LED lamp bead and LED point control lamp string

Abstract

The utility model relates to an LED lamp bead and an LED point control lamp string. The LED lamp bead comprises a support, a light-emitting assembly installed in the support and a driving IC capable of writing codes. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are arranged in the bracket; wherein the first bonding pad is electrically connected with the light-emitting component and the driving IC respectively and is used for supplying power to the light-emitting component and the driving IC; the second bonding pad is electrically connected with the light-emitting component through the driving IC and is used for grounding the light-emitting component and the driving IC; at least one of the third bonding pad and the fourth bonding pad is electrically connected with the driving IC so as to write data into the driving IC; or at least one of the third bonding pad and the fourth bonding pad is electrically connected with the light-emitting component through the driving IC, so that the light-emitting component and the driving IC are grounded; and the second bonding pad is electrically connected with the driving IC so as to write data into the driving IC. When the LED lamp beads disclosed by the utility model are assembled into a lamp string, the processing is simple, the product reliability is high, and the normal work of other lamp beads cannot be influenced when a single lamp bead or a plurality of lamp beads are damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting equipment, in particular to an LED lamp bead and an LED point-controlled lamp string. Background Art

[0002] At present, the LED lamp beads used to assemble LED point-controlled light strings on the market all use return-to-zero code driver ICs (integrated circuits) to achieve the effect of lamp bead point control (individually controlling the brightness and color of the lamp beads). Figure 1 As shown, in addition to the positive and negative poles, this type of lamp bead also has a signal input port (DIN) and a signal output port (DOUT). This type of lamp bead has two shortcomings when assembled into a light string:

[0003] 1. Complex processing and impact on processing yield: The light string is made of multiple lamp beads and metal wires. During the processing of the light string, the metal wires are first welded to the signal input port (DIN) and signal output port (DOUT) of each lamp bead in batches, and then the metal wires between the signal input port (DIN) and signal output port (DOUT) of each lamp bead need to be disconnected, otherwise the signal of the lamp bead on the light string will be short-circuited. The step of cutting the metal wires increases the complexity of assembling the light string, and the process of cutting the metal wires is likely to cause the metal wires to deform, thereby affecting the welding yield of the light string products. At the same time, when the metal wires are cut, metal debris and burrs are likely to be generated, resulting in a short circuit between the metal wires, which in turn causes the light string to be defective.

[0004] 2. Low product reliability: The driving data of this type of light string is transmitted in series. When a single LED lamp bead is damaged, all the lamp beads behind it cannot receive the driving data and therefore cannot light up normally. Utility Model Content

[0005] The utility model aims to provide an LED lamp bead and an LED point-controlled lamp string to solve the problems of complex processing, affecting the processing yield and low product reliability when the existing LED lamp beads are assembled into a lamp string.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] On the one hand, the present application provides an LED lamp bead, comprising: a bracket, a light-emitting component installed in the bracket, and a writable driver IC, wherein the driver IC is used to control the light-emitting component;

[0008] The bracket is provided with a first solder pad, a second solder pad, a third solder pad and a fourth solder pad;

[0009] Wherein, the first pad is electrically connected to the light emitting component and the driving IC respectively, and is used to supply power to the light emitting component and the driving IC;

[0010] The second pad is electrically connected to the light emitting component through the driver IC, and is used to ground the light emitting component and the driver IC; at least one of the third pad and the fourth pad is electrically connected to the driver IC, so as to write data to the driver IC;

[0011] Alternatively, at least one of the third pad and the fourth pad is electrically connected to the light-emitting component through the driver IC to ground the light-emitting component and the driver IC; the second pad is electrically connected to the driver IC to write data to the driver IC.

[0012] Optionally, the light-emitting surface of the LED lamp bead is the front side, and the side opposite to the light-emitting surface is the back side, the front side of the bracket is provided with a bowl-shaped light-emitting port, and the bracket and the light-emitting port are filled with light-transmitting protective glue.

[0013] Optionally, the first solder pad and the second solder pad are respectively arranged at two ends of the LED lamp bead, and the third solder pad and the fourth solder pad are both arranged between the first solder pad and the second solder pad;

[0014] The two ends of the first solder pad extend to the back side of the bracket to form two first solder legs, the two ends of the second solder pad extend to the back side of the bracket to form two second solder legs, one end of the third solder pad extends to the back side of the bracket to form a third solder leg, and one end of the fourth solder pad extends to the back side of the bracket to form a fourth solder leg.

