Photoetching machine for semiconductor production and manufacturing

Abstract

The utility model discloses a photoetching machine for semiconductor production and manufacturing, and relates to the technical field of photoetching machines, in particular to a photoetching machine which comprises a base and a photoetching machine body, the photoetching machine body is positioned above the base, the upper surface of the base is fixedly connected with a mounting seat, the photoetching machine body is positioned above the base, and the mounting seat is fixedly connected with the mounting seat. A motor is fixedly mounted on the inner wall of the base, the output end of the motor is fixedly connected with first conical teeth, a fixing plate is fixedly connected to the inner wall of the base, and a mounting rod is rotatably connected to the inner wall of the fixing plate. According to the photoetching machine for semiconductor production and manufacturing, through a motor, a first conical tooth, a mounting rod, a second conical tooth, a threaded rod, a third conical tooth, a threaded block, a moving rod and a roller, the motor is started, and then the first conical tooth, the second conical tooth and the third conical tooth are arranged in a matched manner, so that the threaded rod rotates, and then the roller is driven to ascend and descend; and therefore, a moving effect is achieved, and the purpose of moving is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of photolithography machines, in particular to a photolithography machine for semiconductor production and manufacturing. Background Art

[0002] Lithography machine / UV exposure machine is also known as: mask alignment exposure machine, exposure system, photolithography system, etc. The commonly used lithography machine is mask alignment lithography. The general lithography process has to go through the steps of silicon wafer surface cleaning and drying, primer coating, photoresist spin coating, soft baking, alignment exposure, post-baking, development, hard baking, etching, etc. Lithography means using light to make a pattern; the process of spreading the photoresist on the surface of the silicon wafer and then transferring the pattern on the mask to the photoresist is the process of temporarily "copying" the device or circuit structure onto the silicon wafer.

[0003] A proximity lithography machine for semiconductor chip production is disclosed in the Chinese utility model patent application publication specification cN201810568507.5. However, existing lithography machines are not easy to move and have poor stability during operation, which increases the difficulty of using the lithography machine. Therefore, a lithography machine for semiconductor production is needed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a photolithography machine for semiconductor production and manufacturing, which solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a photolithography machine for semiconductor production and manufacturing, comprising a base and a photolithography machine body, the photolithography machine body is located above the base, the upper surface of the base is fixedly connected to a mounting seat, the photolithography machine body is located above the base, a motor is fixedly installed on the inner wall of the base, the output end of the motor is fixedly connected to a first conical tooth, the inner wall of the base is fixedly connected to a fixing plate, the inner wall of the fixing plate is rotatably connected to a mounting rod, one side of the mounting rod is fixedly connected to a second conical tooth, the lower end of the second conical tooth is meshed with the first conical tooth, and the inner wall of the base is rotatably connected to a threaded rod.

[0006] Optionally, the outer surface of the threaded rod is threadedly connected with third conical teeth, and the number of the second conical teeth is two.

[0007] Optionally, the lower end of the third conical tooth is meshed with another second conical tooth, and the outer surface of the threaded rod is threadedly connected with a threaded block.

[0008] Optionally, a moving rod is fixedly connected to one side of the threaded block, and a roller is fixedly connected to the lower surface of the moving rod.

[0009] Optionally, a sliding groove is provided on the inner wall of the base, a sliding block is slidably connected to the inner wall of the sliding groove, and one side of the sliding block is fixedly connected to the moving rod.

[0010] Optionally, a partition is fixedly connected to the inner wall of the mounting seat, a sliding groove is provided on the inner wall of the partition, a sliding block is slidably connected to the inner wall of the sliding groove, and a movable plate is fixedly connected to one side of the sliding block.

[0011] Optionally, the upper surface of the movable plate is fixedly connected to the lithography machine body, and the lower surface of the lithography machine body is fixedly connected with a shock absorber.

[0012] Optionally, the lower surface of the movable plate is fixedly connected to a shell, the inner wall of the shell is fixedly connected to a spring, the lower surface of the spring is fixedly connected to a connecting plate, the lower surface of the connecting plate is fixedly connected to a support rod, and the lower surface of the support rod is fixedly connected to a mounting seat.

[0013] The utility model provides a semiconductor manufacturing photolithography machine, which has the following beneficial effects:

[0014] 1. The semiconductor manufacturing photolithography machine has a moving effect through the setting of the base. Through the coordinated setting of the base and the roller, during use, the motor, the first conical teeth, the mounting rod, the second conical teeth, the threaded rod, the third conical teeth, the threaded block, the moving rod and the roller can be started, and then the first conical teeth, the second conical teeth and the third conical teeth are coordinated to make the threaded rod rotate, and then drive the roller to rise and fall, thereby playing a moving role and achieving the purpose of movement.

