LED ceramic circuit board with high thermal conductivity

Abstract

The utility model discloses an LED (light-emitting diode) ceramic circuit board with high thermal conductivity, relates to the technical field of circuit boards, and provides the following scheme aiming at the problems that if heat cannot be effectively dissipated in the prior art, an LED lamp is overheated to be damaged or decayed, and the lighting effect and the service life are influenced, the LED ceramic circuit board comprises a ceramic substrate, the ceramic substrate is made of a ceramic material with excellent heat-conducting property, a cooling fin is arranged at the upper end of the ceramic substrate, a protective shell is connected to the outer ends of the ceramic substrate and the cooling fin, air inlet mechanisms are arranged at the four corners of the upper portion of the protective shell, and air exhaust mechanisms are arranged at the two ends of the protective shell; the heat dissipation device for the LED lamp is novel in structure, the ceramic substrate in the heat dissipation device is made of ceramic materials with excellent heat conduction performance, and heat generated by the LED lamp can be rapidly transmitted.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an LED ceramic circuit board with high thermal conductivity. Background Art

[0002] With the rapid development of LED lighting technology, high-power, high-brightness LED lamps are increasingly used in lighting projects; however, LED lamps generate a lot of heat during use, and because ordinary circuit boards have poor heat dissipation performance, the temperature of the circuit boards will be too high, causing the connected LED lamps to also work in a high-temperature environment. If the heat cannot be effectively dissipated, it will cause the LED lamps to overheat and be damaged or light decay, affecting the lighting effect and service life. Utility Model Content

[0003] The utility model provides an LED ceramic circuit board with high thermal conductivity, which solves the existing problems.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an LED ceramic circuit board with high thermal conductivity, comprising a ceramic substrate, a heat sink is arranged on the upper end of the ceramic substrate, the outer ends of the ceramic substrate and the heat sink are connected to a protective shell, the upper four corners of the protective shell are provided with an air inlet mechanism, and the two ends of the protective shell are provided with an exhaust mechanism, and the exhaust mechanism is used to cooperate with the air inlet mechanism to quickly flow heat out of the outside of the protective shell.

[0005] Preferably, the ceramic substrate and the heat sink are fixedly connected by welding, and the lower end of the ceramic substrate is connected to a card plate, a groove is provided on the card plate close to the ceramic substrate, a thermal conductive adhesive is arranged inside the groove, and the lower end of the card plate is connected to an LED lamp.

[0006] Preferably, air inlets are provided at the four corners of the upper end of the protective shell, an air inlet mechanism is provided around the upper end of the air inlet, and air exhaust ports are symmetrically provided at both ends of the protective shell, and an exhaust mechanism is provided inside the air exhaust ports.

[0007] Preferably, the air inlet mechanism comprises a protective cover, the protective cover is mounted around the top of the air inlet, a dustproof net is arranged inside the top of the protective cover, and a fan is arranged inside the protective cover.

[0008] Preferably, the exhaust mechanism includes a ventilation plate, which is arranged inside the exhaust port, a fixed block is arranged on the outer side of one end of the ventilation plate, a connecting rod is connected to the fixed block, a first rotating rod is arranged on the outside of the other end of the connecting rod, fixed platforms are arranged on both sides of one end of the first rotating rod, a second rotating rod is arranged in the middle of the first rotating rod, a sliding rod is arranged on the other end of the second rotating rod, the outer end of the sliding rod is connected to a sleeve rod, and a spring is arranged on the upper side of the sleeve rod, and one end of the spring is connected to a first clamping block.

[0009] Preferably, a placement groove is provided on one side of the protective shell corresponding to the lower side of the fixing platform, sliding grooves are provided at both ends of the placement groove, and a second clamping block is provided on the side of the sliding groove away from the air outlet.

[0010] The beneficial effects of the utility model are as follows: the ceramic substrate in the device adopts a ceramic material with excellent thermal conductivity, which can quickly transfer the heat generated by the LED lamp. The card plate is connected to the upper end of the LED lamp, and the interior is filled with a thermally conductive adhesive. The high thermal conductivity of the thermally conductive adhesive can improve the heat transfer efficiency. A heat sink is arranged on the upper end of the ceramic substrate to quickly dissipate the heat. Fresh air is introduced through the fan in the air intake mechanism and then the ventilation plate is rotated and unfolded to quickly dissipate the heat to the external environment, thereby further reducing the working temperature of the LED lamp and improving the lighting effect and service life of the LED lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the utility model.

