Novel heat dissipation shielding combined module

Abstract

The utility model provides a novel heat dissipation and shielding combined module, which relates to the technical field of communication products and comprises a shielding support welded on a circuit board, and a heat dissipation assembly is mounted above the shielding support. The novel heat dissipation and shielding combined module mainly aims at the combined requirements of heat dissipation and shielding, through reasonable planning and design, a shielding cover can be omitted, heat resistance can be reduced, the heat dissipation and shielding effects are improved, and the heat dissipation and shielding combined module has the advantages that the structure is simple, the cost is low, and the heat dissipation and shielding effects are good. And optimal utilization of shielding and heat dissipation is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of communication products, in particular to a novel heat dissipation and shielding combined module. Background Art

[0002] The heat dissipation and shielding combination module is a component used for heat dissipation of electronic equipment. It combines heat dissipation and shielding functions to improve the heat dissipation efficiency and electromagnetic shielding effect of the equipment;

[0003] The solution adopted by the heat dissipation shielding combination module in the prior art is to weld the shielding bracket on the PCBA, then assemble the thermal pad & shielding cover in sequence, and then assemble the thermal pad and heat sink (please refer to the attached figure for details). Such a structure assembles a large number of materials and increases the thermal resistance, and does not achieve the optimal design. Therefore, we propose a new heat dissipation shielding combination module. Utility Model Content

[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a novel heat dissipation shielding combination module, which effectively solves the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a novel heat dissipation and shielding combination module, comprising a shielding bracket welded on a circuit board, a heat dissipation component being installed above the shielding bracket;

[0006] The heat dissipation component body is a heat sink, the heat sink and the circuit board are fixed by spring screws, and a thermal pad is filled between the heat sink and the shielding bracket.

[0007] Furthermore, the size of the heat sink is larger than that of the shielding bracket, and the bottom surface is tightly fitted to the shielding bracket.

[0008] Furthermore, the upper end surface of the heat sink is arranged with heat dissipation fins and a heat dissipation fan.

[0009] Furthermore, the spring screws are arranged at the edge and the angle of the upper end of the heat sink, and mounting holes for cooperating and fixing with the spring screws are welded on the circuit board.

[0010] Furthermore, the shielding bracket is installed on the electronic component, and a protrusion is formed in the shielding bracket by adapting the electronic component. A boss is provided at the bottom of the heat sink corresponding to the protrusion, and the thermal pad is located at the bottom of the boss.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The bottom of the heat sink is fitted with the shielding bracket to directly form a shield, thereby omitting the assembly of the shielding cover and the upper thermal pad;

[0013] 2. Use the spring screws on the heat sink to effectively ensure the fit between the heat sink and the shielding bracket, thereby ensuring the shielding effect;

[0014] 3. Since the heat dissipation and shielding combination module does not need to assemble a shielding cover, the boss on the heat sink and the electronic components in the shielding bracket are directly filled with thermal pads, which reduces thermal resistance and improves heat dissipation efficiency compared with existing solutions;

[0015] Combining the above advantages, the novel heat dissipation and shielding combination module is mainly aimed at the combined needs of heat dissipation and shielding. Through reasonable planning and design, the shielding cover can be omitted, and the thermal resistance can be reduced to achieve optimal utilization of shielding and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an exploded schematic diagram of the overall structure of a novel heat dissipation and shielding combination module provided by the utility model;

[0017] Figure 2 This is an exploded schematic diagram of the overall upward structure of a novel heat dissipation and shielding combination module provided by the utility model;

[0018] Figure 3 It is a schematic diagram of the explosion structure of the heat dissipation shielding combination module under the prior art.

[0019] Legend: 1. Shielding bracket; 2. Heat dissipation assembly; 21. Heat sink; 224. Heat dissipation fin; 212. Cooling fan; 22. Spring screw; 23. Thermal pad; 24. Boss. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0024] Example 1

[0025] like Figure 1-2 As shown, the utility model provides a technical solution: a new type of heat dissipation and shielding combination module, including a shielding bracket 1 welded on a circuit board, a heat dissipation component 2 is installed above the shielding bracket 1; the main body of the heat dissipation component 2 is a heat sink 21, the heat sink 21 and the circuit board are fixed by spring screws 22, and a thermal pad 23 is filled between the heat sink 21 and the shielding bracket 1.

