Ejector pin device and chip separation equipment

Abstract

The utility model discloses an ejector pin device and chip separation equipment, and relates to the technical field of semiconductor chip packaging, the ejector pin device comprises an ejector pin assembly, an adjusting assembly and a displacement sensor, the ejector pin assembly comprises an ejector pin cap arranged below a placing position and an ejector pin piece movably connected with the ejector pin cap, the ejector pin cap is used for jacking and sucking a blue film, and the adjusting assembly is used for adjusting the displacement sensor. The adjusting assembly comprises a voice coil motor which is in driving connection with the ejector pin piece, the voice coil motor drives the ejector pin piece to move relative to the ejector pin cap, the ejector pin cap sucks the blue film, the ejector pin jacks up to jack the chip, the ejector pin cap sucks the blue film to move downwards, and the chip is separated from the blue film; and the displacement sensor is connected with the voice coil motor, so that the voice coil motor controls the ejector pin piece to jack the chip to a pickup position. According to the technical scheme provided by the utility model, the possibility that the ejector pin is extruded and damaged when the chip is jacked to the pickup position is reduced, and the success rate of pickup of the chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to an ejector pin device and chip separation equipment. Background Art

[0002] With the rapid development of microelectronics technology, the integration of semiconductor chips continues to increase, the chip size is shrinking, and the requirements for chip manufacturing and packaging processes are becoming more and more stringent. Chip stripping, as one of the key steps in the chip manufacturing process, directly affects the chip yield and packaging quality. The traditional chip picking method is to lift the chip off the blue film with a pin, and then press the pick-up part down to contact the chip to pick up the chip. The force of the pick-up head and the pin when contacting the chip is difficult to control, which can easily cause chip damage and increase production costs. Utility Model Content

[0003] The main purpose of the utility model is to provide an ejector pin device, which is intended to reduce the possibility of the ejector pin causing the chip to be squeezed and damaged when the chip is lifted to a pickup part, thereby improving the success rate of picking up the chip.

[0004] To achieve the above-mentioned purpose, the ejector device proposed in the utility model is applied to a chip separation device, wherein the chip is loaded on a blue film, and the blue film is loaded on a wafer ring. The chip separation device comprises a pick-up member having a pick-up position and a carrying platform, wherein the pick-up member picks up the chip at the pick-up position, and the carrying platform has a placement position for placing the wafer ring, and is characterized in that the ejector device comprises:

[0005] An ejector pin assembly, comprising an ejector pin cap disposed below the placement position, and an ejector pin member movably connected to the ejector pin cap, wherein the ejector pin cap is used to lift and suck the blue film so as to separate the blue film from the wafer ring;

[0006] An adjusting component, comprising a voice coil motor driving the ejector member, wherein the voice coil motor drives the ejector member to move relative to the ejector cap to move to the pickup position to abut against the chip, and the ejector cap absorbs the blue film to separate the chip from the blue film; and

[0007] The displacement sensor is used to detect the displacement of the ejector member driven by the voice coil motor. The displacement sensor is electrically connected to the voice coil motor so that the voice coil motor controls the ejector member to lift the chip to the pickup position.

[0008] In one embodiment, the displacement sensor is configured as a grating ruler, which includes an encoder provided on the ejector part and a reading head slidably connected to the encoder, the encoder follows the ejector part to move toward the picking position, the encoder and the reading head move relative to each other, and the reading head is used to detect the displacement of the ejector part.

[0009] In one embodiment, the ejector pin comprises a needle head for lifting and contacting the chip, and a lifting rod drivingly connected to the voice coil motor, the needle head is arranged on the lifting rod, and the encoder is arranged at one end of the lifting rod away from the needle head.

[0010] In one embodiment, the adjustment component also includes a first sensing member arranged on the encoder, and a first sensor for detecting the first sensing member. The first sensing member can follow the movement of the encoder relative to the first sensor and pass through the detection area of ​​the first sensor to determine the zero return position of the ejector member.

[0011] In one embodiment, the ejector cap has a housing cavity for accommodating the ejector member, and a through hole is formed at one end of the ejector cap facing the picking position. The lifting rod and the needle are both arranged in the housing cavity, and the needle can pass through the through hole to lift the chip.

