Semiconductor chip bonding device

Abstract

The utility model relates to the field of semiconductor chip production, in particular to a semiconductor chip bonding device, which comprises a rack and a double-gantry assembly arranged on the rack, the double-gantry assembly comprises an X-direction gantry mechanism and two groups of Y-direction gantry mechanisms, the Y-direction gantry mechanisms are arranged at the upper end of the X-direction gantry mechanism, and the X-direction gantry mechanism is arranged at the lower end of the Y-direction gantry mechanism. At least four groups of wafer tables are arranged in the middle of the rack in the Y direction, at least one group of substrate workbenches are arranged in the middle of the rack, the substrate workbenches are located between the wafer tables, at least two groups of bonding mechanisms are arranged on the inner side of each group of Y-direction gantry mechanism, a visual inspection system is arranged on one side of each group of bonding mechanism, and a turnover mechanism is arranged above each group of wafer tables in the X direction. A group of glue dipping mechanism is arranged on the outer side of each group of turnover mechanism along the X direction, a group of chip supply mechanism is arranged on the left side of each group of wafer table, a base material feeding and discharging mechanism is arranged on the outer side of the substrate working table, the chip mounting of more than four kinds of chips can be realized for multi-chip production of Chiplet, and the chip mounting device is more advanced compared with a multi-chip connection mode of traditional chip mounting equipment.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip production, and relates to a semiconductor chip bonding device. Background Art

[0002] Since Moore's Law has encountered bottlenecks and the chip feature size has approached the physical limit, advanced packaging technology has become an important way to continue Moore's Law. Chiplet technology has become an important method to extend the life of "Moore's Law" with its advantages of flexible design, short product cycle and low cost. Chiplet is expected to meet the growing demand for chip performance and functional diversification. Chiplet is also known as the best choice in the era of AI computing power explosion. Compared with traditional consumer-grade chips, computing chips have larger areas, larger storage capacity, and higher requirements for interconnection speed. Chiplet technology can well meet the performance and cost requirements of these large-scale chips, so it is widely used. Chiplet, commonly known as "core particle" or "small chip group", is to split the components originally integrated in the same SoC into multiple independent chiplets with specific functions, and then interconnect them through advanced packaging technology after separate manufacturing. Finally, they are integrated and packaged into a system chip, and the packaging object develops from a single chip to multiple chips. The development of chiplet technology, especially CoWoS (2.5D) packaging technology, has prompted the need for further innovation and upgrading of multi-chip mounting technology.

[0003] Traditional flip-chip bonding machines are equipped with only one wafer table and one substrate workbench. The flip head picks up the chip from the wafer on the wafer table, and the bonding head picks up the chip from the flip head. Then, the chip is dipped in glue and visually recognized and calibrated before finally being mounted on the substrate. Therefore, a single device can only bond one type of chip to the substrate. When processing multiple chips, multiple devices need to be connected in series. The substrate with one chip mounted needs to be transferred to the next machine through an intermediate mechanism. Problems such as chip offset affect the yield. This model not only has low operating efficiency but also occupies a large area, resulting in high production costs. Currently, there is no multi-chip production equipment for chiplets. Utility Model Content

[0004] The utility model provides a chip bonding method and bonding equipment thereof to solve the problems of the prior art.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A semiconductor chip bonding device comprises: a frame and a double gantry assembly arranged on the frame, the double gantry assembly comprises an X-direction gantry mechanism and two groups of Y-direction gantry mechanisms, the Y-direction gantry mechanism is arranged at the upper end of the X-direction gantry mechanism, at least four groups of wafer tables are arranged in the middle of the frame along the Y direction, at least one group of substrate worktables is arranged in the middle of the frame, the substrate worktables are located between the wafer tables, at least two groups of bonding mechanisms are arranged inside each group of the Y-direction gantry mechanisms, a visual inspection system is arranged on one side of each group of bonding mechanisms, a group of flipping mechanisms are arranged above each group of wafer tables along the X direction, each group of the flipping mechanisms is provided with a group of dipping mechanisms along the outer side of the X direction, a group of chip supply mechanisms are arranged on the left side of each group of wafer tables, and a substrate feeding and discharging mechanism is arranged on the outer side of the substrate worktable.