[0026] Example 2

[0027] like Figure 1-2 As shown, the size of the heat sink 21 is larger than that of the shielding bracket 1, thereby ensuring installation fit, isolation and installation stability. The size of the heat sink 21 is designed according to heat dissipation requirements for heat dissipation, and the bottom surface is tightly fitted with the shielding bracket 1.

[0028] The upper end surface of the heat sink 21 is arranged with heat dissipation fins 224 and a heat dissipation fan 212, which help the heat sink 21 to dissipate heat more effectively. When heat is transferred from the electronic components in the shielding bracket 1 to the heat sink 21, the heat dissipation fins 212 can increase the contact area between the heat sink 21 and the surrounding air, thereby accelerating the speed of heat transfer from the heat sink to the air. The heat dissipation fan 212 accelerates the convection and radiation process of heat by blowing air. When the heat dissipation fan 212 is working, it will blow cold air to the heat sink 224 and the heat dissipation fins 212, helping to take away the heat from the surface of the heat sink 21 and dissipate it into the surrounding air.

[0029] The spring screws 22 are arranged at the edge and angle of the upper end of the heat sink 21, and mounting holes for cooperating with the spring screws 22 are welded on the circuit board. When the spring screws 22 are tightened, the spring is compressed to generate elastic force, so that the screw head fits more closely with the circuit board, thereby making the shielding bracket 1 and the heat dissipation component 2 fit more tightly and stably, thereby improving the tightness and stability of the connector.

[0030] The shielding bracket 1 is mounted on the electronic component. A protrusion is formed in the shielding bracket 1 by adapting the electronic component. A boss 24 is provided at the bottom of the heat sink 21 corresponding to the protrusion, and the thermal pad 23 is located at the bottom of the boss 24 .

[0031] The working principle of the utility model is as follows: firstly, the bottom of the heat sink 21 is fitted with the shielding bracket 1 to directly form a shield, thereby omitting the assembly of the shielding cover and the upper thermal pad 23, and the spring screws 22 on the heat sink 23 are used to effectively ensure the fit between the heat sink 21 and the shielding bracket 1, thereby ensuring the shielding effect. In addition, since there is no need to assemble the shielding cover, the boss 24 on the heat sink 21 and the electronic components in the shielding bracket 1 are directly filled with the thermal pad 23, which reduces the thermal resistance and improves the heat dissipation efficiency.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel heat dissipation and shielding assembly module, comprising a shielding bracket (1) welded on a circuit board, characterized in that: A heat dissipation component (2) is installed above the shielding bracket (1); The main body of the heat dissipation component (2) is a heat sink (21); the heat sink (21) and the circuit board are fixed by spring screws (22); and a thermal pad (23) is filled between the heat sink (21) and the shielding bracket (1).

2. A novel heat dissipation and shielding combined module according to claim 1, characterized in that: The size of the heat sink (21) is larger than the size of the shielding bracket (1), and the bottom surface is tightly fitted to the shielding bracket (1).

3. A novel heat dissipation and shielding combined module according to claim 1, characterized in that: The upper end surface of the heat sink (21) is provided with heat dissipation fins (224) and a heat dissipation fan (212).

4. The novel heat dissipation and shielding combined module according to claim 1 is characterized in that: The spring screws (22) are arranged at the edge and the included angle of the upper end of the heat sink (21), and mounting holes for cooperating and fixing with the spring screws (22) are welded on the circuit board.

5. The novel heat dissipation and shielding combined module according to claim 1 is characterized in that: The shielding bracket (1) is mounted on the electronic component, and a protrusion is formed in the shielding bracket (1) by adapting the electronic component. A boss (24) is provided at the bottom of the heat sink (21) corresponding to the protrusion, and the thermal pad (23) is located at the bottom of the boss (24).

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