Direct output semiconductor laser

Abstract

The utility model provides a direct output semiconductor laser, which comprises a lower base, an upper base and two fixing assemblies, the upper base is mounted on the upper side surface of the lower base, the two fixing assemblies are symmetrically mounted on the lower side surface of the lower base, and each fixing assembly comprises a fixing plate and a fixing rod which are used for fixing the laser. Compared with the prior art, the laser device has the following beneficial effects that the laser device is more convenient to mount and dismount and convenient to maintain and replace through the arrangement of the fixing assembly and the design of the fixing assembly; the installation time and workload are reduced, the overall installation efficiency is improved, the installation and disassembly processes of the upper base are simpler and more convenient through the arrangement of the installation plate, heat generated when the laser works can be dissipated through the cooling fins symmetrically installed on the left side and the right side, the working efficiency of the laser is improved, and the service life of the laser is prolonged.

Description

Technical Field

[0001] The utility model belongs to the field of laser equipment, and particularly relates to a direct output semiconductor laser. Background Art

[0002] A semiconductor laser is a laser made of semiconductor materials. It generates laser radiation by injecting current into semiconductor crystals to stimulate the recombination of electrons and holes. Although most semiconductor lasers are now installed with screws, screws can provide a firm connection to ensure that the laser will not loosen or move during use, thereby ensuring the stability and reliability of the equipment, but in actual use, semiconductor lasers have the problem that screw installation requires the use of tools, which increases the complexity and time cost of installation. This is because there is a lack of easy-to-install parts. The lack of easy-to-install parts will not only lead to the above problems, but also a single screw may loosen or fall off, resulting in an unstable position of the laser, affecting its performance and reliability. Therefore, it is necessary to propose a new structure to solve the above technical problems. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a direct output semiconductor laser to solve the problems raised in the above background technology.

[0004] The utility model is realized by the following technical scheme: a direct output semiconductor laser, comprising: a lower base, an upper base and a fixing component, the upper surface of the lower base is mounted with the upper base, the lower surface of the lower base is symmetrically mounted with two fixing components, the fixing component comprises: a fixing plate and a fixing rod for fixing the laser, the surface of the fixing plate is uniformly penetrated with the fixing rod, a plurality of electrodes are uniformly mounted on the left and right surfaces of the lower base, a heat sink is mounted on the outer surface of the upper base, a power line is mounted on the rear surface of the upper base, a lens is mounted on the upper surface of the upper base, the front and rear surfaces of the upper base are symmetrically and integrally formed with a mounting plate, and the upper surface of the mounting plate is penetrated with the mounting rod.

[0005] As a preferred embodiment, a fixing plate is symmetrically installed on the left edge and the right edge of the lower surface of the lower base, and the cross-section of the fixing plate is an L-shaped structure. A plurality of fixing rods are evenly penetrated on the surface of the fixing plate, and the surface of the fixing rods is provided with threads.

[0006] As a preferred embodiment, a hand-tightened knob is installed at the lower end of the fixing rod, the laser device is fixed to the equipment through a fixing component, and an upper base is installed at the center position of the upper surface of the lower base. When in use, the design of the fixing component makes the installation and disassembly of the laser more convenient, facilitates maintenance and replacement, reduces installation time and workload, and improves overall installation efficiency.

[0007] As a preferred embodiment, the upper base and the lower base have the same structure but different specifications, a plurality of lenses are evenly installed at the center position of the upper surface of the upper base, a heat sink is symmetrically installed on the left surface and the right surface of the upper base respectively, the heat sink is made of brass, and the heat sink is connected to the inside of the upper base.

[0008] As a preferred embodiment, a semiconductor laser is installed inside the upper base, and a mounting plate is integrally formed on the front surface and the lower edge of the rear surface of the upper base, respectively. The length of the mounting plate is the same as that of the upper base, and the surface of the mounting plate is flush with the upper surface of the lower base.

[0009] As a preferred embodiment, two mounting rods are evenly penetrated through the upper surface of the mounting plate, and magnets are installed at the lower ends of the mounting rods. The mounting rods penetrate the upper surface of the mounting plate through the magnets. The mounting rods penetrate the mounting plate, so that the upper base can be fixed to the lower base through the mounting rods. The magnet design at the lower end of the mounting rods can provide additional adsorption force, making the installation and disassembly process of the upper base easier. At the same time, the heat sinks symmetrically installed on the left and right sides help to dissipate the heat generated by the laser during operation, thereby improving the working efficiency and life of the laser.

