Material lifting and transferring device for electroplating production line of high-density integrated circuit lead frame

Abstract

The utility model relates to the technical field of lead frame feeding and discharging equipment, in particular to a material lifting and transferring device of a high-density integrated circuit lead frame electroplating production line, which comprises a machine table and a main conveying mechanism arranged on the machine table and used for conveying a lead frame in a horizontal posture. A sheet lifting mechanism used for supporting the stacked lead frames is arranged below the machine table, and a material moving hand assembly used for transferring the lead frames between the main conveying mechanism and the sheet lifting mechanism one by one is arranged above the machine table. On one hand, the material moving hand assembly can meet the requirement for taking and placing the lead frames of the corresponding sizes and specifications; and on the other hand, the displacement driving module can drive the displacement sliding seat and the sheet lifting seat to exit from or enter a lead frame stacking station, so that space is reserved in the feeding process, a next stack of lead frames are replaced, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frame conveying, in particular to a material lifting and transferring device for a high-density integrated circuit lead frame electroplating production line. Background Art

[0002] Lead frame, as the chip carrier of integrated circuit, is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It acts as a bridge to connect with external wires. Lead frame is required in most semiconductor integrated blocks and is an important basic material in the electronic information industry. Copper alloys for lead frames are roughly divided into copper-iron series, copper-nickel-silicon series, copper-chromium series, copper-nickel-tin series (JK--2 alloy), etc. Ternary, quaternary and other multi-component copper alloys can achieve better performance and lower cost than traditional binary alloys. Copper-iron series alloys have the most grades and have good mechanical strength, stress relaxation resistance and low creep resistance. They are a good type of lead frame material.

[0003] During the electroplating process, the lead frame needs to be loaded and unloaded. Most conveying mechanisms use belt conveyors for support during conveying. Conveying baffles are provided on both sides of the belt conveyor. The lead frame is located between the two conveying baffles and supported by the belt conveyor, and then conveyed forward. When the width of the lead frame increases, it cannot be placed between the two conveying baffles. When the width of the lead frame decreases, the distance between the two conveying baffles is too large, and the lead frame will fall from it, making it difficult to transport.

[0004] The applicant has previously developed an adjustable track conveying mechanism for lead frame processing equipment as disclosed in the Chinese patent document with announcement number CN219566654U, including a first conveyor plate and a second conveyor plate, the first conveyor plate is arranged with a belt conveyor along the length direction, and the second conveyor plate is equipped with multiple conveying rollers, and the conveying rollers and the belt conveyor are aligned laterally; an adjustment component is arranged between the first conveyor plate and the second conveyor plate, and the adjustment component includes a bottom guide and an adjustment drive; the lead frame to be conveyed forward is placed between the first conveyor plate and the second conveyor plate, and the bottom surface is respectively in contact with the belt conveyor and the conveying roller, and the belt conveyor drives the lead frame to be conveyed forward by forward movement; when the size of the lead frame changes, the second conveyor plate can be driven to slide along the bottom guide by the adjustment drive, so that the distance between the second conveyor plate and the first conveyor plate changes, so that lead frames of different sizes can be conveyed forward without falling or jamming.

[0005] During the electroplating process, the lead frame needs to be loaded and unloaded. The Chinese invention patent number CN201811397007.6 discloses a device and method for moving and transferring the lead frame. The device and method are used to automatically move and transfer the lead frame for preheating. The transmission module controls the movement of the lever, and the lever drives the lever to move the arranged lead frame from the loading platform to the preheating platform, thereby realizing the movement and preheating of the lead frame.

[0006] For example, the reciprocating transfer mechanism of the high-density integrated circuit lead frame device disclosed in the Chinese patent document with publication number CN219216699U previously developed by the applicant includes a driving seat for clamping the lead frame and a driving shaft that cooperates with the driving seat for transmission, the driving shaft is connected to a transmission member, and the driving shaft is formed with an external thread groove along the length direction, wherein the pitch of the middle part of the external thread groove of the driving shaft is greater than the pitch of the two end parts of the external thread groove, and the driving seat is equipped with a sliding block that slides in the external thread groove of the driving shaft; after clamping the lead frame, the transmission member drives the driving shaft to rotate, and the sliding block on the driving seat slides with the external thread groove on the driving shaft to make the driving seat reciprocate. When moving, the sliding seat moves slowly at both ends and moves faster in the middle part. The speed can change during linear transfer, thereby improving the transfer speed while ensuring safe transportation, thereby improving the transfer efficiency.

