Novel feeding auxiliary device at inlet of semiconductor automatic die bonder

Abstract

The utility model discloses a novel feeding auxiliary device at an inlet of a semiconductor automatic die bonder, which belongs to the technical field of feeding assistance and comprises a support frame, and symmetrical grooves I are arranged on two sides of the upper end of the support frame; a plurality of second regular grooves are formed in the middle of the upper end of the supporting frame. The supporting frame is located in the middle of the second symmetrical grooves and slidably connected with a sliding device. Bottom plates are fixedly connected to the two sides of the upper end of the supporting frame correspondingly, connecting devices are fixedly connected to the upper ends of the bottom plates correspondingly, connecting plates are fixedly connected to the upper ends of the connecting devices correspondingly, threaded shafts are slidably connected to the middles of the connecting plates correspondingly, and limiting blocks are in threaded connection with the outer surfaces of the threaded shafts correspondingly. One end of the threaded shaft extends out of one side of the connecting plate by a certain distance, the frame can be automatically fixed through the action of the connecting plate and the spring, friction is converted into rolling friction through the first pulley and the second pulley, the smoothness in the feeding process is reduced, and finally the accuracy of feeding displacement is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of material feeding assistance, and in particular relates to a novel material feeding assistance device at the entrance of a semiconductor automatic crystal bonding machine. Background Art

[0002] Various suction nozzles, ejectors, dispensing heads, porcelain nozzles, steel nozzles, choppers, pass pins, motors, carbon brushes, encoders, transmission belts of automatic die bonder chip mounting equipment, various spare parts of automation equipment, instruments and meters, etc. Some domestic companies have established cooperative relationships with relevant manufacturing plants and multiple service centers in Singapore, Malaysia, Japan, the United States, etc., specializing in various gold and aluminum wire ultrasonic welding machines, chip mounting machines and other SMT electronic mounting equipment for Youguang, ASM, KAIJO, K&S, NEC, ESEC, SHINKAWA, ALPHASEM, etc.

[0003] In the prior art, there is a new feeding auxiliary device at the entrance of a semiconductor automatic crystal bonding machine with patent announcement number CN218918790U. The above patent converts the friction during frame movement into rolling friction through a front pressure wheel assembly, a rear pressure wheel assembly and a roller assembly. In addition, the existence of the front pressure wheel assembly and the rear pressure wheel assembly also prevents the frame from warping or deforming. However, the following deficiencies still exist in actual use: from a practical point of view, one side of the device is still sliding friction, which causes fluctuations in smoothness and stability during feeding, and there are certain limitations for fixing raw materials of different specifications.

[0004] Therefore, a new feeding auxiliary device for the entrance of a semiconductor automatic crystal bonding machine is needed to solve the problem in the prior art that one side of the device is still subject to sliding friction, causing fluctuations in smoothness and stability during the feeding process, and there are certain limitations in fixing raw materials of different specifications. Utility Model Content

[0005] The purpose of the utility model is to provide a novel feeding auxiliary device for the inlet of a semiconductor automatic crystal bonding machine to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a new feeding auxiliary device for the inlet of a semiconductor automatic crystal bonding machine, comprising a support frame, symmetrical grooves 1 are provided on both sides of the upper end of the support frame; a plurality of regular grooves 2 are provided in the middle of the upper end of the support frame; the support frame is slidably connected with a sliding device in the middle of the plurality of symmetrical grooves 2; both sides of the upper end of the support frame are fixedly connected with a base plate, the upper end of the base plate is fixedly connected with a connecting device, the upper end of the connecting device is fixedly connected with a connecting plate, the middle of the connecting plate is slidably connected with a threaded shaft, the outer surface of the threaded shaft is threadedly connected to a limiting block, and one end of the threaded shaft extends a certain distance out of one side of the connecting plate.

[0007] It should be noted in the solution that a storage room is provided on one side of the middle part of the support frame, and anti-slip plates are provided on both sides of the lower end of the support frame.

[0008] It is further worth explaining that the sliding device includes a number of connecting shafts, and a number of the connecting shafts all penetrate a number of regular grooves 2 and are slidably connected to the two sides of the symmetrical grooves 1. A number of pulleys 1 are slidably connected in the number of connecting shafts, and the number and position of the pulleys 1 match and slide in the number of regular grooves 2. The outer surfaces of the number of connecting shafts located inside the grooves 1 are all meshed and connected with conveyor belts, and the inner surface of the other end of the conveyor belt is meshed and connected with a driving shaft, and one end of the driving shaft extends a distance from one end of one side of the support frame and is meshed and connected with a driving device.