[0010] After adopting the above technical scheme, the beneficial effect of the utility model is as follows: by setting a fixing component, the fixing component includes: a fixing plate and a fixing rod for fixing the laser, and a fixing component is symmetrically installed on the left edge and the right edge of the lower surface of the lower base. When in use, the design of the fixing component makes the installation and disassembly of the laser more convenient, which is convenient for maintenance and replacement, reduces installation time and workload, and improves the overall installation efficiency.

[0011] By setting a mounting plate, the front surface and the rear surface of the upper base are symmetrically formed with a mounting plate, the upper surface of the mounting plate is penetrated by a mounting rod, and the lower end of the mounting rod is provided with a magnet. The upper base is fixed to the upper surface of the lower base through the mounting plate and the mounting rod, and a heat sink is symmetrically installed on the left surface and the right surface of the upper base. When in use, the mounting rod penetrates the mounting plate, so that the upper base can be fixed to the lower base through the mounting rod. The magnet design at the lower end of the mounting rod can provide additional adsorption force, making the upper base easier to install and disassemble. At the same time, the heat sinks symmetrically installed on the left and right sides help to dissipate the heat generated when the laser is working, thereby improving the working efficiency and life of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0013] Figure 1 The utility model is a schematic diagram of the overall structure of a direct output semiconductor laser.

[0014] Figure 2 The utility model is a schematic diagram of a mounting rod for directly outputting a semiconductor laser.

[0015] Figure 3 It is a schematic diagram of a fixing component of a direct output semiconductor laser of the utility model.

[0016] In the figure, 100-upper base, 110-heat sink, 120-lens, 130-mounting plate, 140-mounting rod, 141-magnet;

[0017] 200-lower base, 210-electrode;

[0018] 300 - fixing assembly, 310 - fixing plate, 320 - fixing rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figures 1 to 3The utility model provides a technical solution: a direct output semiconductor laser, comprising: a lower base 200, an upper base 100 and a fixing assembly 300, the upper surface of the lower base 200 is mounted with the upper base 100, the lower surface of the lower base 200 is symmetrically mounted with two fixing assemblies 300, the fixing assembly 300 comprises: a fixing plate 310 and a fixing rod 320 for fixing the laser, the surface of the fixing plate 310 is uniformly penetrated with the fixing rod 320, a plurality of electrodes 210 are uniformly mounted on the left and right surfaces of the lower base 200, a heat sink 110 is mounted on the outer surface of the upper base 100, a power cord is mounted on the rear surface of the upper base 100, a lens 120 is mounted on the upper surface of the upper base 100, a mounting plate 130 is symmetrically formed integrally with the front and rear surfaces of the upper base 100, and a mounting rod 140 is mounted on the upper surface of the mounting plate 130.

[0021] See also Figure 1 , Figure 3 As the first embodiment of the utility model: a fixing plate 310 is symmetrically installed on the left edge and the right edge of the lower surface of the lower base 200, and the cross section of the fixing plate 310 is an L-shaped structure. A plurality of fixing rods 320 are evenly penetrated on the surface of the fixing plate 310, and the surface of the fixing rods 320 is provided with threads;

[0022] A hand-tightening knob is installed at the lower end of the fixing rod 320, and the laser device is fixed to the equipment through the fixing assembly 300. The upper base 100 is installed at the center position of the upper side surface of the lower base 200;

[0023] When in use, the user first mounts the fixing plate 310 on the device to be installed. At this time, it should be noted that the installed device must meet the installation method of the fixing component 300. After the fixing plate 310 is installed, the user can then rotate the hand knob to drive the fixing rod 320 to abut and fix the clamped device, thereby fixing the laser through the fixing component 300. The design of the fixing component 300 makes the installation and disassembly of the laser more convenient, facilitates maintenance and replacement, reduces installation time and workload, and improves overall installation efficiency.

[0024] See also Figure 1 , Figure 2 As the second embodiment of the utility model: the upper base 100 and the lower base 200 have the same structure but different specifications. A plurality of lenses 120 are evenly installed at the center of the upper surface of the upper base 100. A heat sink 110 is symmetrically installed on the left and right surfaces of the upper base 100. The heat sink 110 is made of brass and is connected to the interior of the upper base 100.

