Temperature and pressure integrated sensor

Abstract

The embodiment of the utility model discloses a temperature and pressure integrated sensor, which comprises a shell, a temperature sensor and a pressure sensor, a cavity is formed in the base, the base is contained in the mounting cavity, and a through hole penetrating through the base in the lengthwise direction of the base is formed in the base; the support guide column is arranged on one side of the base; the temperature sensing component is arranged at one end, far away from the base, of the support guide column; the lead structure is arranged in the support guide column in a penetrating manner and is electrically connected with the temperature sensing component; the medium body wraps the temperature sensing component and the outer surface of the nearby support guide pillar; a first gap is formed between the support guide column and the shell, and the first gap is communicated with the through hole to form a sensing channel which is connected with the external environment and the pressure sensing component. According to the utility model, while the temperature probe is protected, the support guide pillar and the temperature sensing component have good sealing performance, and the failure of the pressure sensing component is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a temperature and pressure integrated sensor. Background Art

[0002] Sensors are one of the important technologies in modern measurement and automation systems. Sensors are widely used in everything from production process control to modern technological life. When it is necessary to measure temperature and pressure at the same time in some places, it is often necessary to use temperature sensors and pressure sensors together. The temperature and pressure composite sensor combines the double-layer characteristics of temperature sensors and pressure sensors, and can measure both temperature and pressure. Its structural design is generally to add a temperature sensor under the pressure sensor. The temperature probe (NTC) of the existing temperature and pressure integrated sensor usually adopts an encapsulated or exposed structure.

[0003] However, the encapsulated temperature probe is wrapped by a shell, which has a good protective effect on the temperature probe, but the temperature sensitivity is low, and the encapsulated shell will delay the transfer of temperature. The exposed temperature probe has good temperature sensitivity and can directly contact the measured medium, but the sealing of the temperature probe end is poor, which can easily lead to failure of the pressure sensitive element, making it impossible to measure accurately, and the protection effect on the temperature probe is poor.

[0004] Therefore, it is necessary to improve the existing technology. Utility Model Content

[0005] The embodiment of the utility model provides a temperature-pressure integrated sensor, which protects the temperature probe through the dielectric body, ensures good temperature sensitivity of the temperature probe, and ensures good sealing between the bracket guide column and the temperature sensing component to avoid failure of the pressure sensing component.

[0006] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:

[0007] On the one hand, a temperature and pressure integrated sensor is provided, comprising:

[0008] A housing having a mounting cavity therein;

[0009] A base having a cavity inside, the base is accommodated in the installation cavity, and the base is provided with a through hole penetrating along its longitudinal direction;

[0010] A support guide column, which is arranged on one side of the base, and the support guide column passes through the shell along the longitudinal direction of the shell;

[0011] A temperature sensing component, wherein the temperature sensing component is arranged at an end of the support guide column away from the base;

[0012] A lead structure, which is inserted into the support guide post along the longitudinal direction of the support guide post and is electrically connected to the temperature sensing component;

[0013] A dielectric body, the dielectric body wraps the temperature sensing component, the dielectric body covers the outer surface of the support guide column near the temperature sensing component, and the dielectric body has a heat conduction function;

[0014] A pressure sensing component, the pressure sensing component is arranged in the cavity, a first gap is provided between the support guide column and the housing, the first gap is connected with the through hole to form a sensing channel connecting the external environment and the pressure sensing component;

[0015] A circuit board is arranged in the installation cavity, and the circuit board is electrically connected to the pressure sensing component and the temperature sensing component.

[0016] In addition to or as an alternative to one or more of the features disclosed above, the dielectric body has a thermal conductivity greater than 10 W / (m·K).

[0017] In addition to or as an alternative to one or more of the features disclosed above, the base and the support guide column are an integrated structure, and the lead structure is buried in the support guide column and the base.

[0018] In addition to or as an alternative to one or more of the features disclosed above, the housing includes a first housing component and a second housing component that are detachably connected, and the first housing component and the second housing component are arranged to enclose the installation cavity;

[0019] The support guide column passes through the first shell component, and an electrical connector electrically connected to the circuit board is provided at one end of the second shell component away from the first shell component.

[0020] In addition to or as an alternative to one or more of the features disclosed above, the first housing component includes a main body having the cavity and a guide portion having a lead-out channel, the cavity is communicated with the lead-out channel, the bracket guide column is inserted into the lead-out channel, and the gap between the bracket guide column and the guide portion is configured as the first gap;

[0021] The temperature-pressure integrated sensor further includes a third sealing ring, and the third sealing ring is sleeved on the outer periphery of the guide portion.