[0015] Optionally, the two first weld legs are symmetrically arranged, the two second weld legs are symmetrically arranged, the third weld leg and the fourth weld leg are symmetrically arranged, and the first weld leg, the second weld leg and the third weld leg are arranged in parallel.

[0016] Optionally, the light emitting component is arranged on the first pad;

[0017] The third pad and the fourth pad are two independent pads, or the third pad and the fourth pad are integrally formed into one pad;

[0018] When the third pad and the fourth pad are two independent pads, the middle portion of the second pad extends downward to form a protrusion, the protrusion is arranged between the third pad and the fourth pad, and the driver IC is arranged on the protrusion.

[0019] On the other hand, the present application also provides an LED point-controlled light string, comprising a plurality of metal wires and a plurality of the above-mentioned LED lamp beads;

[0020] The first soldering pads of the plurality of LED lamp beads are electrically connected through metal wires and connected to the positive electrode of the VDD power supply;

[0021] When the second pads of the LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply, the third pads and / or the fourth pads of several LED lamp beads are electrically connected through metal wires and connected to the driving data;

[0022] When the second pads of several LED lamp beads are electrically connected through metal wires and connected to driving data, the third pads and / or fourth pads of several LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply.

[0023] In a third aspect, the present application further provides an LED lamp bead, comprising: a light-emitting component, a writable driver IC, a first soldering pad, a second soldering pad, and a third soldering pad;

[0024] Wherein, the driver IC is used to control the light-emitting component;

[0025] The first pad is electrically connected to the light emitting component and the driving IC respectively, and is used to supply power to the light emitting component and the driving IC;

[0026] The second pad is electrically connected to the light emitting component through the driver IC, and is used to ground the light emitting component and the driver IC; the third pad is electrically connected to the driver IC, and is used to write data to the driver IC;

[0027] Alternatively, the third pad is electrically connected to the light emitting component through the driver IC, and is used to ground the light emitting component and the driver IC; the second pad is electrically connected to the driver IC, and data is written to the driver IC;

[0028] Along the direction from the first pad to the second pad, the cross-sections of the first pad and the second pad are both in a square shape, and the cross-section of the third pad is in a square shape or a square shape with a notch;

[0029] The light-emitting surface of the LED lamp bead is the front side, the side opposite to the light-emitting surface is the back side, and the notch of the third solder pad (43) is arranged on the front side;

[0030] The first solder pad (41) includes a first solder foot portion (411) located on the back side, the second solder pad (42) includes a second solder foot portion (421) located on the back side, and the third solder pad (43) includes a third solder foot portion (431) located on the back side.

[0031] Optionally, a light-transmitting protective glue is packaged on the front of the LED lamp bead, and the light-transmitting protective glue is used to protect the light-emitting component and the driver IC;

[0032] Insulating isolation glue is encapsulated in the gaps between the first pad, the second pad and the third pad, as well as in the hollow structure.

[0033] In a fourth aspect, the present application also provides an LED point-controlled light string, comprising a plurality of metal wires and a plurality of the above-mentioned LED lamp beads;

[0034] The first welding pins of the plurality of LED lamp beads are electrically connected through metal wires and connected to the positive electrode of the VDD power supply;

[0035] When the second soldering pins of the plurality of LED lamp beads are electrically connected through metal wires and connected to the negative electrode of the GND power supply, the third soldering pins of the plurality of LED lamp beads are electrically connected through metal wires and connected to the driving data;

[0036] When the second soldering pins of several LED lamp beads are electrically connected through metal wires and connected to driving data, the third soldering pins of several LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply.

