 11 needs to carry are smaller. The cost required to directly manufacture components on the substrate 20 is higher, while the cost required to integrate them on an integrated passive device and then bond them to the substrate 20 is lower. Therefore, in this embodiment, the input pre-matching module 11 is set as an integrated passive device, and the components in the output matching module are directly manufactured on the substrate 20, which can reduce costs and improve the stability of the power amplifier.

[0038] Furthermore, if Figure 3 As shown, the integrated passive device includes a GaAs substrate, a metal layer and an insulating layer arranged on the GaAs substrate; the input pre-matching module includes a resistor, a capacitor, an inductor and a transmission line formed by the metal layer and the insulating layer.

[0039] Specifically, the insulating layer is, for example, a SiN insulating layer, and the capacitors (such as DC blocking capacitors, filter capacitors, etc.) in the input pre-matching module 11 can be formed by metal layers and insulating layers between the metal layers. Resistors, inductors, and transmission lines can all be formed by various metal layers. It is understandable that the substrate can also be a substrate of other materials.

[0040] The utility model also provides a power amplifier device, such as Figure 2 As shown. The power amplifier device includes an input matching module 2 and a power amplifier provided by any embodiment of the utility model; the input matching module 2 is electrically connected to the input pre-matching module 11. The input end of the input matching module 2 serves as the input end of the power amplifier device. Of course, the input end of the input matching module 2 can also be connected to a power divider. The output end of the output matching module can also be connected to a combiner, etc. The input matching module 2 may specifically include resistors, capacitors, inductors, and transmission lines, etc. The input matching module 2 is separately arranged from the power amplifier, and the power amplifier device adopts a semi-integrated manner, that is, the input pre-matching module and the output matching module are integrated in the package, so as to optimize the matching sensitivity. The input matching module is not integrated in the package, but is a discrete component relative to the package. Its design flexibility can be used to obtain a higher gain, and the design complexity is greatly reduced compared to the fully integrated design solution.

[0041] Optionally, Figure 4 A cross-sectional view of a power amplifier device provided in an embodiment of the utility model, referring to Figure 2 and Figure 4 The power amplifier device includes a printed circuit board 30, and the input matching module 2 and the power amplifier are arranged on the printed circuit board 30. The input matching module 2 is composed of discrete components and is arranged on the printed circuit board 30. The printed circuit board 30 may include at least one wiring layer, and the components in the input matching module 2 are electrically connected through the wiring layer. Since the input matching module 2 is not integrated in the package, its design is more flexible and the area occupied can be larger, so that a higher gain and bandwidth can be obtained, so that the power amplifier device has higher compatibility and lower cost, that is, it can be applied to more scenarios.

[0042] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0043] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A power amplifier, characterized in that: The power amplifier comprises a package, wherein the package encapsulates a carrier power amplifier module, at least one peak power amplifier module, an input pre-matching module and an output matching module; The input pre-matching module is electrically connected to the input ends of the carrier power amplifier module and the peak power amplifier module, and the output matching module is electrically connected to the output ends of the carrier power amplifier module and the peak power amplifier module.

2. The power amplifier according to claim 1, characterized in that: The package also includes a substrate, and the carrier power amplifier module, the peak power amplifier module, the input pre-matching module and the output matching module are arranged on the substrate.

3. The power amplifier according to claim 2, characterized in that: The input pre-matching module is an integrated passive device.

4. The power amplifier according to claim 3, characterized in that: The integrated passive device comprises a GaAs substrate, a metal layer and an insulating layer arranged on the GaAs substrate; the input pre-matching module comprises a resistor, a capacitor, an inductor and a transmission line formed by the metal layer and the insulating layer.

5. The power amplifier according to claim 2, characterized in that: The output matching module includes one or more devices of resistors, transmission lines, capacitors and inductors manufactured on the surface of the substrate.

6. The power amplifier according to claim 2, characterized in that: The substrate is an organic substrate.

7. The power amplifier according to claim 1, characterized in that: The input pre-matching module includes a first input pre-matching unit electrically connected to the carrier power amplifier module, and at least one second input pre-matching unit electrically connected to the at least one peak power amplifier module in a one-to-one correspondence.

8. A power amplifier device, characterized in that: The power amplification device comprises an input matching module and the power amplifier according to any one of claims 1 to 7; the input matching module is electrically connected to the input pre-matching module.

9. The power amplifier device according to claim 8, characterized in that: The power amplifying device comprises a printed circuit board, and the input matching module and the power amplifier are arranged on the printed circuit board.

10. The power amplifier device according to claim 9, characterized in that: The input matching module is composed of discrete components arranged on the printed circuit board.

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