[0012] Figure 2 This is a schematic diagram of the interior of the protective shell of the utility model.

[0013] Figure 3 It is a schematic diagram of the air inlet mechanism of the utility model.

[0014] Figure 4 It is a schematic diagram of the exhaust mechanism of the utility model.

[0015] Figure 5 For the utility model Figure 4 Enlarged view of point A.

[0016] Figure 6 For the utility model Figure 4 Enlarged view of point B.

[0017] Numbers in the figure: 1, ceramic substrate; 101, card board; 102, thermal conductive adhesive; 103, LED lamp; 2, heat sink; 3, protective shell; 301, air inlet; 302, air outlet; 4, air inlet mechanism; 401, protective cover; 402, dust net; 403, fan; 5, exhaust mechanism; 501, ventilation plate; 502, fixed block; 503, connecting rod; 504, first rotating rod; 505, fixed platform; 506, second rotating rod; 507, sliding rod; 508, sleeve rod; 509, spring; 510, first card block; 511, placement slot; 512, slide slot; 513, second card block. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-Figure 6 A LED ceramic circuit board with high thermal conductivity includes a ceramic substrate 1, which is made of a ceramic material with excellent thermal conductivity, and a heat sink 2 is arranged on the upper end of the ceramic substrate 1, and the outer ends of the ceramic substrate 1 and the heat sink 2 are connected to a protective shell 3, and air inlet mechanisms 4 are arranged at the four corners above the protective shell 3, and exhaust mechanisms 5 are arranged at both ends of the protective shell 3, and the exhaust mechanism 5 is used to cooperate with the air inlet mechanism 4 to quickly flow heat out of the outside of the protective shell 3.

[0020] refer to Figure 2 The ceramic substrate 1 and the heat sink 2 are fixedly connected by welding, and the lower end of the ceramic substrate 1 is connected to a card board 101, a groove is provided on the card board 101 close to the ceramic substrate 1, a thermal conductive adhesive 102 is arranged inside the groove, and the lower end of the card board 101 is connected to an LED lamp 103, and air inlets 301 are provided at the four corners of the upper end of the protective shell 3, an air inlet mechanism 4 is arranged around the upper end of the air inlet 301, and exhaust ports 302 are symmetrically provided at both ends of the protective shell 3, and an exhaust mechanism 5 is arranged inside the exhaust port 302, and the heat sink 2 can quickly dissipate the heat generated by the LED lamp 103, and the heat sink 2 further reduces the operating temperature of the LED lamp 103 by increasing the heat dissipation area and improving the heat dissipation efficiency.

[0021] refer to Figure 3 The air inlet mechanism 4 includes a protective cover 401, which is mounted around the air inlet 301. A dustproof net 402 is arranged inside the top of the protective cover 401, and a fan 403 is arranged inside the protective cover 401. The dustproof net 402 at the upper end of the fan 403 can effectively prevent dirt from invading the interior of the protective shell 3.

[0022] refer to Figure 4The exhaust mechanism 5 includes a ventilation plate 501, which is arranged inside the exhaust port 302. A fixing block 502 is arranged on the outer side of one end of the ventilation plate 501, and a connecting rod 503 is connected inside the fixing block 502. A first rotating rod 504 is arranged on the outer side of the other end of the connecting rod 503, and a fixing platform 505 is arranged on both sides of one end of the first rotating rod 504. A second rotating rod 506 is arranged in the middle of the first rotating rod 504, and a sliding rod 507 is arranged inside the other end of the second rotating rod 506. The outer end of the sliding rod 507 is connected to a sleeve rod 508, and a spring 509 is arranged on one side above the sleeve rod 508. One end of the spring 509 is connected to a first clamping block 510 The interior of the ventilation plate 501 is a placement groove 511 on one side of the protective shell 3 corresponding to the lower part of the fixed platform 505, and slide grooves 512 are provided at both ends of the placement groove 511. A second block 513 is provided on the side of the slide groove 512 away from the exhaust port 302. The interior of the ventilation plate 501 is an empty slot structure. When the temperature is normal, it does not need to be unfolded for normal ventilation. When the temperature is high, the sleeve rod 508 is pulled to drive the sliding rod 507 to move, so that the second rotating rod 506 follows the sliding rod 507 to move and support the first rotating rod 504. The first rotating rod 504 rotates through the connecting rod 503 to drive the ventilation plate 501 to unfold, so that the vent is enlarged to quickly discharge the heat.

