Liquid cooling system and electronic equipment
By setting multiple heat dissipation spaces in parallel in the liquid cooling system and controlling the coolant flow rate according to the power configuration, the problems of rising coolant temperature and poor heat dissipation effect in traditional liquid cooling systems are solved, and the safety of power devices is improved.
Patent Information
- Application Number
- CN202323614433.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-27
AI Technical Summary
In traditional liquid cooling systems, the temperature rises after the coolant flows through high-power components, and the temperature difference becomes smaller when flowing through low-power components, resulting in poor heat dissipation effect of low-power components, which poses a risk of over-temperature, reducing the safety of power devices' use .
Design a liquid cooling system, and at least two heat dissipation spaces are arranged in parallel along the direction of coolant flow. The coolant flow rate of each heat dissipation space is positively correlated with the power of the corresponding power device. The coolant flow rate is controlled through the shunt plate and the flow guide assembly to ensure that High-power devices are equipped with large flow, and low-power devices are equipped with small flow to achieve balanced heat dissipation.
Through this design, both high-power and low-power devices can dissipate heat through coolant with lower temperatures, improving the safety of power devices and avoiding the risk of overtemperature.
Smart Images
Figure CN222192869U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat exchange, in particular to a liquid cooling system and electronic equipment. Background Art
[0002] In a conventional liquid cooling system, heat exchange components are arranged in series along the flow direction of the coolant. For example, the coolant first flows through the main high-power power components and then exchanges heat with other low-heat power components.
[0003] However, in realizing the above-mentioned heat exchange process, the inventor of the utility model discovered that there are at least the following problems in the prior art: after the coolant flows through the high-power power component, the temperature of the coolant rises, and then flows through the low-power power component, the temperature difference between the coolant and the low-power power component becomes smaller, the low-power power component has poor heat dissipation effect, and there is a risk of overheating, which in turn reduces the safety of the power device.
[0004] Therefore, how to improve the safety of power devices is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0005] The purpose of the utility model is to provide a liquid cooling system to improve the safety of power devices. Another purpose of the utility model is to provide an electronic device including the liquid cooling system.
[0006] The present application provides a liquid cooling system, including a liquid cooling cabinet, in which at least two heat dissipation spaces are arranged in parallel along the flow direction of the coolant, and the coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space.
[0007] Optionally, the above-mentioned liquid cooling system further includes a diverter plate installed in the inner cavity of the liquid cooling cabinet, and the diverter plate is provided with corresponding liquid inlets for the coolant to flow into different heat dissipation spaces.
[0008] Optionally, the above liquid cooling system further includes a flow guide assembly, which includes a flow guide tube and a flow guide plate whose one end is connected to the liquid outlet end of the flow guide tube, and the liquid inlet end of the flow guide tube is connected to one of the liquid inlets.
[0009] Optionally, in the above liquid cooling system, the guide plate is a U-shaped structure that opens upward.
[0010] Optionally, in the above liquid cooling system, the inner cavity of the guide tube is a cylindrical cavity structure, and the liquid inlet connected to the guide tube is set to be a circular structure with the same diameter as the cylindrical cavity structure and the edges are sealed and connected.
[0011] Optionally, in the above-mentioned liquid cooling system, a corresponding device accommodating cavity for accommodating the second power device is formed between the outer wall of the guide plate and the inner wall of the liquid cooling cabinet.
[0012] Optionally, in the above liquid cooling system, the cooling liquid inlet is located at the bottom end of the liquid cooling cabinet, and the cooling liquid outlet is located at the top end of the liquid cooling cabinet.
[0013] Optionally, the above liquid cooling system further includes a confluence space, which is located downstream of the heat dissipation space along the flow direction of the cooling liquid and is communicated with the heat dissipation space.
[0014] Optionally, in the above-mentioned liquid cooling system, the cooling liquid inlet and the cooling liquid outlet arranged on the liquid cooling cabinet are both arranged on the side wall of the liquid cooling cabinet.
[0015] The present application provides an electronic device, including a power device and a liquid cooling system as described above, wherein the power device is installed in a heat dissipation space.
[0016] In the above technical scheme, the liquid cooling system provided by the utility model includes a liquid cooling cabinet, in which at least two heat dissipation spaces are arranged in parallel along the flow direction of the coolant, and the coolant flow rates of different heat dissipation spaces are different, so as to dissipate heat for different power devices, and high-power power devices are configured with a heat dissipation space with a large coolant flow rate, and low-power power devices are configured with a heat dissipation space with a small coolant flow rate.