[0007] A further improvement is that the wafer table includes a first wafer table, a second wafer table, a third wafer table and a fourth wafer table, the bonding mechanism includes a first bonding mechanism, a second bonding mechanism, a third bonding mechanism and a fourth bonding mechanism, the flipping mechanism includes a first flipping mechanism, a second flipping mechanism, a third flipping mechanism and a fourth flipping mechanism, the dipping mechanism includes a first dipping mechanism, a second dipping mechanism, a third dipping mechanism and a fourth dipping mechanism, the chip supply mechanism includes a first chip supply mechanism, a second chip supply mechanism, a third chip supply mechanism and a fourth chip supply mechanism, and the substrate feeding and discharging mechanism includes a substrate loading mechanism and a substrate unloading mechanism.

[0008] A further improvement is that the first chip supply mechanism, the second chip supply mechanism, the third chip supply mechanism and the fourth chip supply mechanism all include a material box, a motor, a linear guide rail, a screw assembly and a material box support plate. The material box is arranged at the upper end of the material box support plate, and the linear guide rail is arranged at the rear end of the material box support plate. The motor drives the screw assembly to rotate and push the material box support plate through the linear guide rail to make the material box move linearly in the Z direction.

[0009] A further improvement is that the first wafer table, the second wafer table, the third wafer table and the fourth wafer table all include a wafer table X-axis stage, a wafer table Y-axis stage and a wafer table expansion stage. The wafer table Y-axis stage is arranged above the wafer table X-axis stage, and the wafer table expansion stage is arranged above the wafer table Y-axis stage. The wafer table X-axis stage and the wafer table Y-axis stage all include a base plate, a second motor, a second ball screw assembly and a second linear guide. The second motor drives the second ball screw assembly to rotate and push the base plate to perform linear motion through the second linear guide. The wafer table expansion stage includes an expansion stage base plate, a stepper motor, a pulley mechanism and a Z-axis expansion mechanism. The stepper motor drives the pulley mechanism to drive the Z-axis expansion mechanism to make the wafer rotate in the Z direction and around the Z axis.

[0010] A further improvement is that the visual inspection system includes a lens assembly, a linear motor and a visual Z-direction mounting plate, the first bonding mechanism, the second bonding mechanism, the third bonding mechanism and the fourth bonding mechanism all include a bonding head mounting plate and a nozzle assembly, the bonding head mounting plate and the lens assembly are arranged on the visual Z-direction mounting plate, and the linear motor drives the lens assembly and the nozzle assembly to move along the Z direction on the mounting plate.

[0011] As a further improvement, the first flipping mechanism, the second flipping mechanism, the third flipping mechanism and the fourth flipping mechanism all include a flipping head, a mounting plate and a motor three.

[0012] As a further improvement, the substrate workbench includes a workbench bottom plate, a pulley assembly 1, a linear motor 2, a double guide rail assembly and a workbench panel. The pulley assembly 1 is driven by the linear motor 2 to move the workbench panel along the X direction on the double guide rail assembly.

[0013] According to a further improvement, the substrate loading mechanism and the substrate unloading mechanism both include a supporting base, a conveyor belt, a second pulley assembly, a fixed plate, a movable plate, a viscous scale and a third linear motor. The second pulley assembly drives the conveyor belt to rotate to drive the substrate at the upper end to move. The third linear motor drives the movable plate to move relative to the fixed plate. The viscous scale is arranged under the conveyor belt.

[0014] A further improvement is that the first glue dipping mechanism, the second glue dipping mechanism, the third glue dipping mechanism and the fourth glue dipping mechanism include a glue box, a screw mechanism, a pulley assembly three, a camera, a scraper plate and a linear guide rail two, and the pulley assembly three drives the screw mechanism and the linear guide rail two to make the scraper plate move along the X direction.

[0015] Compared with the prior art, the semiconductor chip bonding device of the utility model has the following beneficial effects:

[0016] Compared with traditional SMT equipment that requires more than two devices to work in series, occupies a large area, and is prone to dust pollution, chip offset and other problems that affect yield during transmission, this solution is oriented to multi-chip production of chiplets. A single device is configured with at least 4 wafers, which can realize the placement of more than 4 types of chips. It is more advanced than the multi-online mode of traditional SMT equipment.

