Full-automatic wafer cutting equipment

Abstract

The utility model discloses full-automatic wafer cutting equipment, which belongs to the technical field of wafer cutting processing, and comprises a base, a material basket, a feeding and discharging mechanism, a gantry rotating module, a processing platform deck module and a laser cutting module, and is characterized in that a Z-axis linear module capable of driving along a Z direction and an X-axis linear module capable of driving along an X axis are arranged in the feeding and discharging mechanism; the feeding clamping jaw is used for achieving automatic feeding and discharging of the wafer. The two gantry clamping jaws capable of exchanging positions through horizontal rotation are arranged in the gantry rotating module, the processed wafer and the to-be-processed wafer are exchanged, parallel technological processing and feeding actions are realized, and the production efficiency of the equipment is improved. The full-automatic wafer cutting equipment is reasonable in structural design, the gantry rotating module serves as a main body to be connected with other stations in series, double-shaft parallel simultaneous operation is achieved, the operation time of the whole process of the equipment is shortened, the functions and shapes of all components are optimized, the occupied space is small, transportation and installation are convenient, and the space cost is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer cutting and processing, and in particular relates to a full-automatic wafer cutting device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. It is the basis for making various chips. Before use, the wafer needs to be cut into sizes that meet design requirements using a cutting machine. With the rapid development of the semiconductor industry and the trend of chip miniaturization, the speed and precision of wafer cutting are becoming increasingly demanded.

[0003] When performing wafer cutting operations, a loading and unloading mechanism is generally set up to load and unload the wafers, place them on the processing platform for cutting, and put the cut wafers back. During this process, if the loading and unloading cannot be continuous or the loading and unloading accuracy is not high, it will have a certain impact on the production efficiency and production accuracy of the entire process. Utility Model Content

[0004] In response to one or more of the above-mentioned defects or improvement needs in the prior art, the utility model provides a fully automatic wafer cutting equipment, which can realize automatic loading and unloading of wafers, and carry out process processing and loading actions in parallel, thereby shortening the equipment operation time and improving the equipment production capacity.

[0005] To achieve the above-mentioned purpose, the utility model provides a fully automatic wafer cutting device, which includes a base and a material basket arranged on the base, a processing stage module and a laser cutting module.

[0006] It also includes a loading and unloading mechanism and a gantry rotating module arranged on the base;

[0007] As a further improvement of the utility model, the loading and unloading mechanism includes a Z-axis linear module, an X-axis linear module and a loading clamp; the Z-axis linear module is fixedly arranged on the base; the X-axis linear module is arranged on the Z-axis linear module, and can be lifted and moved along the Z direction under the drive of the Z-axis linear module; the loading clamp is arranged on the X-axis linear module, and can be horizontally reciprocated between the material basket and the loading position along the X direction under the drive of the X-axis linear module, for loading and unloading wafers;

[0008] The gantry rotation module includes a gantry, a rotation drive and two gantry clamps; the gantry is fixedly arranged on the base, and the two gantry clamps are connected to the gantry through the rotation drive and are symmetrically arranged on both sides of the rotation drive for grabbing wafers at the loading position and the waiting position, and the two gantry clamps can exchange positions under the rotation of the rotation drive;

[0009] The laser cutting module is arranged above the processing position.

[0010] As a further improvement of the present invention, the loading and unloading mechanism also includes a loading clamping module fixedly arranged on the Z-axis linear module, and the loading clamping module includes two baffles extending along the X-direction and arranged in parallel and spaced apart; the loading clamping claw is arranged between the two baffles, and moves back and forth between the material basket and the baffle under the drive of the X-axis linear module, transferring the wafers to be processed in the material basket to the baffle, and transferring the processed wafers on the baffle to the material basket.