[0022] In addition to or as an alternative to one or more of the features disclosed above, the invention further comprises a first sealing ring, wherein the first sealing ring is sandwiched between the base and the housing;

[0023] In the longitudinal direction of the shell, the orthographic projections of the through hole and the bracket guide column are both contained within the surrounding range of the orthographic projection of the first sealing ring.

[0024] In addition to or as an alternative to one or more of the features disclosed above, the invention further comprises a second sealing ring, wherein the second sealing ring is sandwiched between the pressure sensing component and the base;

[0025] In the longitudinal direction of the housing, the orthographic projections of the through hole and the pressure sensitive area of ​​the pressure sensing element are within the orthographic projection surrounding range of the second sealing ring.

[0026] In addition to or as an alternative to one or more of the features disclosed above, the material of the shell includes ultra-high molecular weight polyethylene.

[0027] In addition to or as an alternative to one or more of the features disclosed above, the temperature sensing component includes one of an NTC thermistor, a PTC thermistor or a platinum thermistor.

[0028] One of the above technical solutions has the following advantages or beneficial effects: while the present application protects the temperature probe through the dielectric body, it ensures good temperature sensitivity of the temperature probe and ensures good sealing between the bracket guide column and the temperature sensing component, thereby avoiding failure of the pressure sensing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0030] Figure 1 It is a structural schematic diagram of a temperature and pressure integrated sensor provided according to an embodiment of the utility model.

[0031] Figure 2 It is a schematic diagram of the explosion structure of a temperature-pressure integrated sensor provided according to an embodiment of the utility model.

[0032] Figure 3 It is a side view of a temperature and pressure integrated sensor provided according to an embodiment of the utility model.

[0033] Figure 4 It is a cross-sectional view along the AA direction of a temperature and pressure integrated sensor provided according to an embodiment of the utility model.

[0034] In the figure: 100-shell; 110-first shell component; 111-main body; 112-guide part; 120-second shell component; 121-electrical connector; 1211-signal probe; 200-core module; 210-base; 211-through hole; 220-bracket guide column; 230-lead structure; 300-temperature sensing component; 400-medium body; 500-pressure sensing component; 600-circuit board; 710-first sealing ring; 720-second sealing ring; 730-third sealing ring. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.

[0036] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0037] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] See also Figure 1 and Figure 2 , Figure 1 and Figure 2The schematic diagram of the structure and the schematic diagram of the explosion structure of a temperature-pressure integrated sensor provided according to an embodiment of the utility model are respectively shown. The temperature-pressure integrated sensor provided in an embodiment of the present application includes a shell 100, a core module 200, a temperature sensing component 300, a dielectric body 400, a pressure sensing component 500 and a circuit board 600. Among them, the shell 100 includes a first shell component 110 and a second shell component 120 that are coaxially arranged and connected, and the first shell component 110 and the second shell component 120 are surrounded to form an installation cavity. The first shell component 110 includes a main body 111 with the above-mentioned installation cavity and a guide portion 112 with a lead-out channel, the lead-out channel is connected to the installation cavity, and the lead-out channel connects the installation cavity with the external environment. The core module 200 includes a base 210 and a bracket guide column 220 that are coaxially arranged, and the base 210 and the bracket guide column 220 are an integrated structure. The base 210 is accommodated in the installation cavity of the first shell component 110. The base 210 is a cylindrical structure with a cavity inside. An opening is provided at one end thereof axially facing the second shell component 120. The cavity is connected to the installation cavity through the opening. The pressure sensing component 500 is at least partially embedded in the cavity of the base 210 through the opening. The support guide column 220 is arranged at one end of the base 210 away from the opening. The support guide column 220 is a columnar structure. The support guide column 220 extends in a direction away from the cavity. The support guide column 220 is partially penetrated in the lead-out channel of the guide portion 112. Part of the support guide column 220 extends from the lead-out channel of the guide portion 112 and contacts the external environment. The temperature sensing component 300 is arranged at the end of the support guide column 220 away from the base 210. The dielectric body 400 is wrapped around the outer surface of the temperature sensing component 300 and covers a portion of the surface of the support guide pillar 220 near the support guide pillar 220. The dielectric body 400 has a heat conduction function, and the temperature sensing component 300 senses the temperature of the test medium in the external environment through the dielectric body 400. The test medium includes gas (such as air) or liquid (such as oil or refrigerant). Further, the thermal conductivity of the dielectric body 400 is greater than 10W / (m·K).

