Aluminum sheet heat dissipation mechanism for inverter

Abstract

The utility model relates to the technical field of heat dissipation mechanisms for inverters, and discloses an aluminum sheet heat dissipation mechanism for inverters, which comprises a mounting aluminum plate, a flow guide block positioned at the middle position of the top of the mounting aluminum plate and a protective cover positioned at the top of the mounting aluminum plate, and is characterized in that the flow guide block comprises a plurality of groups of heat dissipation fins arranged at the bottoms of two sides of the flow guide block; the air inlet groove is formed in the middle of the top of the protective cover, a mounting groove is formed in one side of the air inlet groove, and a semiconductor refrigerator is arranged at the position, close to one side of the mounting groove, of the air inlet groove. Wind power generated by the fan, the air inlet pipe and the air outlet pipe is conveyed into the air inlet groove, low temperature is generated through the semiconductor cooler and the temperature conduction copper sheet, the wind power forms cold air through the temperature conduction copper sheet, and the cold air is conveyed into the heat dissipation fins on the two sides of the flow guide block through the air guide grooves in the two sides of the flow guide block. Therefore, the heat on the heat dissipation fins can be quickly conducted out, and the heat dissipation efficiency of the inverter is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation mechanisms for inverters, in particular to an aluminum sheet heat dissipation mechanism for inverters. Background Art

[0002] An inverter is a converter that converts DC power into constant frequency and voltage or frequency and voltage regulated AC power. It consists of an inverter bridge, control logic and filter circuit. The inverter will generate high temperature during use and needs to be cooled by an aluminum sheet heat dissipation mechanism.

[0003] At present, most aluminum sheet heat dissipation mechanisms have a simple structure and can only exchange heat through the contact between the heat dissipation fins and the air. The heat dissipation effect on the inverter is poor, and dust is easily attached between the fins. As the use time increases, the dust will thicken and affect the heat dissipation performance of the aluminum sheet heat dissipation mechanism. Utility Model Content

[0004] The purpose of the utility model is to provide an aluminum sheet heat dissipation mechanism for an inverter to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: an aluminum sheet heat dissipation mechanism for an inverter, comprising an aluminum plate, a guide block located at the middle position of the top of the aluminum plate, and a protective cover located at the top of the aluminum plate, wherein the guide block comprises:

[0006] A plurality of groups of heat dissipation fins are arranged at the bottom of both sides of the guide block;

[0007] An air inlet slot is arranged at the middle position of the top of the protective cover.

[0008] Preferably, a mounting groove is provided on one side of the air inlet groove, a semiconductor cooler is provided at a position of the air inlet groove close to one side of the mounting groove, a plurality of groups of card slots are provided on the side of the air inlet groove away from the mounting groove, a plurality of groups of thermal conductive copper sheets penetrating into the card slots are provided on one side of the semiconductor cooler, fixing holes are provided at both ends of the top of the air inlet groove, and fans are provided at both ends above the top of the air inlet groove.

[0009] Preferably, the bottom ends of the two groups of fans are both provided with air outlet ducts, the top ends of the two groups of fans are both provided with air inlet ducts, the top ends of the two groups of air inlet ducts are provided with dust covers, the interiors of the two groups of dust covers are both provided with dustproof nets, and the four corners of the interior of the mounting aluminum plate are provided with mounting holes.

[0010] Preferably, two ends of the guide block are respectively connected by welding to two ends inside the protective cover, and the bottom ends of the protective cover, the guide block and the heat dissipation fins are all connected by welding to the top end of the mounting aluminum plate.

[0011] Preferably, air guide grooves are provided on both sides of the guide block, one end of the heat dissipation fin is welded to the guide block, and a plurality of groups of heat dissipation fins are evenly arranged on both sides of the guide block.

[0012] Preferably, one end of the semiconductor refrigerator close to the air inlet slot is a cooling end, and the other end of the semiconductor refrigerator is a heat dissipation end, and one end of the thermal conductive copper sheet is welded to the cooling end of the semiconductor refrigerator.