[0011] As a further improvement of the utility model, a clamping assembly is also provided on the top of each baffle, and the clamping assembly includes a clamping plate and a cylinder. The clamping plate is provided on the side of the baffle close to the loading clamp and is connected to the telescopic end of the cylinder so as to be telescopically extended and retracted along the Y direction under the drive of the cylinder, thereby clamping and positioning the wafer moved between the two baffles in the Y direction.

[0012] As a further improvement of the present utility model, the processing platform module includes a processing platform Y-axis module, a processing platform X-axis module and a processing platform adsorption platform; the processing platform Y-axis is fixedly arranged on the base, the processing platform X-axis module is arranged on the processing platform Y-axis module, and the processing platform adsorption platform is arranged on the processing platform X-axis module; the processing platform adsorption platform moves back and forth between the waiting position and the processing position driven by the X-axis module and the Y-axis module, transports the wafer to be processed from the waiting position to the processing position, and transports the processed wafer from the processing position to the waiting position;

[0013] A rotating module is also provided between the processing platform adsorption platform and the processing platform X-axis module, so as to drive the processing platform adsorption platform to rotate through the rotating module.

[0014] As a further improvement of the utility model, it also includes a positioning camera; the positioning camera is arranged above the loading position and is used to position the wafer at the loading position.

[0015] As a further improvement of the present utility model, the loading and unloading mechanism further includes a loading light source module fixedly arranged on the Z-axis linear module, the loading light source module includes a light source, and is arranged below the loading position to provide a backlight source for the wafer, so as to facilitate the positioning of the positioning camera;

[0016] The loading light source module also includes a lifting component, which is arranged below the light source. The output end of the lifting component can be extended and retracted along the Z direction to drive the light source to move up and down to get close to the wafer and support the recessed wafer.

[0017] As a further improvement of the present invention, a slide plate carrier is fixedly arranged on the Z-axis linear module, and the X-axis linear module, the loading light source module and the loading clamping module are all arranged on the slide plate carrier;

[0018] and / or

[0019] A slide plate is fixedly arranged on the X-axis linear module, and the loading clamp is fixed on the X-axis linear module through the slide plate.

[0020] As a further improvement of the utility model, the gantry rotating module further comprises a horizontally arranged connecting plate, the middle portion of the connecting plate is connected to the rotating driving member, and the two gantry clamps are symmetrically arranged at both ends of the connecting plate;

[0021] A lifting component is also provided between the connecting plate and the gantry clamp, so that the gantry clamp can be lifted and lowered relative to the connecting plate by the lifting component.

[0022] As a further improvement of the present invention, the material basket is a double-layer material basket, and a guide rail is installed at the bottom of each layer of the material basket, and the material basket is slidably installed on the guide rail.

[0023] As a further improvement of the present invention, the loading position is arranged between the Z-axis linear module and the material basket, the waiting position is arranged on the side of the gantry rotating module away from the loading position, and the processing position is arranged on the side of the waiting position away from the loading position.

[0024] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0025] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0026] (1) The fully automatic wafer cutting equipment of the utility model provides a Z-axis linear module that can be driven along the Z direction and an X-axis linear module that can be driven along the X axis in the loading and unloading mechanism, so as to realize automatic loading and unloading of wafers by using loading clamps; by providing two gantry clamps that can interchange positions by horizontal rotation in the gantry rotation module, the processed wafers and the wafers to be processed can be interchanged, so as to realize parallel processing and loading actions and improve the production efficiency of the equipment.

[0027] (2) The fully automatic wafer cutting equipment of the utility model is provided with a positioning camera corresponding to the loading of the loading and unloading mechanism to improve the loading accuracy of the loading and unloading mechanism and the subsequent processing accuracy; a loading light source module is provided corresponding to the positioning camera to ensure the positioning accuracy of the positioning camera and provide a stable carrier for the wafer; the loading position of the wafer is mechanically initially positioned by the loading clamping module to facilitate the camera positioning and provide a channel for the loading clamp to take and place the material.

