Raw material slicing device for compound semiconductor chip production and processing

Abstract

The utility model discloses a raw material slicing device for compound semiconductor chip production and processing. The raw material slicing device comprises a slicing device body and a moving assembly arranged at the upper end of the slicing device body. The raw materials are firstly placed in the processing groove, then the first limiting plate and the second limiting plate move inwards in the sliding groove through the sliding blocks, so that the first limiting plate and the second limiting plate limit the raw materials, the magnet plates are embedded in the inner wall of the sliding groove, and the magnetic plates installed on the outer sides of the sliding blocks can be attracted by the magnet plates; then a first limiting plate and a second limiting plate are limited through cooperation of a limiting block and a limiting groove, then an instruction can be given through a control panel, raw materials are cut through a laser cutting head, and through cooperative use of the first limiting plate, the second limiting plate, a sliding block, a sliding groove, the limiting block, the limiting groove, a magnet plate and a magnetic plate, the cutting efficiency is improved; and raw materials can be limited, and the situation that the cutting quality is affected due to the fact that the raw materials deviate during cutting is prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field related to semiconductors, and in particular relates to a raw material slicing device for producing and processing compound semiconductor chips. Background Art

[0002] Chip refers to integrated circuit chip, which is a technology that produces tiny circuits on extremely small silicon wafers through process and material processing, also known as microelectronics technology. The chip can integrate multiple functions including processors, memory and input and output interfaces, and is widely used in various fields such as computers, mobile phones, smart homes, medical equipment, and automobiles. It is one of the key technologies in the development of modern electronic technology. The raw materials need to be sliced ​​before the chip is produced, and slicing requires the use of a raw material slicing device for the production and processing of compound semiconductor chips. The existing raw material slicing device for the production and processing of compound semiconductor chips is mainly composed of a slicing device body, support columns, support pads, moving components, air pipes, connectors, laser cutting heads, processing grooves, control panels and other components. The existing raw material slicing device for the production and processing of compound semiconductor chips may make the cut raw materials unusable due to the offset of the raw materials during slicing, which not only wastes the raw materials, but also affects the production of chips. Therefore, a raw material slicing device for the production and processing of compound semiconductor chips is indispensable. Utility Model Content

[0003] The purpose of the utility model is to provide a raw material slicing device for the production and processing of compound semiconductor chips, so as to solve the problem in the above-mentioned background technology that the existing raw material slicing device for the production and processing of compound semiconductor chips may make the cut raw materials unusable due to the deviation of the raw materials during slicing, which not only wastes the raw materials but also affects the production of chips.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a raw material slicing device for producing and processing compound semiconductor chips, comprising:

[0005] A slicing device body and a moving component arranged at the upper end of the slicing device body;

[0006] A connector is installed at the upper end of the moving component, and an air pipe is arranged at the upper end of the connector;

[0007] A laser cutting head is arranged at the lower end of the connecting head and at the right side of the moving component;

[0008] A processing groove is provided on the inner side of the slicing device body and below the laser cutting head;

[0009] A control panel is provided at the rear right side of the slicing device body;

[0010] Slide grooves are arranged at the front and rear sides of the processing groove, a magnet plate is inlaid at the inner wall of the slide groove, a first limiting plate and a second limiting plate are arranged in sequence at the upper end of the processing groove and at the right side of the moving component, sliders are arranged inside the slide groove and at the front and rear sides of the first limiting plate and the second limiting plate, placement grooves are arranged at both ends of the slider, a magnetic plate is inlaid inside the placement groove, limiting grooves are arranged at the upper and lower ends of the slide groove, limiting blocks are arranged inside the limiting groove and at the upper and lower ends of the slider, the slicing device body is electrically connected to an external power supply, and the first limiting plate, the second limiting plate, the slider, the slide groove, the limiting block, the limiting groove, the magnet plate and the magnetic plate are used in combination to limit the raw material to prevent the raw material from shifting during cutting and affecting the cutting quality.

[0011] Preferably, protective cushions are provided on the right side of the first limiting plate and the left side of the second limiting plate.