[0012] In one embodiment, a plurality of the needles are provided, a plurality of the through holes are provided, and one through hole corresponds to one needle, so that the needle can pass through the through hole to lift up the chip.

[0013] In one embodiment, the adjustment assembly further includes a rotating bearing rotatably connected to the voice coil motor, and a first motor transmission-connected to the rotating bearing, wherein the first motor drives the rotating bearing to rotate around the axis of the ejector assembly, and the rotating bearing drives the voice coil motor to rotate around the axis, so that the plurality of needles are aligned below the picking position.

[0014] In one embodiment, the adjustment component also includes a second sensing element arranged on the rotating bearing and a second sensor for detecting the second sensing element. The second sensing element can rotate with the rotating bearing and determine the zero position of the rotating bearing through the detection area of ​​the rotating sensor.

[0015] In one embodiment, the adjustment component also includes a first slide seat provided below the rotating bearing, a second motor drivingly connected to the first slide seat, a second slide seat, and a third motor drivingly connected to the second slide seat, the second sensor is provided on the first slide seat, the rotating bearing is provided on the first slide seat, the second motor drives the first slide seat to drive the rotating bearing to move in a first direction, the first slide seat is slidably provided on the second slide seat, the third motor drives the second slide seat to drive the first slide seat to move in a second direction, the second direction is different from the first direction, the adjustment component also includes a stator, a mover slidably provided on the stator, and a fourth motor drivingly connected to the mover, the third slide seat is provided on the mover, and the fourth motor drives the mover to drive the third slide seat to move on the stator.

[0016] The utility model also provides a chip separation device, comprising:

[0017] A picking piece, having the picking position, and the picking piece is used to pick up the chip at the picking position;

[0018] A carrying platform having a placement position for placing the wafer ring;

[0019] And the aforementioned ejector device.

[0020] The technical solution of the utility model adopts an ejector device, arranges a voice coil motor to drive and connect an ejector piece, so as to drive the ejector piece to lift the chip to the picking position, arranges a displacement sensor to detect the displacement of the ejector piece, and when the ejector cap lifts the blue film to the picking position, the voice coil motor drives the ejector piece to move relative to the ejector cap to press against the lower surface of the chip, so that the chip is clamped between the ejector piece and the picking piece. Since the output of the driving force of the voice coil motor on the ejector piece is proportional to the input current, the voice coil motor can achieve very precise displacement control of the ejector piece by accurately controlling the magnitude of the current, so that the ejector piece can be accurately moved to the picking position to lift the chip, reducing the possibility that the ejector piece moves beyond the picking position and causes the chip to be squeezed and damaged. During this period, the displacement sensor continuously detects the displacement of the ejector piece under the drive of the voice coil motor. When the displacement sensor detects that the displacement of the ejector part toward the chip is less than a preset displacement value, the displacement sensor feeds back a signal to the voice coil motor to control the voice coil motor to drive the ejector part to continue moving toward the chip to press against the chip, so that the chip is clamped between the pickup part and the ejector part, thereby improving the success rate of chip picking; when the displacement sensor detects that the displacement of the ejector part toward the chip reaches a preset displacement value, the displacement sensor feeds back a signal to the voice coil motor to control the voice coil motor to stop driving the ejector part to continue lifting the chip, thereby reducing the possibility that the voice coil motor continues to drive the ejector part to lift the chip, resulting in the chip being damaged by greater pressure between the ejector part and the pickup part, thereby improving the success rate of chip picking, reducing the possibility of the chip being squeezed and damaged, and saving production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 A structural schematic diagram of an embodiment of the ejector device provided by the utility model;

[0023] Figure 2 for Figure 1 A schematic structural diagram of the ejector device from another perspective;

[0024] Figure 3 for Figure 1 A schematic diagram of the top view of the structure of the middle ejector device;

[0025] Figure 4 for Figure 1 A schematic diagram of the structure of the ejector pin;

[0026] Figure 5 for Figure 1 A schematic diagram of the structure of the ejector cap;

[0027] Figure 6 This is a structural schematic diagram of an embodiment of a chip separation device provided by the utility model.

