Semiconductor processing equipment
By setting up gate valves and control gas circuit systems in semiconductor processing equipment, the purging and pressure adjustment of the feeding chamber and handling chamber are achieved, the pollution problem in the prior art is solved, and the cleaning effect of the equipment and the yield of the silicon wafer are improved. .
Patent Information
- Application Number
- CN202420995706.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-09
AI Technical Summary
Existing semiconductor epitaxial equipment cannot effectively avoid contamination of particulate matter and reaction by-products during silicon wafer transmission, resulting in limited cleaning effect.
A semiconductor processing equipment is designed, by setting a first gate valve between the feeding chamber and the handling chamber, and setting intake and exhaust pipes in the air circuit system, the valve body is controlled to open and close with a controller to achieve upward adjustment. 料腔和搬运腔的同时或独立吹扫,防止有害气体流向和尾气倒流。
It improves the cleaning effect of the equipment, prevents harmful gases from flowing into the feeding chamber, and prevents the exhaust gas of the reaction chamber from flowing back to the handling chamber, which significantly improves the cleanliness and yield of the silicon wafer.
Smart Images
Figure CN222260999U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing device. Background Art
[0002] Existing semiconductor epitaxial equipment involves multiple processes such as the transfer, transmission, heating, chemical process treatment and cooling of silicon wafers. However, due to the extremely high environmental requirements of semiconductor devices, the number of particles directly affects the yield rate of silicon wafers processed by semiconductor epitaxial equipment. Therefore, semiconductor epitaxial equipment has extremely high requirements for the airtightness and cleanliness of the silicon wafer transmission environment. It is required that in the process of transferring silicon wafers from external equipment to semiconductor epitaxial equipment, external particles will not enter the equipment transmission environment to cause particle accumulation; at the same time, it is also necessary to ensure that by-products and chemical gas residues in the reaction chamber will not enter the equipment transmission environment and cause pollution to the silicon wafers.
[0003] In the prior art, high-purity nitrogen is used to continuously purge the loading chamber, which only pumps and purges the environment inside the loading chamber. It is impossible to pump and replace the gas in the transport chamber connected to the reaction chamber. Therefore, the cleaning effect is limited, and it cannot prevent the reaction by-products in the reaction chamber from being brought into the transport chamber during the silicon wafer transmission process and accumulating, causing particle contamination to the silicon wafer.
[0004] Based on this, there is an urgent need for a semiconductor processing equipment to solve the above-mentioned problems. Utility Model Content
[0005] Based on the above, the purpose of the utility model is to provide a semiconductor processing equipment, which realizes simultaneous or independent purge of the loading chamber and the transport chamber to improve the cleaning effect; prevents harmful gases in the transport chamber from flowing to the loading chamber; and prevents the exhaust gas from the reaction chamber from flowing back to the transport chamber.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A semiconductor processing device, comprising:
[0008] A feeding chamber, a transport chamber and a reaction chamber connected in sequence, a first gate valve is provided between the feeding chamber and the transport chamber, and a second gate valve is provided between the transport chamber and the reaction chamber;
[0009] An air circuit system, comprising an air intake device, a first air intake pipeline, a second air intake pipeline, a first exhaust pipeline and a second exhaust pipeline, wherein the first air intake pipeline is provided with a first valve body, the second air intake pipeline is provided with a second valve body, the first exhaust pipeline is provided with a third valve body, and the second exhaust pipeline is provided with a fourth valve body;
[0010] The two ends of the first air intake pipe are respectively connected to the air intake device and the loading chamber, and the air intake end of the first exhaust pipe is connected to the loading chamber; the two ends of the second air intake pipe are respectively connected to the air intake device and the transport chamber, and the air intake end of the second exhaust pipe is connected to the transport chamber;
[0011] A controller, wherein the first gate valve, the second gate valve, the first valve body, the second valve body, the third valve body and the fourth valve body are all communicatively connected to the controller.
[0012] As a preferred technical solution for semiconductor processing equipment, it also includes:
[0013] A first pressure detection unit, which is used to detect the gas pressure in the feeding chamber;
[0014] a second pressure detection unit, which is used to detect the gas pressure in the transport chamber;
[0015] The first pressure detection unit and the second pressure detection unit are both in communication connection with the controller.