[0028] (3) The fully automatic wafer cutting equipment of the utility model has a reasonable structural design. It uses the gantry rotating module as the main body to connect other workstations in series, realizes dual-axis parallel operation, shortens the overall process operation time of the equipment, and further optimizes the function and appearance of each component. It conforms to ergonomics, occupies a small space, is easy to transport and install, and saves space costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 This is a schematic diagram of the overall structure of the fully automatic wafer cutting equipment in the embodiment of the utility model;

[0031] Figure 2 It is a schematic diagram of the overall structure of the loading and unloading mechanism in the embodiment of the utility model;

[0032] Figure 3 It is a schematic diagram of the overall structure of the loading and unloading mechanism and the gantry rotating module in the embodiment of the utility model;

[0033] Figure 4 This is a schematic diagram of the internal top view of the fully automatic wafer cutting equipment in the embodiment of the utility model;

[0034] In all the drawings, the same reference numerals represent the same technical features, specifically: 100, base; 200, material basket; 210, guide rail; 300, loading and unloading mechanism; 310, Z-axis linear module; 311, slide plate carrier; 320, X-axis linear module; 321, slide plate; 330, loading clamp; 340, loading light source module; 350, loading clamp module; 351, baffle; 352, clamp; 353, cylinder; 400, gantry rotation module; 410, rotating drive member; 420, gantry clamp; 430, positioning camera; 440, gantry; 450, connecting plate; 500, processing carrier module; 510, processing carrier Y axis; 520, processing carrier X axis; 530, processing carrier adsorption platform; 600, laser cutting module. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] Example:

[0041] See also Figure 1~Figure 4 The fully automatic wafer cutting equipment in the preferred embodiment of the utility model includes a base 100 and a material basket 200 arranged on the base 100, a loading and unloading mechanism 300, a gantry rotation module 400, a processing stage module 500 and a laser cutting module 600 to realize automatic loading and unloading and automatic cutting of wafers.

[0042] Specifically, if Figure 1 As shown in the figure, the material basket 200 in the preferred embodiment is arranged on the base 100, and a plurality of slots are arranged in the material basket 200 to place the wafer flower basket in the slots, and it is preferably arranged as a double-layer material basket 200 to increase the storage space of the material basket 200, to facilitate manual replacement of the double-layer material basket 200 at intervals, and to improve production efficiency.

[0043] Preferably, a guide rail 210 is installed at the bottom of each layer of the material basket 200, and the material basket 200 is slidably installed on the guide rail 210 to form a drawer structure, so that the material basket 200 can be manually taken out of the equipment and replaced.

[0044] Furthermore, the loading and unloading mechanism 300 in the preferred embodiment is arranged on the base 100 and is arranged on the same side of the gantry rotating module 400 as the material basket 200, and is used to take out the unprocessed wafers from the material basket 200 and move them to the loading position, so as to facilitate the gantry rotating module 400 to take materials and receive the processed wafers from the gantry rotating module 400 and transport them to the material basket 200. It can be understood that the above-mentioned loading position is the position where the loading and unloading mechanism 300 is moved into position and is connected with the gantry rotating module 400.

[0045] Specifically, Figure 2 As shown in , the loading and unloading mechanism 300 includes a Z-axis linear module 310, an X-axis linear module 320 and a loading clamp 330; wherein the Z-axis linear module 310 is arranged on the base 100, and its driving direction is perpendicular to the horizontal plane, and a slide plate carrier 311 is arranged on the Z-axis linear module 310, and the slide plate carrier 311 can move up and down along the Z axis under the drive of the Z-axis linear module 310. In the preferred embodiment, the Z-axis linear module 310 uses a motor as a power source to drive the slide plate carrier 311 to move.

[0046] At the same time, the X-axis linear module 320 is fixedly arranged on the Z-axis linear module 310 through the slide stage 311, so as to move up and down along with the slide stage 311 under the drive of the Z-axis linear module 310, and a slide plate 321 is arranged on the X-axis linear module 320, and the slide plate 321 can move horizontally along the X-axis under the drive of the X-axis linear module 320. In the preferred embodiment, the X-axis linear module 320 uses a motor as a power source to drive the slide plate 321 to move.