[0028] Description of Figure Numbers:

[0029] 100, ejector assembly; 110, ejector cap; 111, accommodating cavity; 112, through hole; 120, ejector member; 121, lifting rod; 122, needle head; 210, voice coil motor; 221, first induction member; 222, first sensor; 231, second induction member; 232, second sensor; 241, rotating bearing; 242, first motor; 251, first slide; 252, second motor; 261, second slide; 262, third motor; 271, stator; 272, mover; 273, fourth motor; 300, grating ruler; 310, encoder; 320, reading head; 400, picking member; 410, picking position; 500, carrying platform; 510, placement position; 600, wafer ring; 700, blue film; 800, chip.

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0034] With the rapid development of microelectronics technology, the integration of semiconductor chips continues to increase, the chip size is shrinking, and the requirements for chip manufacturing and packaging processes are becoming more and more stringent. Chip stripping, as one of the key steps in the chip manufacturing process, directly affects the chip yield and packaging quality. The traditional chip picking method is to use a pin to lift the chip off the blue film, and then press down the pick-up piece to contact the chip to pick up the chip. The force of the pick-up head and the pin when contacting the chip is difficult to control, which can easily cause chip damage and reduce the processing quality of the chip. To this end, the utility model proposes a pin device to reduce the possibility of the chip being squeezed and damaged when the pin lifts the chip to the pick-up piece, thereby improving the success rate of chip picking.

[0035] See also Figures 1 to 3In one embodiment of the utility model, the ejector device is applied to a chip separation device, the chip 800 is loaded on a blue film 700, the blue film 700 is loaded on a wafer ring 600, the chip separation device includes a pick-up member 400 having a pick-up position 410, and a carrying platform 500, the pick-up member 400 picks up the chip 800 at the pick-up position 410, the carrying platform 500 has a placement position 510 for placing the wafer ring 600, the ejector device includes an ejector assembly 100, an adjustment assembly, and a displacement sensor, the ejector assembly 100 includes an ejector cap 110 disposed below the placement position 510, and an ejector member 120 movably connected to the ejector cap 110, the ejector cap 110 is used to lift the blue film 700 so that the blue film 700 is separated from the wafer ring 600. The adjustment component includes a voice coil motor 210 that drives the ejector member 120. The voice coil motor 210 drives the ejector member 120 to move relative to the ejector cap 110 to move to the pickup position 410 and abut against the chip 800. The ejector cap 110 absorbs the blue film 700 to separate the chip 800 from the blue film 700. The displacement sensor is used to detect the displacement of the ejector member 120 driven by the voice coil motor 210. The displacement sensor is electrically connected to the voice coil motor 210 so that the voice coil motor 210 controls the ejector member 120 to lift the chip 800 to the pickup position 410.

[0036] To facilitate understanding of the present solution, the working principle of the chip 800 separation device is first introduced. The ejector cap 110 and the ejector member 120 move toward the blue film 700 driven by the adjusting component. The ejector cap 110 absorbs the blue film 700 and lifts the blue film 700 to separate from the wafer ring 600. The ejector member 120 presses against the lower surface of the chip 800. The ejector cap 110 continues to lift the blue film 700 until the ejector member 120 and the pick-up member 400 clamp the chip 800. Then the ejector cap 110 absorbs the blue film 700 and moves toward the bottom of the pick-up position 410, so that the chip 800 is separated from the blue film 700. The pick-up member 400 picks up the chip 800 for the next processing. During this process, when the ejector pin 120 lifts the chip 800 to be picked up by the picking part 400, the chip 800 may be squeezed and damaged due to the large displacement of the ejector pin 120, which reduces the success rate of picking up the chip 800 and increases the production cost. It is also possible that the ejector pin 120 has a small displacement of the chip 800, which makes it difficult for the picking part 400 to pick up the chip 800, reducing the success rate of picking up the chip 800.

