Dehumidification assembly and disinfection cabinet

Abstract

The utility model relates to a dehumidification assembly and a disinfection cabinet, comprising: a first substrate, which is provided with a liquid discharge hole; the front cover covers the front surface of the first base plate, so that a condensation cavity is defined by the front cover and the first base plate, and one end of the liquid drainage hole communicates with the condensation cavity; the semiconductor chilling plate is located in the condensation cavity, and the heating face of the semiconductor chilling plate is attached to the front face of the first substrate; the condensation part is located in the condensation cavity and used for forming condensate water, a liquid guide face is arranged in the condensation cavity, and the liquid guide face is used for collecting the condensate water formed on the condensation part and guiding the condensate water to the liquid drainage hole; the water absorption piece is arranged on the back face of the first base plate, and the water absorption piece is used for absorbing condensate water flowing out of the liquid drainage hole.

Description

Technical Field

[0001] The utility model relates to the field of dehumidification, in particular to a dehumidification component and a disinfection cabinet. Background Art

[0002] A condensation seat is used when dehumidifying the disinfection cabinet. Fins are provided inside the condensation seat. By lowering the internal temperature of the condensation seat, condensation water is formed on the fins, and then the condensation water is discharged to the outside of the condensation seat, thereby achieving the purpose of reducing the humidity in the disinfection cabinet.

[0003] In order to drain the condensed water from the condensation seat, a drain pipe can only be set on the condensation seat to collect and process the condensed water. The drain pipe not only takes up a lot of space, but also cannot be effectively utilized because the amount of condensed water is not large, resulting in a low cost-effectiveness of setting up the drain pipe. Utility Model Content

[0004] Based on this, it is necessary to provide a dehumidification component and a disinfection cabinet to address the problem that the drainage pipe occupies a large space and has a low cost-effectiveness during the dehumidification process of the disinfection cabinet.

[0005] A dehumidification assembly, comprising:

[0006] A first substrate, wherein a drainage hole is formed on the first substrate;

[0007] A front cover, the front cover is covered on the front side of the first substrate to form a condensation chamber with the first substrate, and one end of the drainage hole is connected to the condensation chamber;

[0008] A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is located in the condensation chamber, and a heating surface of the semiconductor refrigeration sheet is attached to the front surface of the first substrate;

[0009] A condensation element, the condensation element is located in the condensation chamber for forming condensed water, a liquid guide surface is provided in the condensation chamber, and the liquid guide surface is used to collect the condensed water formed on the condensation element and guide it to the drainage hole;

[0010] A water absorbing member is installed on the back side of the first substrate and is used to absorb condensed water flowing out of the drainage hole.

[0011] The liquid guiding surface of the utility model is a U-shaped surface or a V-shaped surface, the opening formed by the liquid guiding surface is oriented in a first direction, the projection of the condensation element in the first direction is located within the projection of the liquid guiding surface in the first direction, and the drainage hole is located at the end of the liquid guiding surface.

[0012] The condensing element of the utility model is in sheet shape and extends along a first direction. The condensing element has at least two sheets and is arranged at intervals.

[0013] The dehumidification component of the utility model further comprises a second substrate, the back side of the second substrate is located at the cooling surface of the semiconductor cooling sheet, and the edge of the condensing element is fixed on the front side of the second substrate.

[0014] The dehumidification component of the utility model also includes a heat insulation ring arranged around the semiconductor refrigeration plate, and the back side of the second substrate is attached to the heat insulation ring to cover the refrigeration surface of the semiconductor refrigeration plate.

[0015] The side edges of both ends of the liquid guiding surface of the utility model are respectively located on the inner wall of the front cover and the front surface of the first substrate.

[0016] The utility model provides a ventilation hole on the front cover which is connected to the condensation chamber, and the ventilation hole is avoided at the end of the liquid guide surface.

[0017] The dehumidification assembly of the utility model further comprises a plurality of heat sinks, the edges of which are fixed on the back side of the first substrate, and at least a part of the heat sinks is in contact with the water absorbing member.

[0018] The water absorbing member of the utility model is blocked at the end of the liquid discharge hole.

[0019] A disinfection cabinet comprises a cabinet body and a dehumidification component, wherein the condensation chamber is at least partially located outside the cabinet body, and the water absorbing component is located outside the cabinet body.

[0020] The beneficial effects of the utility model are:

[0021] The cooling surface of the semiconductor cooling sheet can reduce the temperature in the condensation chamber, so that the water vapor in the condensation chamber forms condensed water on the condensation element. The condensed water formed on the condensation element is first transferred to the liquid guide surface. Under the guidance of the liquid guide surface, the condensed water flows to the drainage hole and is transferred to the back of the first substrate to be absorbed and stored by the water absorbing element. The heating surface of the semiconductor cooling sheet increases the temperature of the first substrate, which helps the evaporation of water in the water absorbing element.