[0007] On the one hand, the prior art has complicated adjustment of the clamping fingers of the lead frame for lead frames of different sizes, which reduces the efficiency of taking and placing materials. On the other hand, there is a need for improving the efficiency of the lifting mechanism for lifting the stacked lead frames for feeding or lowering the accumulated materials. Summary of the invention

[0008] In view of the above technical problems existing in the prior art, the utility model provides a material lifting and transferring device for a high-density integrated circuit lead frame electroplating production line.

[0009] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0010] Provide a material lifting and transferring device for a high-density integrated circuit lead frame electroplating production line, including a machine platform and a main conveying mechanism installed on the machine platform for conveying a lead frame in a horizontally lying posture;

[0011] A film lifting mechanism for supporting the stacked lead frames is arranged below the machine platform, and the film lifting mechanism includes a shift slide rail arranged along the width direction of the main conveying mechanism, a shift slide seat slidably mounted on the shift slide rail, a shift driving module for driving the shift slide seat to move, a film lifting slide rail vertically mounted on the shift slide seat, a film lifting seat slidably mounted on the film lifting slide rail, and a film lifting driving module for driving the film lifting seat to move up and down;

[0012] A material transfer hand assembly is arranged above the machine table for transferring the lead frame piece by piece between the main conveying mechanism and the lifting mechanism, and includes a material holding module and a moving module for driving the material holding module to move laterally and longitudinally. The material holding module includes a material holding base and two groups of clamping mechanisms. Each group of clamping mechanisms includes a material holding slide slidably mounted on the material holding base, clamping fingers fixed to the material holding slide and a clamping cylinder for driving the material holding slide to move, so as to drive the two groups of clamping fingers to move closer or farther to pick up and place the lead frame; the material holding base is also provided with a positioning mechanism for adjusting the clamping cylinder and the initial position of the material holding slide.

[0013] As a further optional scheme, the film lifting mechanism includes a shift slide rail arranged along the width direction of the main conveying mechanism, a shift slide slidably mounted on the shift slide rail, a shift drive module for driving the shift slide to move, a film lifting slide rail vertically mounted on the shift slide, a film lifting seat slidably mounted on the film lifting slide rail, and a film lifting drive module for driving the film lifting seat to move up and down.

[0014] As a further optional solution, the upper end of the lifting slide rail is fixedly connected to the shift slide, the lower end of the lifting slide rail is fixedly connected to the alignment plate, and the number of the lifting slide rails is more than two.

[0015] As a further optional solution, the film lifting drive module includes a film lifting motor and a film lifting screw. The two ends of the film lifting screw are rotatably installed on the shift slide and the alignment plate. The film lifting seat and the film lifting screw are threadedly connected. The film lifting motor is used to drive the film lifting screw to rotate.

[0016] As a further optional solution, the material holding base is provided with a material holding slide rail, and the material holding slide plates of the two sets of clamping mechanisms are respectively provided with a material holding slide seat adapted to the material holding slide rail.

[0017] As a further optional solution, a support arm and a support are provided on the top of the material holding base, the support can slide relative to the support arm, the cylinder barrel of the clamping cylinder is fixed to the support, and the piston rod of the clamping cylinder is fixedly connected to the material holding slide.

[0018] As a further optional solution, the positioning mechanism includes a positioning screw, which is rotatably mounted on the support arm, and the support arm and the support are threadedly connected.

[0019] As a further optional scheme, the two groups of clamping mechanisms are respectively the first clamping group and the second clamping group. The support of the first clamping group is fixed to the support arm, and the support of the first clamping group is fixed with a clamping slide rod. The support of the second clamping group is slidably connected to the clamping slide rod, and the clamping slide rod is arranged parallel to the adjusting screw.

[0020] As a further optional solution, the material holding slide of each group of clamping mechanisms may correspond to a plurality of material clamping fingers, and the plurality of material clamping fingers may be spaced apart and distributed along the length direction of the material holding slide.

[0021] As a further optional solution, the clamping side of the clamping finger is an inclined surface, and the inclined surface is provided with a clamping tooth groove.

