Corrosion etching equipment for subminiature quartz wafer
By designing the corrosion etching equipment of ultra-small quartz wafers, and using the motor-driven carrier device to perform precise control in the etching and cleaning slides, the problems of unstable manpower operation and waste liquid recovery in the traditional quartz wafer etching process are solved, and the problem of improvement is improved. Erosion efficiency and accuracy reduce costs.
Patent Information
- Application Number
- CN202421064165.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-05-16
AI Technical Summary
In the traditional wet etching process of quartz wafers, man-made operation leads to unstable etching time, difficult to control the etching depth, and difficult to recover the mixed waste liquid after cleaning, which increases labor intensity and processing complexity.
An etching equipment for ultra-small quartz wafers is designed, including a support carrier, an etching drive device, a loading device and a drive drive device. It is connected through a working slide and a drive belt, and a motor drive device is used to drive the loading device in the etching and cleaning slide. Perform precise control and set up water outlets and water inlets for easy solution recovery.
It achieves the accuracy and efficiency of etching time, simplifies the production process of quartz wafers, reduces labor costs, and improves the convenience of waste liquid recycling and etching accuracy.
Smart Images
Figure CN222205563U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of quartz wafer production equipment, in particular to corrosion and etching equipment for ultra-small quartz wafers. Background Art
[0002] When a quartz wafer is subjected to a wet etching process, the quartz wafer is first placed in an etching solution, and then after a period of time, the quartz wafer is placed in a cleaning solution for cleaning. This method increases the labor intensity of the staff during the transfer of the quartz wafer. On the other hand, since the contact time between the etching solution and the quartz wafer is difficult to control, the etching depth is often difficult to control. Moreover, after the etching is completed, when the cleaning solution is used to clean the quartz wafer, the mixed waste liquid is difficult to recycle, which increases the difficulty of recycling the cleaning solution and the etching solution.
[0003] As disclosed in application number: CN202010277329.8, a special etching equipment for quartz wafer production and its use method include a stand, on which a driving mechanism and a conveyor belt are provided. The driving mechanism is located above the conveyor belt, and connecting rod assemblies are provided on both sides of the driving mechanism. The connecting rod assembly on the right is connected to the etching solution output mechanism, and the connecting rod assembly on the left is connected to the cleaning liquid output mechanism. The cleaning liquid output mechanism is connected to the waste liquid recovery mechanism. The conveyor belt is connected to the driving mechanism through a sprocket assembly, and a plurality of solution pools are fixed at equal intervals on the conveyor belt.
[0004] However, in the traditional chip etching process, etching operations are performed manually, which not only results in unstable etching time but also involves a certain degree of risk during human operation. In addition, there is the problem that the mixed waste liquid of the cleaning liquid after cleaning is inconvenient to recycle. Utility Model Content
[0005] In order to solve the problems of unstable etching time and inconvenient waste liquid recovery under manual operation in traditional etching process, the utility model provides a corrosion etching equipment for ultra-small quartz wafer to solve the problem.
[0006] In order to achieve the above object, the utility model provides the following technical solutions:
[0007] A corrosion etching equipment for ultra-small quartz wafers, comprising: a supporting carrier, an etching drive device, a loading device and a transmission drive device, wherein a working slide is arranged on the supporting carrier, and the working slide is W-shaped, and the working slide comprises: an etching feed slide, a cleaning slide and a delivery slide, wherein the etching feed slide, the cleaning slide and the delivery slide are through-connected, the loading device is slidably arranged in the working slide, the etching drive device is arranged at the lower side of the cleaning slide, and the transmission drive device is arranged at the lower side of the delivery slide, the etching drive device and the driving end of the transmission drive device are used in conjunction with the loading device, an etching pool is arranged directly below the lowest point of the etching feed slide, and a cleaning pool is arranged directly below the lowest point of the cleaning slide.
[0008] Preferably, the etching pool and the cleaning pool are provided with a water outlet and a water inlet.