[0040] Combination Figure 3 , Figure 4 As shown, Figure 3 and Figure 4The side view and the cross-sectional view along the AA direction of a temperature-pressure integrated sensor provided according to an embodiment of the utility model are respectively shown. Two through holes 211 penetrating the base 210 along the axial direction of the bracket guide column 220 are provided on the base 210. The through holes 211 connect the cavity and the installation cavity on one side of the base 210 where the bracket guide column 220 is provided. The bracket guide column 220 is inserted into the lead-out channel of the guide portion 112. There is a first gap between the bracket guide column 220 and the guide portion 112. The first gap and the through hole 211 form a sensing channel connecting the external environment and the pressure sensing component 500. The test medium reaches the pressure sensing component 500 through the sensing channel, and the pressure sensing component 500 senses the pressure value of the test medium.

[0041] In this embodiment, the number of the through holes 211 is two; in other embodiments, the number of the through holes 211 may be one or more than two, which is not specifically limited herein.

[0042] Combination Figure 1 , Figure 4 As shown, the pressure sensing component 500 has a first surface and a second surface facing each other, and the first surface of the pressure sensing component 500 is arranged on a side facing the support guide column 220 and communicates with the external environment through a sensing channel. The pressure sensing component 500 outputs a pressure value signal about the test medium in the external environment by sensing the pressure difference between the external environment and the installation cavity. A pressure sensitive area is provided on the first surface of the pressure sensing component 500. The temperature and pressure integrated sensor of the present application also includes a first sealing ring 710 and a second sealing ring 720. Among them, the first sealing ring 710 is sandwiched between the base 210 and the first external component, and the first sealing ring 710 is sleeved on the outer periphery of the support guide column 220. In the longitudinal direction of the housing 100, all through holes 211 and the orthographic projection of the support guide column 220 are contained within the surrounding range of the orthographic projection of the first sealing ring 710. The second sealing ring 720 is sandwiched between the pressure sensing component 500 and the base 210. In the longitudinal direction of the housing 100, all through holes 211 and the orthographic projections of the pressure sensitive areas are contained within the surrounding range of the orthographic projection of the second sealing ring 720. The present application isolates the sensing channel connected to the pressure sensing component 500 from the mounting cavity connected to the second surface of the pressure sensing component 500 through the first sealing ring 710 and the second sealing ring 720, thereby providing conditions for forming a pressure difference between the first surface and the second surface of the pressure sensing component 500.

[0043] The circuit board 600 is disposed on a side of the pressure sensing component 500 away from the support guide column 220 , and the circuit board 600 is electrically connected to the pressure sensing component 500 .

[0044] The core module 200 also includes a lead structure 230. The base 210 and the bracket guide column 220 are an integrated structure. The lead structure 230 is inserted into the base 210 and the bracket guide column 220. The lead structure 230 has a first end and a second end relative to each other. The first end of the lead structure 230 is connected to the temperature sensing component 300 at the end of the bracket guide column 220. The second end of the lead structure 230 is led out from the end surface of the base 210 near the opening and connected to the circuit board 600 to realize the electrical connection between the temperature sensing component 300 and the circuit board 600. In the prior art, the base 210 and the bracket guide column 220 are usually formed by an integrated injection molding process. The materials of the base 210 and the bracket guide column 220 are engineering plastics, and the material of the lead structure 230 is metal. The thermal expansion coefficients of the two materials are inconsistent. During the manufacturing process, the lead structure 230 may not be completely combined with the base 210 or the bracket guide column 220, and a leakage gap may be formed between the lead structure 230 and the base 210 or the bracket guide column 220. The leakage gap may cause the test medium to leak into the installation cavity on the second surface side of the pressure sensing component 500, and a pressure difference cannot be formed between the first surface and the second surface of the pressure sensing component 500, thereby causing the pressure sensing component 500 to fail. The dielectric body 400 wraps the outer surface of the temperature sensing component 300 and covers part of the surface of the bracket guide pillar 220 near the temperature sensing component 300 to fill the connection gap between the temperature sensing component 300 and the bracket guide pillar 220, thereby sealing the leakage gap that may be formed, improving the sealing between the bracket guide pillar 220 and the temperature sensing component 300, and avoiding failure of the pressure sensing component 500.

[0045] Furthermore, the temperature sensing component 300 includes one of an NTC thermistor, a PTC thermistor or a platinum thermistor.

[0046] It should be noted that the dielectric body 400 is in a hard solid state in a natural state or in contact with a test medium, so as to protect the temperature sensing component 300 and prevent the temperature sensing component 300 from being damaged due to collision during transportation. During the manufacturing process, the dielectric body 400 is coated on the surface of the temperature sensing component 300 and the surface of the bracket guide column 220 attached to the temperature sensing component 300 in a liquid state under special conditions (such as high temperature conditions), and then cured by a curing process (such as cooling curing, light curing).