[0037] Compared with the prior art, the utility model has the following beneficial effects: when the LED lamp beads provided by the utility model are assembled into a lamp string, data can be directly written to the lamp beads through the second soldering pad (or at least one of the third soldering pad and the fourth soldering pad), and there is no need to set a signal output port on the lamp bead to transmit the data to the next lamp bead. For the light string, the driving data of each lamp bead is written through its own second soldering pad (or at least one of the third soldering pad and the fourth soldering pad), and there is no need to set a signal output port in the point-controlled lamp bead. Therefore, when assembling into the light string, there is no need to cut the metal wire when assembling it, which simplifies the processing procedure, saves working time, and avoids the problem of deformation of the metal wire during cutting, which in turn affects the welding yield of the light string product. Moreover, the driving data of the lamp string is transmitted in parallel. Compared with the solution of serial transmission of driving data in the existing light string, the product has high reliability, and damage to a single lamp bead or damage to multiple lamp beads will not affect the normal operation of other lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0039] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0040] Figure 1 It is a structural schematic diagram of an LED point-controlled light string in the background technology;

[0041] Figure 2a This is a schematic diagram of the structure of an LED lamp bead in Example 1;

[0042] Figure 2b for Figure 2a Schematic diagram of the structure of the middle pad;

[0043] Figure 3a This is a schematic diagram of the structure of another LED lamp bead in Example 1;

[0044] Figure 3b for Figure 3a Schematic diagram of the structure of the middle pad;

[0045] Figure 4a This is a schematic diagram of the structure of an LED point-controlled light string in Example 1;

[0046] Figure 4b This is a schematic diagram of the structure of another LED point-controlled light string in Example 1;

[0047] Figure 5a This is a schematic diagram of the structure of an LED lamp bead in Example 2;

[0048] Figure 5b for Figure 5a Schematic diagram of the structure of the middle pad;

[0049] Figure 5c for Figure 5a A schematic diagram of the structure of the LED lamp bead encapsulated with a light-transmitting protective adhesive;

[0050] Figure 6a This is a schematic diagram of the structure of another LED lamp bead in Example 2;

[0051] Figure 6b for Figure 6a Schematic diagram of the structure of the middle pad;

[0052] Figure 6c for Figure 6a Schematic diagram of the structure of the LED lamp bead encapsulated with light-transmitting protective glue.

[0053] Explanation of the reference numerals: 10, bracket; 11, light-emitting port; 20, light-emitting component; 30, driver IC; 41, first solder pad; 411, first solder foot; 42, second solder pad; 421, second solder foot; 422, protrusion; 43, third solder pad; 431, third solder foot; 44, fourth solder pad; 441, fourth solder foot; 50, light-transmitting protective glue. DETAILED DESCRIPTION

[0054] In order to make the utility model's purpose, features, and advantages more obvious and easy to understand, the following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. Obviously, the embodiments described below are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0055] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0056] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0057] Example 1

[0058] Reference Figures 2a to 3b The LED lamp bead disclosed in this embodiment includes: a bracket 10, a light-emitting component 20 installed in the bracket 10, and a writable driver IC 30, the driver IC 30 is used to control the light-emitting component 20; a first solder pad 41, a second solder pad 42, a third solder pad 43 and a fourth solder pad 44 are provided in the bracket 10;

[0059] The first pad 41 is electrically connected to the light emitting component 20 and the driver IC 30 respectively, and is used to supply power to the light emitting component 20 and the driver IC 30;

[0060] The second pad 42 is electrically connected to the light emitting component 20 through the driver IC 30, and is used to ground the light emitting component 20 and the driver IC 30; at least one of the third pad 43 and the fourth pad 44 is electrically connected to the driver IC 30, so as to write data to the driver IC 30 (that is, data can be written to the driver IC 30 through one of the third pad 43 or the fourth pad 44, or data can be written to the driver IC 30 through both the third pad 43 and the fourth pad 44);

[0061] Alternatively, at least one of the third solder pad 43 and the fourth solder pad 44 is electrically connected to the light-emitting component 20 through the driver IC 30, so as to ground the light-emitting component 20 and the driver IC 30 (that is, the light-emitting component 20 and the driver IC 30 can be grounded through one of the third solder pad 43 or the fourth solder pad 44, or the light-emitting component 20 and the driver IC 30 can be grounded through both the third solder pad 43 and the fourth solder pad 44); the second solder pad 42 is electrically connected to the driver IC 30 to write data to the driver IC 30.