[0012] Preferably, Velcro sub-surfaces are provided at the four right corners of the first limiting plate and the four left corners of the second limiting plate, and Velcro parent surfaces are provided on the inner wall of the protective cushion at positions corresponding to the Velcro sub-surfaces.

[0013] Preferably, the Velcro sub-surface and the Velcro main surface are both a rectangular parallelepiped structure, and the Velcro sub-surface and the Velcro main surface are connected by gluing.

[0014] Preferably, the protective cushion is made of silicone material, and the provision of the protective cushion can protect the raw materials.

[0015] Preferably, support columns are provided at four corners of the lower end of the slicing device body, and support pads are provided at the lower ends of the support columns.

[0016] Preferably, the support column and the slicing device body are fixedly connected by welding, and both the support column and the slicing device body are made of stainless steel. The stability of the slicing device body is enhanced by the provision of the support column and the support pad.

[0017] Compared with the prior art, the utility model provides a raw material slicing device for compound semiconductor chip production and processing, which has the following beneficial effects:

[0018] 1. In the raw material slicing device for compound semiconductor chip production and processing, when using the raw material slicing device for compound semiconductor chip production and processing, first connect the slicing device body to an external power supply, then place the raw material in the processing groove, and then move the first limiting plate and the second limiting plate inward in the slide groove through the slider, so that the first limiting plate and the second limiting plate limit the raw material. Since the inner wall of the slide groove is inlaid with a magnet plate, the magnetic plate installed on the outer side of the slider will be adsorbed by the magnet plate, and then cooperate with the limiting block and the limiting groove to limit the first limiting plate and the second limiting plate. Then, instructions can be issued through the control panel, and the raw material can be cut by the laser cutting head. Through the coordinated use of the first limiting plate, the second limiting plate, the slider, the slide groove, the limiting block, the limiting groove, the magnet plate and the magnetic plate, the raw material can be limited to prevent the raw material from being offset during cutting and affecting the cutting quality, so that the raw material slicing device for compound semiconductor chip production and processing can better cut the raw material. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The utility model is a schematic diagram of the overall structure of the raw material slicing device for producing and processing compound semiconductor chips.

[0020] Figure 2 It is a schematic diagram of the enlarged structure of the magnet plate of the raw material slicing device for producing and processing compound semiconductor chips of the utility model.

[0021] Figure 3 It is a schematic diagram of the enlarged structure of the slider of the raw material slicing device for producing and processing compound semiconductor chips of the utility model.

[0022] Figure 4 It is a structural schematic diagram of an enlarged Velcro surface of a raw material slicing device for producing and processing compound semiconductor chips of the utility model.

[0023] Figure 5 It is a schematic diagram of the structure of the enlarged back side of the protective cushion of the raw material slicing device for producing and processing compound semiconductor chips of the utility model.

[0024] In the figure: 1. support pad; 2. support column; 3. slicing device body; 4. moving assembly; 5. connector; 6. air pipe; 7. first limiting plate; 8. processing groove; 9. second limiting plate; 10. control panel; 11. protective cushion; 12. laser cutting head; 13. slider; 14. magnet plate; 15. slide groove; 16. limiting groove; 17. limiting block; 18. placement groove; 19. magnetic plate; 20. Velcro sub-surface; 21. Velcro mother surface. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The utility model provides Figure 1-5 The raw material slicing device for compound semiconductor chip production and processing shown is a raw material slicing device for compound semiconductor chip production and processing, comprising a slicing device body 3 and a moving component 4 arranged at the upper end of the slicing device body 3; a connector 5 is installed at the upper end of the moving component 4, and an air pipe 6 is arranged at the upper end of the connector 5; a laser cutting head 12 is arranged at the lower end of the connector 5 and at the right side of the moving component 4; a processing groove 8 is arranged on the inner side of the slicing device body 3 and below the laser cutting head 12; a control panel 10 is arranged at the rear side of the right side of the slicing device body 3; a slide groove 15 is arranged at the front and rear sides of the processing groove 8, a magnet plate 14 is inlaid on the inner wall of the slide groove 15, and a magnet plate 14 is arranged at the upper end of the processing groove 8 and at the position of the moving component The first limiting plate 7 and the second limiting plate 9 are arranged in sequence on the right side of the component 4, and sliders 13 are arranged inside the slide groove 15 and at the front and rear sides of the first limiting plate 7 and the second limiting plate 9. Placement grooves 18 are arranged at both ends of the slider 13, and a magnetic plate 19 is inlaid inside the placement groove 18. Limiting grooves 16 are arranged at the upper and lower ends of the slide groove 15, and limiting blocks 17 are arranged inside the limiting groove 16 and at the upper and lower ends of the slider 13. The slicing device body 3 is electrically connected to an external power supply. The first limiting plate 7, the second limiting plate 9, the slider 13, the slide groove 15, the limiting block 17, the limiting groove 16, the magnet plate 14 and the magnetic plate 19 can be used in combination to limit the raw materials to prevent the raw materials from shifting during cutting and affecting the cutting quality.