[0037] Therefore, a voice coil motor 210 is provided to drive and connect the ejector member 120 to drive the ejector member 120 to lift the chip 800 to the pickup position 410, and a displacement sensor is provided to detect the displacement of the ejector member 120. When the ejector cap 110 lifts the blue film 700 to the pickup position 410, the voice coil motor 210 drives the ejector member 120 to move relative to the ejector cap 110 to press against the lower surface of the chip 800, so that the chip 800 is clamped between the ejector member 120 and the pickup member 400. The output of the driving force of the voice coil motor 210 on the ejector pin 120 is proportional to the input current. By accurately controlling the current, the voice coil motor 210 can achieve very precise displacement control of the ejector pin 120, so that the ejector pin 120 can be accurately moved to the pick-up position to lift the chip, reducing the possibility that the ejector pin 120 moves beyond the pick-up position and causes the chip to be squeezed and damaged. During this period, the displacement sensor continuously detects the displacement of the ejector pin 120 driven by the voice coil motor 210. When the displacement sensor When it is detected that the displacement amount of the ejector member 120 moving toward the chip 800 is less than the preset displacement value, the displacement sensor feeds back a signal to the voice coil motor 210 to control the voice coil motor 210 to drive the ejector member 120 to continue moving toward the chip 800 to resist the chip 800, so that the chip 800 is clamped between the pickup member 400 and the ejector member 120, thereby improving the success rate of picking up the chip 800; when the displacement sensor detects that the displacement amount of the ejector member 120 moving toward the chip 800 reaches the preset displacement value, the displacement sensor feeds back a signal to the voice coil motor 210 to control the voice coil motor 210 to stop driving the ejector member 120 to continue lifting the chip 800, thereby reducing the possibility that the voice coil motor 210 continues to drive the ejector member 120 to lift the chip 800, resulting in the chip 800 being damaged by a large pressure between the ejector member 120 and the pickup member 400, thereby improving the success rate of picking up the chip 800, reducing the possibility of the chip 800 being squeezed and damaged, and saving production costs.

[0038] Optionally, in one embodiment, please refer to Figures 2 to 4The displacement sensor is configured as a grating ruler 300, which includes an encoder 310 arranged on the ejector part 120, and a reading head 320 slidably connected to the encoder 310. The encoder 310 moves with the ejector part 120 toward the picking position 410. The encoder 310 and the reading head 320 move relative to each other, and the reading head 320 is used to detect the displacement of the ejector part 120. In this way, the displacement sensor is configured as a grating ruler 300, an encoder 310 is set on the ejector part 120, and the reading head 320 is slidably connected to the encoder 310. When the ejector part 120 moves under the drive of the voice coil motor 210, the encoder 310 moves with the ejector part 120, and the reading head 320 detects the relative displacement of the reading head 320 on the encoder 310 to calculate the displacement of the end of the ejector part 120 away from the voice coil motor 210 relative to the voice coil motor 210. According to the detected displacement, the grating ruler 300 feeds back a signal to the voice coil motor 210, and controls the displacement of the ejector part 120 driven by the voice coil motor 210.

[0039] Optionally, in another embodiment, there may be multiple types of displacement sensors, and a laser displacement sensor may be used, as long as it can detect the displacement of the ejector member 120 driven by the voice coil motor 210 and control the displacement of the ejector member 120 driven by the voice coil motor 210 .

[0040] Optionally, in one embodiment, please refer to Figures 3 to 5 The ejector 120 includes a needle 122 for lifting and contacting the chip 800, and a lifting rod 121 drivingly connected to the voice coil motor 210. The needle 122 is arranged on the lifting rod 121, and the encoder 310 is arranged at one end of the lifting rod 121 away from the needle 122. In this way, the encoder 310 is arranged on the lifting rod 121, and the lifting rod 121 is drivingly connected to the voice coil motor 210. The voice coil motor 210 drives the ejector rod to move toward the direction of the chip 800, so that the encoder 310 moves with the lifting rod 121, which is convenient for the reading head 320 to detect the displacement of the encoder 310 relative to the reading head 320, and improves the detection accuracy of the grating ruler 300 on the displacement of the needle 122 relative to the voice coil motor 210, so that the grating ruler 300 controls the voice coil motor 210 to drive the needle 122 to move accurately to the lower surface of the chip 800.

