LED light source assembly based on heat pipe packaging
By adopting heat pipe packaging technology in the LED light source assembly, the line layer and heat sink are used to directly connect the LED chip, and the heat dissipation fins are connected through the welding surface, the problem of poor heat dissipation effect of traditional LED headlights is solved, and more efficient heat dissipation is achieved and higher power LED chip packages.
Patent Information
- Application Number
- CN202420475448.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-12
AI Technical Summary
Traditional LED headlights limit heat transfer power due to the flat shape of the copper substrate, resulting in limited power of the LED light source and poor heat dissipation effect.
The LED light source component based on heat pipe packaging is adopted. By setting the line layer and heat sink on the heat pipe, the LED chip is directly connected, and the heat dissipation fins are connected through the welding surface to improve the heat dissipation performance.
Effectively reduce thermal resistance, improve the power and heat dissipation performance of LED chips, and can package higher power LED chips.
Smart Images
Figure CN222210253U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED light sources, in particular to an LED light source component based on heat pipe packaging. Background Art
[0002] At present, LED lights generally adopt a patch structure; in order to increase the brightness of LED lights, the power of LED lights is generally increased, which causes the heat generated by LED lights to be large, so LED lights have high requirements for heat dissipation structure. To facilitate the heat dissipation of LED lights, traditional LED lights generally use the LED light source to be attached to a copper substrate, and the copper substrate is connected to a heat dissipation fin. The heat generated by the LED light source is directly transferred to the heat dissipation fins through the copper substrate. However, since the shape of the copper plate is generally flat, the heat transfer power is limited, which leads to the power of the LED light source being limited. Summary of the invention
[0003] The utility model aims to provide an LED light source assembly based on heat pipe packaging in view of the deficiencies of the prior art. The LED light source assembly has relatively large light source power and relatively good heat dissipation effect.
[0004] A LED light source assembly based on heat pipe packaging comprises: a heat pipe, a circuit layer is arranged on the surface of the heat pipe, the circuit layer is provided with connection positions for multiple LED chips and is connected to the LED chips, two ends of the circuit layer are provided with solder pads for connecting to a PCB board, and the middle of the heat pipe is provided with a welding surface for welding heat dissipation fins.
[0005] Furthermore, an insulating layer is provided on the surface of the heat pipe, and the circuit layer and solder resist ink are provided on the surface of the insulating layer.
[0006] Furthermore, the insulating layer is provided with hollow holes, the hollow holes are filled with heat sinks, the heat sinks are connected to the surface of the heat pipe, the LED chip is fixed to the heat sink, and the electrode end of the LED chip is connected to the circuit layer through a gold wire.
[0007] Furthermore, a fluorescent film is bonded to the surface of the LED chip.
[0008] Furthermore, the heat pipe is welded with heat dissipation fins through the welding surface.
[0009] Furthermore, the LED chip is an aluminum nitride substrate chip.
[0010] Beneficial effects of the utility model: the utility model adopts a circuit layer and a heat sink arranged on the heat pipe, so that the LED chip is directly connected to the heat pipe through the heat sink, and the LED chip is connected to the PCB board through the circuit layer; the LED light source assembly has good overall heat dissipation performance and can encapsulate higher-power LED chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 A top view schematic diagram of an LED light source assembly.
[0012] Figure 2 A cross-sectional schematic diagram of a heat pipe.
[0013] Figure 3 Schematic diagram of fixing LED chip on heat pipe.
[0014] Figure 4 Schematic diagram of the connection between the LED chip and the circuit layer on the heat pipe.
[0015] Figure 5 Schematic diagram of bonding the fluorescent film to the LED chip.
[0016] Figure 6 It is a cross-sectional schematic diagram of an LED light source assembly.
[0017] Reference numerals include:
[0018] 1 - heat pipe; 2 - LED chip; 3 - circuit layer; 4 - welding surface; 5 - welding pad; 6 - heat sink fin;
[0019] 12 - insulation layer; 13 - heat sink; 14 - solder resist ink; 22 - gold wire; 23 - fluorescent film. DETAILED DESCRIPTION
[0020] The utility model is described in detail below with reference to the accompanying drawings. Figures 1 to 5 shown.
[0021] Example 1: See Figure 1 , Figure 2 A LED light source assembly based on heat pipe packaging, comprising: a heat pipe 1, a circuit layer 3 is provided on the surface of the heat pipe 1, the circuit layer 3 is provided with connection positions for multiple LED chips 2 and is connected to the LED chips 2, the two ends of the circuit layer 3 are provided with soldering pads 5 for connecting to a PCB board, and the middle part of the heat pipe 1 is provided with a welding surface 4 for welding heat dissipation fins 6.