[0017] At least it can be known from the above description that in the liquid cooling system provided in the present application, the coolant flow rate of the heat dissipation space corresponds to the power configuration of the power device, and the heat dissipation spaces are arranged in parallel, so that both high-power devices and low-power devices dissipate heat through coolant with lower temperature, and by controlling the flow rate, the heat dissipation of power devices with higher power is guaranteed, thereby improving the safety of power device use. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0019] Figure 1 A schematic diagram of the structure of a liquid cooling system provided by an embodiment of the utility model;
[0020] Figure 2 A diagram showing the installation position of the flow guide assembly provided in the embodiment of the utility model;
[0021] Figure 3This is a schematic structural diagram of a diverter plate provided in an embodiment of the utility model.
[0022] in Figure 1-3 In: 1-coolant outlet, 2-server hard disk, 3-second power device, 4-coolant inlet, 5-server power supply, 6-first power device, 7-guide assembly, 8-dividing plate, 9-liquid inlet channel, 10-first liquid inlet, 11-second liquid inlet, 12-guide tube, 13-guide plate, 14-first device accommodating cavity, 15-convergence space. DETAILED DESCRIPTION
[0023] The core of the utility model is to provide a liquid cooling system to improve the safety of power devices. Another core of the utility model is to provide an electronic device including the liquid cooling system.
[0024] Please refer to Figures 1 to 3 .
[0025] In a specific embodiment, the liquid cooling system provided by the utility model includes a liquid cooling cabinet, and at least two heat dissipation spaces are arranged in parallel along the flow direction of the coolant in the liquid cooling cabinet. The heat dissipation spaces can be two, three or at least four.
[0026] The coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space. Specifically, the liquid cooling cabinet is provided with at least two heat dissipation spaces arranged in parallel along the coolant flow direction, and the coolant flow rates of different heat dissipation spaces are different, so as to dissipate heat for different power devices, and high-power power devices are configured with a heat dissipation space with a large coolant flow rate, and low-power power devices are configured with a heat dissipation space with a small coolant flow rate.
[0027] The shape and size of the heat dissipation space are determined according to the size of the power device installed inside, and this application does not make any specific restrictions.
[0028] From the above description, it can be seen that in the liquid cooling system provided in the specific embodiment of the present application, the coolant flow rate of the heat dissipation space corresponds to the power configuration of the power device, and the heat dissipation space is arranged in parallel, so that both high-power devices and low-power devices dissipate heat through coolant with lower temperature, and by controlling the flow rate, and then controlling the coolant flow rate, it is ensured that the power device with higher power dissipates heat, thereby improving the safety of the power device.
[0029] Preferably, the ratio of the power of the power device in each heat dissipation space to the coolant flow rate in the corresponding heat dissipation space is the same. For example, the ratio of the first power device 6 to the coolant flow rate in the first heat dissipation space corresponding to the first power device 6 is the same as the ratio of the second power device 3 to the coolant flow rate in the second heat dissipation space corresponding to the second power device 3. This arrangement allows the power devices in each heat dissipation space to dissipate heat in a balanced manner.
[0030] In a specific embodiment, the two heat dissipation spaces are respectively a first heat dissipation space and a second heat dissipation space, and the flow rate of the coolant in the first heat dissipation space is greater than the flow rate of the coolant in the second heat dissipation space. A coolant inlet 4 and a coolant outlet 1 are provided on the liquid cooling cabinet, and specifically, the coolant inlet 4 and the coolant outlet 1 are respectively arranged at two ends of the liquid cooling cabinet.
[0031] In order to facilitate the placement of the liquid cooling cabinet, the cooling liquid inlet 4 and the cooling liquid outlet 1 are both arranged on the side wall of the liquid cooling cabinet. Specifically, the cooling liquid inlet 4 is located at the bottom end of the liquid cooling cabinet, and the cooling liquid outlet 1 is located at the top end of the liquid cooling cabinet.
[0032] The first heat dissipation space is used to dissipate heat for the first power device 6, and the second heat dissipation space is used to dissipate heat for the second power device 3. The power of the first power device 6 is greater than the power of the second power device 3. Specifically, the first power device 6 includes but is not limited to a server chip, and the second power device 3 includes but is not limited to a server memory.
[0033] When a liquid cooling system is required, a corresponding heat dissipation space is set according to the location of the power device.
