Slit valve device and semiconductor device

Abstract

The utility model provides a slit valve device and semiconductor equipment. The slit valve device comprises a slit valve body, a first air valve, a sealing baffle plate and a driving piece, a front-back through channel is arranged in the slit valve body; the first gas valve is arranged at the top of the slit valve body and is used for spraying gas into the channel; the sealing baffle is rotatably arranged in the slit valve body; the driving part is in driving connection with the sealing baffle to drive the sealing baffle to be opened and closed, when the sealing baffle is closed, the sealing baffle blocks the interior of the channel and is arranged close to the first air valve so as to divide the channel into a first space and a second space which are independent from each other, and the first space is communicated with the first air valve. When the sealing baffle is closed, the sealing baffle is blocked in the channel, the first air valve only blows to one space, the other space can be in a closed state due to the fact that the gate valve is closed, turbulent flow formed by gas in the slit valve channel is reduced, sediment and external particles are prevented from being accumulated at the position of the gate valve, and stability of a flow field in a cavity is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a slit valve device and a semiconductor device. Background Art

[0002] In most semiconductor process equipment, when a semiconductor wafer is transferred from a vacuum transfer chamber to a process chamber, or when the wafer needs to be transferred out of the process chamber after the process is completed, it needs to pass through a slit valve between the chamber and the vacuum transfer platform. Usually, a slit purge (slit air curtain) is set in the slit valve to isolate the chamber environment to avoid contaminating the process. It can also prevent toxic special gases in the process chamber from diffusing to the external transfer space and causing danger.

[0003] In traditional slit valves, the slit air curtain is usually located on the side of the gate valve close to the chamber. The gas is sprayed from top to bottom to form a vertical downward gas curtain. The swept gas will form turbulence in the slit valve, which is easy to produce coating (deposits) at the valve port and foreign particles (particles) to enter. Especially in processes such as EPI (epitaxial layer) that require high uniformity of the flow field, the slit air curtain may affect the flow field in the chamber, thereby affecting the stability of the process.

[0004] In view of this, it is necessary to provide a slit valve device and a semiconductor device to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a slit valve device and a semiconductor device, so as to improve the problem that the existing slit valve is easy to generate sediments and foreign particles at the valve port.

[0006] The utility model provides a slit valve device, comprising: a slit valve body, a first air valve, a sealing plate and a driving member; the slit valve body is provided with a front-to-rear through-channel; the first air valve is provided at the top of the slit valve body and is used to spray gas into the channel; the sealing plate is rotatably provided in the slit valve body; the driving member is drivingly connected to the sealing plate to drive the opening and closing of the sealing plate, and when the sealing plate is closed, the sealing plate seals in the channel and is close to the first air valve to separate the channel into a first space and a second space that are independent of each other, wherein the first space is connected to the first air valve.

[0007] In a possible embodiment, the slit valve body has a first end and a second end that are relatively arranged, the first gas valve is arranged close to the first end, a second gas valve is provided on the side of the slit valve body, and the second gas valve is arranged close to the second end and is used to inject gas into the channel.

[0008] In a possible embodiment, the second air valve has a second air hole connected to the channel, and the second air hole is horizontally or obliquely arranged; there is one second air hole and it is strip-shaped, or there are several second air holes on the second air valve and they are arranged at intervals in the vertical direction.

[0009] In a possible embodiment, the number of the second air valves is at least one pair, and each pair of the second air valves is located on two opposite sides of the slit valve body.

[0010] In a possible embodiment, when the sealing plate is opened, the sealing plate is attached to the inner top wall, inner side wall or inner bottom wall of the slit valve body.

[0011] In a possible embodiment, in view of the situation where the sealing plate is opened and attached to the inner bottom wall of the slit valve body, a choke groove is provided on the inner top wall of the slit valve body near the first air valve, and the choke groove is arranged close to the second space. When the sealing plate is closed, the end of the sealing plate can extend into the choke groove to form a blocking seal.

[0012] In a possible embodiment, the choke groove includes a limiting surface arranged close to the first air valve and a guiding surface connected to the limiting surface, and the guiding surface is inclined.

[0013] In a possible embodiment, the slit valve device also includes a guide plate arranged on the bottom wall of the slit valve body, the guide plate is located below the first air valve and on one side of the sealing plate, and the top surface of the guide plate is inclined downward from close to the sealing plate to away from the sealing plate.

[0014] In a possible embodiment, the blocking plate is rotatably disposed on the guide plate.

[0015] In addition, the utility model also provides a semiconductor device, including a process chamber, a wafer transfer chamber and a slit valve device as in any of the above embodiments; the slit valve device is connected between the process chamber and the wafer transfer chamber.

