Heat dissipation device with self-adaptive power control

By designing an adaptive power-controlled heat dissipation device on the laptop, using the combination of a heat sink and a temperature detection module, the problem of poor sliding and heat dissipation of the laptop during high load operation is solved, and the effect of fixed and rapid cooling is achieved.

CN222232929UActive Publication Date: 2024-12-24梁彦超
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Patent Information

Application Number
CN202323507225.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-22
Publication Date
2024-12-24
Estimated Expiration
2033-12-22

AI Technical Summary

Technical Problem

The existing laptop cooling brackets are operating at high loads, causing the laptop to slide downward due to gravity, lacking a fixed structure and unable to effectively assist in heat dissipation.

Method used

Designed a heat dissipation device with adaptive power control, including a heat dissipation seat installed on a laptop computer, using components such as cross plates, cooling fans, down plates, springs, gears, clamping wheels and blocking rubber sheets to push down plates and The card board is used to fix the laptop and control the semiconductor heat sink, thermal copper plate and cooling fan through the temperature detection module to achieve rapid cooling.

Benefits of technology

Effectively prevent the laptop from sliding, ensure the heat dissipation effect, and achieve rapid cooling through real-time temperature detection and automatic control, improving the heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a self-adaptive power control heat dissipation device which comprises a heat dissipation base installed on a notebook computer body, an installation cylinder is fixedly installed on the inner wall of the heat dissipation base, and the heat dissipation base is provided with a lower pressing plate, a second spring, a toothed plate, an installation column, a gear, a clamping wheel, an installation column and a blocking rubber sheet. The lower pressing plate is pushed, the clamping plate outside the lower pressing plate pushes the clamping wheel to rotate, and then the gear is meshed with the toothed plate to push out the blocking rubber block to block and limit the notebook computer body. According to the notebook computer, the notebook computer body can be fixed, meanwhile, a side box, a semiconductor cooling fin, a heat conduction copper sheet and a second cooling fan are arranged, a temperature detection module in the notebook computer body is used for conducting real-time temperature detection, and when heat is accumulated, the heat is accumulated; the semiconductor cooling fins, the heat conduction copper sheet and the second cooling fan can be controlled to be started through the notebook computer body, and low-temperature air flows out to the top of the notebook computer body to achieve rapid cooling.
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Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a heat dissipation device with adaptive power control. Background Art

[0002] Nowadays, science and technology are developing rapidly, and people's productivity tools are becoming more and more diversified. Among them, computers, as one of the most efficient production tools, have been widely used in all walks of life. There are also many types of computers. Portable laptops have more flexible applications due to their portability. However, due to their size, their own heat dissipation effect is average, and auxiliary heat dissipation is required when operating at high loads.

[0003] After searching, the Chinese patent publication number CN110275589A discloses a notebook cooling bracket, including a placement plate, a front end surface of the placement plate is symmetrically provided with a fan cavity opening forward, a filter is fixedly installed on the front inner wall of the fan cavity, a rotating mechanism that can rotate the placement plate is provided under the placement plate, and an adjustment mechanism that can adjust the height of the entire notebook cooling bracket is provided on the rear side of the fixed plate. The adjustment mechanism includes a fixed platform placed on the ground, and the front end surface of the fixed platform is rotatably installed to provide a rotating block for providing power to the adjustment mechanism.

[0004] The above patent has the following deficiencies: when the above device is in use, the laptop is supported by placing a plate, and then the angle is adjusted to dissipate heat, but the gravity effect caused by the laptop's own weight is ignored, which may cause it to slide downward, and this device does not have a structure to fix the laptop. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a heat dissipation device with adaptive power control.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The outer wall of the cooling fan is fixedly provided with a toothed plate and a toothed column, and the outer wall of the cooling fan is fixedly provided with a toothed plate and a toothed column, and the outer wall of the cooling fan is fixedly provided with a toothed plate and a toothed column.

[0008] As a further solution of the utility model: the inner wall of the heat sink is rotatably connected with a rotating rod 1, the outer side wall of the rotating rod 1 is fixedly installed with a support plate, and the outer side wall of the rotating rod 1 is sleeved with a torsion spring.

[0009] As a further solution of the utility model: the two ends of the torsion spring respectively abut against the outer side wall of the support plate and the outer bottom of the heat sink.

[0010] As a further solution of the present invention: a temperature detection module is provided inside the notebook computer body.