[0034] It can be seen from the above description that in the liquid cooling system provided in the specific embodiment of the present application, since the first heat dissipation space and the second heat dissipation space are arranged in parallel, the first power device 6 and the second power device 3 can both dissipate heat through the coolant with a lower temperature, and by controlling the flow rate, and then the coolant flow rate, it is ensured that the power device with higher power dissipates heat, thereby improving the safety of the power device.
[0035] In a specific embodiment, the liquid cooling system further comprises a diverter plate 8 installed in the inner cavity of the liquid cooling cabinet, and the diverter plate 8 is provided with corresponding liquid inlets for the coolant to flow into different heat dissipation spaces.
[0036] Specifically, a liquid inlet channel 9 is formed between the diverter plate 8 and the coolant inlet 4 in the inner cavity of the liquid cooling cabinet. The diverter plate 8 is provided with a first liquid inlet 10 for the coolant to flow into the first heat dissipation space and a second liquid inlet 11 for the coolant to flow into the second heat dissipation space.
[0037] like Figure 1As shown, the liquid inlet channel 9 is located at the bottom end of the liquid cooling cabinet. Preferably, according to the flow direction of the coolant in the liquid inlet channel, the first liquid inlet 10 is located downstream of the second liquid inlet 11. That is, the coolant entering the liquid cooling cabinet first flows to the position of the second liquid inlet 11, and then flows to the position of the first liquid inlet 10. Since the coolant flow in the first heat dissipation space corresponding to the first liquid inlet 10 is greater than the coolant flow in the second heat dissipation space corresponding to the second liquid inlet, in order to control the coolant flow in the first heat dissipation space to be greater than the second heat dissipation space, the size of the corresponding liquid inlet is usually adjusted. For example, the size of the first liquid inlet 10 is greater than the size of the second liquid inlet 11. In order to make the coolant flow smoothly to the second heat dissipation space, the first liquid inlet 10 is set downstream of the second liquid inlet 11 to ensure that the second heat dissipation space is filled with liquid, that is, to facilitate the coolant to flow into the second heat dissipation space through the second liquid inlet 11.
[0038] The shapes and sizes of the first liquid inlet 10 and the second liquid inlet 11 can be designed according to actual needs, and are not limited in the present invention. To facilitate processing and coolant flow, preferably, the first liquid inlet 10 and / or the second liquid inlet 11 is a circular hole structure.
[0039] In a specific embodiment, the liquid cooling system also includes a flow guide assembly 7, which includes a flow guide tube 12 and a flow guide plate 13 having one end connected to the liquid outlet end of the flow guide tube 12, and the liquid inlet end of the flow guide tube 12 is connected to one of the liquid inlets. Specifically, the power device is installed on the flow channel formed by the flow guide tube 12 and the flow guide plate 13.
[0040] like Figure 2 and Figure 3 As shown, the guide tube 12 is connected to the first liquid inlet 10. A first device accommodating cavity 14 for accommodating the first power device 6 is formed between the inner wall of the guide plate 13 and the inner wall of the liquid cooling cabinet, and the cross-sectional area of the liquid inlet end of the first device accommodating cavity 14 gradually increases along the direction perpendicular to the flow of the coolant.
[0041] Specifically, the guide plate 13 is a U-shaped structure that opens upward. To facilitate assembly, preferably, the guide plate 13 is an integrally formed structure, which can be specifically formed by injection molding or by bending a plate.
[0042] Specifically, the inner cavity of the guide tube 12 is a cylindrical cavity structure, and the liquid inlet connected to the guide tube 12 is set to a circular structure with the same diameter as the cylindrical cavity structure and sealed at the edge. Specifically, the first liquid inlet 10 has the same diameter as the cylindrical cavity structure and is sealed at the edge. By setting the guide tube 12, it is convenient to quickly guide the coolant to the guide plate 13 position, thereby facilitating the heat dissipation of the first power device 6.
[0043] Specifically, a second device accommodating cavity for accommodating the second power device 3 is formed between one side of the guide plate 13 and the inner wall of the liquid cooling cabinet, that is, the present application can realize cooling liquid diversion by adding a diverter plate 8 and a guide assembly 7 inside a traditional liquid cooling cabinet.
[0044] In a specific embodiment, the liquid cooling system further includes a confluence space 15, which is located downstream of the first heat dissipation space and the second heat dissipation space along the flow direction of the coolant, and is connected to the first heat dissipation space and the second heat dissipation space. In specific use, a power device can be arranged in the confluence space 15. Specifically, preferably, the power device placed in this position has a low heat dissipation requirement and almost no heat dissipation structure is required. Specifically, the confluence space 15 can be placed including but not limited to a server hard disk 2 and a server power supply 5.