[0013] Preferably, the semiconductor refrigerator is detachably connected to the air inlet slot via a fixing bolt, and the thermal conductive copper sheet is detachably connected to the air inlet slot via a clamping slot.

[0014] Preferably, the two groups of fans are detachably connected to the air inlet slot via fixing bolts, and the air outlet pipe is detachably connected to the air inlet slot via fixing holes.

[0015] Preferably, the outer side of the air inlet pipe is provided with an external thread, the inner side of the dust cover is provided with an internal thread matching the air inlet pipe, and the dust cover is detachably connected to the air inlet pipe via the external thread and the internal thread.

[0016] Preferably, a fixing groove is provided inside the dust cover, and the dustproof net is detachably connected to the dust cover via the fixing groove.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] 1. The utility model generates wind through a fan, an air inlet pipe and an air outlet pipe and transmits it to the inside of the air inlet slot, and generates low temperature through a semiconductor refrigerator and a thermal conductive copper sheet. The wind passes through the thermal conductive copper sheet to form cold air, and then the cold air is transmitted to the heat dissipation fins on both sides of the guide block through the air guide slots on both sides of the guide block, thereby quickly extracting the heat from the heat dissipation fins and improving the heat dissipation efficiency of the inverter;

[0019] 2. The utility model can prevent dust from falling on the cooling fins through the protective cover, and can prevent dust in the air from entering the inside of the protective cover through the protective cover and the dustproof net, which has a better dustproof effect on the aluminum sheet cooling mechanism, avoids the adhesion of dust to affect the cooling performance of the cooling mechanism, and improves the practicality of the aluminum sheet cooling mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0021] Figure 1 It is a structural schematic diagram of the utility model.

[0022] Figure 2 It is a cross-sectional view of the utility model.

[0023] Figure 3 It is a schematic diagram of the internal structure of the utility model.

[0024] In the figure: 1. mounting aluminum plate; 101. mounting hole; 2. protective cover; 201. air inlet slot; 202. mounting slot; 203. semiconductor refrigerator; 204. card slot; 205. thermal conductive copper sheet; 206. fixing hole; 207. fan; 208. air outlet duct; 209. air inlet duct; 210. dust cover; 211. dust net; 3. guide block; 301. cooling fins. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0026] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-3 The utility model provides an embodiment of an aluminum sheet heat dissipation mechanism for an inverter: an aluminum sheet heat dissipation mechanism for an inverter, comprising an installed aluminum plate 1, a guide block 3 located at the middle position of the top of the installed aluminum plate 1, and a protective cover 2 located at the top of the installed aluminum plate 1, the guide block 3 comprising: a plurality of groups of heat dissipation fins 301 arranged at the bottom of both sides of the guide block 3, and the heat dissipation fins 301 are used to facilitate heat dissipation of the inverter; an air inlet slot 201 is arranged at the middle position of the top of the protective cover 2.

[0030] Please refer to Figure 1 and Figure 2 A mounting groove 202 is provided on one side of the air inlet groove 201, and a semiconductor refrigerator 203 is provided at a position of the air inlet groove 201 near one side of the mounting groove 202, so that the semiconductor refrigerator 203 can be fixedly installed. A plurality of card slots 204 are provided on the side of the air inlet groove 201 away from the mounting groove 202, and a plurality of thermal conductive copper sheets 205 penetrating into the card slot 204 are provided on one side of the semiconductor refrigerator 203. The card slot 204 can support one end of the thermal conductive copper sheet 205, so as to make the use of the semiconductor refrigerator 203 and the thermal conductive copper sheet 205 more stable. Both ends of the top of the air inlet groove 201 are provided with fixing holes 206, and both ends above the top of the air inlet groove 201 are provided with fans 207, and the fans 207 can be installed on both ends of the top of the air inlet groove 201 through the fixing holes 206.