[0062] When the LED lamp beads provided in this embodiment are assembled into a lamp string, data can be directly written to the lamp beads through the second soldering pad 42 (or at least one of the third soldering pad 43 and the fourth soldering pad 44), and there is no need to set a signal output port on the lamp bead to transmit the data to the next lamp bead. For the light string, the driving data of each lamp bead is written through its own second soldering pad 42 (or at least one of the third soldering pad 43 and the fourth soldering pad 44), and there is no need to set a signal output port in the point-controlled lamp bead. Therefore, when assembling into a light string, there is no need to cut the metal wire, which simplifies the processing procedure, saves operation time, and avoids the problem of deformation of the metal wire during the cutting process, thereby affecting the welding yield of the light string product; and the driving data of the lamp string is transmitted in parallel. Compared with the solution of serial transmission of driving data in the existing light string, the product reliability is high, and damage to a single lamp bead or damage to multiple lamp beads will not affect the normal operation of other lamp beads.

[0063] Reference Figure 2a and Figure 3a The light-emitting surface of the LED lamp bead is the front side, and the side opposite to the light-emitting surface is the back side. A bowl-shaped light-emitting port 11 is opened on the front side of the bracket 10, and the bracket 10 and the light-emitting port 11 are filled with light-transmitting protective glue.

[0064] Further, see Figure 2b and Figure 3b , the first solder pad 41 and the second solder pad 42 are respectively arranged at two ends of the LED lamp bead, and the third solder pad 43 and the fourth solder pad 44 are both arranged between the first solder pad 41 and the second solder pad 42;

[0065] Both ends of the first solder pad 41 extend to the back side of the bracket 10 to form two first solder legs 411, both ends of the second solder pad 42 extend to the back side of the bracket 10 to form two second solder legs 421, one end of the third solder pad 43 extends to the back side of the bracket 10 to form a third solder leg 431, and one end of the fourth solder pad 44 extends to the back side of the bracket 10 to form a fourth solder leg 441.

[0066] Further, see Figure 2b and Figure 3b The two first solder legs 411 are symmetrically arranged, the two second solder legs 421 are symmetrically arranged, the third solder leg 431 and the fourth solder leg 441 are symmetrically arranged, and the first solder leg 411, the second solder leg 421 and the third solder leg 431 are arranged in parallel. This symmetrical and consistent layout helps to standardize the production process when the lamp beads are assembled into a lamp string, and improves the accuracy and speed of the assembly process.

[0067] Further, see Figure 2a and Figure 3a , the light emitting component 20 is arranged on the first pad 41; the third pad 43 and the fourth pad 44 are two independent pads, or the third pad 43 and the fourth pad 44 are integrally formed into one pad; when the third pad 43 and the fourth pad 44 are two independent pads, the middle part of the second pad 42 extends downward to form a protrusion 422, the protrusion 422 is arranged between the third pad 43 and the fourth pad 44, and the driver IC 30 is arranged on the protrusion 422. This layout helps to improve the compactness of the components in the lamp bead and reduce the overall size of the lamp bead.

[0068] Reference Figure 4a and Figure 4b The LED point-controlled light string disclosed in this embodiment includes a plurality of metal wires and a plurality of the above-mentioned LED lamp beads; the first soldering pads 41 of the plurality of LED lamp beads are electrically connected through the metal wires and connected to the positive electrode of the VDD power supply;

[0069] When the second pads 42 of several LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply, the third pads 43 and / or the fourth pads 44 of several LED lamp beads are electrically connected through metal wires and connected to the driving data;

[0070] When the second pads 42 of several LED lamp beads are electrically connected through metal wires and connected to driving data, the third pads 43 and / or the fourth pads 44 of several LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply.

[0071] like Figure 4aAs shown, in one connection mode, the first soldering pads 41 (the two first soldering legs 411) of several LED lamp beads are electrically connected through metal wires and connected to the positive electrode of the VDD power supply, the second soldering pads 42 (the two second soldering legs 421) of several LED lamp beads are electrically connected through metal wires and connected to the negative electrode of the GND power supply, and the third soldering pads 43 (the third soldering leg 431) and the fourth soldering pads 44 (the fourth soldering leg 441) of several LED lamp beads are electrically connected through metal wires and connected to the DAT driving data.

[0072] like Figure 4b As shown, in another connection method, the first soldering pads 41 (the two first soldering legs 411) of several LED lamp beads are electrically connected through metal wires and connected to the positive electrode of the VDD power supply, the second soldering pads 42 (the two second soldering legs 421) of several LED lamp beads are electrically connected through metal wires and connected to the DAT driving data, and the third soldering pads 43 (the third soldering leg 431) and the fourth soldering pads 44 (the fourth soldering leg 441) of several LED lamp beads are electrically connected through metal wires and connected to the negative electrode of the GND power supply.