[0009] Preferably, the etching drive device includes: a first motor and a first drive rod, the first motor is fixedly arranged on the lower side of the cleaning slide, the output end of the first motor is fixedly connected to one end of the first drive rod, and the other end of the first drive rod is open and connected to the loading device.
[0010] Preferably, the transmission drive device includes: a second motor and a second drive rod, the second motor is fixedly arranged on the lower side of the delivery slide, the output end of the second motor is fixedly connected to one end of the second drive rod, and the other end of the second drive rod is open and connected to the loading device.
[0011] Preferably, the loading device includes: a connecting rod, a limit block, a swing arm, a splint, a loading rack, a spring and a clamping rod, the connecting rod is connected to the opening on the first driving rod or the second driving rod, a limit block is provided at the end of the connecting rod, the upper end of the swing arm is rotatably set on the connecting rod, the lower part of the swing arm is hinged to the middle part of the splint, the upper end of the splint is connected to the swing arm through a spring, the lower end of the splint is fixedly connected to the clamping rod, and the splint is connected to the loading rack through the clamping rod.
[0012] Preferably, the loading rack comprises: a connecting block, a loading plate and a loading connecting rod, the connecting block is cooperatively connected with the clamping rod, a plurality of groups of loading plates are arranged on the lower side of the connecting block, and the plurality of groups of loading plates are fixedly connected by the loading connecting rod.
[0013] The advantages of the utility model are: by connecting the working slideway with the transmission belt, the entire device can be directly connected to the processing flow, the carrying device is driven by the driving device to perform etching and cleaning, the accuracy of the etching time is guaranteed by controlling the motor, and the set drain port and water inlet make it easier to recover the solution, thereby improving the efficiency and accuracy of the etching process and reducing the cost of etching work. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the accompanying drawings:
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a side perspective view of the utility model;
[0017] Figure 3 This is a schematic diagram of the support carrier structure of the utility model;
[0018] Figure 4 It is the right side view of the utility model;
[0019] Figure 5 It is a left view of the utility model;
[0020] Figure 6 It is a front view of the object carrying device of the utility model;
[0021] Figure 7 This is a schematic diagram of the structure of the utility model carrier;
[0022] Description of reference numerals:
[0023] 1. Support carrier; 2. Etching drive device; 3. Loading device; 4. Transmission drive device; 5. Working slide; 11. Etching pool; 12. Cleaning pool; 13. Water outlet; 14. Water inlet; 21. First motor; 22. First drive rod; 31. Connecting rod; 32. Limiting block; 33. Swing arm; 34. Clamp; 35. Loading rack; 36. Spring; 37. Clamping rod; 351. Connecting block; 352. Loading plate; 353. Loading connecting rod; 41. Second motor; 42. Second drive rod; 51. Etching slide; 52. Cleaning slide; 53. Exit slide. DETAILED DESCRIPTION
[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0025] Embodiment 1, combined with Figure 1 , Figure 2 and Figure 3 To explain:
[0026] A corrosion etching equipment for ultra-small quartz wafers, comprising: a supporting carrier 1, an etching drive device 2, a carrier device 3 and a transmission drive device 4, wherein a working slide 5 is arranged on the supporting carrier 1, and the working slide 5 is W-shaped, and the working slide 5 comprises: an etching feed slide 51, a cleaning slide 52 and a delivery slide 53, wherein the etching feed slide 51, the cleaning slide 52 and the delivery slide 53 are connected through, the carrier device 3 is slidably arranged in the working slide 5, the etching drive device 2 is arranged at the lower side of the cleaning slide 52, and the transmission drive device 4 is arranged at the lower side of the delivery slide 53, the driving ends of the etching drive device 2 and the transmission drive device 4 are used in conjunction with the carrier device 3, an etching pool 11 is arranged directly below the lowest point of the etching feed slide 51, and a cleaning pool 12 is arranged directly below the lowest point of the cleaning slide 52.