[0017] The XYZ-driven double gantry assembly architecture is used for high-precision placement of multiple chips. It is equipped with at least 4 wafer tables, at least one substrate workbench, at least 4 bonding mechanisms, at least 4 flipping mechanisms, at least 4 sets of dipping mechanisms and visual systems. Each wafer table is equipped with an automatic material box loading mechanism, and each bonding mechanism is responsible for picking up a chip on a wafer. After the bonding mechanism picks up the chip from the flipping mechanism, it performs dipping, identification, and placement in sequence, and can simultaneously perform placement of at least 4 types of chips.

[0018] At the same time, this solution supports the waffle pack loading method. At least 2 sets of waffle packs can be placed on each wafer position, which can achieve at least 8 types of chip mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the overall layout of the utility model.

[0020] Figure 2 It is a structural schematic diagram of the utility model as a whole from another perspective.

[0021] Figure 3 It is a schematic structural diagram of a top view of the utility model after a part of the shell is removed.

[0022] Figure 4 This is a schematic diagram of the structure of the chip supply mechanism of this device.

[0023] Figure 5 This is a structural diagram of the front view of the chip supply mechanism of this device.

[0024] Figure 6 This is a schematic diagram of the structure of the wafer table of this equipment.

[0025] Figure 7 This is a structural diagram of the visual inspection system of this equipment.

[0026] Figure 8 This is a schematic diagram of the structure of the bonding mechanism of this device.

[0027] Fig. 9 It is a structural schematic diagram of the flipping mechanism of this equipment.

[0028] Fig.10 This is a schematic diagram of the structure of the workbench of this equipment.

[0029] Fig.11 It is a structural schematic diagram of the substrate feeding and discharging mechanism of this equipment.

[0030] Fig.12 It is a structural schematic diagram of the glue dipping mechanism of this equipment.

[0031] Fig.13 It is a structural schematic diagram of the ejector mechanism of this equipment.

[0032] Fig.14 This is the flow chart of this equipment.

[0033] In the figure, 1-double gantry assembly, 11-X-direction gantry mechanism, 12-Y-direction gantry mechanism, 2-frame, 31-first wafer stage, 32-second wafer stage, 33-wafer stage X-direction carrier, 34-wafer stage Y-direction carrier, 35-wafer stage expansion carrier, 351-wafer expansion stage bottom plate, 352-Z-direction expansion mechanism, 353-pulley mechanism, 361-bottom plate, 362-second linear guide rail, 363-second ball screw assembly, 37-needle-shaped lifting mechanism, 38-second wafer stage Wafer stage 3, 39-4th wafer stage, 4-substrate worktable, 432-pulley assembly 1, 433-linear motor 2, 434-double guide rail assembly, 435-worktable panel, 51-visual inspection system, 511-lens assembly, 512-linear motor 1, 513-visual Z-direction mounting plate, 52-first bonding mechanism, 53-second bonding mechanism, 54-third bonding mechanism, 55-fourth bonding mechanism, 561-bonding head mounting plate, 562-nozzle assembly Components, 61-first flip mechanism, 62-second flip mechanism, 63-third flip mechanism, 64-fourth flip mechanism, 651-flip head 651, 652-mounting plate, 653-motor three, 71-first glue dipping mechanism, 72-second glue dipping mechanism, 73-third glue dipping mechanism, 74-fourth glue dipping mechanism, 751-glue box, 752-screw mechanism, 753-pulley assembly, 754-linear guide rail two, 755-scraper, 81-first chip supply Mechanism, 82-second chip supply mechanism, 83-material box, 84-motor one, 85-linear guide rail one, 86-screw assembly one, 87-material box support plate, 88-third chip supply mechanism, 89-fourth chip supply mechanism, 91-substrate loading mechanism, 92-substrate unloading mechanism, 931-support base, 932-conveyor belt, 933-pulley assembly two, 934-fixed plate, 935-movable plate, 936-viscous scale, 937-linear motor three. DETAILED DESCRIPTION

[0034] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Below is a combination of the embodiments and the attached Figures 1 to 14 , the technical solution of the utility model is further elaborated.