[0041] Optionally, in another embodiment, the encoder 310 can be arranged in a variety of ways. The encoder 310 can also be fixed on the housing of the voice coil motor 210, and the reading head 320 can be arranged on the lifting rod 121. The reading head 320 moves up and down with the lifting rod 121, and can also detect the displacement of the needle 122 relative to the voice coil motor 210. There can be other situations for the setting positions of the encoder 310 and the reading head 320, as long as the above functions can be achieved.

[0042] Optionally, in one embodiment, the adjustment component further includes a first sensing member 221 disposed on the encoder 310, and a first sensor 222 for detecting the first sensing member 221. The first sensing member 221 can follow the encoder 310 to move relative to the first sensor 222, and pass through the detection area of ​​the first sensor 222 to determine the zero return position of the ejector member 120. When the ejector device is started, the position of the ejector member 120 may not be at the initial zero position, so that the ejector member 120 has a certain height value when it is driven to lift the chip 800, causing the voice coil motor 210 to drive the ejector member 120 to exceed the preset displacement value, so that the chip 800 is squeezed and damaged between the pickup member 400 and the ejector member 120, thereby reducing the success rate of picking up the chip 800. Therefore, a first sensor 222 and a first inductive element 221 are provided. When the voice coil motor 210 drives the ejector member 120, the lift rod 121 moves in the up and down directions, driving the first inductive element 221 to pass through the detection area of ​​the first sensor 222 to determine the zero position of the ejector member 120, so that the needle head 122 can return to the initial position, thereby reducing the possibility that the voice coil motor 210 drives the ejector member 120 to exceed a preset displacement value, thereby squeezing and damaging the chip 800.

[0043] Optionally, in another embodiment, the structures of the first sensing element 221 and the first sensor 222 can be omitted. Through the zero point scale of the encoder 310, the voice coil motor 210 drives the ejector element 120 to descend, so that the reading head 320 slides to the zero point scale of the encoder 310 to determine the zero return position of the ejector element 120.

[0044] Optionally, in one embodiment, the ejector cap 110 has a receiving cavity 111 for receiving the ejector member 120, and a through hole 112 is provided at one end of the ejector cap 110 facing the pick-up position 410, and the lifting rod 121 and the needle 122 are both arranged in the receiving cavity 111, and the needle 122 can pass through the through hole 112 to lift the chip 800. In this way, the lifting rod 121 and the needle 122 are both arranged in the receiving cavity 111, and the lifting rod 121 and the needle 122 can move relative to the ejector cap 110 in the receiving cavity 111. Driven by the voice coil motor 210, the needle 122 passes through the through hole 112 and presses against the lower surface of the chip 800, thereby realizing the relative movement of the needle 122 and the ejector cap 110, and completing the separation between the chip 800 and the blue film 700.

[0045] Optionally, in one embodiment, a plurality of needles 122 are provided, a plurality of through holes 112 are provided, and one through hole 112 corresponds to one needle 122, so that the needle 122 can pass through the through hole 112 to lift the chip 800. In this way, a plurality of needles 122 are provided, so that the ejector 120 can lift a plurality of chips 800 at the same time, complete the separation of the plurality of chips 800 on the blue film 700, and improve the efficiency of picking up the chips 800.

[0046] Optionally, in another embodiment, the number of needles 122 may be set in a variety of situations, and only one needle 122 may be provided, as long as the function of lifting the chip 800 can be achieved.

[0047] Optionally, in one embodiment, the adjustment assembly further includes a rotating bearing 241 rotatably connected to the voice coil motor 210, and a first motor 242 transmission-connected to the rotating bearing 241, the first motor 242 drives the rotating bearing 241 to rotate around the axis of the ejector assembly 100, and the rotating bearing 241 drives the voice coil motor 210 to rotate around the axis, so that the multiple needles 122 are aligned below the picking position 410. In this way, a rotating bearing 241 is arranged below the voice coil motor 210, and the rotating bearing 241 is driven by the first motor 242 to drive the ejector cap 110 and the ejector member 120 to rotate, so that the needle head 122 is aligned with the chip 800 below the picking member 400, thereby improving the accuracy of the needle head 122 abutting against the chip 800. If the needle head 122 is not aligned with the chip 800 at the picking position 410, the needle head 122 will apply an eccentric force to the chip 800, causing the chip 800 to tilt between the picking member 400 and the needle head 122, or even detach from the picking member 400, thereby reducing the success rate of picking up the chip 800, or the needle head 122 cannot abut against the chip 800, so that the chip 800 and the blue film 700 cannot be separated, thereby reducing the efficiency and success rate of picking up the chip 800.

