Shell structure of semiconductor cavity

Abstract

The utility model discloses a shell structure of a semiconductor cavity, which comprises a cavity and a cavity cover, the top of the cavity is provided with a sealing groove, the bottom of the cavity cover is provided with a sealing plate, the surface of the sealing plate is in sliding connection with the inner surface of the sealing groove, the bottom of the sealing plate is provided with a sealing gasket, and the sealing gasket is provided with a sealing groove. A sealing assembly is arranged in the cavity, a material taking mechanism is arranged at the bottom of an inner cavity of the cavity, the material taking mechanism comprises a material taking assembly, the material taking assembly comprises a limiting plate installed on the inner wall of the cavity, a placing plate is slidably connected to the interior of the limiting plate, and a connecting plate is fixedly connected to the bottom of the placing plate; the utility model relates to the technical field of semiconductors. According to the shell structure of the semiconductor cavity, through the arrangement of the material taking mechanism, flexible adjustment of the height of the placement plate is achieved, so that a worker can conveniently place and collect materials placed on the top of the placement plate, and the situation that the materials collide with the inner wall of the cavity in the placing and collecting process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a shell structure of a semiconductor cavity. Background Art

[0002] The reference patent name is: A sealed chamber for semiconductor equipment (patent publication number: CN216250655U, patent publication date: 2022.04.08), which is provided with an upper chamber, a lower chamber, an air inlet interface, an automatic sealing door, a maintenance operation door and an exhaust pipe; the lower chamber is installed below the upper chamber, and a mechanical sealing device is provided at the connection position of the upper chamber and the lower chamber; the top surface of the upper chamber is evenly distributed with air inlet interfaces, and the automatic sealing door and the maintenance operation door are arranged on the side of the upper chamber; a pressure difference sensor is provided on the side of the upper chamber; the exhaust pipe is installed on the bottom surface of the lower chamber, and an exhaust valve is provided at the end of the exhaust pipe; an air intake diffuser plate is provided on the upper part of the upper chamber, and an exhaust collection plate is provided on the lower part of the lower chamber; good sealing can be maintained, the environment inside the chamber is separated from the external environment, the cavity can maintain a high degree of cleanliness, and after filling with protective gas, problems such as backflow and turbulence can be avoided, reducing the entry of external gas into the sealed chamber.

[0003] Based on the above-mentioned documents: the sealed cavity is involved in various types of semiconductor equipment, and its main function is to separate the working area from the external environment and avoid adverse chemical reactions between the wafer surface and the external gas; secondly, fill the sealed cavity with suitable reaction gas to achieve better process effects. However, the structure of the existing semiconductor sealed cavity is relatively simple and due to its deep inner cavity, the process of placing and taking materials is relatively inconvenient. For this reason, the utility model provides a shell structure of a semiconductor cavity. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a shell structure of a semiconductor cavity, which solves the problem that the structure of the existing semiconductor sealed cavity is relatively simple and its inner cavity is relatively deep, making the process of placing and taking materials relatively inconvenient.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a shell structure of a semiconductor cavity, including a cavity and a cavity cover, the top of the cavity is provided with a sealing groove, the bottom of the cavity cover is provided with a sealing plate, the surface of the sealing plate is slidably connected with the inner surface of the sealing groove, the bottom of the sealing plate is provided with a sealing gasket, the interior of the cavity is provided with a sealing assembly, the bottom of the inner cavity of the cavity is provided with a material taking mechanism, and the material taking mechanism includes:

[0006] The material taking component comprises a limit plate installed on the inner wall of the cavity, the interior of the limit plate is slidably connected with a placement plate, the bottom of the placement plate is fixedly connected with a connecting plate, and the interior of the connecting plate is provided with a sliding groove;

[0007] The driving assembly is arranged inside the cavity.

[0008] Preferably, the driving assembly includes a driving motor installed on the front side of the cavity, one end of the output shaft of the driving motor is fixedly connected to a driving rod through a coupling, the surface of the driving rod is rotatably connected to the inner wall of the cavity, the surface of the driving rod is fixedly connected to an arc-shaped tooth plate, the surface of the driving rod is fixedly connected to a rotating rod, one end of the rotating rod is fixedly connected to a sliding block, and the surface of the sliding block is slidably connected to the inner surface of the sliding groove.

[0009] Preferably, the arc-shaped toothed plate, the driving rod, the rotating rod and the sliding block are each provided with two pieces, and the surfaces of the two arc-shaped toothed plates are meshed with each other.

[0010] Preferably, the sealing assembly includes an air pump installed on the right side of the cavity, one side of the air pump is fixedly connected to a rubber sealing tube via a connecting pipe, and the rubber sealing tube is installed on the surface of the sealing groove.

[0011] Preferably, an air inlet pipe is installed on the rear side of the top of the cavity cover, and an air outlet pipe is installed on the front side of the top of the cavity cover.