[0047] Accordingly, the loading clamp 330 is fixedly arranged on the X-axis linear module 320 through the slide 321, so that it can move back and forth horizontally between the material basket 200 and the loading position with the slide 321 under the drive of the X-axis linear module 320, so that the loading clamp 330 can drive the wafer to be loaded and unloaded after clamping the wafer. At the same time, according to the placement height of the wafer in the material basket 200, the clamping height of the loading clamp 330 is adjusted through the Z-axis linear module 310.

[0048] Preferably, the loading and unloading mechanism 300 also includes a loading clamping module 350, which includes two baffles 351 extending along the X direction and arranged in parallel. The two baffles 351 are respectively fixedly arranged on both sides of the slide platform 311, and the loading clamp 330 is arranged between the two baffles 351. The two baffles 351 provide a channel for the loading clamp 330 to take and put materials. Specifically, the loading clamp 330 moves back and forth between the material basket 200 and the baffle 351 along with the slide 321 under the drive of the X-axis linear module 320, arrives at the material basket 200 to clamp the wafer, and then moves between the two baffles 351 after clamping, and places the wafer on the baffle 351; accordingly, the wafer that has been processed on the baffle 351 is transferred to the material basket. See Figure 2 A step is provided on one side of the two baffles 351 close to the loading clamp 330 , and the wafer is placed on the step.

[0049] At the same time, a clamping assembly is also provided on each baffle 351, including a clamping plate 352 and a cylinder 353, wherein the clamping plate 352 is arranged on the side of the baffle 351 close to the loading clamp 330, and is connected to the telescopic end of the cylinder 353, and is telescoped along the Y direction under the drive of the cylinder 353, so that after the loading and unloading mechanism 300 transfers the wafer to the loading position, the two cylinders 353 perform mechanical initial positioning on the wafer, which is convenient for camera positioning.

[0050] Those skilled in the art can understand that the clamping module 350 provides a wafer placement and clamping position, and the position of the clamping module 350 is the loading position. In this embodiment, the loading position is set between the Z-axis linear module 310 and the material basket 200 to facilitate the loading and unloading of materials.

[0051] Furthermore, in a preferred embodiment, a positioning camera 430 is also included, which is arranged just above the loading position and is used to take pictures and locate the loading position of the wafer to provide position information for laser processing.

[0052] Preferably, a loading light source module 340 is also provided in the loading and unloading mechanism 300 corresponding to the positioning camera 430, which is fixedly provided on the Z-axis linear module 310 through the slide platform 311, and driven by the slide platform 311 to move back and forth in the Z direction. The loading light source module 340 includes a light source, which is provided at the loading position and below the clamping module 350, so as to provide a backlight source for the wafer when the loading clamp 330 grabs the wafer and moves to the loading position, so as to facilitate the positioning camera 430 to position and take pictures.

[0053] Further preferably, a lifting component is also provided in the loading light source module 340, which is also provided on the slide platform 311. Specifically, it is provided below the light source to drive the light source to rise and fall. Here, the light source is preferably a surface light source or a plate light source, so that when the wafer is sunken due to its own gravity, the light source can be lifted by the lifting component to support the wafer, thereby providing a stable platform for the wafer and preventing the positioning camera 430 from being affected by the sinking of the wafer.

[0054] Furthermore, if Figure 3As shown in the figure, the gantry rotating module 400 in the preferred embodiment is fixedly arranged on the base 100, and specifically includes a rotating driving member 410, a gantry clamp 420 and a gantry frame 440; wherein the gantry frame 440 is fixedly arranged on the base 100, the rotating driving member 410 is fixedly arranged on the gantry frame 440, and the gantry clamp 420 is connected to the rotating driving member 410 and can be horizontally rotated relative to the gantry frame 440 under the drive of the rotating driving member 410. The rotating driving member 410 in the preferred embodiment is a rotating motor.