[0011] As a further solution of the utility model: a guide plate is slidably connected to the inner wall of the installation cylinder, and a clamping block is fixedly installed at the other end of the guide plate.

[0012] As a further solution of the utility model: a spring is fixedly installed between the clamping block and the inner wall of the bottom of the installation tube.

[0013] As a further solution of the utility model: a side box is fixedly installed on the inner wall of the heat sink, a heat dissipation groove 1 is opened on the outer wall of the top of the side box, and a heat dissipation groove 2 is opened on the outer side wall of the side box.

[0014] As a further solution of the utility model: a semiconductor heat sink is fixedly installed on the inner wall of the side box, a heat-conducting copper sheet is fixedly installed on the outer side wall of the semiconductor heat sink, and a second cooling fan is fixedly installed on the outer side wall of the heat-conducting copper sheet.

[0015] Compared with the prior art, the utility model provides a heat dissipation device with adaptive power control, which has the following beneficial effects:

[0016] 1. The utility model is provided with a mounting tube, a lower pressure plate, a second spring, a tooth plate, a mounting column, a gear, a card wheel, a mounting column, and a blocking rubber sheet. When in use, the laptop body is placed in the heat dissipation seat, and then the lower pressure plate is pushed. The card plate outside the lower pressure plate pushes the card wheel to rotate, and then the gear engages the tooth plate to push out the blocking rubber block to block and limit the laptop body. When it needs to be removed, just push another set of lower pressure plates.

[0017] 2. The utility model is provided with a guide plate, a spring 1 and a clamping block. When the clamping wheel is pushed to rotate by the clamping plate, the clamping block can be intermittently clamped to the outside of the clamping wheel under the elastic force of the spring 1, thereby clamping the clamping wheel to a certain extent and preventing the clamping wheel from being rotated by external force.

[0018] 3. The utility model is provided with a side box, a semiconductor heat sink, a thermal copper sheet, two cooling fans, a heat sink one, and a heat sink two. A temperature detection module inside the notebook computer body performs real-time temperature detection. When heat accumulates, the semiconductor heat sink, the thermal copper sheet, and the two cooling fans can be turned on by the notebook computer body, so that the air passing through the side box can be cooled and flow out to the top of the notebook computer body to achieve rapid cooling, and the power of the adaptive control device can be used.

[0019] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device with adaptive power control proposed by the utility model;

[0021] Figure 2 A schematic diagram of the structure of a heat sink of a heat sink device with adaptive power control proposed by the utility model;

[0022] Figure 3 A schematic diagram of the rear view structure of a heat sink of a heat sink device with adaptive power control proposed by the utility model;

[0023] Figure 4 A schematic diagram of the exploded structure of a side box of a heat dissipation device with adaptive power control proposed by the utility model;

[0024] Figure 5 A schematic diagram of the cross-sectional structure of the mounting tube of a heat dissipation device with adaptive power control proposed by the utility model Figure 1 ;

[0025] Figure 6 A schematic diagram of the cross-sectional structure of the mounting tube of a heat dissipation device with adaptive power control proposed by the utility model Figure 2 .

[0026] In the figure: 1. heat sink; 2. side box; 3. notebook computer body; 4. cooling fan 1; 5. cross plate; 6. rotating rod 1; 7. support plate; 8. torsion spring; 9. mounting tube; 10. semiconductor heat sink; 11. thermal conductive copper sheet; 12. cooling fan 2; 13. guide plate; 14. spring 1; 15. tooth plate; 16. blocking rubber sheet; 17. mounting column; 18. spring 2; 19. clamping wheel; 20. elastic metal plate; 21. clamping plate; 22. lower pressure plate; 23. L-shaped pressing plate; 24. clamping block; 25. gear; 26. rotating rod 2; 27. heat sink 1; 28. heat sink 2. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0028] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0029] Embodiment 1:

[0030] A heat dissipation device with adaptive power control is used to block and fix the notebook computer body 3, such as Figure 1-6 As shown, it includes a heat sink 1 installed on a laptop computer body 3, the laptop computer body 3 is provided with a temperature detection module, a cross plate 5 is welded to the inner wall at the bottom of the heat sink 1, and a heat dissipation fan 4 is rotatably connected to the outer wall at the bottom of the cross plate 5, a mounting tube 9 is welded to the inner wall of the heat sink 1, and a lower pressure plate 22 is slidably connected to the inner wall of the mounting tube 9, an L-shaped pressing plate 23 is welded to the top outer wall of the lower pressure plate 22, a spring 18 is welded between the lower pressure plate 22 and the inner wall at the bottom of the mounting tube 9, and the inner wall of the mounting tube 9 slides A toothed plate 15 and a mounting column 17 are connected, a gear 25 is rotatably connected to the inner side wall of the mounting cylinder 9, a card wheel 19 and a second rotating rod 26 are connected to the outer side wall of the gear 25 through a key, the second rotating rod 26 is meshed with the toothed plate 15, an elastic metal plate 20 is welded to the outer side wall of the lower pressing plate 22, a card plate 21 is rotatably connected to the outer side wall of the lower pressing plate 22, the card plate 21 is in contact with the elastic metal plate 20, the card plate 21 is matched with the card wheel 19, and a blocking rubber sheet 16 is bonded to the outer wall of the toothed plate 15 and the bottom of the mounting column 17;

[0031] When in use, place the laptop body 3 on the bottom inner wall of the heat sink 1, and push the lower pressure plate 22 downward through a group of L-shaped pressing plates 23, and the card plate 21 outside the lower pressure plate 22 pushes the card wheel 19 to rotate, and the card wheel 19 rotates and drives the gear 25 outside the rotating rod 26 to engage the toothed plate 15, so that the toothed plate 15 moves outward, and then the laptop body 3 is squeezed and fixed through the blocking rubber sheet 16 outside the toothed plate 15, and then the cooling fan 4 is turned on for auxiliary heat dissipation. When the laptop body 3 needs to be removed, press another group of L-shaped pressing plates 23 so that the lower pressure plate 22 of the other group pushes the card wheel 19 to rotate to achieve the reversal of the gear 25, and then the gear 25 engages the toothed plate 15 to move the toothed plate 15 inward, and the laptop body 3 can be taken out by removing the squeeze.

[0032] The inner wall of the installation tube 9 is slidably connected with a guide plate 13, the other end of the guide plate 13 is welded with a clamping block 24, and a spring 14 is welded between the clamping block 24 and the inner wall of the bottom of the installation tube 9;

[0033] When the clamping wheel 19 is pushed to rotate by the clamping plate 21, the clamping block 24 can be intermittently clamped to the outside of the clamping wheel 19 under the elastic force of the spring 14, thereby clamping the clamping wheel 19 to a certain extent and preventing the clamping wheel 19 from rotating due to external force.

[0034] The inner wall of the heat sink 1 is rotatably connected with a rotating rod 6, the outer side wall of the rotating rod 6 is welded with a supporting plate 7, the outer side wall of the rotating rod 6 is sleeved with a torsion spring 8, and the two ends of the torsion spring 8 are respectively in contact with the outer side wall of the supporting plate 7 and the outer bottom of the heat sink 1;

[0035] When in use, the support plate 7 can be rotated to support the heat sink 1 at a certain angle to accelerate heat dissipation. When in use, the support plate 7 can be directly retracted by the torsion of the torsion spring 8.

[0036] Working principle: When in use, place the laptop body 3 on the inner wall at the bottom of the heat sink 1, rotate the support plate 7 to support the heat sink 1 at a certain angle, push the lower pressure plate 22 downward through a set of L-shaped pressing plates 23, and the card plate 21 outside the lower pressure plate 22 pushes the card wheel 19 to rotate. When the card wheel 19 is pushed and rotated by the card plate 21, the card block 24 can be intermittently clamped to the outside of the card wheel 19 under the elastic force of the spring 14, so as to clamp the card wheel 19 to a certain extent, and the card wheel 19 rotates to drive the outside of the rotating rod 26 The gear 25 meshes with the tooth plate 15, so that the tooth plate 15 moves outward, and then the laptop body 3 is squeezed and fixed through the blocking rubber sheet 16 outside the tooth plate 15, and then the cooling fan 4 is turned on for auxiliary heat dissipation. When the laptop body 3 needs to be removed, the other set of L-shaped pressing plates 23 is pressed so that the lower pressing plate 22 of the other set pushes the card wheel 19 to rotate to achieve the reversal of the gear 25, and then the gear 25 meshes with the tooth plate 15 to move the tooth plate 15 inward, and the laptop body 3 can be taken out by removing the squeeze.