[0022] Beneficial effects of the utility model:

[0023] Compared with the prior art, the lifting and transferring device of the high-density integrated circuit lead frame electroplating production line of the utility model has, on the one hand, a positioning mechanism for adjusting the initial position of the clamping cylinder and the material holding slide plate. According to the different specifications and sizes of the grasped lead frames, the positioning mechanism is first operated to adjust the initial position of the clamping cylinder, so that the initial distance between the clamping fingers of the two sets of clamping mechanisms is adapted to the width of the lead frame, which can meet the requirements of the corresponding size of the lead frame to be taken and placed, thereby improving the efficiency of taking and placing. On the other hand, the shift drive module can drive the shift slide and the film lifter to exit or enter the lead frame stacking station, so as to make room during the loading process and replace the next stack of lead frames, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of a material lifting and transferring device of a high-density integrated circuit lead frame electroplating production line in an embodiment.

[0025] Figure 2 Schematic diagram of the sheet lifting mechanism in the embodiment.

[0026] Figure 3 It is a schematic structural diagram of the material transfer hand assembly in the embodiment.

[0027] Figure 4 Schematic diagram of the structure of the material holding module in the embodiment.

[0028] Figure 5 It is an exploded view of the material holding module in the embodiment.

[0029] Figure 6 Schematic diagram of the structure of the clamping finger in the embodiment

[0030] Reference numerals:

[0031] Machine 1;

[0032] Main conveying mechanism 31;

[0033] The sheet lifting mechanism 4, the shifting slide rail 41, the shifting slide seat 42, the shifting driving module 43, the sheet lifting slide rail 44, the sheet lifting seat 45, the base portion 451, the extension portion 452, the sheet lifting portion 453, the top material surface 454, the sheet lifting driving module 46, the sheet lifting motor 461, the sheet lifting screw rod 462, and the alignment plate 47;

[0034] Material transfer hand assembly 5, material holding module 50, material holding base 51, material clamping mechanism 52, material holding slide plate 53, material clamping fingers 54, material clamping tooth groove 541, material clamping cylinder 55, material holding slide rail 56, material holding slide seat 57, support arm 58, support seat 59, first material clamping group 510, second material clamping group 511, material clamping slide rod 512, vacuum suction tube 513; moving module 514, positioning screw 515. DETAILED DESCRIPTION

[0035] The following will be combined with the accompanying drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] The material lifting and transferring device of the high-density integrated circuit lead frame electroplating production line of this embodiment is as follows: Figures 1 to 6 As shown, it includes a machine table 1 and a main conveying mechanism 31 installed on the machine table 1 for conveying the lead frames in a horizontal position. A lifting mechanism 4 for supporting the stacked lead frames is arranged below the machine table 1, and a material transfer hand assembly 5 for transferring the lead frames one by one between the main conveying mechanism 31 and the lifting mechanism 4 is arranged above the machine table 1, which can take the materials by adsorption or clamping. The stacked lead frames are located at the lifting mechanism 4, and the material transfer hand assembly 5 sucks and places the stacked lead frames one by one onto the main conveying mechanism 31.

[0037] In this embodiment, the film lifting mechanism 4 includes a shift slide 41 installed on the machine 1 and arranged along the width direction of the main conveying mechanism 31, a shift slide 42 slidably installed on the shift slide 41, a shift driving module 43 for driving the shift slide 42 to move, a film lifting slide 44 vertically installed on the shift slide 42, a film lifting seat 45 slidably installed on the film lifting slide 44, and a film lifting driving module 46 for driving the film lifting seat 45 to move up and down. The shift driving module 43 can drive the shift slide and the film lifting seat 45 to exit or enter the lead frame stacking station, so as to make room during the loading process and replace the next stack of lead frames.

[0038] Specifically, the upper end of the sheet lifting slide 44 is fixedly connected to the shift slide 42, and the lower end of the sheet lifting slide 44 is fixedly connected to the alignment plate 47. The number of the sheet lifting slides 44 is more than two, and this example shows four. Specifically, the sheet lifting drive module 46 includes a sheet lifting motor 461 and a sheet lifting screw 462. The two ends of the sheet lifting screw 462 are rotatably mounted on the shift slide 42 and the alignment plate 47. The sheet lifting seat 45 is threadedly connected with the sheet lifting screw 462. The sheet lifting motor 461 is used to drive the sheet lifting screw 462 to rotate via a transmission pulley to realize the lifting movement of the sheet lifting seat 45.