[0016] As a preferred technical solution for semiconductor processing equipment, it also includes a third pressure detection unit, which is used to detect the gas pressure in the reaction chamber; the third pressure detection unit is communicatively connected to the controller.
[0017] As a preferred technical solution for semiconductor processing equipment, the gas circuit system also includes a first air intake branch, the two ends of which are respectively connected to the air intake device and the loading chamber, and the first air intake branch is provided with an eighth valve body and a flow limiting adjustment component which are communicated with the controller.
[0018] As a preferred technical solution of semiconductor processing equipment, the gas circuit system further includes a first main pipeline and a first safety branch, one end of the first main pipeline is connected to the air intake device, and the other end is connected to the first air intake pipeline and the second air intake pipeline;
[0019] The first main pipeline is provided with a first back pressure valve, one end of the first safety branch is connected to the inlet of the first back pressure valve, and the other end is connected to the outlet of the first back pressure valve, and the first safety branch is provided with a fifth valve body.
[0020] As a preferred technical solution for semiconductor processing equipment, the gas circuit system also includes a second safety branch, a one-way pressure relief valve is arranged on the second safety branch, a second back-pressure valve is arranged on the second exhaust pipe, the inlet of the one-way pressure relief valve is connected to one end connected to the inlet of the second back-pressure valve, and the outlet of the one-way pressure relief valve is connected to the outlet of the second back-pressure valve.
[0021] As an optimal technical solution for semiconductor processing equipment, it also includes an exhaust system, which includes a vacuum pump and a first exhaust pipe, a sixth valve body is provided on the first exhaust pipe, and both ends of the first exhaust pipe are respectively connected to the vacuum pump and the loading chamber; the sixth valve body is communicatively connected to the controller.
[0022] As a preferred technical solution for semiconductor processing equipment, the exhaust system also includes a second exhaust pipe, on which a seventh valve body and a needle valve are provided, and both ends of the second exhaust pipe are connected to the vacuum pump and the loading chamber respectively, and the seventh valve body and the needle valve are both communicatively connected to the controller.
[0023] As a preferred technical solution for semiconductor processing equipment, a vacuum gauge which is communicatively connected to the controller is also provided on the second exhaust pipe.
[0024] As a preferred technical solution for semiconductor processing equipment, the loading chamber, the first gate valve, the first air inlet pipe, the first exhaust pipe and the exhaust system are multiple and correspond to each other one by one.
[0025] The beneficial effects of the utility model are:
[0026] The utility model provides a semiconductor processing equipment. When backfilling and purging the loading chamber and the transport chamber, the controller controls the first gate valve, the first valve body, the second valve body, the third valve body and the fourth valve body to open, the second gate valve to close, the air intake device supplies air to the loading chamber through the first air intake pipeline, and then discharges it through the first exhaust pipeline, so as to achieve the purging of the loading chamber. The air intake device also supplies air to the transport chamber through the second air intake pipeline, and then discharges it through the second exhaust pipeline, so as to achieve the purging of the loading chamber and the transport chamber at the same time. In addition, the controller can also control the first gate valve and the second gate valve to close, and the first valve body, the second valve body, the third valve body and the fourth valve body to open, so as to achieve the independent purging of the loading chamber and the transport chamber, so as to achieve the independent enhanced cleaning effect.
[0027] Furthermore, the semiconductor processing equipment can use a controller to control the closing of the first gate valve and the second gate valve, so that the loading chamber, the transport chamber and the reaction chamber are independent. The controller controls the opening and closing of the first valve body and the third valve body to adjust the pressure of the loading chamber, and controls the opening and closing of the second valve body and the fourth valve body to adjust the pressure of the transport chamber. Through the above-mentioned adjustment method, the pressure of the loading chamber is adjusted to be greater than that of the transport chamber, so when the first gate valve is opened, harmful gases in the transport chamber can be prevented from flowing into the loading chamber; the pressure of the transport chamber can also be adjusted to be greater than that of the reaction chamber, so as to prevent the tail gas of the reaction chamber from flowing back to the transport chamber and affecting the surface state of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0029] Figure 1 It is a structural schematic diagram of a semiconductor processing device provided by a specific embodiment of the utility model;
[0030] Figure 2 It is a top view of a semiconductor processing device provided by a specific embodiment of the utility model.
