Anti-interference tester with good heat dissipation performance
By using heat dissipation systems of thermal plates, heat conduction pipes, semiconductor refrigeration sheets and water tanks in the immunity tester, the high temperature problem caused by the sealing structure is solved, more efficient heat dissipation effect is achieved, and the service life of the equipment is extended.
Patent Information
- Application Number
- CN202420481612.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-03-12
AI Technical Summary
The existing immunity tester is difficult to quickly discharge internal heat due to the sealing structure, which leads to short circuits in electronic components in high temperature environments, reducing the service life of the equipment.
A heat dissipation mechanism including a thermal plate, a heat conduction pipe, a semiconductor refrigeration sheet and a water tank is designed to transfer heat through the heat conduction pipe, and the circulating cooling system of the semiconductor refrigeration sheet and the water tank is used to reduce the temperature, and heat dissipation is accelerated through the fan.
It effectively improves the heat dissipation effect of the immunity tester and extends the service life of the equipment.
Smart Images
Figure CN222232502U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of anti-interference testers, and more specifically, particularly relates to an anti-interference tester with good heat dissipation. Background Art
[0002] The immunity tester is an electronic measuring instrument used in the field of electronics and communication technology. It tests transient, surge and other anti-interference voltage changes. The multi-function immunity tester is a multi-function combined immunity test equipment that can perform three tests: electrostatic discharge immunity, electrical fast transient pulse group immunity and surge immunity.
[0003] Based on the above, the inventors have discovered the following problems: the control box of current immunity testers is mostly a sealed structure, which makes it difficult to quickly discharge the internal heat of the tester when it is in use, causing its internal electronic components to continue to operate in a high-temperature environment. Electronic components are prone to short circuits when operating in a high-temperature environment, which greatly reduces the service life of the tester.
[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and an anti-interference tester with good heat dissipation is provided, in order to achieve a purpose with more practical value. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides an anti-interference tester with good heat dissipation.
[0006] The purpose and effect of the anti-interference tester with good heat dissipation of the utility model are achieved by the following specific technical means:
[0007] An immunity tester with good heat dissipation comprises a main body and a heat dissipation mechanism, wherein the main body comprises a tester body, a heat conduction plate is fixedly installed inside one end of the tester body, a heat conduction tube is fixedly installed on one side of the heat conduction plate, a first semiconductor refrigeration sheet is installed on one side of the heat conduction tube, a water tank is fixedly installed on one side of the first semiconductor refrigeration sheet, both ends of the heat conduction tube pass through the first semiconductor refrigeration sheet and communicate with the water tank, the heat dissipation mechanism comprises a movable sleeve, the movable sleeve is arranged on one end of the tester body, a second semiconductor refrigeration sheet is fixedly installed on the inner side of the tester body, and one side of the second semiconductor refrigeration sheet abuts against the water tank.
[0008] Furthermore, a pump is fixedly installed at the inner bottom end of the water tank, and the input end of the pump is connected to one end of the heat conduction pipe.
[0009] Furthermore, a pair of fans are embedded and installed on one side of the movable sleeve, and the wind direction of the fans is outward.
[0010] Furthermore, magnetic strips are embedded and installed on both upper and lower sides of one end of the tester body, and the magnetic strips are magnetically connected to the inner side of the movable sleeve.
[0011] Furthermore, handles are installed on both sides of the tester body, and a power socket is installed on the bottom of one side of the tester body.
[0012] Furthermore, the heat conducting plate and the heat conducting pipe are both made of brass, and the movable sleeve is made of aluminum.
[0013] Furthermore, a water inlet is provided at an upper end of one side of the water tank, and a sealing cover is connected to the inner thread of the water inlet.
[0014] Compared with the prior art, the utility model has the following beneficial effects:
[0015] This anti-interference tester with good heat dissipation performance has a heat conduction plate installed inside one end of the tester body, and a heat conduction pipe installed on one side of the heat conduction plate. The heat absorbed by the heat conduction plate can be transferred by the heat conduction pipe, thereby reducing the temperature inside the tester body. A first semiconductor refrigeration plate is installed on one side of the heat conduction pipe so that its cold end is cooled when it is working, thereby cooling the heat conduction pipe and promoting the heat conduction effect on the heat conduction plate. A water tank is installed on one side of the first semiconductor refrigeration plate so that the heat of the medium inside the heat conduction pipe and the hot end of the first semiconductor refrigeration plate can be transferred to the water tank. One side of the water tank is abutted against one side of the second semiconductor refrigeration plate. When the second semiconductor refrigeration plate is working, its cold end cools the water tank, thereby promoting the heat conduction effect of the heat conduction plate and the heat conduction pipe, and promoting the heat dissipation effect on the tester body. The utility model can effectively improve the heat dissipation effect of the anti-interference tester and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a three-dimensional schematic diagram of the utility model. Figure 1 .