[0022] The dehumidification component of the utility model realizes the collection and treatment process of condensed water through the cooperation of semiconductor cooling sheets, liquid guide surfaces and water absorbents. Users do not need to additionally process the condensed water, which simplifies the workload of users during the dehumidification process. The above working method avoids the use of drainage pipes by the dehumidification component, thereby avoiding the problem of large space occupied by drainage pipes and low cost performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the three-dimensional structure of the dehumidification component in the embodiment of the utility model;

[0024] Figure 2 A schematic diagram of the three-dimensional structure of a part of the dehumidification component in the embodiment of the utility model Figure 1;

[0025] Figure 3 A schematic diagram of the three-dimensional structure of a part of the dehumidification component in the embodiment of the utility model Figure 2 ;

[0026] Figure 4 This is a schematic diagram of the three-dimensional structure of the front cover in the embodiment of the utility model;

[0027] Figure 5 The three-dimensional structure of the disinfection cabinet in the embodiment of the utility model is shown in FIG. Figure 1 ;

[0028] Figure 6 The three-dimensional structure of the disinfection cabinet in the embodiment of the utility model is shown in FIG. Figure 2 .

[0029] Reference numerals:

[0030] 1. First substrate; 11. Drain hole; 2. Front cover; 21. Liquid guide surface; 22. Ventilation hole; 3. Semiconductor refrigeration plate; 4. Water absorbing component; 5. Second substrate; 6. Condensation component; 7. Heat insulation ring; 8. Heat sink; 9. Cabinet body. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0037] Example:

[0038] See also Figure 5-Figure 6 The present embodiment provides a disinfection cabinet, including a cabinet body 9 and a dehumidification component. A avoidance opening is provided on the rear side wall of the cabinet body 9, and the dehumidification component is installed at the avoidance opening to reduce the humidity in the cabinet body 9.

[0039] See also Figure 1-Figure 4 The dehumidification component includes a first substrate 1, a front cover 2, a semiconductor refrigeration sheet 3, a condensing element 6 and a water absorbing element 4.

[0040] The front cover 2 covers the front surface of the first substrate 1, and the front cover 2 and the first substrate 1 are arranged to form a condensation chamber. The semiconductor refrigeration sheet 3 and the condensation element 6 are both arranged in the condensation chamber, wherein the heating surface of the semiconductor refrigeration sheet 3 is attached to the front surface of the first substrate 1, so that the semiconductor refrigeration sheet 3 can increase the temperature of the first substrate 1, and correspondingly, the cooling surface of the semiconductor refrigeration sheet 3 can reduce the temperature in the condensation chamber, so as to facilitate the water vapor in the condensation chamber to form condensed water on the condensation element 6. A drainage hole 11 is provided on the first substrate 1, one end of the drainage hole 11 is connected to the condensation chamber, and the other end is connected to the back of the first substrate 1. A liquid guide surface 21 is provided in the condensation chamber, and the condensed water formed on the condensation element 6 is first transferred to the liquid guide surface 21. Under the guidance of the liquid guide surface 21, the condensed water flows to the drainage hole 11 and is transferred to the back of the first substrate 1. The water absorbent 4 is installed on the back of the first substrate 1. The water absorbent 4 generally has a strong water absorption capacity, such as a sponge. After the condensed water reaches the back of the first substrate 1, it is absorbed by the water absorbent 4, so that the condensed water is stored by the water absorbent 4. Since the heating surface of the semiconductor cooling sheet 3 increases the temperature of the first substrate 1, the first substrate 1 can further increase the temperature of the water absorbent 4, thereby facilitating the evaporation of water in the water absorbent 4.

[0041] The dehumidification component of this embodiment effectively converts the water vapor in the condensation chamber into condensed water through the cooperation of the semiconductor cooling sheet 3 and the condensation member 6, thereby reducing the humidity in the condensation chamber. The condensed water is discharged to the outside of the condensation chamber under the guidance of the liquid guide surface 21 and absorbed and stored by the water absorbent member 4. The semiconductor cooling sheet 3 can increase the temperature of the water absorbent member 4 through the first substrate 1, thereby accelerating the evaporation of the condensed water in the water absorbent member 4, thereby achieving the cleaning of the condensed water. Therefore, the working process of the dehumidification component of this embodiment can be regarded as the process of transferring water vapor from the inside to the outside of the dehumidification component.