[0031] The following are marked in the figure:
[0032] 1. Loading chamber; 2. Transport chamber; 3. Reaction chamber; 41. First gate valve; 42. Second gate valve; 5. Gas circuit system; 51. First air inlet pipeline; 511. First valve body; 52. Second air inlet pipeline; 521. Second valve body; 53. First exhaust pipeline; 531. Third valve body; 54. Second exhaust pipeline; 541. Fourth valve body; 542. Second back pressure valve; 55. First air inlet branch; 551. Eighth valve body; 552. Current limiting adjusting member; 56. First main pipeline; 561. First back pressure valve; 57. First safety branch; 571. Fifth valve body; 58. Second safety branch; 581. One-way pressure relief valve;
[0033] 61. First pressure detection unit; 62. Second pressure detection unit; 7. Air extraction system; 71. First air extraction pipeline; 711. Sixth valve body; 72. Second air extraction pipeline; 721. Seventh valve body; 722. Needle valve; 723. Vacuum gauge. DETAILED DESCRIPTION
[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0037] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0038] like Figure 1 and Figure 2As shown, this embodiment provides a semiconductor processing equipment, which includes a loading chamber 1, a transport chamber 2 and a reaction chamber 3 connected in sequence, and also includes a gas circuit system 5 and a controller. A first gate valve 41 is provided between the loading chamber 1 and the transport chamber 2, and a second gate valve 42 is provided between the transport chamber 2 and the reaction chamber 3; the gas circuit system 5 includes an air intake device, a first air intake pipeline 51, a second air intake pipeline 52, a first exhaust pipeline 53 and a second exhaust pipeline 54. The first air intake pipeline 51 is provided with a first valve body 511, and the second air intake pipeline 52 is provided with a second valve body 512. 21, a third valve body 531 is provided on the first exhaust pipe 53, and a fourth valve body 541 is provided on the second exhaust pipe 54; both ends of the first air intake pipe 51 are respectively connected with the air intake device and the loading chamber 1, and the air intake end of the first exhaust pipe 53 is connected with the loading chamber 1; both ends of the second air intake pipe 52 are respectively connected with the air intake device and the conveying chamber 2, and the air intake end of the second exhaust pipe 54 is connected with the conveying chamber 2; the first gate valve 41, the second gate valve 42, the first valve body 511, the second valve body 521, the third valve body 531 and the fourth valve body 541 are all connected to the controller for communication.
[0039] When backfilling and purging the loading chamber 1 and the transport chamber 2, the controller controls the first gate valve 41, the first valve body 511, the second valve body 521, the third valve body 531 and the fourth valve body 541 to open, and the second gate valve 42 to close. The air intake device supplies air to the loading chamber 1 through the first air intake pipe 51, and then discharges it through the first exhaust pipe 53, so as to achieve the purge of the loading chamber 1. The air intake device also supplies air to the transport chamber 2 through the second air intake pipe 52, and then discharges it through the second exhaust pipe 54, so as to achieve the simultaneous purge of the loading chamber 1 and the transport chamber 2. In addition, the controller can also control the first gate valve 41 and the second gate valve 42 to close, and the first valve body 511, the second valve body 521, the third valve body 531 and the fourth valve body 541 to open, so as to achieve the independent purge of the loading chamber 1 and the transport chamber 2, so as to achieve the independent enhanced cleaning effect. Furthermore, the semiconductor processing equipment can use a controller to control the closing of the first gate valve 41 and the second gate valve 42, so that the loading chamber 1, the transport chamber 2 and the reaction chamber 3 are independent. The controller controls the opening and closing of the first valve body 511 and the third valve body 531 to adjust the pressure of the loading chamber 1, and controls the opening and closing of the second valve body 521 and the fourth valve body 541 to adjust the pressure of the transport chamber 2. Through the above-mentioned adjustment method, the pressure of the loading chamber 1 is adjusted to be greater than that of the transport chamber 2. Therefore, when the first gate valve 41 is opened, it can prevent the harmful gas in the transport chamber 2 from flowing into the loading chamber 1; it can also adjust the pressure of the transport chamber 2 to be greater than that of the reaction chamber 3, so as to prevent the tail gas in the reaction chamber 3 from flowing back to the transport chamber 2 and affecting the surface state of the wafer.