[0025] A semiconductor laser is installed inside the upper base 100. A mounting plate 130 is formed integrally on the front surface and the lower edge of the rear surface of the upper base 100. The length of the mounting plate 130 is the same as that of the upper base 100. The surface of the mounting plate 130 is flush with the upper surface of the lower base 200.

[0026] Two mounting rods 140 are evenly penetrated on the upper surface of the mounting plate 130. A magnet 141 is installed on the lower end of the mounting rod 140. The mounting rod 140 penetrates the upper surface of the mounting plate 130 through the magnet 141.

[0027] When in use, when it is necessary to remove the upper base 100 from the surface of the lower base 200, the user can pull out the magnetic mounting rod 140 to separate the magnet 141 at the lower end of the mounting rod 140 from the magnet 141 inside the lower base 200, and then separate the upper base 100 from the lower base 200. At this time, the user can perform maintenance operations on the electronic components inside the upper base 100 or the lower base 200 (this device is modified according to the semiconductor laser component of Beiyi Fiber Communication Company, which uses 635nm 400mW The working principle and structure of the multi-mode belt-cooled semiconductor laser are already existing technologies, so they will not be described in detail here. Since the mounting rod 140 passes through the mounting plate 130, the upper base 100 can be fixed on the lower base 200 through the mounting rod 140. The magnet 141 at the lower end of the mounting rod 140 can provide additional adsorption force, making the upper base 100 easier to install and remove. At the same time, the heat sink 110 symmetrically installed on the left and right sides helps to dissipate the heat generated by the laser during operation, thereby improving the working efficiency and life of the laser.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A direct output semiconductor laser comprising: A lower base (200), an upper base (100), and a fixing assembly (300), characterized in that the upper base (100) is mounted on the upper surface of the lower base (200), and two fixing assemblies (300) are symmetrically mounted on the lower surface of the lower base (200), and the fixing assembly (300) comprises: a fixing plate (310) and a fixing rod (320) for fixing a laser; The surface of the fixing plate (310) is uniformly penetrated by fixing rods (320), the left and right surfaces of the lower base (200) are uniformly mounted with a plurality of electrodes (210), the outer surface of the upper base (100) is mounted with a heat sink (110), and the rear surface of the upper base (100) is mounted with a power cord; A lens (120) is mounted on the upper surface of the upper base (100), and a mounting plate (130) is symmetrically formed on the front surface and the rear surface of the upper base (100), respectively, and a mounting rod (140) is installed through the upper surface of the mounting plate (130).

2. A direct output semiconductor laser as claimed in claim 1, characterized in that: A fixing plate (310) is symmetrically mounted on the left edge and the right edge of the lower surface of the lower base (200), the cross section of the fixing plate (310) being an L-shaped structure, a plurality of fixing rods (320) evenly passing through the surface of the fixing plate (310), and the surfaces of the fixing rods (320) are provided with threads.

3. A direct output semiconductor laser as claimed in claim 2, characterized in that: A hand-tightening knob is installed at the lower end of the fixing rod (320); the laser device is fixed to the equipment via a fixing assembly (300); and an upper base (100) is installed at the center of the upper surface of the lower base (200).

4. A direct output semiconductor laser as claimed in claim 3, characterized in that: The upper base (100) and the lower base (200) have the same structure but different specifications; a plurality of lenses (120) are evenly mounted at the center of the upper surface of the upper base (100); a heat sink (110) is symmetrically mounted on the left and right surfaces of the upper base (100); the heat sink (110) is made of brass; and the heat sink (110) is connected to the interior of the upper base (100).

5. A direct output semiconductor laser as claimed in claim 4, characterized in that: A semiconductor laser is installed inside the upper base (100); a mounting plate (130) is integrally formed on the front surface and the lower edge of the rear surface of the upper base (100); the length of the mounting plate (130) is the same as that of the upper base (100); and the surface of the mounting plate (130) is flush with the upper surface of the lower base (200).

6. A direct output semiconductor laser as claimed in claim 5, characterized in that: Two mounting rods (140) are evenly penetrated through the upper surface of the mounting plate (130), magnets (141) are installed at the lower ends of the mounting rods (140), and the mounting rods (140) penetrate the upper surface of the mounting plate (130) through the magnets (141).

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