[0042] See also Figure 4-Figure 6 , a ventilation hole 22 connected to the condensation chamber is provided on the front cover 2, and the condensation chamber is at least partially located in the cabinet 9, so the water vapor in the cabinet 9 can continuously enter the condensation chamber through the ventilation hole 22, thereby continuously forming condensed water on the condensation member 6, thereby reducing the humidity in the cabinet 9. Since the water absorbing member 4 is located outside the cabinet 9, the condensed water in the cabinet 9 will eventually be discharged to the outside of the cabinet 9 and converted into water vapor for cleaning.

[0043] The dehumidification component of this embodiment simultaneously realizes the collection and processing process of condensed water, reducing the complexity of the user's operation when dehumidifying the disinfection cabinet, and there is no need to use a drain pipe during the dehumidification process, thereby maintaining the space occupied by the disinfection cabinet at a low level.

[0044] See also Figure 3 and Figure 4In this embodiment, the liquid guiding surface 21 is a V-shaped surface. In some other embodiments, the liquid guiding surface 21 may also be a U-shaped surface, wherein the drainage hole 11 is located at the end of the liquid guiding surface 21. The opening formed by the liquid guiding surface 21 is oriented in the first direction, and the projection of the condensation element 6 in the first direction is located within the projection of the liquid guiding surface 21 in the first direction. During the operation of the dehumidification component, the first direction is generally a direction perpendicular to the horizontal plane. Accordingly, the condensation element 6 is located directly above the liquid guiding surface 21. The condensed water formed on the condensation element 6 can naturally fall to the liquid guiding surface 21 under the action of gravity, and the condensed water on the liquid guiding surface 21 will also naturally flow to the bottom of the liquid guiding surface 21 under the action of gravity, and then flow from the rear end of the bottom of the liquid guiding surface 21 to the drainage hole 11.

[0045] The condensation element 6 is generally in the form of a sheet, and there are at least two condensation elements 6 that are spaced apart. The gaps between adjacent condensation elements 6 allow condensation water to form on the surface of the condensation element 6. The condensation element 6 extends along the first direction so that the condensation element 6 is perpendicular to the horizontal plane during the operation of the dehumidification component. Accordingly, the condensation water formed on the condensation element 6 can be transferred to the liquid guide surface 21 more quickly. On the other hand, all condensation elements 6 extend along the first direction so that the projections of different condensation elements 6 in the first direction will not block each other. Under the action of gravity, the condensation water dripping from one of the condensation elements 6 can be directly transferred to the liquid guide surface 21 without dripping onto another condensation element 6. Therefore, the design that the condensation element 6 is in the form of a sheet and extends along the first direction effectively improves the efficiency of transferring the condensation water from the inside of the condensation chamber to the water absorbing element 4.

[0046] The semiconductor refrigeration sheet 3 is an electronic device. In order to increase safety, it is necessary to avoid the formation of condensed water on the cooling surface of the semiconductor refrigeration sheet 3 as much as possible. Therefore, the dehumidification component of this embodiment also includes a second substrate 5. The back of the second substrate 5 is very close to the cooling surface of the semiconductor refrigeration sheet 3, or is in contact with the cooling surface of the semiconductor refrigeration sheet 3, and the edge of the condensation member 6 is fixed on the front of the second substrate 5. The semiconductor refrigeration sheet 3 can reduce the temperature of the condensation member 6 through the second substrate 5, so that the condensation member 6 is the lower temperature point or the lowest temperature point in the condensation chamber, so that the position where the condensed water is generated in the condensation chamber is concentrated on the condensation member 6 as much as possible, so that all the condensed water can be transferred to the liquid guide surface 21 as much as possible and then transferred to the water absorbing member 4. The second substrate 5 shields the cooling surface of the semiconductor refrigeration sheet 3, thereby reducing or avoiding the contact between the cooling surface of the semiconductor refrigeration sheet 3 and water vapor, and correspondingly, it also reduces or avoids the generation of water vapor at the cooling surface of the semiconductor refrigeration sheet 3.

[0047] See also Figure 2 and Figure 3The dehumidification assembly also includes an insulation ring 7 arranged around the semiconductor cooling sheet 3, and the back of the second substrate 5 is attached to the insulation ring 7. The semiconductor cooling sheet 3 is thin, so the distance between the front of the first substrate 1 and the second substrate 5 is small. The insulation ring 7 can reduce or block the heat exchange between the part of the front of the first substrate 1 at the edge of the semiconductor cooling sheet 3 and the second substrate 5. The heating surface of the semiconductor cooling sheet 3 directly adheres to the front of the first substrate 1, so the temperature of the front of the first substrate 1 at the edge of the semiconductor cooling sheet 3 is relatively high. The insulation ring 7 can effectively reduce the heat transfer from the front of the first substrate 1 to the second substrate 5, so that the condensation element 6 can be maintained at a lower temperature, which is conducive to the formation of condensed water.