[0017] Figure 2 It is a three-dimensional schematic diagram of the utility model. Figure 2 .
[0018] Figure 3 It is a schematic diagram of the internal three-dimensional structure of the utility model.
[0019] Figure 4 It is a side sectional schematic diagram of a water tank of the utility model.
[0020] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:
[0021] 100, main body; 1001, tester body; 1002, power socket; 1003, grip; 1004, heat conduction plate; 1005, heat conduction pipe; 1006, first semiconductor cooling sheet; 1007, water tank; 1008, magnetic strip; 1009, pump; 200, heat dissipation mechanism; 2001, movable cover; 2002, fan; 2003, second semiconductor cooling sheet. DETAILED DESCRIPTION
[0022] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.
[0023] Example:
[0024] As attached Figure 1 To Attachment Figure 4 As shown:
[0025] The utility model provides an immunity tester with good heat dissipation, comprising a main body 100 and a heat dissipation mechanism 200, wherein the main body 100 comprises a tester main body 1001, a heat conducting plate 1004 is fixedly installed inside one end of the tester main body 1001, a heat conducting pipe 1005 is fixedly installed on one side of the heat conducting plate 1004, a first semiconductor cooling sheet 1006 is installed on one side of the heat conducting pipe 1005, a water tank 1007 is fixedly installed on one side of the first semiconductor cooling sheet 1006, both ends of the heat conducting pipe 1005 penetrate the first semiconductor cooling sheet 1006 and communicate with the water tank 1007, and the heat dissipation mechanism 200 comprises a movable sleeve 2001, the movable sleeve 2001 is sleeved on one end of the tester main body 1001, a second semiconductor cooling sheet 2003 is fixedly installed on the inner side of the tester main body 1001, one side of the second semiconductor cooling sheet 2003 is against the water tank 1007, and the heat dissipation mechanism 200 comprises a movable sleeve 2001, the movable sleeve 2001 is sleeved on one end of the tester main body 1001, a second semiconductor cooling sheet 2003 is fixedly installed on the inner side of the tester main body 1001, and ... the second semiconductor cooling sheet 2003 is against the water tank 1007 by installing a movable sleeve 2 A heat conducting plate 1004 is provided, and a heat conducting pipe 1005 is installed on one side of the heat conducting plate 1004. The heat absorbed by the heat conducting plate 1004 can be transferred by the heat conducting pipe 1005, thereby reducing the temperature inside the tester body 1001. A first semiconductor cooling sheet 1006 is installed on one side of the heat conducting pipe 1005 so that its cold end is cooled when it is working, thereby reducing the temperature of the heat conducting pipe 1005, thereby promoting the heat conduction effect of the heat conducting plate 1004. A water tank 1007 is installed on one side of 6 to facilitate the heat transfer of the medium inside the heat pipe 1004 and the hot end of the first semiconductor refrigeration plate 1006 to the water tank 1007. By abutting against one side of the second semiconductor refrigeration plate 2003 on one side of the water tank 1007, when the second semiconductor refrigeration plate 2003 is working, its cold end cools the water tank 1007, thereby promoting the heat conduction effect of the heat conduction plate 1004 and the heat conduction pipe 1005, and promoting the heat dissipation effect of the tester body 1001.
[0026] Among them, a pump 1009 is fixedly installed at the inner bottom end of the water tank 1007, and the input end of the pump 1009 is connected to one end of the heat pipe 1005. By installing the pump 1009, the medium inside the water tank 1007 can be exchanged with the medium inside the heat pipe 1005 when it is working.
[0027] A pair of fans 2002 are embedded and installed on one side of the movable sleeve 2001. The wind direction of the fans 2002 is outward. By installing the fans 2002, the hot end of the second semiconductor cooling plate 2003 can be cooled to promote the cooling effect of its cold end.
[0028] Among them, magnetic strips 1008 are embedded and installed on the upper and lower sides of one end of the tester body 1001. The magnetic strip 1008 is magnetically connected to the inner side of the movable sleeve 2001. By installing the magnetic strip 1008 and making it magnetically connected to the inner side of the movable sleeve 2001, it is convenient for the user to disassemble and assemble the movable sleeve 2001.
[0029] Among them, handles 1003 are installed on both sides of the tester body 1001, and a power socket 1002 is installed at the bottom of one side of the tester body 1001. By installing the handle 1003, it is convenient to move the tester body 1001, and by installing the power socket 1002, it is convenient to provide power to the tester body 1001.