[0055] Specifically, in the preferred embodiment, two gantry clamps 420 are provided in the gantry rotating module 400, and the two gantry clamps 420 are connected to the rotating shaft of the rotating motor through the connecting plate 450, and the two gantry clamps 420 are symmetrically arranged on both sides of the rotating driving member 410, for grabbing the wafer, and the two gantry clamps 420 can interchange positions under the rotation of the rotating driving member 410, so that the wafer can be loaded through one gantry clamp 420, and the wafer can be unloaded by the other gantry clamp 420, so as to realize parallel loading and unloading and interchange, and improve the loading and unloading efficiency of the equipment. Specifically, the two gantry clamps 420 can be respectively arranged at the loading position and the waiting position, one gantry clamp 420 clamps the wafer to be processed from the loading position, and the other gantry clamp 420 clamps the processed wafer from the waiting position, and can interchange positions under the rotation of the rotating driving member 410, and simultaneously complete loading and unloading.

[0056] In a preferred embodiment, the rotary driving member 410 is connected to the middle of the connecting plate 450 , and the two gantry clamps 420 are respectively disposed at the two ends of the connecting plate 450 .

[0057] More specifically, the gantry clamp 420 in the preferred embodiment includes a lifting assembly, a suction cup and a suction nozzle, wherein one end of the lifting assembly is fixedly connected to the connecting plate 450, and the other end is connected to the suction cup as a lifting output end, so that the suction cup is driven to lift relative to the connecting plate 450 through the lifting assembly, so that after the gantry clamp 420 rotates into place, the gantry clamp 420 is lowered to the height of the wafer through the lifting assembly. The lifting assembly in the preferred embodiment is a lifting cylinder. At the same time, a plurality of suction nozzles are arranged at the bottom of the suction cup to grab / place the wafer in the vertical direction through the suction nozzle.

[0058] Furthermore, the positioning camera 430 in the preferred embodiment is fixed on the gantry 440 to facilitate the installation of the positioning camera 430 .

[0059] Furthermore, the processing stage module 500 in the preferred embodiment is arranged on the base 100, and is used to receive the wafer clamped by the gantry rotating module 400 at the waiting position, and transport it to the processing position. It can be understood that the waiting position in the utility model is the position where the processing stage module 500 and the gantry rotating module 400 intersect, which is arranged on the side of the gantry 440 away from the loading position, and is arranged corresponding to the loading position; the processing position is the position where the wafer is processed by the laser cutting module 600, and the laser cutting module 600 is arranged above the processing position.

[0060] Specifically, Figure 4 As shown in , the processing stage module 500 includes a processing stage Y-axis module 510, a processing stage X-axis module 520 and a processing stage adsorption platform 530; wherein the processing stage Y-axis module 510 is arranged on the base 100, the processing stage X-axis module 520 is arranged on the processing stage Y-axis module 510, and can move back and forth along the Y direction driven by the processing stage Y-axis module 510; the processing stage adsorption platform 530 is arranged on the processing stage X-axis module 520, and can move back and forth along the X direction driven by the processing stage X-axis module 520. In the preferred embodiment, a marble stage is arranged on the base 100, and the processing stage module 500 is arranged on the marble stage.

[0061] At the same time, a rotating module is also configured in the processing stage adsorption platform 530, and high-precision quartz glass is installed in the middle of the rotating module to effectively protect the wafer from damage. At the same time, adsorption grooves are engraved on the quartz glass to adsorb the wafer through the negative pressure of the adsorption grooves, and suction nozzles are evenly distributed around the adsorption grooves to adsorb the iron rings set around the wafer.

[0062] Furthermore, the laser cutting module 600 in the preferred embodiment is disposed on a marble carrier to provide the required light source for wafer cutting and to cut the wafer positioned on the processing carrier adsorption platform 530 .