[0015] 2. The semiconductor manufacturing lithography machine has a stable effect through the setting of the mounting seat. Through the coordinated setting of the mounting seat and the base, during use, the matching setting between the partition, shock absorber, shell, spring, connecting plate and support rod can be used to achieve the limiting effect through the sliding groove and the sliding block. When the shock absorber vibrates, it drives the shell, spring and support rod working device as a whole to increase the double fixing effect, so that the installation of the device is more stable when working, and the vibration generated by the device when working is reduced, thereby playing a stabilizing role and achieving the purpose of stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the main cross-section of the utility model;

[0018] Figure 3 For this utility model Figure 2 The enlarged structural diagram at A in the middle;

[0019] Figure 4 For this utility model Figure 2 The enlarged structural diagram at B in the middle;

[0020] Figure 5 For this utility model Figure 2 The enlarged structural diagram at C in the middle;

[0021] Figure 6 For this utility model Figure 2 Schematic diagram of the structure enlarged at point D in the middle.

[0022] In the figure: 1. base; 2. photolithography machine body; 3. motor; 4. first conical tooth; 5. fixed plate; 6. mounting rod; 7. second conical tooth; 8. threaded rod; 9. third conical tooth; 10. threaded block; 11. moving rod; 12. roller; 13. slide groove; 14. slider; 15. partition; 16. slide groove; 17. slide block; 18. movable plate; 19. shock absorber; 20. housing; 21. spring; 22. connecting plate; 23. support rod. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Example

[0024] See also Figure 1-4 The utility model provides a technical solution: a semiconductor manufacturing photolithography machine, comprising a base 1 and a photolithography machine body 2, the photolithography machine body 2 is located above the base 1, a slide groove 13 is provided on the inner wall of the base 1, a slider 14 is slidably connected to the inner wall of the slide groove 13, one side of the slider 14 is fixedly connected to the moving rod 11, a mounting seat is fixedly connected to the upper surface of the base 1, the photolithography machine body 2 is located above the base 1, a motor 3 is fixedly installed on the inner wall of the base 1, the output end of the motor 3 is fixedly connected to the first conical gear 4, the inner wall of the base 1 is fixedly connected to the fixing plate 5, and the fixing plate 5 is fixedly connected to the inner wall of the base 1. The inner wall of the fixed plate 5 is rotatably connected to a mounting rod 6, one side of the mounting rod 6 is fixedly connected to a second conical tooth 7, the lower end of the second conical tooth 7 is meshed with the first conical tooth 4, the inner wall of the base 1 is rotatably connected to a threaded rod 8, the outer surface of the threaded rod 8 is threadedly connected to a third conical tooth 9, the number of the second conical teeth 7 is two, the lower end of the third conical tooth 9 is meshed with another second conical tooth 7, the outer surface of the threaded rod 8 is threadedly connected to a threaded block 10, one side of the threaded block 10 is fixedly connected to a moving rod 11, and the lower surface of the moving rod 11 is fixedly connected to a roller 12.

[0025] When in use, the semiconductor manufacturing lithography machine has a moving effect through the setting of the base 1. Through the coordinated setting of the base 1 and the roller 12, during use, the motor 3, the first conical teeth 4, the mounting rod 6, the second conical teeth 7, the threaded rod 8, the third conical teeth 9, the threaded block 10, the moving rod 11 and the roller 12 can be started by starting the motor 3, and then the first conical teeth 4, the second conical teeth 7 and the third conical teeth 9 are coordinated to make the threaded rod 8 rotate, and then drive the roller 12 to rise and fall, thereby playing a moving role and achieving the purpose of movement. Example