[0045] For ease of understanding, the cooling method of the liquid cooling system is explained below in conjunction with a specific working method. When the liquid cooling system is working, the coolant enters the liquid inlet channel 9 from the coolant inlet 4, and enters each heat dissipation space through the diversion of the diverter plate 8, for example, enters the inside of the server. The diverter plate 8 is provided with holes of different sizes with different hole areas, specifically, including a first liquid inlet 10 and a second liquid inlet 11. The positions and hole areas of the first liquid inlet 10 and the second liquid inlet 11 are determined according to the positions and power consumption of the power devices in each heat dissipation space. Preferably, along the flow direction of the coolant in the heat dissipation space, the liquid inlet hole of each heat dissipation space is directly opposite to the power device in the corresponding heat dissipation space, so as to dissipate the power device in time.
[0046] After being diverted by the diverter plate 8 , most of the coolant flows into the first liquid inlet 10 of the diverter plate 8 , and is transported to the high-power power devices of the server via the guide assembly 7 .
[0047] A small portion of the flow flows into the server through the second liquid inlet 11 of the server to cool the low-power power devices inside the server.
[0048] After the coolant takes away the heat of each power device inside the server, it finally flows out from the coolant outlet 1. Specifically, the coolant outlet 1 can be an overflow port arranged at the top of the liquid cooling cabinet.
[0049] Since the flow path between the first power device and the second power device of the present application is in a parallel relationship, the coolant can directly cool the low-power device, and there is no flow dead zone in the server, that is, there is no risk of overheating of the electronic devices inside the liquid cooling cabinet, which is convenient for wide promotion and use.
[0050] The present application provides an electronic device, including a power device and any one of the above-mentioned liquid cooling systems, wherein the power device is installed in a heat dissipation space. The above-mentioned specific structure of the liquid cooling system is described, and the present application includes the above-mentioned liquid cooling system, and also has the above-mentioned technical effects.
[0051] The design of the utility model meets the heat dissipation requirements of various power components, and the redundant design without flow saves the energy consumption of the system.
[0052] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0053] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A liquid cooling system, It is characterized in that It comprises a liquid cooling cabinet and a confluence space (15), wherein at least two heat dissipation spaces are arranged in parallel in the liquid cooling cabinet along the flow direction of the coolant, and the coolant flow rate in each heat dissipation space is positively correlated with the power of the power device in the corresponding heat dissipation space; Along the flow direction of the coolant, the confluence space (15) is located downstream of the heat dissipation space and is communicated with the heat dissipation space.
2. The liquid cooling system according to claim 1, It is characterized in that It also includes a flow divider (8) installed in the inner cavity of the liquid cooling cabinet, and the flow divider (8) is provided with corresponding liquid inlets for the coolant to flow into different heat dissipation spaces.
3. The liquid cooling system according to claim 2, It is characterized in that It also comprises a flow guide assembly (7), the flow guide assembly (7) comprising a flow guide tube (12) and a flow guide plate (13) one end of which is connected to the liquid outlet end of the flow guide tube (12), and the liquid inlet end of the flow guide tube (12) is connected to one of the liquid inlets.
4. The liquid cooling system according to claim 3, It is characterized in that The guide plate (13) is a U-shaped structure that opens upward.
5. The liquid cooling system according to claim 3, It is characterized in that The inner cavity of the guide tube (12) is a cylindrical cavity structure, and the liquid inlet connected to the guide tube (12) is configured as a circular structure having the same diameter as the cylindrical cavity structure and having its edges sealed.
6. The liquid cooling system according to claim 3, It is characterized in that A corresponding device accommodating cavity for accommodating a second power device (3) is formed between the outer wall of the guide plate (13) and the inner wall of the liquid cooling cabinet.
7. The liquid cooling system according to claim 2, It is characterized in that The cooling liquid inlet (4) is located at the bottom end of the liquid cooling cabinet, and the cooling liquid outlet (1) is located at the top end of the liquid cooling cabinet.
8. The liquid cooling cabinet according to claim 1, It is characterized in that The cooling liquid inlet (4) and the cooling liquid outlet (1) arranged on the liquid cooling cabinet are both arranged on the side wall of the liquid cooling cabinet.
9. An electronic device comprising a power device, It is characterized in that It also includes a liquid cooling system as claimed in any one of claims 1 to 8, wherein the power device is installed in the heat dissipation space.