[0009] It should be further explained that a groove three is provided on the upper end of the bottom plate.

[0010] As a preferred embodiment, the connecting device includes a connecting column 1 and a spring, the spring is located on the outer surface of the connecting column 1, and the lower ends of the connecting column 1 and the spring are fixedly connected to the bottom of the groove 3, the upper ends of the connecting column 1 and the spring are respectively fixedly connected with a slider and a connecting column 2, the slider is slidably connected to the sliding groove provided inside the connecting column 2, and the upper ends of the connecting column 2 are fixedly connected to the lower end of the connecting plate.

[0011] As a preferred embodiment, the limit blocks all include protrusion guides, which are slidably connected to the lower end of the connecting plate, and a connecting hole is provided in the middle of the protrusion guides, which are threadedly connected to the threaded shaft, and the lower ends of the protrusion guides are fixedly connected to the limit plates, one side of the limit plates is fixedly connected to a rotating shaft, and the other end of the rotating shaft is slidably connected to pulley 2.

[0012] As a preferred embodiment, the protrusion guide is trapezoidal, and the lower base of the trapezoid is located inside the connecting plate.

[0013] Compared with the prior art, the utility model provides a new feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine, which has at least the following beneficial effects:

[0014] (1) The frame is automatically fixed by the action of the connecting plate and the spring, that is, by the gravity of the connecting plate itself, and the limit block can be fixed at different positions of the frame by rotating the threaded shaft, thereby improving the practicality of the new feeding auxiliary device at the entrance of the semiconductor automatic crystal bonding machine.

[0015] (2) The friction is converted into rolling friction through pulleys 1 and 2, which reduces the smoothness of the feeding process and ultimately ensures the accuracy of the feeding displacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a front structural schematic diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the limit block structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the cross-sectional structure of the connection device of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the sliding device of the utility model.

[0020] In the figure: 1. support frame; 2. storage room; 3. anti-skid plate; 4. groove one; 5. groove two; 6. bottom plate; 601. groove three; 7. connecting device; 701. connecting column one; 702. spring; 703. slider; 704. connecting column two; 705. sliding groove; 8. sliding device; 801. connecting shaft; 802. pulley one; 803. conveyor belt; 804. driving shaft; 9. connecting plate; 10. limit block; 1001. protruding guide; 1002. connecting hole; 1003. limit plate; 1004. rotating shaft; 1005. pulley two; 11. threaded shaft. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with embodiments.

[0022] See also Figure 1-4 The utility model provides a new feeding auxiliary device for the entrance of a semiconductor automatic crystal bonding machine, including: a support frame 1, symmetrical grooves 4 are arranged on both sides of the upper end of the support frame 1; a plurality of regular grooves 5 are arranged in the middle of the upper end of the support frame 1; a sliding device 8 is slidably connected to the middle of the plurality of symmetrical grooves 5 of the support frame 1; a bottom plate 6 is fixedly connected to both sides of the upper end of the support frame 1, a connecting device 7 is fixedly connected to the upper end of the bottom plate 6, a connecting plate 9 is fixedly connected to the upper end of the connecting device 7, a threaded shaft 11 is slidably connected to the middle of the connecting plate 9, the outer surface of the threaded shaft 11 is threadedly connected to a limiting block 10, and one end of the threaded shaft 11 extends a certain distance from one side of the connecting plate 9.

[0023] Further Figure 1 As shown, it is worth explaining in detail that a storage chamber 2 is provided on one side of the middle part of the support frame 1, and anti-skid plates 3 are provided on both sides of the lower end of the support frame 1. Through the storage chamber 2, excess raw materials or some tools can be placed in the storage chamber 2 without affecting the operation of the operator, and the stability of the device is improved through the anti-skid plate 3, thereby improving the practicality of the new feeding auxiliary device at the entrance of the semiconductor automatic crystal bonding machine.