[0039] Specifically, the film lift seat 45 includes a base portion 451, an extension portion 452 and a film lift portion 453. The base portion 451 is provided with a driving portion threadedly connected to the film lift screw 462 and a guide hole for the film lift slide rail 44 to pass through. The extension portion 452 and the base portion 451 are arranged in a T shape with each other. The film lift portion 453 is fixed to the end of the extension portion 452 away from the base portion 451. The film lift portion 453 is provided with a top material surface 454 that supports the stacked lead frame. Specifically, the film lift portion 453 is in the shape of a "7", which includes a vertical portion vertically fixed to the extension portion 452 and a horizontal portion fixed to the upper end of the vertical portion, and the top material surface 454 is located on the top surface of the horizontal portion. This structure enables the top material surface 454 to support the relatively central position of the lead frame, and the lifting is more stable.

[0040] The material transfer hand assembly 5 is used to move the stacked lead frames on the film lift seat 45 to the main conveying mechanism 31 piece by piece, or to move the lead frames on the main conveying mechanism 31 to the film lift seat 45 for stacking and unloading. The material transfer hand assembly 5 includes a material holding module 50 and a moving module 514. The moving module 514 is used to drive the material holding module 50 to move horizontally and vertically. For details, please refer to the mechanism disclosed in the Chinese patent document with publication number CN219566761U or the Chinese patent document with publication number CN219216699U, or use the gantry robot arm of the existing technology, which will not be elaborated here. The main improvements of this embodiment are:

[0041] The material holding module 50 includes a material holding base 51 and two groups of clamping mechanisms 52. Each group of clamping mechanisms 52 includes a material holding slide 53 slidably mounted on the material holding base 51, a material clamping finger 54 fixed to the material holding slide 53, and a material clamping cylinder 55 for driving the material holding slide 53 to move, so as to drive the two groups of clamping fingers 54 to move closer or farther to pick up and place the lead frame. The material holding base 51 is provided with two parallel material holding slide rails 56, and the material holding slide rails 53 of the two groups of clamping mechanisms 52 are respectively provided with material holding slide seats 57 adapted to the material holding slide rails 56 to achieve directional sliding.

[0042] In this embodiment, a support arm 58 is provided at the top of the material holding base 51. The support arm 58 is L-shaped, with a short side fixed to the top of the material holding base 51 and a long side arranged parallel to the plane of the support 59. Each group of clamping mechanisms 52 corresponds to a support 59, the cylinder of the clamping cylinder 55 is fixed to the support 59, and the piston rod of the clamping cylinder 55 is fixedly connected to the material holding slide plate 53. The two groups of clamping mechanisms 52 are respectively a first clamping group 510 and a second clamping group 511. The support 59 of the first clamping group 510 is fixed to the support arm 58, and a clamping slide bar 512 is fixed to the support 59 of the first clamping group 510. The support 59 of the second clamping group 511 is slidably connected to the clamping slide bar 512, and the clamping slide bar 512 is arranged in parallel with the adjustment screw. It can be seen from this that the support 59 of the first clamping group 510 and the cylinder barrel of the clamping cylinder 55 are stationary relative to the support arm 58, while the support 59 and the clamping cylinder 55 of the second clamping group 511 can move relative to the support arm 58. By adjusting the position of the support 59 of the second clamping group 511, the distance between the clamping fingers 54 of the first clamping group 510 and the clamping fingers 54 of the second clamping group 511 can be changed, thereby adapting to the requirements of taking and placing lead frames of different widths and improving the efficiency of taking and placing.

[0043] Specifically, the support 59 of the second clamping group 511 is adjusted as follows: the material holding base 51 is also provided with an adjustment mechanism for adjusting the initial position of the clamping cylinder 55 and the material holding slide plate 53, and the adjustment mechanism includes an adjustment screw 515, which is rotatably mounted on the support arm 58, and the support arm 58 is threadedly connected to the support 59. The position of the support 59 of the second clamping group 511 can be adjusted by manually rotating the adjustment screw 515, and the adjustment method is simple and convenient.

[0044] It should be noted that in this example, only the support 59 of one clamping group is movable. In practice, the support 59 of the first clamping group 510 can be threadedly connected to the support arm 58, so that the supports 59 of the two clamping groups can be adjusted in reverse at the same time.

[0045] In this embodiment, the number of clamping fingers 54 corresponding to the holding slide plate 53 of each group of clamping mechanisms 52 is multiple, and the multiple clamping fingers 54 are spaced apart along the length direction of the holding slide plate 53. The clamping side of the clamping finger 54 is an inclined surface, and the inclined surface is provided with a clamping tooth groove 541, so as to more stably clamp the side of the lead frame.