[0027] like Figure 1 and Figure 2As shown, in order to prevent the raw material from deviating during cutting and affecting the cutting quality, when using the raw material slicing device for compound semiconductor chip production and processing, first connect the slicing device body 3 to the external power supply, then place the raw material in the processing groove 8, and then move the first limiting plate 7 and the second limiting plate 9 inward in the slide groove 15 through the slider 13, so that the first limiting plate 7 and the second limiting plate 9 limit the raw material. Since the inner wall of the slide groove 15 is inlaid with a magnet plate 14, the magnetic plate 19 installed on the outer side of the slider 13 will be adsorbed by the magnet plate 14, and then cooperate with the limiting block 17 and the limiting groove 16 to limit the first limiting plate 7 and the second limiting plate 9. Then, the control panel 10 can issue an instruction, and the raw material can be cut by the laser cutting head 12. Through the coordinated use of the first limiting plate 7, the second limiting plate 9, the slider 13, the slide groove 15, the limiting block 17, the limiting groove 16, the magnet plate 14 and the magnetic plate 18, the raw material can be limited to prevent the raw material from deviating during cutting and affecting the cutting quality, so that the raw material slicing device for compound semiconductor chip production and processing can better cut the raw material.

[0028] Protective pads 11 are provided on the right side of the first limiting plate 7 and the left side of the second limiting plate 9. Velcro sub-surfaces 20 are provided at the four right corners of the first limiting plate 7 and the four left corners of the second limiting plate 9. Velcro mother surfaces 21 are provided on the inner wall of the protective pad 11 and at the position corresponding to the Velcro sub-surface 20. The Velcro sub-surface 20 and the Velcro mother surface 21 are both a rectangular structure, and the Velcro sub-surface 20 and the Velcro mother surface 21 are connected by adhesion. The protective pad 11 is made of silicone material. The setting of the protective pad 11 can protect the raw materials.

[0029] like Figure 1 , Figure 4 and Figure 5 As shown, in order to prevent the first limiting plate 7 and the second placing plate 9 from causing damage to the raw materials when limiting the raw materials, when using the raw material slicing device for compound semiconductor chip production and processing, the protective pad 11 is first adhered to the first limiting plate 7 and the second limiting plate 9 through the Velcro mother surface 21 and the Velcro child surface 20, so that the protective pad 11 is installed on the inner side of the first limiting plate 7 and the second limiting plate 9, and then the raw material is placed in the processing groove 8, and then the first limiting plate 7 and the second limiting plate 9 are moved inward in the slide groove 15 through the slider 13, so that the first limiting plate 7 and the second limiting plate 9 limit the raw materials, and the protective pad 11 installed on the inner side of the first limiting plate 7 and the second limiting plate 9 can protect the raw materials. Through the setting of the protective pad 11, the raw materials can be protected to prevent the raw materials from being damaged when the first limiting plate 7 and the second placing plate 9 limit the raw materials.

[0030] Support columns 2 are arranged at the four corners of the lower end of the slicing device body 3, and support pads 1 are arranged at the lower ends of the support columns 2. The support columns 2 and the slicing device body 3 are fixedly connected by welding. The support columns 2 and the slicing device body 3 are both made of stainless steel. The stability of the slicing device body 3 is enhanced by the arrangement of the support columns 2 and the support pads 1.