[0023] Working principle: First, a ceramic substrate 1 of the required shape and size is prepared using a ceramic material with excellent thermal conductivity, and a high-brightness LED lamp 103 is encapsulated into a lamp bead of the required shape and size. The protective shell 3 is connected to the bottom of the card board 101 and bonded to the ceramic substrate 1 through a thermally conductive adhesive 102. Then, a heat sink 2 of the required shape and size is prepared using a material with excellent thermal conductivity, and the heat sink 2 is fixedly connected to the ceramic substrate 1 by welding. Finally, it is tested and debugged to ensure its normal operation. The interior of the ventilation plate 501 is an empty slot structure. When the temperature is normal, it does not need to be unfolded for normal ventilation. If the heat dissipation temperature of the LED lamp 103 is high, the fan 403 can be started to rotate, and fresh air can be introduced into the protective shell 3 from the air inlet 301. The sleeve rod 508 is pulled to drive the second rotating rod 506 to move. The movement of the second rotating rod 506 drives the first rotating rod 504 to rotate. The rotation of the first rotating rod 504 drives the ventilation plate 501 to unfold, and the heat inside the protective shell 3 is discharged.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An LED ceramic circuit board with high thermal conductivity, comprising a ceramic substrate (1), characterized in that: A heat sink (2) is provided at the upper end of the ceramic substrate (1); the outer ends of the ceramic substrate (1) and the heat sink (2) are connected to a protective shell (3); air inlet mechanisms (4) are provided at the four upper corners of the protective shell (3); and exhaust mechanisms (5) are provided at both ends of the protective shell (3); the exhaust mechanisms (5) are used to cooperate with the air inlet mechanisms (4) to quickly transfer heat out of the protective shell (3).

2. The LED ceramic circuit board with high thermal conductivity according to claim 1, characterized in that: The ceramic substrate (1) and the heat sink (2) are fixedly connected by welding, and the lower end of the ceramic substrate (1) is connected to a cardboard (101), a groove is provided on a side of the cardboard (101) close to the ceramic substrate (1), a heat-conducting adhesive (102) is provided inside the groove, and the lower end of the cardboard (101) is connected to an LED lamp (103).

3. The LED ceramic circuit board with high thermal conductivity according to claim 1, characterized in that: The protective shell (3) is provided with air inlets (301) at four corners of the upper end, an air inlet mechanism (4) is arranged around the upper end of the air inlet (301), and air outlets (302) are symmetrically arranged at both ends of the protective shell (3), and an air outlet mechanism (5) is arranged inside the air outlet (302).

4. The LED ceramic circuit board with high thermal conductivity according to claim 1, characterized in that: The air inlet mechanism (4) comprises a protective cover (401), the protective cover (401) is mounted on the four sides above the air inlet (301), a dustproof net (402) is arranged inside the top of the protective cover (401), and a fan (403) is arranged inside the protective cover (401).

5. The LED ceramic circuit board with high thermal conductivity according to claim 1, characterized in that: The exhaust mechanism (5) comprises a ventilation plate (501), wherein the ventilation plate (501) is arranged inside the exhaust port (302), a fixing block (502) is arranged on the outer side of one end of the ventilation plate (501), a connecting rod (503) is connected inside the fixing block (502), a first rotating rod (504) is arranged on the outer side of the other end of the connecting rod (503), a fixing platform (505) is arranged on both sides of one end of the first rotating rod (504), a second rotating rod (506) is arranged in the middle of the first rotating rod (504), a sliding rod (507) is arranged inside the other end of the second rotating rod (506), the outer end of the sliding rod (507) is connected to a sleeve rod (508), and a spring (509) is arranged on the upper side of the sleeve rod (508), and one end of the spring (509) is connected to a first clamping block (510).

6. The LED ceramic circuit board with high thermal conductivity according to claim 5, characterized in that: A placement groove (511) is provided on one side of the protective shell (3) corresponding to the lower side of the fixing platform (505), sliding grooves (512) are provided at both ends of the placement groove (511), and a second clamping block (513) is provided on the side of the sliding groove (512) away from the air outlet (302).

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