[0037] Example 1

[0038] A semiconductor chip bonding device comprises: a frame 2 and a double gantry assembly 1 arranged on the frame 2, the double gantry assembly 1 comprises an X-direction gantry mechanism 11 and two groups of Y-direction gantry mechanisms 12, the Y-direction gantry mechanism 12 is arranged at the upper end of the X-direction gantry mechanism 11, at least four groups of wafer stages are arranged in the middle of the frame 2 along the Y direction, at least one group of substrate worktables 4 is arranged in the middle of the frame 2, the substrate worktables 4 are located between the wafer stages, at least two groups of bonding mechanisms are arranged inside each group of the Y-direction gantry mechanisms 12, a visual inspection system 51 is arranged on one side of each group of bonding mechanisms, a group of flipping mechanisms are arranged above each group of wafer stages along the X direction, each group of the flipping mechanisms is provided with a group of dipping mechanisms along the outer side of the X direction, a group of chip supply mechanisms are arranged on the left side of each group of wafer stages, and a substrate feeding and discharging mechanism is arranged on the outer side of the substrate worktable 4.

[0039] The wafer table includes a first wafer table 31, a second wafer table 32, a third wafer table 38 and a fourth wafer table 39, the bonding mechanism includes a first bonding mechanism 52, a second bonding mechanism 53, a third bonding mechanism 54 and a fourth bonding mechanism 55, the flipping mechanism includes a first flipping mechanism 61, a second flipping mechanism 62, a third flipping mechanism 63 and a fourth flipping mechanism 64, the dipping mechanism 7 includes a first dipping mechanism 71, a second dipping mechanism 72, a third dipping mechanism 73 and a fourth dipping mechanism 74, the chip supply mechanism includes a first chip supply mechanism 81, a second chip supply mechanism 82, a third chip supply mechanism 88 and a fourth chip supply mechanism 89, and the substrate feeding and discharging mechanism includes a substrate loading mechanism 91 and a substrate unloading mechanism 92.

[0040] like Figure 1 to Figure 14 , as shown, the use principle of the utility model:

[0041] The X-direction gantry mechanism 11 is fixed to the frame 2, and the two groups of Y-direction gantry mechanisms 12 move on the X-direction gantry mechanism 11. The first chip supply mechanism 81, the second chip supply mechanism 82, the third chip supply mechanism 88 and the fourth chip supply mechanism 89 have Z-direction movement, the first wafer table 31, the second wafer table 32, the third wafer table 38 and the fourth wafer table 39 have X-direction, Y-direction, Z-direction and rotational movement around the Z-axis direction, the first bonding mechanism 52, the second bonding mechanism 53, the third bonding mechanism 54 and the fourth bonding mechanism 55 have Y-direction and Z-direction movement, the first flipping mechanism 61, the second flipping mechanism 62, the third flipping mechanism 63 and the fourth flipping mechanism 64 have rotational movement around the Y-axis direction, the substrate workbench 4 has X-direction movement, and the first dipping mechanism 71, the second dipping mechanism 72, the third dipping mechanism 73 and the fourth dipping mechanism 74 have X-direction movement.

[0042] The first wafer stage 31 and the second wafer stage 32 are located on the right side of the first chip supply mechanism 81 and the second chip supply mechanism 82, and the third wafer stage 38 and the fourth wafer stage 39 are located on the left side of the third chip supply mechanism 88 and the fourth chip supply mechanism 89. Each wafer stage is used to carry a blue film supplied by the chip supply mechanism and can support more than four chip mountings at the same time. There is a pin mechanism under each wafer stage for lifting the chip on the blue film of the wafer stage so that the chip is separated from the blue film. There is a flipping mechanism on the upper side of each wafer stage for sucking the chip lifted by the blue film on the wafer stage and rotating it 180° around the Y-axis. Two sets of Y-axis gantry mechanisms 12 move along the X-axis to move the bonding mechanism to the top of the flipping mechanism, pick up the chip on the flipping mechanism, and then the Y-axis gantry mechanism 12 moves along the X-axis and the bonding mechanism moves along the Y-axis to the glue dipping mechanism to dip the chip surface with glue and position the chip, and transport the glue-dipped chip to the specified position on the supporting substrate workbench 4. The visual inspection system 51 confirms the correctness of the chip, presses down after confirmation, and bonds the chip. The substrate loading mechanism 91 can transport the substrate to the specified position of the substrate workbench 4, and after the chip is mounted on the substrate, it is transported to the substrate unloading mechanism 92.