[0024] Further Figure 4As shown, it is worth specifically explaining that the sliding device 8 includes a plurality of connecting shafts 801, and the plurality of connecting shafts 801 all penetrate a plurality of regular grooves 25 and are slidably connected to both sides of the symmetrical groove 14, and a plurality of pulleys 802 are slidably connected in the plurality of connecting shafts 801, and the number and position of the plurality of pulleys 802 all match and slide in the plurality of regular grooves 25, and the outer surfaces of the plurality of connecting shafts 801 located inside the groove 14 are all meshedly connected with a conveyor belt 803, and the inner surface of the other end of the conveyor belt 803 is meshedly connected with a driving shaft 804, and one end of the driving shaft 804 extends out of the distance of one end of one side of the support frame 1, and is meshedly connected with a driving device, and the position and movement trajectory of the conveyor belt 803 and the plurality of pulleys 802 are limited by the symmetrical groove 4 and the plurality of regular grooves 25, and the friction is converted into rolling friction by the sliding device 8, that is, by the pulley 1 802 and the pulley 2 1005, thereby reducing the smoothness of the feeding process and ultimately ensuring the accuracy of the feeding displacement.

[0025] This solution has the following working process: first, separate the bottom plate 6 and the connecting plate 9, then place the feeding frame between pulley 1 802 and pulley 2 1005, and then rotate the threaded shaft 11 to move the two threaded limit blocks 10 left and right to the appropriate position, that is, pulley 2 1005 moves to the appropriate position, and then withdraw the traction force to bring the bottom plate 6 and the connecting plate 9 together, that is, pulley 1 802 and pulley 2 1005 fix the feeding frame.

[0026] According to the above working process, it can be known that: through the storage room 2, excess raw materials or some tools can be placed in the storage room 2, which will not affect the operation of the operator, and the stability of the device is improved through the anti-slip plate 3, thereby improving the practicality of the new feeding auxiliary device at the entrance of the semiconductor automatic crystal bonding machine. Through the symmetrical groove 1 4 and a plurality of regular grooves 2 5, the position and movement trajectory of the conveyor belt 803 and a plurality of pulleys 1 802 are limited, and through the sliding device 8, that is, through the pulley 1 802 and the pulley 2 1005, the friction is converted into rolling friction, which reduces the smoothness of the feeding process and finally ensures the accuracy of the feeding displacement.

[0027] Further Figure 3 As shown, it is worth explaining in detail that a groove three 601 is provided on the upper end of the bottom plate 6, and through the groove three 601, the bottom plate 6 and the connecting plate 9 can be better fitted and connected.

[0028] Further Figure 3As shown, it is worth explaining in detail that the connecting device 7 includes a connecting column 1 701 and a spring 702, the spring 702 is located on the outer surface of the connecting column 1 701, and the lower ends of the connecting column 1 701 and the spring 702 are fixedly connected to the bottom of the groove 3 601, and the upper ends of the connecting column 1 701 and the spring 702 are respectively fixedly connected with a slider 703 and a connecting column 2 704, the slider 703 is slidably connected to the sliding groove 705 provided inside the connecting column 2 704, and the upper ends of the connecting column 2 704 are fixedly connected to the lower end of the connecting plate 9, through the connecting device 7, that is, through the pressure and tension of the spring 702, a certain reaction is made to the self-gravity of the connecting plate 9, that is, the frame is automatically fixed by the self-gravity of the connecting plate 9, thereby improving the practicability of the new feeding auxiliary device at the entrance of the semiconductor automatic crystal bonding machine.

[0029] Further Figure 2 As shown, it is worth explaining in detail that the limit blocks 10 include protruding guides 1001, which are slidably connected to the lower end of the connecting plate 9, and a connecting hole 1002 is provided in the middle of the protruding guides 1001, and the connecting holes 1002 are threadedly connected to the threaded shaft 11, and the lower ends of the protruding guides 1001 are fixedly connected to the limit plates 1003, and a rotating shaft 1004 is fixedly connected to one side of the limit plates 1003, and a pulley 1005 is slidably connected to the other end of the rotating shaft 1004, and the limit blocks 10 can move left and right as the threaded shaft 11 rotates through the connecting holes 1002 of the limit blocks 10, and the transportation of raw materials is smoother through the pulley 1005 on one side of the limit plates 1003.

[0030] Further Figure 1 and Figure 2 As shown, it is worth explaining in detail that the raised guide 1001 is trapezoidal, and the lower base of the trapezoid is located inside the connecting plate 9. Through the shape and position of the raised guide 1001, the limit block 10 is restricted to move only left and right, thereby increasing the practicality of the device.