[0073] For LED point-controlled light strings, the driving data of each lamp bead is written into the data through its respective second soldering pad 42 (or at least one of the third soldering pad 43 and the fourth soldering pad 44), and there is no need to set a signal output port in the point-controlled lamp bead. Therefore, there is no need to cut the metal wire when assembling the light string, which simplifies the processing procedure, improves the processing efficiency, and avoids the problem of deformation of the metal wire during the cutting process, thereby affecting the welding yield of the light string product. Moreover, the driving data of the light string is transmitted in parallel. Compared with the solution of serial transmission of driving data in the existing light string, the product has high reliability, and damage to a single lamp bead or damage to multiple lamp beads will not affect the normal operation of other lamp beads.

[0074] Example 2

[0075] Reference Figures 5a to 6c The LED lamp bead disclosed in this embodiment includes: a light-emitting component 20, a writable driver IC 30, a first solder pad 41, a second solder pad 42 and a third solder pad 43; wherein the driver IC 30 is used to control the light-emitting component 20; the first solder pad 41 is electrically connected to the light-emitting component 20 and the driver IC 30 respectively, and is used to supply power to the light-emitting component 20 and the driver IC 30;

[0076] The second pad 42 is electrically connected to the light emitting component 20 through the driver IC 30, and is used to ground the light emitting component 20 and the driver IC 30; the third pad 43 is electrically connected to the driver IC 30, so as to write data to the driver IC 30;

[0077] Alternatively, the third pad 43 is electrically connected to the light emitting component 20 through the driver IC 30, and is used to ground the light emitting component 20 and the driver IC 30; the second pad 42 is electrically connected to the driver IC 30, so as to write data to the driver IC 30;

[0078] From the first solder pad 41 to the second solder pad 42, the cross-sections of the first solder pad 41 and the second solder pad 42 are both in a square shape, and the cross-section of the third solder pad 43 is in a square shape or a square shape with a notch; the light-emitting surface of the LED lamp bead is the front side, and the side opposite to the light-emitting surface is the back side, and the notch of the third solder pad 43 is set on the front side;

[0079] The first solder pad 41 includes a first solder foot portion 411 located on the back side, the second solder pad 42 includes a second solder foot portion 421 located on the back side, and the third solder pad 43 includes a third solder foot portion 431 located on the back side.

[0080] When the LED lamp beads provided in this embodiment are assembled into a lamp string, data can be directly written to the lamp beads through the second soldering pad 42 (or at least one of the third soldering pad 43 and the fourth soldering pad 44), and there is no need to set a signal output port on the lamp bead to transmit the data to the next lamp bead. For the light string, the driving data of each lamp bead is written through its own second soldering pad 42 (or at least one of the third soldering pad 43 and the fourth soldering pad 44), and there is no need to set a signal output port in the point-controlled lamp bead. Therefore, when assembling into a light string, there is no need to cut the metal wire, which simplifies the processing procedure, saves operation time, and avoids the problem of deformation of the metal wire during the cutting process, thereby affecting the welding yield of the light string product; and the driving data of the lamp string is transmitted in parallel. Compared with the solution of serial transmission of driving data in the existing light string, the product reliability is high, and damage to a single lamp bead or damage to multiple lamp beads will not affect the normal operation of other lamp beads.

[0081] Further, see Figure 5c and Figure 6c A light-transmitting protective glue 50 is packaged on the front of the LED lamp bead, and the light-transmitting protective glue 50 is used to protect the light-emitting component 20 and the driver IC 30; and insulating isolation glue is packaged in the gaps between the first pad 41, the second pad 42 and the third pad 43 and in the hollow structure.

[0082] The LED point-controlled light string disclosed in this embodiment includes a plurality of metal wires and a plurality of the above-mentioned LED lamp beads; the first welding pins 411 of the plurality of LED lamp beads are electrically connected through the metal wires and connected to the positive electrode of the VDD power supply;

[0083] When the second soldering pins 421 of the plurality of LED lamp beads are electrically connected through metal wires and connected to the negative electrode of the GND power supply, the third soldering pins 431 of the plurality of LED lamp beads are electrically connected through metal wires and connected to the driving data;

[0084] When the second soldering pins 421 of several LED lamp beads are electrically connected through metal wires and connected to driving data, the third soldering pins 431 of several LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply.