[0043] In addition to the above-mentioned vision system for the bonding point, there are also cameras for detecting the handover between different mechanisms, and a second vision system for completing functions such as chip positioning, quality inspection, and identification point detection in the placement process. The rack is used for the structural support of the entire chip inverted placement equipment.

[0044] The equipment has two Y-direction gantry mechanisms driving four bonding mechanisms to move four flipping mechanisms in the X direction to pick up four different chips, and the four bonding mechanisms alternately mount the four different chips. When sucking the chip from the blue film, the flipping mechanism picks up the chip and then rotates 180° around the Y axis. The two bonding heads installed on the same Y-direction gantry mechanism pick up the chip on the flipping mechanism and dip it in glue, and then alternately mount the chip on the substrate workbench. When the bonding mechanism on one Y-direction gantry mechanism is mounting, the bonding mechanism on the other moving gantry picks it up and dips it in glue, thereby realizing that the four bonding mechanisms on the two Y-direction gantry mechanisms alternately mount four different chips.

[0045] This solution is based on the XYZ-driven double gantry component architecture and is used for high-precision placement of multiple chips. It is equipped with at least 4 wafer tables, at least one substrate workbench, at least 4 bonding mechanisms, at least 4 flipping mechanisms, at least 4 sets of dipping mechanisms and visual systems. Each wafer table is equipped with an automatic material box loading mechanism, and each bonding mechanism is responsible for picking up a chip on a wafer. After the bonding mechanism picks up the chip from the flipping mechanism, it performs dipping, identification, and placement in sequence, and can simultaneously perform placement of at least 4 types of chips.

[0046] At the same time, this solution supports the waffle pack loading method. At least 2 sets of waffle packs can be placed on each wafer position, which can achieve at least 8 types of chip mounting.

[0047] When traditional SMT equipment mounts multiple chips, more than two devices are required to work in series, which occupies a large area and has extremely low efficiency. During the transmission process, dust pollution, chip offset and other problems that affect the yield are prone to occur. In this solution, for multi-chip production of chiplets, a single device is configured with at least 4 wafers, which can realize the mounting of more than 4 types of chips, which is more advanced than the multi-unit online mode of traditional SMT equipment.

[0048] As a further preferred embodiment, the first chip supply mechanism 81, the second chip supply mechanism 82, the third chip supply mechanism 88 and the fourth chip supply mechanism 89 all include a material box 83, a motor 84, a linear guide rail 85, a screw assembly 86 and a material box support plate 87. The material box 83 is arranged at the upper end of the material box support plate 87, and the linear guide rail 85 is arranged at the rear end of the material box support plate 87. The motor 84 drives the screw assembly 86 to rotate and push the material box support plate 87 through the linear guide rail 85 to make the material box 83 move linearly in the Z direction.

[0049] As a further preferred embodiment, the first wafer stage 31, the second wafer stage 32, the third wafer stage 38 and the fourth wafer stage 39 all include a wafer stage X-axis stage 33, a wafer stage Y-axis stage 34 and a wafer stage expansion stage 35, the wafer stage Y-axis stage 34 is arranged above the wafer stage X-axis stage 33, the wafer stage expansion stage 35 is arranged above the wafer stage Y-axis stage 34, and the wafer stage X-axis stage 33 and the wafer stage Y-axis stage 34 all include a bottom plate 361, a second motor, a second ball screw assembly 363 and a second linear guide rail 362. , the motor 2 drives the ball screw assembly 2 363 to rotate and push the bottom plate 361 to make linear motion through the linear guide 2 362. The wafer expansion platform 35 includes the wafer expansion platform bottom plate 351, the stepping motor, the pulley mechanism 353 and the Z-direction wafer expansion mechanism 352. The stepping motor drives the pulley mechanism 353 to drive the Z-direction wafer expansion mechanism 352 to make the wafer rotate in the Z direction and around the Z axis. The servo motor 2 on the wafer X-direction platform drives the ball screw assembly 2 and the linear guide 2 to drive the wafer Y-direction platform and the wafer expansion platform to move in the X direction. The servo motor 2 on the wafer Y-direction platform drives the ball screw assembly 2 and the linear guide 2 to drive the wafer expansion platform to move in the Y direction. The pulley mechanism on the wafer expansion platform drives the Z-direction wafer expansion mechanism to make the wafer rotate in the Z direction and around the Z axis.