[0063] The processing stage adsorption platform 530 moves back and forth between the waiting position and the processing position under the drive of the X-axis module 520 and the Y-axis module 510, transporting the wafer to be processed from the waiting position to the processing position, and transporting the processed wafer from the processing position to the waiting position. Figure 4 In this embodiment, the processing position is located on the side of the material-waiting position away from the material-loading position. In this way, the wafer loading and unloading is on one side, and the wafer waiting processing is on the other side. The two are connected in series through the gantry rotating module 400, which occupies a small area and is conducive to the arrangement and installation of the laser cutting module 600.

[0064] Furthermore, the following briefly describes the use process of the above-mentioned fully automatic wafer cutting equipment:

[0065] First, the wafer basket is manually placed in the slot on the double-layer basket 200 in advance; the loading clamp 330 is lifted and lowered to the height of the wafer to be taken through the Z-axis linear module 310, and then moved to the wafer basket through the X-axis linear module 320. After the loading clamp 330 clamps the wafer, it is moved to the loading position through the X-axis linear module 320 and the wafer is released to the loading position. The wafer is mechanically initially positioned by the loading clamp module 350, and the loading light source module 340 provides a backlight source for the wafer, and then the wafer is precisely positioned by the positioning camera 430. Correspondingly, if the positioning camera 430 finds that the wafer is concave, the wafer is lifted and supported by the lifting assembly, and then the wafer is positioned again by the positioning camera 430.

[0066] Then, the gantry clamp 420 clamps the positioned wafer and rotates it to the processing stage module 500 located at the waiting position through the rotating drive component 410. The wafer is moved and positioned to the cutting position by the processing stage module 500, and then the wafer is cut by the laser cutting module 600. After cutting is completed, the wafer is transported to the waiting position by the processing stage module 500.

[0067] It can be known that when the processing stage module 500 and the laser cutting module 600 are transporting and cutting the wafers, the loading and unloading mechanism 300 also loads the next wafer to be processed and transports it to the loading position. After the previous wafer is processed and transported to the waiting position, the two gantry clamps 420 in the gantry rotating module 400 respectively clamp the processed wafer and the unprocessed wafer, and after rotating and moving through the rotating drive part 410, the positions of the two wafers are exchanged, and the material picking and placing actions are completed at the same time.

[0068] Afterwards, the processing stage module 500 and the laser cutting module 600 continue to transport and process the unprocessed wafers; synchronously, the loading and unloading mechanism 300 puts the processed wafers back into the basket 200, and takes the next wafer for loading, and repeats the cycle until all wafers are processed.

[0069] The fully automatic wafer cutting equipment in the utility model has a reasonable structural design. The gantry rotating module is used as the main body to connect other workstations in series, realize dual-axis parallel operation at the same time, shorten the overall process operation time of the equipment, and further optimize the function and appearance of each component. It conforms to ergonomics, occupies a small space, is easy to transport and install, and saves space costs.

[0070] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic wafer cutting device, comprising a base and a material basket arranged on the base, a processing stage module and a laser cutting module, characterized in that: It also includes a loading and unloading mechanism and a gantry rotating module arranged on the base; The loading and unloading mechanism includes a Z-axis linear module, an X-axis linear module and a loading clamp; the Z-axis linear module is fixedly arranged on the base; the X-axis linear module is arranged on the Z-axis linear module, and can be lifted and lowered along the Z direction under the drive of the Z-axis linear module; the loading clamp is arranged on the X-axis linear module, and can be horizontally reciprocated between the material basket and the loading position along the X direction under the drive of the X-axis linear module, so as to load and unload the wafers; The gantry rotation module includes a gantry, a rotation drive and two gantry clamps; the gantry is fixedly arranged on the base, and the two gantry clamps are connected to the gantry through the rotation drive and are symmetrically arranged on both sides of the rotation drive for grabbing wafers at the loading position and the waiting position, and the two gantry clamps can exchange positions under the rotation of the rotation drive; The laser cutting module is arranged above the processing position.