[0048] Optionally, in another embodiment, the first motor 242 and the rotating bearing 241 may be omitted to reduce the development cost and the weight of the ejector device.

[0049] Optionally, in one embodiment, the adjustment component further includes a second sensing member 231 disposed on the rotating bearing 241, and a second sensor 232 for detecting the second sensing member 231. The second sensing member 231 can rotate along with the rotating bearing 241 and determine the zero position of the rotating bearing 241 through the detection area of ​​the rotating sensor. When the ejector device is started, the position of the rotating bearing 241 on the horizontal plane may not be at the initial zero position, so that the needle 122 has a certain rotation angle when it is driven to lift the chip 800, resulting in the needle 122 being unable to accurately align with the chip 800 when moving toward the chip 800. If the needle 122 is not aligned with the chip 800 at the picking position 410, the needle 122 will apply an eccentric force to the chip 800, causing the chip 800 to tilt between the picking member 400 and the needle 122, or even detach from the picking member 400, thereby reducing the success rate of picking up the chip 800, or the needle 122 cannot abut against the chip 800, so that the chip 800 and the blue film 700 cannot be separated, thereby reducing the efficiency and success rate of picking up the chip 800. Therefore, a second sensor 232 and a second sensing element 231 are provided. When the first motor 242 drives the rotating bearing 241 to rotate, the second sensing element 231 is detected via the detection area of ​​the second sensor 232 to determine the zero position of the rotating bearing 241, so that the needle 122 can be accurately aligned with the chip 800, thereby improving the success rate and efficiency of picking up the chip 800.

[0050] Optionally, in another embodiment, the structural arrangement of the second induction member 231 and the second sensor 232 may be omitted to reduce the development cost of the ejector device.

[0051] Optionally, in one embodiment, the adjustment component also includes a first slide 251 arranged below the rotating bearing 241, a second motor 252 drivingly connected to the first slide 251, a second slide 261, and a third motor 262 drivingly connected to the second slide 261, the second sensor 232 is arranged on the first slide 251, the rotating bearing 241 is arranged on the first slide 251, the second motor 252 drives the first slide 251 to drive the rotating bearing 241 to move toward a first direction, the first slide 251 is slidably arranged on the second slide 261, the third motor 262 drives the second slide 261 to drive the first slide 251 to move toward a second direction, the second direction is different from the first direction, the adjustment component also includes a stator 271, a mover 272 slidingly arranged on the stator 271, and a fourth motor 273 drivingly connected to the mover 272, the third slide is arranged on the mover 272, and the fourth motor 273 drives the mover 272 to drive the third slide to move on the stator 271. In this way, the second motor 252 is provided to drive the first slide 251 to move in the first direction, drive the rotating bearing 241 and the ejector assembly 100 to move in the first direction, so as to adjust the position of the ejector assembly 100 in the first direction; the third motor 262 is provided to drive the second slide 261 to move in the second direction, drive the rotating bearing 241 and the ejector assembly 100 to move in the second direction, so as to adjust the ejector assembly 100 in the second direction; the first direction and the second direction are not in the same direction; the fourth motor 273 is provided to drive the stator 271 to slide in the up-and-down direction of the mover 272, drive the ejector assembly 100 and the rotating bearing 241 to move in the up-and-down direction, so as to adjust the position of the ejector assembly 100 in the up-and-down direction; under the driving of the second motor 252, the third motor 262, and the fourth motor 273, the ejector assembly 100 is adjusted in the first direction, the second direction, and the up-and-down direction, so that the ejector cap 110 can accurately lift the blue film 700, thereby improving the success rate of picking up the chip 800.