[0085] The existing processing technology of LED point-controlled light strings requires disconnecting the metal wire between the signal input and signal output of each lamp bead. The metal wire is prone to deformation during the cutting process, affecting the welding performance. At the same time, the cut metal wire may also have burrs or debris, causing a short circuit. At the same time, an additional signal output pin DOUT is added during welding, and the probability of false welding during welding is also increased. Moreover, this type of light string uses a return-to-zero code signal handshake series transmission. When a single LED is damaged, all the LED lamp beads in series behind it cannot light up normally.

[0086] The processing techniques that can be used for the LED point-controlled light strings disclosed in Examples 1 and 2 include Solution 1 and Solution 2:

[0087] Solution 1 specifically includes the following steps:

[0088] S1: Tinning of metal wires; S2: Mounting of lamp beads to solder paste positions; S3: Soldering; S4: Testing and address writing of lamp beads; S5: Gluing; S6: Curing (only UV curing). The processing technology of Scheme 1 can only process one lamp bead at a time, and 1-10 heads can operate at the same time, and 15,000 lamp beads can be mounted in one hour.

[0089] Solution 2 specifically includes the following steps:

[0090] S10: Wrap the metal wire on a flat carrier with poor thermal conductivity (it can be wound evenly according to a regular pattern), and apply solder paste on the position of the metal wire corresponding to the pin of the lamp bead (in the form of a steel mesh); S20: Mount the lamp bead on the solder paste position, and perform batch reflow soldering on the lamp bead; S30: Test the lamp bead and write the address; S40: Perform batch glue dispensing on the lamp bead; S50: Finally, batch cure the lamp bead (through a tunnel furnace, which can be thermally cured or UV cured). Solution 2 uses PCB patch technology, which can process several lamp beads at a time and can mount 50,000pcs of lamp beads in one hour.

[0091] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED lamp bead, characterized in that: include: A bracket (10), a light-emitting component (20) installed in the bracket (10), and a writable driver IC (30), wherein the driver IC (30) is used to control the light-emitting component (20); A first soldering pad (41), a second soldering pad (42), a third soldering pad (43) and a fourth soldering pad (44) are provided in the bracket (10); Wherein, the first pad (41) is electrically connected to the light-emitting component (20) and the driving IC (30) respectively, and is used to supply power to the light-emitting component (20) and the driving IC (30); The second pad (42) is electrically connected to the light-emitting component (20) through the driver IC (30) and is used to ground the light-emitting component (20) and the driver IC (30); at least one of the third pad (43) and the fourth pad (44) is electrically connected to the driver IC (30) to write data to the driver IC (30); Alternatively, at least one of the third pad (43) and the fourth pad (44) is electrically connected to the light-emitting component (20) via the driver IC (30) to ground the light-emitting component (20) and the driver IC (30); and the second pad (42) is electrically connected to the driver IC (30) to write data to the driver IC (30).

2. The LED lamp bead according to claim 1, characterized in that: The light-emitting surface of the LED lamp bead is the front side, and the side opposite to the light-emitting surface is the back side. The front side of the bracket (10) is provided with a bowl-shaped light-emitting opening (11), and the bracket (10) and the light-emitting opening (11) are filled with light-transmitting protective glue.

3. The LED lamp bead according to claim 2, characterized in that: The first soldering pad (41) and the second soldering pad (42) are respectively arranged at two ends of the LED lamp bead, and the third soldering pad (43) and the fourth soldering pad (44) are both arranged between the first soldering pad (41) and the second soldering pad (42); The two ends of the first solder pad (41) respectively extend to the back side of the bracket (10) to form two first solder legs (411), the two ends of the second solder pad (42) respectively extend to the back side of the bracket (10) to form two second solder legs (421), one end of the third solder pad (43) extends to the back side of the bracket (10) to form a third solder leg (431), and one end of the fourth solder pad (44) extends to the back side of the bracket (10) to form a fourth solder leg (441).