[0046] In this embodiment, the material holding slide plate 53 is provided with a plurality of vacuum suction tubes 513 along its length direction. According to the type of the lead frame, a vacuum suction method or a clamping method with the clamping fingers 54 can be selected.

[0047] In the description of the present invention, it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations.

[0048] Therefore, the above detailed description of the embodiments of the utility model provided in the accompanying drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of the utility model.

[0049] In the description of the present utility model, it should be noted that the terms "middle", "upper", "lower", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invented product is usually placed when in use, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. The material lifting and transferring device of the high-density integrated circuit lead frame electroplating production line is characterized by: It includes a machine platform and a main conveying mechanism installed on the machine platform for conveying a lead frame in a horizontally lying posture; A film lifting mechanism for supporting the stacked lead frames is arranged below the machine platform, and the film lifting mechanism includes a shift slide rail arranged along the width direction of the main conveying mechanism, a shift slide seat slidably mounted on the shift slide rail, a shift driving module for driving the shift slide seat to move, a film lifting slide rail vertically mounted on the shift slide seat, a film lifting seat slidably mounted on the film lifting slide rail, and a film lifting driving module for driving the film lifting seat to move up and down; A material transfer hand assembly is arranged above the machine table for transferring the lead frame piece by piece between the main conveying mechanism and the lifting mechanism, and includes a material holding module and a moving module for driving the material holding module to move laterally and longitudinally. The material holding module includes a material holding base and two groups of clamping mechanisms. Each group of clamping mechanisms includes a material holding slide slidably mounted on the material holding base, clamping fingers fixed to the material holding slide and a clamping cylinder for driving the material holding slide to move, so as to drive the two groups of clamping fingers to move closer or farther to pick up and place the lead frame; the material holding base is also provided with a positioning mechanism for adjusting the clamping cylinder and the initial position of the material holding slide.

2. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized in that: The film lifting mechanism includes a shift slide rail arranged along the width direction of the main conveying mechanism, a shift slide slidably mounted on the shift slide rail, a shift drive module for driving the shift slide to move, a film lifting slide rail vertically mounted on the shift slide, a film lifting seat slidably mounted on the film lifting slide rail, and a film lifting drive module for driving the film lifting seat to move up and down.

3. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 2 is characterized in that: The upper end of the sheet-lifting slide rail is fixedly connected to the shift slide seat, and the lower end of the sheet-lifting slide rail is fixedly connected to the alignment plate. The number of the sheet-lifting slide rails is more than two.

4. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 3 is characterized in that: The film lifting drive module includes a film lifting motor and a film lifting screw. The two ends of the film lifting screw are rotatably installed on the shift slide and the alignment plate. The film lifting seat and the film lifting screw are threadedly connected. The film lifting motor is used to drive the film lifting screw to rotate.

5. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized in that: Holding material The base is provided with a material holding slide rail, and the material holding slide plates of the two groups of clamping mechanisms are respectively provided with a material holding slide seat matched with the material holding slide rail.

6. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized in that: A support arm and a support are arranged on the top of the material holding base. The support can slide relative to the support arm. The cylinder barrel of the clamping cylinder is fixed to the support. The piston rod of the clamping cylinder is fixedly connected to the material holding slide plate.

7. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 6 is characterized by: The positioning mechanism comprises a positioning screw rod, which is rotatably mounted on the support arm, and the support arm is threadedly connected to the support seat.

8. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 7 is characterized in that: The two groups of clamping mechanisms are respectively the first clamping group and the second clamping group. The support of the first clamping group is fixed to the support arm. The support of the first clamping group is fixed with a clamping slide rod. The support of the second clamping group is slidably connected to the clamping slide rod. The clamping slide rod is arranged in parallel with the adjusting screw rod.

9. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 1 is characterized in that: The material holding slide plate of each group of material clamping mechanisms corresponds to a plurality of material clamping fingers, and the plurality of material clamping fingers are distributed at intervals along the length direction of the material holding slide plate.

10. The material lifting and transferring device for the high-density integrated circuit lead frame electroplating production line according to claim 1, characterized in that: The clamping side of the clamping finger is an inclined surface, and the inclined surface is provided with a clamping tooth groove.

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