[0050] As a further preferred embodiment, the visual inspection system 51 includes a lens assembly 511, a linear motor 512 and a visual Z-direction mounting plate 513, the first bonding mechanism 52, the second bonding mechanism 53, the third bonding mechanism 54 and the fourth bonding mechanism 55 all include a bonding head mounting plate 561 and a nozzle assembly 562, the bonding head mounting plate 561 and the lens assembly 511 are arranged on the visual Z-direction mounting plate 513, and the linear motor 512 drives the lens assembly 511 and the nozzle assembly 562 to move along the Z direction on the mounting plate 513, and the nozzle assembly 562 also includes a center axis, a downward pressure spring, bearings and bushings, an air pipe joint, a nozzle, etc.

[0051] As a further preferred embodiment, the first flip mechanism 61, the second flip mechanism 62, the third flip mechanism 63 and the fourth flip mechanism 64 all include a flip head 651, a mounting plate 652 and a motor 3 653. The servo motor 3 653 drives the flip head 651 to rotate around the Y axis to rotate the chip 180 degrees.

[0052] As a further preferred embodiment, the substrate workbench 4 includes a workbench bottom plate 431, a pulley assembly 432, a linear motor 433, a double guide rail assembly 434 and a workbench panel 435. The linear motor 433 drives the pulley assembly 432 to make the workbench panel 435 move along the X direction on the double guide rail assembly 434.

[0053] As a further preferred embodiment, the substrate loading mechanism 91 and the substrate unloading mechanism 92 both include a supporting base 931, a conveyor belt 932, a pulley assembly 933, a fixed plate 934, a movable plate 935, a sticky scale 936 and a linear motor 937. The pulley assembly 933 drives the conveyor belt 932 to rotate and drive the substrate at the upper end to move. The linear motor 937 drives the movable plate 935 to move relative to the fixed plate 934. The sticky scale 936 is arranged under the conveyor belt 932. The pulley assembly 2 in the substrate loading mechanism can drive the substrate to move onto the workbench, and the linear motor 3 can adjust the width of the substrate loading mechanism according to substrates of different widths; the pulley assembly 2 in the substrate unloading mechanism can drive the mounted substrate to leave the workbench, and the linear motor 3 can adjust the width of the substrate unloading mechanism according to substrates of different widths.

[0054] As a further preferred embodiment, the first dipping mechanism 71, the second dipping mechanism 72, the third dipping mechanism 73 and the fourth dipping mechanism 74 include a glue box 751, a screw mechanism 752, a pulley assembly three 753, a camera, a scraper plate 755 and a linear guide rail two 754. The pulley assembly three 753 drives the screw mechanism 752 and the linear guide rail two 754 to move the scraper plate 755 along the X direction. The dipping camera under the glue box 751 can position the chip and detect the offset printing condition after the scraper plate 755 leaves.

[0055] The preferred specific embodiments of the utility model are described in detail above. It should be understood that ordinary technicians in this field can make many modifications and changes based on the concept of the utility model without creative work. Therefore, all technical solutions that can be obtained by technicians in this technical field based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the existing technology should be within the scope of protection determined by the claims.

Claims

1. A semiconductor chip bonding device, characterized in that: include: A frame and a double gantry assembly arranged on the frame, the double gantry assembly includes an X-direction gantry mechanism and two groups of Y-direction gantry mechanisms, the Y-direction gantry mechanism is arranged at the upper end of the X-direction gantry mechanism, at least four groups of wafer tables are arranged in the middle of the frame along the Y direction, at least one group of substrate worktables is arranged in the middle of the frame, the substrate worktables are located between the wafer tables, at least two groups of bonding mechanisms are arranged on the inner side of each group of the Y-direction gantry mechanisms, a visual inspection system is arranged on one side of each group of the bonding mechanisms, a group of flipping mechanisms are arranged above each group of the wafer tables along the X direction, each group of the flipping mechanisms is provided with a group of dipping mechanisms along the outer side of the X direction, a group of chip supply mechanisms are arranged on the left side of each group of the wafer tables, and a substrate feeding and discharging mechanism is arranged on the outer side of the substrate worktable.