[0022] The technical solution improves the traditional connection method: the LED light source is fixed on the PCB; the LED light source is fixed on the heat pipe 1, and a circuit layer 3 is arranged on the heat pipe 1; the heat pipe 1 is connected to the PCB board through the soldering pad 5 and to the heat dissipation fin 6 through the soldering surface 4, and the LED chip is directly connected to the heat dissipation fin 6 through the heat pipe 1 instead of the PCB board, thereby effectively reducing the thermal resistance, and the thermal conductivity of the heat pipe 1 is much higher than that of the copper substrate; thereby, the power and quantity of the LED chip 2 can be effectively increased.
[0023] See also Figure 2The surface of the heat pipe 1 is provided with an insulating layer 12 , and the surface of the insulating layer 12 is provided with the circuit layer 3 and the solder resist ink 14 .
[0024] In actual use, the heat pipe 1 is generally made of metal. In order to facilitate the setting of the circuit layer 3, an insulating layer 12 is first set on its surface, and then the wiring is laid on the insulating layer 12; secondly, a solder resist ink 14 is set on the insulating layer 12 to provide insulation to prevent the circuit layer 3 from short-circuiting due to accidental bridging; secondly, the insulating layer 12 can also be protected.
[0025] See also Figure 2 , Figure 3 as well as Figure 4 The insulating layer 12 is provided with a hollow hole, and the hollow hole is filled with a heat sink 13, the heat sink 13 is connected to the surface of the heat pipe 1, the LED chip 2 is fixed to the heat sink 13, and the electrode end of the LED chip 2 is connected to the circuit layer 3 through a gold wire 22.
[0026] In order to further improve the heat dissipation performance, the present technical solution sets hollow holes and a heat sink 13 on the insulating layer 12, the heat sink 13 is directly connected to the surface of the heat pipe 1, the LED chip 2 is fixed to the heat sink 13 by a solid crystal process, and the LED chip 2 is connected to the heat pipe 1 through the heat sink 13, the thermal resistance is small, and the heat dissipation efficiency is improved. Specifically, the LED chip 2 adopts an aluminum nitride substrate and is directly connected to the heat sink 13 on the heat pipe 1 through nano silver glue, the heat conduction path is short, and the heat dissipation is efficient.
[0027] See also Figure 4 The fluorescent film 23 is bonded to the surface of the LED chip 2 .
[0028] The surface of the LED chip 2 is coated with a layer of adhesive, and then the fluorescent film 23 is attached to the LED chip 2 by a film attaching machine and baked and cured. The fluorescent film 23 is provided to facilitate light adjustment and convert the blue light emitted by the chip into white light.
[0029] See also Figure 6 The heat pipe 1 is welded with the heat dissipation fins 6 through the welding surface 4 .
[0030] By providing the heat dissipation fins 6, the heat dissipation performance can be improved.
[0031] Furthermore, the LED chip 2 is an aluminum nitride substrate chip.
[0032] The aluminum nitride substrate chip has better heat dissipation effect than the traditional gallium nitride substrate chip, and can achieve greater power and brightness with the same lamp bead size and the same chip size.
[0033] The above contents are only preferred embodiments of the utility model. For ordinary technicians in this field, according to the concept of the utility model, there will be changes in the specific implementation method and application scope. The content of this specification should not be understood as a limitation on the utility model.
Claims
1. An LED light source assembly based on heat pipe packaging, characterized in that: It includes: A heat pipe, a circuit layer is provided on the surface of the heat pipe, the circuit layer is provided with connection positions for multiple LED chips and is connected to the LED chips, the two ends of the circuit layer are provided with solder pads for connecting to the PCB board, and the middle part of the heat pipe is provided with a welding surface for welding heat dissipation fins.
2. The LED light source assembly based on heat pipe packaging according to claim 1, characterized in that: An insulating layer is provided on the surface of the heat pipe, and the circuit layer and solder resist ink are provided on the surface of the insulating layer.
3. The LED light source assembly based on heat pipe packaging according to claim 2, characterized in that: The insulating layer is provided with hollow holes, the hollow holes are filled with heat sinks, the heat sinks are connected to the surface of the heat pipe, the LED chip is fixed to the heat sink, and the electrode end of the LED chip is connected to the circuit layer through a gold wire.
4. The LED light source assembly based on heat pipe packaging according to claim 1, 2 or 3, characterized in that: The surface of the LED chip is bonded with a fluorescent film.
5. The LED light source assembly based on heat pipe packaging according to claim 1, characterized in that: The heat pipe is welded with heat dissipation fins through the welding surface.
6. The LED light source assembly based on heat pipe packaging according to claim 4, characterized in that: The LED chip is an aluminum nitride substrate chip.