4. The LED lamp bead according to claim 3, characterized in that: The two first welding legs (411) are symmetrically arranged, the two second welding legs (421) are symmetrically arranged, the third welding leg (431) and the fourth welding leg (441) are symmetrically arranged, and the first welding leg (411), the second welding leg (421) and the third welding leg (431) are arranged in parallel.

5. The LED lamp bead according to claim 3, characterized in that: The light-emitting component (20) is arranged on the first solder pad (41); The third solder pad (43) and the fourth solder pad (44) are two independent solder pads, or the third solder pad (43) and the fourth solder pad (44) are integrally formed into one solder pad; When the third pad (43) and the fourth pad (44) are two independent pads, the middle portion of the second pad (42) extends downward to form a protrusion (422), the protrusion (422) is arranged between the third pad (43) and the fourth pad (44), and the driver IC (30) is arranged on the protrusion (422).

6. An LED point-controlled light string, characterized in that: It comprises a plurality of metal wires and a plurality of LED lamp beads according to any one of claims 1 to 5; The first solder pads (41) of a plurality of the LED lamp beads are electrically connected via metal wires and connected to the positive electrode of the VDD power supply; When the second soldering pads (42) of a plurality of the LED lamp beads are electrically connected through metal wires and connected to the negative pole of the GND power supply, the third soldering pads (43) and / or the fourth soldering pads (44) of a plurality of the LED lamp beads are electrically connected through metal wires and connected to the driving data; When the second soldering pads (42) of the plurality of LED lamp beads are electrically connected via metal wires and connected to driving data, the third soldering pads (43) and / or the fourth soldering pads (44) of the plurality of LED lamp beads are electrically connected via metal wires and connected to the negative pole of the GND power supply.

7. An LED lamp bead, characterized in that: include: A light-emitting component (20), a writable driver IC (30), a first solder pad (41), a second solder pad (42), and a third solder pad (43); Wherein, the driving IC (30) is used to control the light-emitting component (20); The first solder pad (41) is electrically connected to the light-emitting component (20) and the driver IC (30) respectively, and is used to supply power to the light-emitting component (20) and the driver IC (30); The second pad (42) is electrically connected to the light-emitting component (20) through the driver IC (30) and is used to ground the light-emitting component (20) and the driver IC (30); the third pad (43) is electrically connected to the driver IC (30) to write data to the driver IC (30); Alternatively, the third pad (43) is electrically connected to the light-emitting component (20) through the driver IC (30) to ground the light-emitting component (20) and the driver IC (30); the second pad (42) is electrically connected to the driver IC (30) to write data to the driver IC (30); Along the direction from the first solder pad (41) to the second solder pad (42), the cross-sections of the first solder pad (41) and the second solder pad (42) are both in the shape of a square, and the cross-section of the third solder pad (43) is in the shape of a square or a square with a notch; The light-emitting surface of the LED lamp bead is the front side, the side opposite to the light-emitting surface is the back side, and the notch of the third solder pad (43) is arranged on the front side; The first solder pad (41) includes a first solder foot portion (411) located on the back side, the second solder pad (42) includes a second solder foot portion (421) located on the back side, and the third solder pad (43) includes a third solder foot portion (431) located on the back side.

8. The LED lamp bead according to claim 7, characterized in that: A light-transmitting protective glue (50) is packaged on the front side of the LED lamp bead, and the light-transmitting protective glue (50) is used to protect the light-emitting component (20) and the driver IC (30); Insulating adhesive is encapsulated in the gaps between the first solder pad (41), the second solder pad (42) and the third solder pad (43) as well as in the hollow structure.

9. An LED point-controlled light string, characterized in that: It comprises a plurality of metal wires and a plurality of LED lamp beads as described in any one of claims 7 to 8; The first welding pins (411) of a plurality of the LED lamp beads are electrically connected via metal wires and connected to the positive electrode of the VDD power supply; When the second soldering pins (421) of the plurality of LED lamp beads are electrically connected through a metal wire and connected to the negative electrode of the GND power supply, the third soldering pins (431) of the plurality of LED lamp beads are electrically connected through a metal wire and connected to the driving data; When the second soldering pins (421) of the plurality of LED lamp beads are electrically connected via metal wires and connected to driving data, the third soldering pins (431) of the plurality of LED lamp beads are electrically connected via metal wires and connected to the negative pole of the GND power supply.

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