[0027] In this way, the carrier device 3 is slidably set in the working slide 5, so that the working slide 5 controls the movement trajectory of the carrier device 3, and the etching pool 11 and the cleaning pool 12 are placed in coordination with the working slide 5, so that the carrier device 3 can contact the etching pool 11 and the cleaning pool 12 according to the working slide 5, and the etching drive device 2 and the transmission drive device 4 can contact the carrier device 3 for driving.
[0028] Embodiment 2, based on embodiment 1, combined with Figure 4 and Figure 5 To explain:
[0029] The etching drive device 2 includes: a first motor 21 and a first drive rod 22, the first motor 21 is fixedly arranged at the lower side of the cleaning slide 52, the output end of the first motor 21 is fixedly connected to one end of the first drive rod 22, the other end of the first drive rod 22 is open and is connected with the object carrier 3. The transmission drive device 4 includes: a second motor 41 and a second drive rod 42, the second motor 41 is fixedly arranged at the lower side of the delivery slide 53, the output end of the second motor 41 is fixedly connected to one end of the second drive rod 42, the other end of the second drive rod 42 is open and is connected with the object carrier 3.
[0030] In this way, the etching drive device 2 and the transmission drive device 4 are fixedly arranged and cooperate with the carrier device 3. When the carrier device 3 enters the working slide 5, the first drive rod 22 cooperates to be sent into the etching slide 51 and is connected with the carrier device 3. Under the drive of the first motor 21, the first drive rod 22 drives the carrier device 3 to leave the etching tank 11 and put it into the cleaning tank 12, and at the same time, the carrier device 3 is connected with the second drive rod 42. After cleaning is completed, the second drive rod 42 drives the carrier device 3 to be sent out along the delivery slide 53 to complete the etching and cleaning process.
[0031] Embodiment 3, based on embodiment 2, combined with Figure 6 and Figure 7To explain:
[0032] The object carrying device 3 comprises: a connecting rod 31, a limit block 32, a swing arm 33, a clamping plate 34, an object carrying rack 35, a spring 36 and a clamping rod 37. The connecting rod 31 is connected with the opening on the first driving rod 22 or the second driving rod 42. The limit block 32 is arranged at the end of the connecting rod 31. The upper end of the swing arm 33 is rotatably arranged on the connecting rod 31. The lower part of the swing arm 33 is hinged with the middle part of the clamping plate 34. The upper end of the clamping plate 34 is connected with the swing arm 33 through a spring 36. The lower end of the clamping plate 34 is fixedly connected with the clamping rod 37. The clamping plate 34 is connected with the object carrying rack 35 through the clamping rod 37. The object carrying rack 35 comprises: a connecting block 351, a carrying plate 352 and an object carrying connecting rod 353. The connecting block 351 is connected with the clamping rod 37. A plurality of groups of carrying plates 352 are arranged at the lower side of the connecting block 351. The plurality of groups of carrying plates 352 are fixedly connected through the carrying connecting rod 353.
[0033] With such arrangement, the wafers are placed on the carrier plate 352, and multiple sets of carrier plates 352 can be used to etch multiple sets of wafers at one time. The carrier 35 is connected to the connecting rod 31 through the cooperation of the clamp 34, the swing arm 33, the spring 36 and the clamping rod 37. The carrier 35 slides in the working slide 5 through the connecting rod 31, and follows the sliding to perform etching and cleaning work, and leaves from the delivery slide 53 after completing the etching and cleaning work.