[0052] The utility model also provides a chip separation device, please refer to Figure 6 The chip separation device includes a pick-up member 400, a carrier platform 500, and the aforementioned ejector device, which has a pick-up position 410. The pick-up member 400 is used to pick up the chip 800 at the pick-up position 410. The carrier platform 500 has a placement position 510 for placing a wafer ring 600. The specific structure of the ejector device refers to the above embodiment. Since the chip separation device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0053] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A pin device is used in a chip separation device, wherein the chip is loaded on a blue film, and the blue film is loaded on a wafer ring. The chip separation device comprises a pick-up member having a pick-up position and a carrying platform, wherein the pick-up member picks up the chip at the pick-up position, and the carrying platform has a placement position for placing the wafer ring, characterized in that: The ejector device comprises: An ejector pin assembly, comprising an ejector pin cap disposed below the placement position, and an ejector pin member movably connected to the ejector pin cap, wherein the ejector pin cap is used to lift and suck the blue film so as to separate the blue film from the wafer ring; An adjusting component, comprising a voice coil motor driving the ejector member, wherein the voice coil motor drives the ejector member to move relative to the ejector cap to move to the pickup position to abut against the chip, and the ejector cap absorbs the blue film to separate the chip from the blue film; and The displacement sensor is used to detect the displacement of the ejector member driven by the voice coil motor. The displacement sensor is electrically connected to the voice coil motor so that the voice coil motor controls the ejector member to lift the chip to the pickup position.

2. The ejector device according to claim 1, characterized in that: The displacement sensor is configured as a grating ruler, which includes an encoder arranged on the ejector part and a reading head slidably connected to the encoder. The encoder moves along with the ejector part toward the picking position. The encoder and the reading head move relative to each other, and the reading head is used to detect the displacement of the ejector part.

3. The ejector device according to claim 2, characterized in that: The ejector pin comprises a needle head for lifting and contacting the chip, and a lifting rod driving and connecting the voice coil motor. The needle head is arranged on the lifting rod, and the encoder is arranged at one end of the lifting rod away from the needle head.

4. The ejector device according to claim 2, characterized in that: The adjustment component also includes a first sensing member arranged on the encoder, and a first sensor for detecting the first sensing member. The first sensing member can follow the encoder to move relative to the first sensor and pass through the detection area of ​​the first sensor to determine the zero return position of the ejector member.

5. The ejector device according to claim 3, characterized in that: The ejector cap has a receiving cavity for receiving the ejector member, and a through hole is formed at one end of the ejector cap facing the picking position. The lifting rod and the needle are both arranged in the receiving cavity, and the needle can pass through the through hole to lift the chip.

6. The ejector device according to claim 5, characterized in that: There are a plurality of needles, and a plurality of through holes, one through hole corresponds to one needle, so that the needle can pass through the through hole to lift up the chip.

7. The ejector device according to claim 3, characterized in that: The adjustment component also includes a rotating bearing rotatably connected to the voice coil motor, and a first motor transmission-connected to the rotating bearing, the first motor drives the rotating bearing to rotate around the axis of the ejector assembly, and the rotating bearing drives the voice coil motor to rotate around the axis, so that the multiple needles are aligned below the picking position.

8. The ejector device according to claim 7, characterized in that: The adjustment component also includes a second sensing member arranged on the rotating bearing, and a second sensor for detecting the second sensing member. The second sensing member can rotate along with the rotating bearing and determine the zero position of the rotating bearing through the detection area of ​​the second sensor.

9. The ejector device according to claim 8, characterized in that: The adjusting component also includes a first slide seat provided below the rotating bearing, a second motor drivingly connected to the first slide seat, a second slide seat, and a third motor drivingly connected to the second slide seat, the second sensor is provided on the first slide seat, the rotating bearing is provided on the first slide seat, the second motor drives the first slide seat to drive the rotating bearing to move in a first direction, the first slide seat is slidably provided on the second slide seat, the third motor drives the second slide seat to drive the first slide seat to move in a second direction, the second direction is different from the first direction, the adjusting component also includes a stator, a mover slidingly provided on the stator, a third slide seat and a fourth motor drivingly connected to the mover, the third slide seat is provided on the mover, and the fourth motor drives the mover to drive the third slide seat to move on the stator.

10. A chip separation device, characterized in that: include: A picking piece, having the picking position, and the picking piece is used to pick up the chip at the picking position; A carrying platform having a placement position for placing the wafer ring; The ejector device according to any one of claims 1 to 9.

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