[0031] In summary: first separate the bottom plate 6 and the connecting plate 9, then place the feeding frame between the pulley 1 802 and the pulley 2 1005, then rotate the threaded shaft 11 to move the two threaded limit blocks 10 to the appropriate position, that is, the pulley 2 1005 moves to the appropriate position, and then withdraw the traction force to bring the bottom plate 6 and the connecting plate 9 together, that is, the pulley 1 802 and the pulley 2 1005 fix the feeding frame, and through the groove 3 601, the bottom plate 6 and the connecting plate 9 can be better fitted and connected, through the connecting device 7, that is, through the pressure of the spring 702 The connecting plate 9 reacts to its own gravity with the pulling force, that is, the frame is automatically fixed by the connecting plate 9's own gravity, thereby improving the practicability of the new feeding auxiliary device at the entrance of the semiconductor automatic crystal bonding machine. Through the connecting hole 1002 of the limit block 10, the limit block 10 can move left and right as the threaded shaft 11 rotates, and through the pulley 1005 on one side of the limit plate 1003, the transportation of the raw materials is smoother. Through the shape and position of the raised guide 1001, the limit block 10 is limited to move only left and right, thereby increasing the practicability of the device.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A novel feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine, comprising a support frame (1), characterized in that: Symmetrical grooves (4) are provided on both sides of the upper end of the support frame (1); a plurality of regular grooves (5) are provided in the middle of the upper end of the support frame (1); a sliding device (8) is slidably connected to the middle of the plurality of symmetrical grooves (5) of the support frame (1); a bottom plate (6) is fixedly connected to both sides of the upper end of the support frame (1); a connecting device (7) is fixedly connected to the upper end of the bottom plate (6); a connecting plate (9) is fixedly connected to the upper end of the connecting device (7); a threaded shaft (11) is slidably connected to the middle of the connecting plate (9); an outer surface of the threaded shaft (11) is threadedly connected to a limiting block (10), and one end of the threaded shaft (11) extends a certain distance from one side of the connecting plate (9).

2. According to claim 1, a new type of feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine is characterized in that: A storage chamber (2) is provided on one side of the middle of the support frame (1), and anti-slip plates (3) are provided on both sides of the lower end of the support frame (1).

3. According to claim 1, a new type of feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine is characterized in that: The sliding device (8) comprises a plurality of connecting shafts (801), each of which passes through a plurality of regular grooves (5) and is slidably connected to the two sides of a symmetrical groove (4), each of which is slidably connected to a plurality of pulleys (802), the number and position of each of which matches that of the plurality of regular grooves (5), and each of which slides in the plurality of regular grooves (5), and the outer surfaces of each of which is located inside the groove (4) is meshedly connected to a conveyor belt (803), the inner surface of the other end of the conveyor belt (803) is meshedly connected to a driving shaft (804), one end of which extends out of a distance from one end of the support frame (1) and is meshedly connected to a driving device.

4. According to claim 1, a new type of feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine is characterized in that: The upper end of the bottom plate (6) is provided with a groove three (601).

5. The novel feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine according to claim 1 is characterized in that: The connecting device (7) comprises a connecting column (701) and a spring (702), wherein the spring (702) is located on the outer surface of the connecting column (701), and the lower ends of the connecting column (701) and the spring (702) are fixedly connected to the bottom of the groove (601), and the upper ends of the connecting column (701) and the spring (702) are respectively fixedly connected to a slider (703) and a connecting column (704), wherein the slider (703) is slidably connected to a sliding groove (705) provided inside the connecting column (704), and the upper end of the connecting column (704) is fixedly connected to the lower end of the connecting plate (9).

6. The novel feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine according to claim 1 is characterized in that: The limit blocks (10) each include a protruding guide (1001), the protruding guide (1001) is slidably connected to the lower end of the connecting plate (9), and a connecting hole (1002) is provided in the middle of the protruding guide (1001), the connecting hole (1002) is threadedly connected to the threaded shaft (11), and the lower end of the protruding guide (1001) is fixedly connected to the limit plate (1003), one side of the limit plate (1003) is fixedly connected to a rotating shaft (1004), and the other end of the rotating shaft (1004) is slidably connected to a pulley 2 (1005).

7. The novel feeding auxiliary device for the inlet of a semiconductor automatic die bonding machine according to claim 6 is characterized in that: The protrusion guide (1001) is trapezoidal in shape, and the lower base of the trapezoid is located inside the connecting plate (9).

Images