[0047] Furthermore, the temperature and pressure integrated sensor of the present application further includes a third sealing ring 730, which is sleeved on the outer periphery of the guide portion 112 of the first housing component 110. When the present application is installed on the detected device, the detected device has a detection cavity inside, and the detected device has a detection hole connected to the detection cavity. The guide portion 112 of the first housing component 110 is extended into the detection hole so that the temperature sensing component 300 enters the detection environment, and the pressure sensing component 500 is connected to the detection environment through the sensing channel. The third sealing ring 730 is used to seal the gap between the guide portion 112 and the detection hole to improve the sealing of the detection cavity.

[0048] Furthermore, an external thread is provided on the outer periphery of the guide portion 112, and the guide portion 112 is installed on the detected device by screwing the external thread into the detection hole.

[0049] Furthermore, if Figure 4 As shown, an electrical connector 121 is provided at one end of the second housing component 120 away from the first housing component 110, and the electrical connector 121 is fixedly connected to the second housing component 120 by injection molding, and the electrical connector 121 is communicatively connected to the circuit board 600 to output the electrical signal on the circuit board 600. The electrical connector 121 includes a signal probe 1211, such as a pin, to transmit the electrical signal to the outside.

[0050] Furthermore, the material of the housing 100 includes ultra-high molecular weight polyethylene.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A temperature and pressure integrated sensor, It is characterized in that include: A housing having a mounting cavity therein; A base having a cavity inside, the base is accommodated in the installation cavity, and the base is provided with a through hole penetrating along its longitudinal direction; A support guide column, which is arranged on one side of the base, and the support guide column passes through the shell along the longitudinal direction of the shell; A temperature sensing component, wherein the temperature sensing component is arranged at an end of the support guide column away from the base; A lead structure, which is inserted into the support guide post along the longitudinal direction of the support guide post and is electrically connected to the temperature sensing component; A dielectric body, the dielectric body wraps the temperature sensing component, the dielectric body covers the outer surface of the support guide column near the temperature sensing component, and the dielectric body has a heat conduction function; A pressure sensing component, the pressure sensing component is arranged in the cavity, a first gap is provided between the support guide column and the housing, the first gap is connected with the through hole to form a sensing channel connecting the external environment and the pressure sensing component; A circuit board is arranged in the installation cavity, and the circuit board is electrically connected to the pressure sensing component and the temperature sensing component.

2. The temperature and pressure integrated sensor according to claim 1, It is characterized in that The thermal conductivity of the dielectric body is greater than 10 W / (m·K).

3. The temperature and pressure integrated sensor according to claim 1, It is characterized in that The base and the support guide column are an integrated structure, and the lead structure is buried in the support guide column and the base.

4. The temperature and pressure integrated sensor according to claim 1, It is characterized in that The housing comprises a first housing component and a second housing component which are detachably connected, and the first housing component and the second housing component are arranged to enclose the installation cavity; The support guide column passes through the first housing component; An electrical connector electrically connected to the circuit board is provided at one end of the second housing component away from the first housing component.

5. The temperature and pressure integrated sensor according to claim 4, It is characterized in that The first shell component includes a main body having the cavity and a guide portion having a lead-out channel, the cavity is communicated with the lead-out channel, and the bracket guide column is inserted into the lead-out channel; the gap between the bracket guide column and the guide portion is configured as the first gap.

6. The temperature-pressure integrated sensor according to claim 1, It is characterized in that It also includes a first sealing ring, which is sandwiched between the base and the shell; In the longitudinal direction of the shell, the orthographic projections of the through hole and the bracket guide column are both contained within the surrounding range of the orthographic projection of the first sealing ring.

7. The temperature and pressure integrated sensor according to claim 1, It is characterized in that It also includes a second sealing ring, which is sandwiched between the pressure sensing component and the base; In the longitudinal direction of the housing, the orthographic projections of the through hole and the pressure sensitive area of ​​the pressure sensing element are within the orthographic projection surrounding range of the second sealing ring.

8. The temperature and pressure integrated sensor according to claim 5, It is characterized in that It also includes a third sealing ring, which is sleeved on the outer periphery of the guide portion.

9. The temperature-pressure integrated sensor according to claim 1, It is characterized in that The material of the shell includes ultra-high molecular weight polyethylene.

10. The temperature-pressure integrated sensor according to claim 1, It is characterized in that The temperature sensing component includes one of an NTC thermistor, a PTC thermistor or a platinum thermistor.

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