[0031] like Figure 1 As shown, in order to make the placement of the raw material slicing device for the production and processing of compound semiconductor chips more stable, when using the raw material slicing device for the production and processing of compound semiconductor chips, first connect the support pad 1 and the support column 2, and then weld the support column 2 to the four corners of the lower end of the slicing device body 3, and then connect the raw material slicing device for the production and processing of compound semiconductor chips to the ground through the support pad 1, so that the raw material slicing device for the production and processing of compound semiconductor chips is placed on the ground through the support column 2. Through the arrangement of the support column 2 and the support pad 1, the placement of the raw material slicing device for the production and processing of compound semiconductor chips becomes more stable, so that the raw material slicing device for the production and processing of compound semiconductor chips can better process the raw materials.

[0032] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A raw material slicing device for compound semiconductor chip production and processing, comprising: A slicing device body (3) and a moving component (4) arranged at the upper end of the slicing device body (3); A connector (5) is installed at the upper end of the moving component (4), and an air pipe (6) is provided at the upper end of the connector (5); A laser cutting head (12) is provided at the lower end of the connecting head (5) and at the right side of the moving component (4); A processing groove (8) is provided on the inner side of the slicing device body (3) and below the laser cutting head (12); A control panel (10) is provided at the rear right side of the slicing device body (3); Features: The processing groove (8) is provided with a slide groove (15) at the front and rear sides thereof, and a magnet plate (14) is embedded at the inner wall of the slide groove (15). A first limiting plate (7) and a second limiting plate (9) are sequentially disposed at the upper end of the processing groove (8) and at the right side of the moving component (4). Slide blocks (13) are disposed inside the slide groove (15) and at the front and rear sides thereof. Placement grooves (18) are disposed at the two end positions of the slide block (13), and a magnetic plate (14) is embedded inside the placement groove (18). 9), limiting grooves (16) are arranged at the upper and lower ends of the slide groove (15), limiting blocks (17) are arranged inside the limiting groove (16) and at the upper and lower ends of the slider (13), the slicing device body (3) is electrically connected to an external power supply, and the raw materials can be restricted by the coordinated use of the first limiting plate (7), the second limiting plate (9), the slider (13), the slide groove (15), the limiting block (17), the limiting groove (16), the magnet plate (14) and the magnetic plate (19), so as to prevent the raw materials from being offset during cutting and affecting the cutting quality.

2. The raw material slicing device for compound semiconductor chip production and processing according to claim 1, characterized in that: Protective cushions (11) are provided on the right side of the first limiting plate (7) and on the left side of the second limiting plate (9).

3. A raw material slicing device for compound semiconductor chip production and processing according to claim 2, characterized in that: Velcro sub-surfaces (20) are provided at the four right corners of the first limiting plate (7) and the four left corners of the second limiting plate (9), and a Velcro mother surface (21) is provided on the inner wall of the protective cushion (11) at a position corresponding to the Velcro sub-surfaces (20).

4. A raw material slicing device for compound semiconductor chip production and processing according to claim 3, characterized in that: The Velcro sub-surface (20) and the Velcro main surface (21) are both rectangular parallelepiped structures, and the Velcro sub-surface (20) and the Velcro main surface (21) are connected by gluing.

5. The raw material slicing device for compound semiconductor chip production and processing according to claim 3, characterized in that: The protective soft pad (11) is made of silica gel material, and the provision of the protective soft pad (11) can play a protective role on the raw materials.

6. The raw material slicing device for compound semiconductor chip production and processing according to claim 1, characterized in that: Support columns (2) are arranged at the four corner positions of the lower end of the slicing device body (3), and support pads (1) are arranged at the lower ends of the support columns (2).

7. A raw material slicing device for compound semiconductor chip production and processing according to claim 6, characterized in that: The support column (2) and the slicing device body (3) are fixedly connected by welding; the support column (2) and the slicing device body (3) are both made of stainless steel; and the stability of the slicing device body (3) is enhanced by the provision of the support column (2) and the support pad (1).

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