[0037] Embodiment 2:

[0038] A heat dissipation device with adaptive power control, such as Figure 1-6 As shown; this embodiment is supplemented by the following on the basis of embodiment 1: the inner wall of the heat sink 1 is welded with a side box 2, the top outer wall of the side box 2 is provided with a heat dissipation groove 1 27, the outer side wall of the side box 2 is provided with a heat dissipation groove 28, the inner wall of the side box 2 is welded with a semiconductor heat sink 10, the outer side wall of the semiconductor heat sink 10 is welded with a heat conductive copper sheet 11, and the outer side wall of the heat conductive copper sheet 11 is fixed with a heat dissipation fan 2 12 by bolts;

[0039] Working principle: When in use, real-time temperature detection is performed through the temperature detection module inside the laptop body 3. When the heat dissipation fan 4 is not fast enough to cause heat accumulation, the semiconductor heat sink 10, the thermal copper sheet 11, and the heat dissipation fan 2 12 can be controlled to turn on through the laptop body 3, so that the air flowing in through the heat dissipation slot 1 27 on the top of the side box 2 can be quickly cooled, and then flow out through the heat dissipation slot 2 28 to the top of the laptop body 3 to achieve rapid cooling, depending on the power of the applicable control device.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation device with adaptive power control, comprising a heat dissipation seat (1) mounted on a notebook computer body (3), characterized in that: A cross plate (5) is fixedly mounted on the inner wall of the bottom of the heat sink (1), and a heat sink fan (4) is rotatably connected to the outer wall of the bottom of the cross plate (5). A mounting tube (9) is fixedly mounted on the inner wall of the heat sink (1), and a lower pressure plate (22) is slidably connected to the inner wall of the mounting tube (9). An L-shaped pressing plate (23) is fixedly mounted on the top outer wall of the lower pressure plate (22), and a spring (18) is fixedly mounted between the lower pressure plate (22) and the inner wall of the bottom of the mounting tube (9). A tooth plate (15) and a mounting column (17) are slidably connected to the inner wall of the mounting tube (9). The inner side wall is rotatably connected to a gear (25), and the outer side wall of the gear (25) is connected to a card wheel (19) and a second rotating rod (26) through a key, and the second rotating rod (26) is meshed with the tooth plate (15). The outer side wall of the lower pressure plate (22) is fixedly installed with an elastic metal plate (20), and the outer side wall of the lower pressure plate (22) is rotatably connected to a card plate (21), and the card plate (21) is in contact with the elastic metal plate (20), and the card plate (21) cooperates with the card wheel (19), and a blocking rubber sheet (16) is fixedly installed on the outer wall of the bottom of the tooth plate (15) and the mounting column (17).

2. The heat dissipation device with adaptive power control according to claim 1, characterized in that: The inner wall of the heat sink (1) is rotatably connected to a rotating rod (6), the outer side wall of the rotating rod (6) is fixedly mounted with a support plate (7), and the outer side wall of the rotating rod (6) is sleeved with a torsion spring (8).

3. The heat dissipation device with adaptive power control according to claim 2, characterized in that: The two ends of the torsion spring (8) respectively contact the outer side wall of the support plate (7) and the outer bottom of the heat sink (1).

4. The heat dissipation device with adaptive power control according to claim 1, characterized in that: A temperature detection module is provided inside the notebook computer body (3).

5. The heat dissipation device with adaptive power control according to claim 1, characterized in that: The inner wall of the installation cylinder (9) is slidably connected with a guide plate (13), and a clamping block (24) is fixedly mounted on the other end of the guide plate (13).

6. The heat dissipation device with adaptive power control according to claim 5, characterized in that: A spring 1 (14) is fixedly installed between the clamping block (24) and the inner wall of the bottom of the installation tube (9).

7. The heat dissipation device with adaptive power control according to claim 1, characterized in that: A side box (2) is fixedly mounted on the inner wall of the heat sink (1), a heat dissipation groove (27) is provided on the top outer wall of the side box (2), and a heat dissipation groove (28) is provided on the outer side wall of the side box (2).

8. The heat dissipation device with adaptive power control according to claim 7, characterized in that: A semiconductor heat sink (10) is fixedly mounted on the inner wall of the side box (2), a heat-conducting copper sheet (11) is fixedly mounted on the outer side wall of the semiconductor heat sink (10), and a second heat-dissipating fan (12) is fixedly mounted on the outer side wall of the heat-conducting copper sheet (11).