[0030] Among them, the heat conducting plate 1004 and the heat conducting pipe 1005 are both made of brass, and the movable sleeve 2001 is made of aluminum. By setting the heat conducting plate 1004 and the heat conducting pipe 1005 to be made of brass, their thermal conductivity effect can be improved, and by setting the movable sleeve 2001 to be made of aluminum, its thermal conductivity and heat dissipation effect can be improved.
[0031] Among them, a water filling port is opened at the upper end of one side of the water tank 1007, and the internal thread of the water filling port is connected to a cover. By setting the water filling port and its internal thread connected to the cover, it is convenient for the user to inject cooling medium into the water tank 1007.
[0032] The specific usage and function of this embodiment are as follows:
[0033] When using this product, first check whether the connection of the product is tightened. After ensuring that it is intact, place the product in the designated position. Install a heat conducting plate 1004 inside one end of the tester body 1001, and install a heat conducting pipe 1005 on one side of the heat conducting plate 1004. The heat absorbed by the heat conducting plate 1004 can be transferred by the heat conducting pipe 1005, thereby reducing the temperature inside the tester body 1001. Install a first semiconductor refrigeration plate 1006 on one side of the heat conducting pipe 1005 so that its cold end is cooled when it is working, thereby cooling the heat conducting pipe 1005 and promoting the heat conduction effect of the heat conducting plate 1004. Both ends of the heat conducting pipe 1005 are connected to a water tank 1007. A pump 1009 is installed at the bottom of the water tank 1007. When the pump 1009 is working, the medium inside the water tank 1007 can be injected into the heat conducting pipe. 1005, the medium inside the heat pipe 1005 is squeezed into the water tank 1007, so as to achieve the effect of circulation, by abutting against the second semiconductor refrigeration plate 2003 on one side of the water tank 1007, the water tank 1007 is cooled by the cold end of the second semiconductor refrigeration plate 2003, and the heat dissipation effect of the tester body 1001 is further promoted, and a pair of fans 2002 are installed on one side of the movable sleeve 2001, and the heat of the hot end of the second semiconductor refrigeration plate 2003 can be extracted by the fan 2002, thereby promoting the cooling effect of the cold end of the second semiconductor refrigeration plate 2003, so as to cool the medium inside the water tank 1007, and the movable sleeve 2001 is magnetically connected to the magnetic strip 1008 installed on the tester body 1001, so that the user can disassemble and assemble the movable sleeve 2001 and replace the medium inside the water tank 1007.
[0034] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. An anti-interference tester with good heat dissipation performance, comprising a main body (100) and a heat dissipation mechanism (200), characterized in that: The main body (100) comprises a tester body (1001), a heat conducting plate (1004) is fixedly installed inside one end of the tester body (1001), a heat conducting pipe (1005) is fixedly installed on one side of the heat conducting plate (1004), a first semiconductor cooling plate (1006) is installed on one side of the heat conducting pipe (1005), a water tank (1007) is fixedly installed on one side of the first semiconductor cooling plate (1006), both ends of the heat conducting pipe (1005) pass through the first semiconductor cooling plate (1006) and communicate with the water tank (1007), the heat dissipation mechanism (200) comprises a movable sleeve (2001), the movable sleeve (2001) is sleeved on one end of the tester body (1001), a second semiconductor cooling plate (2003) is fixedly installed on the inner side of the tester body (1001), and one side of the second semiconductor cooling plate (2003) abuts against the water tank (1007).
2. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: A pump (1009) is fixedly installed at the inner bottom end of the water tank (1007), and the input end of the pump (1009) is connected to one end of the heat conduction pipe (1005).
3. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: A pair of fans (2002) are embedded and installed on one side of the movable sleeve (2001), and the wind direction of the fans (2002) is outward.
4. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: Magnetic strips (1008) are embedded and installed on both upper and lower sides of one end of the tester body (1001), and the magnetic strips (1008) are magnetically connected to the inner side of the movable sleeve (2001).
5. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: Grips (1003) are installed on both sides of the tester body (1001), and a power socket (1002) is installed at the bottom of one side of the tester body (1001).
6. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: The heat conducting plate (1004) and the heat conducting pipe (1005) are both made of brass, and the movable sleeve (2001) is made of aluminum.
7. The anti-interference tester with good heat dissipation as claimed in claim 1, characterized in that: A water inlet is provided at an upper end of one side of the water tank (1007), and a sealing cover is connected to the inner thread of the water inlet.