[0016] The beneficial effect of the slit valve device provided by the utility model is that: a sealing plate that can be opened and closed is provided, and when the sealing plate is closed, the sealing plate blocks the passage, the first air valve only blows to one of the spaces, and the other space can be in a closed state due to the closure of the gate valve, thereby reducing the turbulence of the gas in the slit valve passage, preventing the accumulation of sediments and foreign particles at the gate valve position, and being beneficial to the stability of the flow field in the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a conventional slit valve.

[0018] Figure 2 It is a three-dimensional diagram of the slit valve device of the utility model.

[0019] Figure 3 It is a cross-sectional view of the slit valve device of the utility model at the first air valve.

[0020] Figure 4 It is a cross-sectional view of the slit valve device of the utility model at the second air valve.

[0021] Figure 5 This is a state diagram of the slit valve device of the utility model when the sealing plate is closed.

[0022] Figure 6 for Figure 5 A partial enlarged schematic diagram of area A in the middle.

[0023] Figure 7 This is a state diagram of the slit valve device of the utility model when the sealing plate is opened.

[0024] Explanation of the accompanying drawings: slit valve device 100; slit valve body 110; channel 111; first space 1111; second space 1112; first end 112; second end 113; flow blocking groove 114; guide surface 1141; limiting surface 1142; first air valve 120; first air hole 121; sealing plate 130; second air valve 140; second air hole 141; guide plate 150; gate valve 160; wafer 200. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be described clearly and completely below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Combination Figure 1 It can be seen that in the traditional slit valve design, due to improper control of gas flow direction and flow rate, there is often a purge blind area (i.e., close to the valve port), which makes it easy for sediments and foreign particles to accumulate in the purge blind area.

[0027] In view of the problems existing in the prior art, the embodiments of the present utility model provide a slit valve device, which can be applied to EPI (epitaxial layer) process machines, CVD (chemical vapor deposition) and PVD (physical vapor deposition) machines with high requirements for the sealing of process chambers. Figure 2 is a three-dimensional diagram of the slit valve device of the utility model, see Figure 2The slit valve device 100 includes: a slit valve body 110, a first gas valve 120, a sealing plate 130 and a driving member (not shown in the figure), wherein a channel 111 is provided in the slit valve body 110 and passes through the slit valve body 110, and the first gas valve 120 is provided at the top of the slit valve body 110 and is used to inject gas into the channel 111. The sealing plate 130 is rotatably provided in the slit valve body 110, and the driving member is drivingly connected to the sealing plate 130 to drive the sealing plate 130 to open and close. Figure 5 This is a state diagram of the slit valve device of the utility model when the sealing plate is closed, see Figure 5 When the sealing plate 130 is closed, the sealing plate 130 seals in the channel 111 and is close to the first gas valve 120, so as to separate the channel 111 into a first space 1111 and a second space 1112 which are independent of each other, wherein the first space 1111 is connected to the first gas valve 120. Specifically, the slit valve device 100 is made of ultra-clean and pollution-free materials such as quartz, and the slit valve body 110 is flat. The gas can be a common process carrier gas such as H2 and N2, or other suitable gases can be selected according to the specific process.

[0028] In this embodiment, the opening and closing of the baffle plate 130 can be controlled by the driving member. When the gate valve 160 is closed, the baffle plate 130 is controlled to close by the driving member, and the first gas valve 120 sprays gas into the slit valve body 110 to form a slit air curtain. Under the blocking effect of the baffle plate 130, the gas can only enter the process chamber through one of the spaces, and the other space is sealed under the closure of the baffle plate 130 and the gate valve 160. The slit air curtain and the baffle plate 130 form a double effective seal to avoid turbulence in the slit valve, reduce the sediments and particles accumulated in the original purge blind area, and ensure the stability of the flow field in the chamber.

[0029] In another embodiment, see Figure 2 and Figure 5 The slit valve body 110 has a first end 112 and a second end 113 that are arranged opposite to each other. The first end 112 is used to connect to the process chamber, and the second end 113 is used to connect to the wafer transfer chamber. The second end 113 is provided with a gate valve 160 that can be opened and closed. The first gas valve 120 is arranged near the first end 112, and the side of the slit valve body 110 is provided with a second gas valve 140. The second gas valve 140 is arranged near the second end 113 and is used to spray gas into the channel 111. In this embodiment, the first gas valve 120 sprays gas from the top of the slit valve body 110 into the slit valve body 110, forming a first isolation gas curtain in the up and down direction to purge particles on the front side of the wafer 200. The second gas valve 140 sprays gas from the side of the slit valve body 110 into the slit valve body 110, forming a second isolation gas curtain in the left and right direction to purge particles on the back side of the wafer 200. By providing two sets of isolation air curtains in different directions, it is possible to prevent the particles remaining on the wafer 200 from contaminating the chamber inside the cavity.