2. A semiconductor chip bonding device according to claim 1, characterized in that: The wafer table includes a first wafer table, a second wafer table, a third wafer table and a fourth wafer table, the bonding mechanism includes a first bonding mechanism, a second bonding mechanism, a third bonding mechanism and a fourth bonding mechanism, the flipping mechanism includes a first flipping mechanism, a second flipping mechanism, a third flipping mechanism and a fourth flipping mechanism, the dipping mechanism includes a first dipping mechanism, a second dipping mechanism, a third dipping mechanism and a fourth dipping mechanism, the chip supply mechanism includes a first chip supply mechanism, a second chip supply mechanism, a third chip supply mechanism and a fourth chip supply mechanism, and the substrate feeding and discharging mechanism includes a substrate loading mechanism and a substrate unloading mechanism.

3. A semiconductor chip bonding device according to claim 2, characterized in that: The first chip supply mechanism, the second chip supply mechanism, the third chip supply mechanism and the fourth chip supply mechanism all include a material box, a motor, a linear guide rail, a screw assembly and a material box support plate. The material box is arranged at the upper end of the material box support plate, and the linear guide rail is arranged at the rear end of the material box support plate. The motor drives the screw assembly to rotate and push the material box support plate through the linear guide rail to make the material box move linearly in the Z direction.

4. A semiconductor chip bonding device according to claim 2, characterized in that: The first wafer table, the second wafer table, the third wafer table and the fourth wafer table all include a wafer table X-axis stage, a wafer table Y-axis stage and a wafer table expansion stage. The wafer table Y-axis stage is arranged above the wafer table X-axis stage, and the wafer table expansion stage is arranged above the wafer table Y-axis stage. The wafer table X-axis stage and the wafer table Y-axis stage all include a base plate, a second motor, a second ball screw assembly and a second linear guide. The second motor drives the second ball screw assembly to rotate and push the base plate to perform linear motion through the second linear guide. The wafer table expansion stage includes an expansion stage base plate, a stepper motor, a pulley mechanism and a Z-axis expansion mechanism. The stepper motor drives the pulley mechanism to drive the Z-axis expansion mechanism to make the wafer rotate in the Z direction and around the Z axis.

5. The semiconductor chip bonding device according to claim 2, characterized in that: The visual inspection system includes a lens assembly, a linear motor 1 and a visual Z-direction mounting plate. The first bonding mechanism, the second bonding mechanism, the third bonding mechanism and the fourth bonding mechanism all include a bonding head mounting plate and a nozzle assembly. The bonding head mounting plate and the lens assembly are arranged on the visual Z-direction mounting plate. The linear motor 1 drives the lens assembly and the nozzle assembly to move along the Z direction on the mounting plate.

6. A semiconductor chip bonding device according to claim 2, characterized in that: The first flipping mechanism, the second flipping mechanism, the third flipping mechanism and the fourth flipping mechanism all include a flipping head, a mounting plate and a motor three.

7. The semiconductor chip bonding device according to claim 2, characterized in that: The substrate workbench comprises a workbench bottom plate, a pulley assembly 1, a linear motor 2, a double guide rail assembly and a workbench panel. The pulley assembly 1 is driven by the linear motor 2 to make the workbench panel move along the X direction on the double guide rail assembly.

8. The semiconductor chip bonding device according to claim 2, characterized in that: The substrate loading mechanism and the substrate unloading mechanism both include a supporting base, a conveyor belt, a second pulley assembly, a fixed plate, a movable plate, a viscous scale and a third linear motor. The second pulley assembly drives the conveyor belt to rotate and drives the upper end of the substrate to move. The third linear motor drives the movable plate to move relative to the fixed plate. The viscous scale is arranged under the conveyor belt.

9. The semiconductor chip bonding device according to claim 2, characterized in that: The first glue dipping mechanism, the second glue dipping mechanism, the third glue dipping mechanism and the fourth glue dipping mechanism include a glue box, a screw mechanism, a pulley assembly three, a camera, a scraper plate and a linear guide rail two. The pulley assembly three drives the screw mechanism and the linear guide rail two to make the scraper plate move along the X direction.

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