[0048] In order to ensure that the condensed water on the liquid guiding surface 21 can flow to the drainage hole 11, the front end of the liquid guiding surface 21 is fixed on the inner wall of the front cover 2, and the front end of the liquid guiding surface 21 needs to avoid the ventilation hole 22. The front end of the liquid guiding surface 21 is blocked by the inner wall of the front cover 2, and the rear end edge of the liquid guiding surface 21 abuts against the front side of the first substrate 1, so that the condensed water at the bottom of the liquid guiding surface 21 can only flow to the drainage hole 11.

[0049] See also Figure 1-Figure 3 In this embodiment, the dehumidification assembly further includes a plurality of heat sinks 8, the edges of which are fixed to the back of the first substrate 1. The heat sinks 8 help dissipate heat from the first substrate 1 to prevent the first substrate 1 from being overheated and affecting the performance of the disinfection cabinet. In order to increase the heat conducted to the water absorbing member 4 and improve the evaporation rate of the condensed water stored in the water absorbing member 4, at least part of the heat sinks 8 will be in contact with the water absorbing member 4.

[0050] In other embodiments, the end of the drainage hole 11 on the back side of the first substrate 1 may be directly above the water absorbent 4, so that the condensed water flowing out of the end of the drainage hole 11 naturally falls on the water absorbent 4 under the action of gravity and is absorbed. In this embodiment, in order to allow the condensed water flowing out of the drainage hole 11 to be fully absorbed by the water absorbent 4, the water absorbent 4 is blocked at the end of the drainage hole 11.

[0051] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A dehumidification component, characterized in that: include: A first substrate (1), wherein a liquid discharge hole (11) is provided on the first substrate (1); A front cover (2), the front cover (2) covering the front surface of the first substrate (1) to enclose the first substrate (1) to form a condensation chamber, and one end of the drainage hole (11) is connected to the condensation chamber; A semiconductor refrigeration sheet (3), the semiconductor refrigeration sheet (3) being located in the condensation chamber, and the heating surface of the semiconductor refrigeration sheet (3) being attached to the front surface of the first substrate (1); A condensation element (6), the condensation element (6) being located in the condensation chamber for forming condensed water, a liquid guide surface (21) being provided in the condensation chamber, the liquid guide surface (21) being used to collect the condensed water formed on the condensation element (6) and guide it to the drainage hole (11); A water absorbing member (4), the water absorbing member (4) being mounted on the back side of the first substrate (1), the water absorbing member (4) being used to absorb condensed water flowing out of the drainage hole (11).

2. The dehumidification assembly according to claim 1, characterized in that: The liquid guiding surface (21) is a U-shaped surface or a V-shaped surface, the opening formed by the liquid guiding surface (21) is oriented in a first direction, the projection of the condensation element (6) in the first direction is located within the projection of the liquid guiding surface (21) in the first direction, and the drainage hole (11) is located at the end of the liquid guiding surface (21).

3. The dehumidification assembly according to claim 2, characterized in that: The condensing element (6) is in the form of a sheet and extends along a first direction. The condensing element (6) has at least two sheets and is arranged at intervals.

4. The dehumidification assembly according to claim 3, characterized in that: The dehumidification component further comprises a second substrate (5), the back side of the second substrate (5) being located at the cooling surface of the semiconductor cooling sheet (3), and the edge of the condensation element (6) being fixed on the front side of the second substrate (5).

5. The dehumidification assembly according to claim 4, characterized in that: The dehumidification component also includes a heat insulation ring (7) arranged around the circumference of the semiconductor refrigeration plate (3), and the back surface of the second substrate (5) is attached to the heat insulation ring (7) to shield the refrigeration surface of the semiconductor refrigeration plate (3).

6. The dehumidification assembly according to claim 2, characterized in that: The side edges at both ends of the liquid guiding surface (21) are respectively located on the inner wall of the front cover (2) and the front surface of the first substrate (1).

7. The dehumidification assembly according to claim 6, characterized in that: The front cover (2) is provided with a ventilation hole (22) connected to the condensation chamber, and the ventilation hole (22) is avoided at the end of the liquid guide surface (21).

8. The dehumidification assembly according to claim 1, characterized in that: The dehumidification component further comprises a plurality of heat sinks (8), the edges of the heat sinks (8) being fixed on the back side of the first substrate (1), and at least a portion of the heat sinks (8) being in contact with the water absorbing member (4).

9. The dehumidification assembly according to claim 1, characterized in that: The water absorbing member (4) covers the end of the liquid discharge hole (11).

10. A disinfection cabinet, characterized in that: It comprises a cabinet (9) and a dehumidification assembly according to any one of claims 1 to 9, wherein the condensation chamber is at least partially located inside the cabinet (9), and the water absorbing member (4) is located outside the cabinet (9).

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