[0031] Please refer to Figure 2 and Figure 3 The bottom ends of the two sets of fans 207 are both provided with air outlet pipes 208, and the top ends of the two sets of fans 207 are both provided with air inlet pipes 209, through which the outside air can be drawn into the fan 207, and the top ends of the two sets of air inlet pipes 209 are provided with dust covers 210, and the insides of the two sets of dust covers 210 are both provided with dust nets 211, and the dust nets 211 can be installed on the top ends of the air inlet pipes 209 through the dust covers 210, so as to achieve the effect of dust prevention and prevent dust from affecting the performance of the aluminum sheet heat dissipation mechanism, and the four corners of the aluminum plate 1 are provided with mounting holes 101, so as to fix the aluminum sheet heat dissipation mechanism.

[0032] Please refer to Figure 1 and Figure 2The two ends of the guide block 3 are respectively welded to the two ends inside the protective cover 2, and the bottom ends of the protective cover 2, the guide block 3 and the heat dissipation fins 301 are all welded to the top of the mounting aluminum plate 1. The protective cover 2, the guide block 3 and the heat dissipation fins 301 can be installed on the top of the mounting aluminum plate 1. Both sides of the guide block 3 are provided with air guide grooves to guide the cold air. One end of the heat dissipation fin 301 is welded to the guide block 3, and multiple groups of heat dissipation fins 301 are evenly arranged on both sides of the guide block 3, so that the heat dissipation effect of the aluminum sheet heat dissipation mechanism is better. The end of the semiconductor refrigerator 203 close to the air inlet groove 201 is the cooling end, and the semiconductor refrigerator 203 is connected to the cooling end. The other end of the conductor cooler 203 is the heat dissipation end. One end of the thermal conductive copper sheet 205 is welded and connected to the cooling end of the semiconductor cooler 203, so that the thermal conductive copper sheet 205 can be cooled, which is convenient for cooling the wind. The semiconductor cooler 203 is detachably connected to the air inlet slot 201 through fixing bolts. The semiconductor cooler 203 can be installed on the top of the air inlet slot 201 through fixing bolts. The thermal conductive copper sheet 205 is detachably connected to the air inlet slot 201 through the card slot 204. One end of the thermal conductive copper sheet 205 can be inserted into the interior of the card slot 204 through the card slot 204, so that the use of the thermal conductive copper sheet 205 is more temperature-efficient.

[0033] Please refer to Figure 2 and Figure 3 , two sets of fans 207 are detachably connected to the air inlet slot 201 through fixing bolts, so that the two sets of fans 207 can be installed on the top of the air inlet slot 201, and the air outlet pipe 208 is detachably connected to the air inlet slot 201 through the fixing hole 206, so as to facilitate the delivery of wind to the inside of the air inlet slot 201, and the outer side of the air inlet pipe 209 is provided with an external thread, and the inner side of the dust cover 210 is provided with an internal thread matching the air inlet pipe 209, and the dust cover 210 is detachably connected to the air inlet pipe 209 through the external thread and the internal thread, and the dust cover 210 can be installed on the top of the air inlet pipe 209 through the external thread and the internal thread, and the dust cover 210 is provided with a fixing groove inside the dust cover 210, and the dust net 211 is detachably connected to the dust cover 210 through the fixing groove, and the dust net 211 can be installed inside the dust cover 210 through the fixing groove, so as to achieve the effect of dustproof, prevent dust from entering the interior of the protective cover 2, and avoid the adhesion of dust affecting the use of the aluminum sheet heat dissipation mechanism.

[0034] Working principle: Before use, the utility model is installed on the inverter by installing bolts to install the bottom end of the mounting aluminum plate 1. When in use, the power is turned on, and the fan 207 is started to generate wind. The wind is transported to the inside of the air inlet slot 201 through the air inlet pipe 209. The dust in the outside air can be prevented from being drawn into the inside of the protective cover 2 by the dustproof net 211 and the dustproof cover 210, so as to prevent the dust from adhering to the heat dissipation fins 301. The temperature of the thermal conductive copper sheet 205 is lowered by the cooling end of the semiconductor refrigerator 203. The wind passes through the low-temperature thermal conductive copper sheet 205 to form cold wind, and then the cold wind is led to the two sides of the inside of the protective cover 2 through the guide grooves on both sides of the guide block 3. The cold wind passes through the heat dissipation fins 301, and the high temperature on the heat dissipation fins 301 can be quickly discharged, so as to quickly dissipate heat for the inverter.