[0012] Preferably, an observation window is installed at the center of the top of the cavity cover, a fixing piece is threadedly connected to the top of the cavity cover, and a surface of the fixing piece is threadedly connected to the top of the cavity.

[0013] Beneficial Effects

[0014] The utility model provides a shell structure of a semiconductor cavity. Compared with the prior art, it has the following beneficial effects:

[0015] (1) The shell structure of the semiconductor cavity is provided with a material taking mechanism to realize flexible adjustment of the height of the placement plate, thereby facilitating the staff to place and take away the materials placed on the top of the placement plate, thereby avoiding the collision of the materials with the inner wall of the cavity during the placement and taking away process.

[0016] (2) The shell structure of the semiconductor cavity is provided with a sealing assembly, so that after the cavity cover is installed, the rubber sealing tube is inflated so that its surface is fully fitted with the inner and outer sides of the sealing plate, thereby further improving the sealing between the cavity and the cavity cover and improving the quality of subsequent work. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the external structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the cavity of the utility model;

[0020] Figure 4 It is a three-dimensional schematic diagram of the cavity cover of the utility model;

[0021] Figure 5 It is a three-dimensional schematic diagram of the material taking component of the utility model.

[0022] In the figure: 1-cavity, 2-cavity cover, 3-sealing groove, 4-sealing plate, 5-sealing pad, 6-feeding mechanism, 61-feeding assembly, 611-limiting plate, 612-placing plate, 613-connecting plate, 614-sliding groove, 62-driving assembly, 621-driving motor, 622-driving rod, 623-arc tooth plate, 624-rotating rod, 7-sealing assembly, 71-inflating pump, 72-rubber sealing tank, 8-inlet pipe, 9-outlet pipe, 10-observation window, 11-fixing part. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-5 , the utility model provides two technical solutions:

[0025] Embodiment 1

[0026] A shell structure of a semiconductor cavity comprises a cavity 1 and a cavity cover 2, a handle is installed on the top of the cavity 1, a sealing groove 3 is opened on the top of the cavity 1, a sealing plate 4 is installed on the bottom of the cavity cover 2, the surface of the sealing plate 4 is slidably connected with the inner surface of the sealing groove 3, a sealing gasket 5 is installed on the bottom of the sealing plate 4, a sealing assembly 7 is provided inside the cavity 1, and a material taking mechanism 6 is provided at the bottom of the inner cavity of the cavity 1, and the material taking mechanism 6 comprises:

[0027] The material taking component 61 includes a limiting plate 611 installed on the inner wall of the chamber 1, a placing plate 612 is slidably connected inside the limiting plate 611, a placing groove is provided on the top of the placing plate 612 for placing semiconductor materials, a connecting plate 613 is fixedly connected to the bottom of the placing plate 612, and a sliding groove 614 is provided inside the connecting plate 613;

[0028] The driving assembly 62 is arranged inside the cavity 1. The driving assembly 62 includes a driving motor 621 installed on the front side of the cavity 1. The driving motor 621 is a three-phase asynchronous motor and is connected to the external circuit through wires. One end of the output shaft of the driving motor 621 is fixedly connected to a driving rod 622 through a coupling. The surface of the driving rod 622 is rotatably connected to the inner wall of the cavity 1. The surface of the driving rod 622 is fixedly connected to an arc-shaped tooth plate 623. The surface of the driving rod 622 is fixedly connected to a rotating rod 624. One end of the rotating rod 624 is fixedly connected to a sliding block. The surface of the sliding block is slidably connected to the inner surface of the sliding groove 614. Two arc-shaped tooth plates 623, driving rods 622, rotating rods 624 and sliding blocks are each provided. The surfaces of the two arc-shaped tooth plates 623 are meshed with each other. By providing a material taking mechanism 6, the height of the placement plate 612 can be flexibly adjusted, so that it is convenient for the staff to place and collect the materials placed on the top of the placement plate 612, and avoid the collision of materials with the inner wall of the cavity 1 during the placement and collection process.

[0029] Embodiment 2

[0030] The main difference from the first embodiment is:

[0031] A shell structure of a semiconductor cavity, wherein a sealing component 7 comprises an air pump 71 installed on the right side of a cavity 1, wherein the air pump 71 is of prior art and is connected to an external circuit through an electric wire, wherein one side of the air pump 71 is fixedly connected to a rubber sealing tube 72 through a connecting tube, wherein two groups of rubber sealing tanks 72 are provided, wherein the rubber sealing tube 72 is installed on the surface of a sealing groove 3, wherein an air inlet pipe 8 is installed on the rear side of the top of a cavity cover 2, wherein the air inlet pipe 8 is connected to an external air inlet device, wherein an air outlet pipe 9 is connected to an external vacuum pump, wherein an air outlet pipe 9 is installed on the front side of the top of the cavity cover 2, wherein an observation window 10 is installed at the center of the top of the cavity cover 2, wherein a fixing member 11 is threadedly connected to the top of the cavity cover 2, wherein the surface of the fixing member 11 is threadedly connected to the top of the cavity 1, wherein the sealing component 7 is provided, wherein after the cavity cover 2 is installed, the rubber sealing tube 72 is inflated so that the surface thereof is fully fitted to the inner and outer sides of a sealing plate 4, thereby further improving the sealing performance between the cavity 1 and the cavity cover 2 and improving the quality of subsequent work, and wherein the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0032] During operation, the material to be processed is first placed in the placement groove on the top of the placement plate 612. The staff then holds the handle on the top of the cavity cover 2 and slides the sealing plate 4 to the inside of the sealing groove 3. At this time, the rubber sealing tube 72 is in an uninflated state. Subsequently, the cavity cover 2 is installed by rotating the fixing piece 11, and then the two groups of rubber sealing tubes 72 are inflated by starting the air pump 71. After the rubber sealing tube 72 is inflated, its surface is fully in contact with the inner and outer surfaces of the sealing plate 4 to achieve full sealing. Then, the air outlet pipe 9 is connected to the external vacuum pump to keep the inside of the cavity 1 in a vacuum state. Subsequently, the air inlet pipe 8 is connected to the air inlet device. The reaction gas is introduced into the cavity 1 so that the reaction gas reacts with the surface of the material to be processed. After the reaction work is completed, the cavity cover 2 is opened, and then the driving motor 621 is started to drive the driving rod 622, the rotating rod 624, the arc-shaped tooth plate 623 and the sliding block on the left to rotate counterclockwise synchronously. At the same time, the rotation of the arc-shaped tooth plate 623 on the left causes the arc-shaped tooth plate 623, the driving rod 622, the rotating rod 624 and the sliding block on the right to rotate clockwise synchronously, so that the sliding block slides on the inner surface of the sliding groove 614, thereby causing the connecting plate 613 and the placement plate 612 to slide upward synchronously, thereby facilitating the staff to perform material taking operations.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A shell structure of a semiconductor cavity, comprising a cavity (1) and a cavity cover (2), characterized in that: The top of the cavity (1) is provided with a sealing groove (3), the bottom of the cavity cover (2) is provided with a sealing plate (4), the surface of the sealing plate (4) is slidably connected to the inner surface of the sealing groove (3), the bottom of the sealing plate (4) is provided with a sealing gasket (5), the interior of the cavity (1) is provided with a sealing assembly (7), and the bottom of the inner cavity of the cavity (1) is provided with a material taking mechanism (6), and the material taking mechanism (6) comprises: The material taking component (61) comprises a limiting plate (611) installed on the inner wall of the cavity (1), wherein a placing plate (612) is slidably connected inside the limiting plate (611), a connecting plate (613) is fixedly connected to the bottom of the placing plate (612), and a sliding groove (614) is provided inside the connecting plate (613); A driving assembly (62) is arranged inside the cavity (1).

2. The shell structure of a semiconductor cavity according to claim 1, characterized in that: The driving assembly (62) includes a driving motor (621) installed on the front side of the cavity (1), one end of the output shaft of the driving motor (621) is fixedly connected to a driving rod (622) via a coupling, the surface of the driving rod (622) is rotatably connected to the inner wall of the cavity (1), the surface of the driving rod (622) is fixedly connected to an arc-shaped tooth plate (623), the surface of the driving rod (622) is fixedly connected to a rotating rod (624), one end of the rotating rod (624) is fixedly connected to a sliding block, and the surface of the sliding block is slidably connected to the inner surface of the sliding groove (614).

3. The shell structure of a semiconductor cavity according to claim 2, characterized in that: The arc-shaped toothed plate (623), the driving rod (622), the rotating rod (624) and the sliding block are each provided with two pieces, and the surfaces of the two arc-shaped toothed plates (623) are meshed with each other.

4. The shell structure of a semiconductor cavity according to claim 1, characterized in that: The sealing assembly (7) comprises an air pump (71) installed on the right side of the cavity (1); one side of the air pump (71) is fixedly connected to a rubber sealing tube (72) via a connecting tube; the rubber sealing tube (72) is installed on the surface of the sealing groove (3).

5. The shell structure of a semiconductor cavity according to claim 1, characterized in that: An air inlet pipe (8) is installed on the rear side of the top of the cavity cover (2), and an air outlet pipe (9) is installed on the front side of the top of the cavity cover (2).

6. The shell structure of a semiconductor cavity according to claim 1, characterized in that: An observation window (10) is installed at the center of the top of the cavity cover (2), and a fixing piece (11) is threadedly connected to the top of the cavity cover (2), and a surface of the fixing piece (11) is threadedly connected to the top of the cavity body (1).

Images