[0026] See also Figure 5-6 The utility model provides a technical solution: a semiconductor manufacturing photolithography machine, comprising a base 1 and a photolithography machine body 2, the photolithography machine body 2 is located above the base 1, the inner wall of the mounting seat is fixedly connected with a partition 15, the inner wall of the partition 15 is provided with a sliding groove 16, the inner wall of the sliding groove 16 is slidably connected with a sliding block 17, one side of the sliding block 17 is fixedly connected with a movable plate 18, the upper surface of the movable plate 18 is fixedly connected to the photolithography machine body 2, the lower surface of the photolithography machine body 2 is fixedly connected with a shock absorber 19, the lower surface of the movable plate 18 is fixedly connected with a shell 20, the inner wall of the shell 20 is fixedly connected with a spring 21, the spring 2 The lower surface of the base 1 is fixedly connected with a connecting plate 22, the lower surface of the connecting plate 22 is fixedly connected with a supporting rod 23, the lower surface of the supporting rod 23 is fixedly connected with the mounting seat, the upper surface of the base 1 is fixedly connected with the mounting seat, the lithography machine body 2 is located above the base 1, the inner wall of the base 1 is fixedly installed with a motor 3, the output end of the motor 3 is fixedly connected with a first conical tooth 4, the inner wall of the base 1 is fixedly connected with a fixing plate 5, the inner wall of the fixing plate 5 is rotatably connected with a mounting rod 6, one side of the mounting rod 6 is fixedly connected with a second conical tooth 7, the lower end of the second conical tooth 7 is meshed with the first conical tooth 4, and the inner wall of the base 1 is rotatably connected with a threaded rod 8.

[0027] When in use, the semiconductor manufacturing lithography machine has a stable effect through the setting of the mounting seat. Through the matching setting of the mounting seat and the base 1, during use, the matching setting between the partition 15, the shock absorber 19, the shell 20, the spring 21, the connecting plate 22 and the support rod 23 can be used, and the limiting effect can be achieved through the sliding groove 16 and the sliding block 17. When the shock absorber 19 vibrates, it drives the shell 20, the spring 21 and the support rod 23 to increase the double fixing effect of the working device as a whole, so that the installation of the device is more stable when working, and the vibration generated when the device is working is reduced, thereby playing a stabilizing role and achieving the purpose of stability.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A photolithography machine for semiconductor manufacturing, comprising a base (1) and a photolithography machine body (2), characterized in that: The photolithography machine body (2) is located above the base (1); the upper surface of the base (1) is fixedly connected to a mounting seat; the photolithography machine body (2) is located above the base (1); a motor (3) is fixedly installed on the inner wall of the base (1); the output end of the motor (3) is fixedly connected to a first conical tooth (4); the inner wall of the base (1) is fixedly connected to a fixing plate (5); the inner wall of the fixing plate (5) is rotatably connected to a mounting rod (6); one side of the mounting rod (6) is fixedly connected to a second conical tooth (7); the lower end of the second conical tooth (7) is meshed with the first conical tooth (4); and the inner wall of the base (1) is rotatably connected to a threaded rod (8).

2. A semiconductor manufacturing photolithography machine according to claim 1, characterized in that: The outer surface of the threaded rod (8) is threadedly connected with a third conical tooth (9), and the number of the second conical teeth (7) is two.

3. A semiconductor manufacturing photolithography machine according to claim 2, characterized in that: The lower end of the third conical tooth (9) is meshed with another second conical tooth (7), and the outer surface of the threaded rod (8) is threadedly connected with a threaded block (10).

4. A semiconductor manufacturing photolithography machine according to claim 3, characterized in that: A moving rod (11) is fixedly connected to one side of the threaded block (10), and a roller (12) is fixedly connected to the lower surface of the moving rod (11).

5. A semiconductor manufacturing photolithography machine according to claim 4, characterized in that: The inner wall of the base (1) is provided with a sliding groove (13), the inner wall of the sliding groove (13) is slidably connected to a sliding block (14), and one side of the sliding block (14) is fixedly connected to the moving rod (11).

6. A semiconductor manufacturing photolithography machine according to claim 1, characterized in that: A partition plate (15) is fixedly connected to the inner wall of the mounting seat, a sliding groove (16) is provided on the inner wall of the partition plate (15), a sliding block (17) is slidably connected to the inner wall of the sliding groove (16), and a movable plate (18) is fixedly connected to one side of the sliding block (17).

7. A semiconductor manufacturing photolithography machine according to claim 6, characterized in that: The upper surface of the movable plate (18) is fixedly connected to the photolithography machine body (2), and the lower surface of the photolithography machine body (2) is fixedly connected to a shock absorber (19).

8. A semiconductor manufacturing photolithography machine according to claim 7, characterized in that: The lower surface of the movable plate (18) is fixedly connected to a housing (20), the inner wall of the housing (20) is fixedly connected to a spring (21), the lower surface of the spring (21) is fixedly connected to a connecting plate (22), the lower surface of the connecting plate (22) is fixedly connected to a supporting rod (23), and the lower surface of the supporting rod (23) is fixedly connected to a mounting seat.

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