[0030] In some possible embodiments, Figure 4 This is a cross-sectional view of the slit valve device of the utility model at the second air valve, see Figure 4 The second air valve 140 has a second air hole 141 connected to the channel 111, and the second air hole 141 is arranged horizontally or obliquely. There is one second air hole 141 in a strip shape, or there are a plurality of second air holes 141 on the second air valve 140 and they are arranged at intervals in the vertical direction. By arranging the second air holes 141 on the second air valve 140 in a strip shape or in a row, the extension length of the second insulating air curtain is increased, and the purge effect and air tightness are enhanced.

[0031] In a specific embodiment, see Figure 4 The second air valve 140 is at least one pair, and each pair of the second air valves 140 is respectively located on two opposite sides of the slit valve body 110. Preferably, each pair of the second air valves 140 is symmetrically distributed.

[0032] In some possible embodiments, Figure 3 This is a cross-sectional view of the slit valve device of the utility model at the first air valve, see Figure 3 The first air valve 120 has a first air hole 121 connected to the channel 111, and the first air hole 121 is vertically arranged or inclined. There is one first air hole 121 in a strip shape, or there are a plurality of first air holes 121 on the first air valve 120 and they are arranged at intervals in the horizontal direction. By arranging the first air holes 121 on the first air valve 120 in a strip shape or a row, the extension length of the first insulating air curtain is increased, and the purge effect and air tightness are enhanced.

[0033] In a specific embodiment, when the sealing plate 130 is opened, the sealing plate 130 is attached to the inner top wall, inner side wall or inner bottom wall of the slit valve body 110 to avoid affecting the transportation of the wafer 200 by the robot.

[0034] In one embodiment, Figure 5 This is a state diagram of the slit valve device of the utility model when the sealing plate is closed. Figure 6 for Figure 5 A partial enlarged schematic diagram of the A area in the middle, see Figure 5 and Figure 6 In view of the situation that the blocking plate 130 is opened and attached to the inner bottom wall of the slit valve body 110, a blocking groove 114 is provided on the inner top wall of the slit valve body 110 near the first gas valve 120. The blocking groove 114 is provided near the second space 1112. When the blocking plate 130 is closed, the end of the blocking plate 130 can extend into the blocking groove 114 to form a blocking seal. The cooperation between the blocking groove 114 and the blocking plate 130 can block gas flow and particle penetration, thereby enhancing the sealing between the blocking plate 130 and the slit valve body 110.

[0035] In yet another embodiment, see Figure 5 and Figure 6 The blocking groove 114 includes a limiting surface 1142 disposed near the first air valve 120 and a guiding surface 1141 connected to the limiting surface 1142, and the guiding surface 1141 is inclined. When the blocking plate 130 is turned upward from the bottom to the blocking groove 114, the end of the blocking plate 130 rotates to the bottom end of the guiding surface 1141, rotates to the top end of the guiding surface 1141 along the inclined direction of the guiding surface 1141, and is limited by the limiting surface to further turn over the blocking plate 130.

[0036] In a preferred embodiment, Figure 7 This is a state diagram of the slit valve device of the utility model when the sealing plate is opened, see Figure 7 The slit valve device 100 further includes a guide plate 150 disposed on the inner bottom wall of the slit valve body 110. The guide plate 150 is located below the first gas valve 120 and on one side of the baffle plate 130. The top surface of the guide plate 150 is inclined downward from the direction close to the baffle plate 130 to the direction away from the baffle plate 130. After the gas ejected from the first gas valve 120 flows from top to bottom to the top surface of the guide plate 150, it will flow toward the process chamber along the inclined direction of the top surface of the guide plate 150.

[0037] Better, see Figure 7 The top surface of the sealing plate 130 is inclined downward from the direction close to the guide plate 150 to the direction away from the guide plate 150. When the gate valve 160 is opened and the sealing plate 130 is opened, the gas ejected by the first gas valve 120 flows from top to bottom to the top surface of the sealing plate 130, and then flows toward the wafer transfer chamber along the inclined direction of the top surface of the sealing plate 130.

[0038] In a specific embodiment, see Figure 5 , the baffle plate 130 is rotatably disposed on the guide plate 150. Preferably, the baffle plate 130 is rotatably disposed on a side of the top surface of the guide plate 150 close to the baffle plate 130. The connection between the baffle plate 130 and the guide plate 150 is located below the first air valve 120. The driving member can be a solenoid valve, a motor, a rotary cylinder, etc. The driving member can be connected to the baffle plate 130 through a transmission mechanism (for example, a gear, a connecting rod).

[0039] The working process of the slit valve device is explained in detail below in conjunction with specific embodiments.