2. The fully automatic wafer cutting equipment according to claim 1, characterized in that: The loading and unloading mechanism also includes a loading clamping module fixedly arranged on the Z-axis linear module, and the loading clamping module includes two baffles extending along the X direction and arranged in parallel and spaced apart; the loading clamping claw is arranged between the two baffles, and moves back and forth between the material basket and the baffle under the drive of the X-axis linear module, transferring the wafers to be processed in the material basket to the baffle, and transferring the wafers that have been processed on the baffle to the material basket.

3. The fully automatic wafer cutting equipment according to claim 2, characterized in that: A clamping assembly is also provided on the top of each baffle, and the clamping assembly includes a clamping plate and a cylinder. The clamping plate is provided on the side of the baffle close to the loading clamp and is connected to the telescopic end of the cylinder so as to be telescopically extended and retracted along the Y direction under the drive of the cylinder, thereby clamping and positioning the wafer moved between the two baffles in the Y direction.

4. The fully automatic wafer cutting equipment according to claim 1, characterized in that: The processing platform module includes a processing platform Y-axis module, a processing platform X-axis module and a processing platform adsorption platform; the processing platform Y-axis is fixedly arranged on the base, the processing platform X-axis module is arranged on the processing platform Y-axis module, and the processing platform adsorption platform is arranged on the processing platform X-axis module; the processing platform adsorption platform moves back and forth between the waiting position and the processing position driven by the X-axis module and the Y-axis module, transports the wafer to be processed from the waiting position to the processing position, and transports the processed wafer from the processing position to the waiting position; A rotating module is also provided between the processing platform adsorption platform and the processing platform X-axis module, so as to drive the processing platform adsorption platform to rotate through the rotating module.

5. The fully automatic wafer cutting equipment according to any one of claims 1 to 4, characterized in that: It also includes a positioning camera; the positioning camera is arranged above the loading position and is used to position the wafer at the loading position.

6. The fully automatic wafer cutting equipment according to claim 5, characterized in that: The loading and unloading mechanism also includes a loading light source module fixedly arranged on the Z-axis linear module, the loading light source module includes a light source, and is arranged below the loading position to provide a backlight source for the wafer, so as to facilitate the positioning of the positioning camera; The loading light source module also includes a lifting component, which is arranged below the light source. The output end of the lifting component can be extended and retracted along the Z direction to drive the light source to move up and down to get close to the wafer and support the recessed wafer.

7. The fully automatic wafer cutting equipment according to claim 1, characterized in that: A slide plate carrier is fixedly arranged on the Z-axis linear module, and the X-axis linear module, the loading light source module and the loading clamping module are all arranged on the slide plate carrier; and / or A slide plate is fixedly arranged on the X-axis linear module, and the loading clamp is fixed on the X-axis linear module through the slide plate.

8. The fully automatic wafer cutting equipment according to claim 1, characterized in that: The gantry rotating module further comprises a horizontally arranged connecting plate, the middle portion of which is connected to the rotating driving member, and the two gantry clamps are symmetrically arranged at both ends of the connecting plate; A lifting component is also provided between the connecting plate and the gantry clamp, so that the gantry clamp can be lifted and lowered relative to the connecting plate by the lifting component.

9. The fully automatic wafer cutting equipment according to claim 1, characterized in that: The material basket is a double-layer material basket, and a guide rail is installed at the bottom of each layer of the material basket, and the material basket is slidably installed on the guide rail.

10. The fully automatic wafer cutting equipment according to claim 1, characterized in that: The loading position is arranged between the Z-axis linear module and the material basket, the waiting position is arranged on a side of the gantry away from the loading position, and the processing position is arranged on a side of the waiting position away from the loading position.

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