[0034] The working principle of the utility model is as follows: the wafer is placed on the carrier plate 352, the carrier 35 is connected to the connecting rod 31 through the cooperation of the clamping plate 34, the swing arm 33, the spring 36 and the clamping rod 37, the connecting rod 31 is slidably set in the working slide 5, and is connected with the first driving rod 22 in the etching slide 51, and etching is performed in the etching pool 11. After the etching work is completed, under the drive of the first driving rod 22, the carrier device 3 enters the cleaning slide 52, the carrier device 3 performs cleaning work in the cleaning pool 12, and is connected with the second driving rod. After the cleaning work is completed, under the drive of the second driving rod 42, the carrier device 3 leaves the device along the delivery slide 53 to complete the entire process. The utility model has a simple structure and obvious effect. In the production process of quartz wafers, the etching process is simplified, the labor cost is reduced, and the wafer immersion time is more accurately controllable through motor control, thereby improving the etching efficiency and accuracy.
[0035] For those skilled in the art, the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.
[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any minor modifications, equivalent substitutions and improvements made to the above embodiments based on the technical essence of the present invention should be included in the protection scope of the technical solution of the present invention.
Claims
1. An ultra-small quartz wafer etching equipment, It is characterized in that include: A support carrier (1), an etching drive device (2), a carrier (3) and a transmission drive device (4); a working slide (5) is arranged on the support carrier (1); the working slide (5) is W-shaped; the working slide (5) comprises: an etching feed slide (51), a cleaning slide (52) and a delivery slide (53); the etching feed slide (51), the cleaning slide (52) and the delivery slide (53) are connected through; the carrier (3) is slidably arranged in the working slide (5); the etching drive device (2) is arranged at the lower side of the cleaning slide (52); the transmission drive device (4) is arranged at the lower side of the delivery slide (53); the driving ends of the etching drive device (2) and the transmission drive device (4) are used in conjunction with the carrier (3); an etching pool (11) is arranged directly below the lowest point of the etching feed slide (51); and a cleaning pool (12) is arranged directly below the lowest point of the cleaning slide (52).
2. The ultra-small quartz wafer etching equipment according to claim 1, It is characterized in that The etching pool (11) and the cleaning pool (12) are provided with a water outlet (13) and a water inlet (14).
3. The ultra-small quartz wafer etching equipment according to claim 1, It is characterized in that The etching drive device (2) comprises: a first motor (21) and a first drive rod (22); the first motor (21) is fixedly arranged on the lower side of the cleaning slide (52); the output end of the first motor (21) is fixedly connected to one end of the first drive rod (22); the other end of the first drive rod (22) is open and cooperatively connected to the loading device (3).
4. The ultra-small quartz wafer etching equipment according to claim 1, It is characterized in that The transmission drive device (4) comprises: a second motor (41) and a second drive rod (42); the second motor (41) is fixedly arranged on the lower side of the delivery slide (53); the output end of the second motor (41) is fixedly connected to one end of the second drive rod (42); the other end of the second drive rod (42) is open and is cooperatively connected to the object carrying device (3).
5. An ultra-small quartz wafer etching equipment according to claim 3 or 4, It is characterized in that The object carrying device (3) comprises: a connecting rod (31), a limit block (32), a swing arm (33), a clamping plate (34), an object carrying rack (35), a spring (36) and a clamping rod (37); the connecting rod (31) is connected to an opening on a first driving rod (22) or a second driving rod (42); a limit block (32) is arranged at the end of the connecting rod (31); the upper end of the swing arm (33) is rotatably arranged on the connecting rod (31); the lower part of the swing arm (33) is hinged to the middle part of the clamping plate (34); the upper end of the clamping plate (34) is connected to the swing arm (33) through a spring (36); the lower end of the clamping plate (34) is fixedly connected to the clamping rod (37); and the clamping plate (34) is connected to the object carrying rack (35) through the clamping rod (37).
6. The ultra-small quartz wafer etching equipment according to claim 5, It is characterized in that The object carrier (35) comprises: a connecting block (351), an object carrier plate (352) and an object carrier connecting rod (353); the connecting block (351) is connected in cooperation with the clamping rod (37); a plurality of groups of object carrier plates (352) are arranged on the lower side of the connecting block (351); and the plurality of groups of object carrier plates (352) are fixedly connected via the object carrier connecting rod (353).