[0040] like Figure 5As shown, when the gate valve 160 is closed, the baffle plate 130 is controlled by the driving member to rotate to the closed state. At this time, under the sealing effect of the baffle plate 130, the gas ejected by the first gas valve 120 flows from top to bottom to the top surface of the guide plate 150, and then flows to the process chamber along the inclined direction of the top surface of the guide plate 150, and forms a sealed space in the channel 111 area between the baffle plate 130 and the gate valve 160, that is, the gas will all flow into the process chamber and will not flow into the sealed space. At this time, the second gas valve 140 can be opened for ventilation, or the second gas valve 140 can be not opened for ventilation. For example, the second gas valve 140 on one side of the slit valve body 110 is ventilated, and the second gas valve 140 on the other side of the slit valve body 110 is opened but not ventilated. After the gas enters from the second gas valve 140 on one side of the slit valve body 110, it flows out from the second gas valve 140 on the other side of the slit valve body 110 and takes away the particles remaining in the sealed space, effectively reducing the particles remaining in the valve.

[0041] like Figure 7 As shown, when the gate valve 160 is closed, the baffle plate 130 is controlled by the driving member to rotate to the open state, and the gas ejected by the first gas valve 120 flows from top to bottom to the connection between the baffle plate 130 and the guide plate 150, a part of the gas flows to the process chamber along the inclined direction of the top surface of the guide plate 150, and the other part of the gas flows to the wafer transfer chamber along the inclined direction of the top surface of the baffle plate 130, and the gas ejected by the first gas valve 120 forms a first isolation gas curtain to purge particles on the front of the wafer 200. The second gas valves 140 on the slit valve body 110 are all in the state of ejecting gas into the slit valve body 110 to form a second isolation gas curtain to purge particles on the back of the wafer 200. The two-way gas curtain ensures that the chambers are completely sealed.

[0042] In addition, the utility model further provides a semiconductor device, including a process chamber, a wafer transfer chamber, and a slit valve device 100 as in any of the above embodiments, wherein the slit valve device 100 is connected between the process chamber and the wafer transfer chamber.

[0043] Although the embodiments of the utility model are described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the utility model described in the claims. Moreover, the utility model described herein may have other embodiments and may be implemented or realized in a variety of ways. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with ordinary skills in the field to which the utility model belongs. The words "including" and the like used herein mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

Claims

1. A slit valve device, characterized in that: include: A slit valve body, a first air valve, a sealing plate and a driving member; The slit valve body is provided with a passage that passes through from front to back; The first gas valve is disposed at the top of the slit valve body and is used to inject gas into the channel; The sealing plate is rotatably arranged in the slit valve body; The driving member is connected to the sealing plate to drive the opening and closing of the sealing plate. When the sealing plate is closed, the sealing plate seals in the channel and is close to the first air valve to separate the channel into a first space and a second space that are independent of each other, wherein the first space is connected to the first air valve.

2. The slit valve device according to claim 1, characterized in that The slit valve body has a first end and a second end that are oppositely arranged, the first gas valve is arranged near the first end, a second gas valve is arranged on the side of the slit valve body, and the second gas valve is arranged near the second end and is used to inject gas into the channel.

3. The slit valve device according to claim 2, characterized in that: The second air valve has a second air hole connected to the channel, and the second air hole is arranged horizontally or inclined; The second air hole is one and strip-shaped, or, There are a plurality of second air holes on the second air valve and the second air holes are arranged at intervals in the vertical direction.

4. The slit valve device according to claim 2, characterized in that: The second air valves are at least one pair, and each pair of the second air valves is respectively located on two opposite sides of the slit valve body.

5. The slit valve device according to claim 1, characterized in that When the sealing plate is opened, the sealing plate is attached to the inner top wall, inner side wall or inner bottom wall of the slit valve body.

6. The slit valve device according to claim 5, characterized in that In view of the situation where the sealing plate is opened and attached to the inner bottom wall of the slit valve body, a choke groove is provided on the inner top wall of the slit valve body near the first air valve, and the choke groove is arranged close to the second space. When the sealing plate is closed, the end of the sealing plate can extend into the choke groove to form a blocking seal.

7. The slit valve device according to claim 6, characterized in that The choke groove includes a limit surface arranged close to the first air valve and a guide surface connected to the limit surface, and the guide surface is inclined.

8. The slit valve device according to any one of claims 1 to 7, characterized in that: It also includes a guide plate arranged on the bottom wall of the slit valve body, the guide plate is located below the first air valve and on one side of the sealing plate, and the top surface of the guide plate is inclined downward from the direction close to the sealing plate to the direction away from the sealing plate.

9. The slit valve device according to claim 8, characterized in that The baffle plate is rotatably arranged on the guide plate.

10. A semiconductor device, characterized in that: It comprises a process chamber, a wafer transfer chamber and a slit valve device as claimed in any one of claims 1 to 9; The slit valve device is connected between the process chamber and the wafer transfer chamber.

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