[0035] The above is only an embodiment of the utility model, and the common sense such as the known specific structure and characteristics in the scheme is not described too much here. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model. Any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. An aluminum sheet heat dissipation mechanism for an inverter, characterized in that: The invention comprises an aluminum mounting plate (1), a guide block (3) located at the middle position of the top of the aluminum mounting plate (1), and a protective cover (2) located at the top of the aluminum mounting plate (1), wherein the guide block (3) comprises: A plurality of groups of heat dissipation fins (301) are arranged at the bottom of both sides of the guide block (3); An air inlet slot (201) is arranged at the middle position of the top of the protective cover (2).

2. The aluminum sheet heat dissipation mechanism for an inverter according to claim 1, characterized in that: A mounting groove (202) is provided on one side of the air inlet groove (201); a semiconductor cooler (203) is provided at a position of the air inlet groove (201) close to one side of the mounting groove (202); a plurality of groups of card slots (204) are provided on a side of the air inlet groove (201) away from the mounting groove (202); a plurality of groups of thermal conductive copper sheets (205) penetrating into the card slots (204) are provided on one side of the semiconductor cooler (203); fixing holes (206) are provided at both ends of the top of the air inlet groove (201); and fans (207) are provided at both ends above the top of the air inlet groove (201).

3. The aluminum sheet heat dissipation mechanism for an inverter according to claim 2, characterized in that: The bottom ends of the two groups of fans (207) are both provided with air outlet pipes (208), the top ends of the two groups of fans (207) are both provided with air inlet pipes (209), the top ends of the two groups of air inlet pipes (209) are both provided with dust covers (210), the interiors of the two groups of dust covers (210) are both provided with dust nets (211), and the four corners of the interior of the mounting aluminum plate (1) are both provided with mounting holes (101).

4. The aluminum sheet heat dissipation mechanism for an inverter according to claim 1, characterized in that: The two ends of the guide block (3) are respectively welded to the two ends inside the protective cover (2), and the bottom ends of the protective cover (2), the guide block (3) and the heat dissipation fins (301) are all welded to the top end of the mounting aluminum plate (1).

5. The aluminum sheet heat dissipation mechanism for an inverter according to claim 1, characterized in that: Air guide grooves are provided on both sides of the guide block (3); one end of the heat dissipation fin (301) is welded to the guide block (3); and a plurality of groups of heat dissipation fins (301) are evenly arranged on both sides of the guide block (3).

6. The aluminum sheet heat dissipation mechanism for an inverter according to claim 2, characterized in that: One end of the semiconductor cooler (203) close to the air inlet slot (201) is a cooling end, and the other end of the semiconductor cooler (203) is a heat dissipation end. One end of the thermal conductive copper sheet (205) is welded to the cooling end of the semiconductor cooler (203).

7. The aluminum sheet heat dissipation mechanism for an inverter according to claim 2, characterized in that: The semiconductor refrigerator (203) is detachably connected to the air inlet slot (201) via a fixing bolt, and the thermal conductive copper sheet (205) is detachably connected to the air inlet slot (201) via a clamping slot (204).

8. The aluminum sheet heat dissipation mechanism for an inverter according to claim 3, characterized in that: The two groups of fans (207) are detachably connected to the air inlet slot (201) via fixing bolts, and the air outlet pipe (208) is detachably connected to the air inlet slot (201) via fixing holes (206).

9. The aluminum sheet heat dissipation mechanism for an inverter according to claim 3, characterized in that: The outer side of the air inlet pipe (209) is provided with an external thread, and the inner side of the dust cover (210) is provided with an internal thread matching the air inlet pipe (209). The dust cover (210) is detachably connected to the air inlet pipe (209) via the external thread and the internal thread.

10. The aluminum sheet heat dissipation mechanism for an inverter according to claim 3, characterized in that: A fixing groove is provided inside the dust cover (210), and the dust net (211) is detachably connected to the dust cover (210) via the fixing groove.

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