[0040] Furthermore, the semiconductor processing equipment also includes a first pressure detection unit 61 and a second pressure detection unit 62, the first pressure detection unit 61 is used to detect the gas pressure in the loading chamber 1; the second pressure detection unit 62 is used to detect the gas pressure in the transport chamber 2; the first pressure detection unit 61 and the second pressure detection unit 62 are both communicatively connected to the controller, and the controller can control the opening and closing of the first gate valve 41, the second gate valve 42, the first valve body 511, the second valve body 521, the third valve body 531 and the fourth valve body 541 according to the data of the first pressure detection unit 61 and the second pressure detection unit 62, thereby realizing automatic adjustment of the purge pressure of the loading chamber 1 and the transport chamber 2 to prevent the purge pressure from being too large or too small.
[0041] Preferably, the semiconductor processing equipment further includes a third pressure detection unit, which is used to detect the gas pressure in the reaction chamber 3; the third pressure detection unit is connected to the controller for communication. The controller accurately obtains the pressure of the reaction chamber 3 according to the third pressure detection unit, and when the pressure of the transport chamber 2 is greater than the pressure of the reaction chamber 3, the second gate valve 42 is opened to prevent the tail gas of the reaction chamber 3 from flowing back into the transport chamber 2.
[0042] Furthermore, the gas circuit system 5 also includes a first air intake branch 55, the two ends of which are connected to the air intake device and the feeding chamber 1 respectively, and the first air intake branch 55 is provided with an eighth valve body 551 and a flow limiting adjustment member 552 which are connected to the controller in communication. When the feeding chamber 1 is in a vacuum and needs to be backfilled, first, the air intake device supplies air to the feeding chamber 1 through the first air intake pipe 51 to achieve rapid backfilling. When the pressure of the feeding chamber 1 reaches the first preset pressure, the controller controls the first valve body 511 to be disconnected and the eighth valve body 551 to be opened. The air intake device supplies air to the feeding chamber 1 through the first air intake branch 55. The flow limiting adjustment member 552 can adjust the opening of the first air intake branch 55, thereby achieving the regulation of the gas flow rate, achieving slow backfilling, and improving the regulation accuracy of the pressure in the feeding chamber 1. In this embodiment, the first preset pressure is 0.8PSI. Furthermore, during the purging process, the purging pressure is accurately controlled to prevent the purging pressure from being too high and improve the purging effect. In this embodiment, the current limiting adjustment member 552 may be a current limiting gasket.
[0043] Preferably, the gas circuit system 5 further includes a first main pipeline 56 and a first safety branch 57. One end of the first main pipeline 56 is connected to the air intake device, and the other end is connected to the first air intake pipeline 51 and the second air intake pipeline 52. A first back pressure valve 561 is provided on the first main pipeline 56. One end of the first safety branch 57 is connected to the inlet of the first back pressure valve 561, and the other end is connected to the outlet of the first back pressure valve 561. A fifth valve body 571 is provided on the first safety branch 57. When working, the fifth valve body 571 is disconnected, the first back pressure valve 561 is opened, and the air intake device delivers inert gas to the first air intake pipeline 51 and the second air intake pipeline 52 through the first main pipeline 56. The gas delivery pressure can also be adjusted through the first back pressure valve 561. When the equipment fails and the power is cut off, the fifth valve body 571 automatically switches to the open circuit state, and the air intake device can deliver gas through the first safety branch 57, which plays a role in protecting the air intake device.
[0044] Further preferably, the gas circuit system 5 further includes a second safety branch 58, a one-way pressure relief valve 581 is provided on the second safety branch 58, a second back pressure valve 542 is provided on the second exhaust pipe 54, an inlet of the one-way pressure relief valve 581 is connected to an inlet of the second back pressure valve 542 at one end, and an outlet of the one-way pressure relief valve 581 is connected to an outlet of the second back pressure valve 542. Similarly, by providing the second safety branch 58, when the second back pressure valve 542 is blocked, the gas can be discharged through the second safety branch 58, to prevent the problem of blockage of the gas circuit system 5.
[0045] Furthermore, the semiconductor processing equipment also includes an exhaust system 7, which includes a vacuum pump and a first exhaust pipe 71. A sixth valve body 711 is provided on the first exhaust pipe 71, and both ends of the first exhaust pipe 71 are respectively connected to the vacuum pump and the loading chamber 1; the sixth valve body 711 is communicatively connected to the controller, and when the controller controls the sixth valve body 711 to open, the vacuum pump can quickly exhaust air through the first exhaust pipe 71.
[0046] Preferably, the exhaust system 7 also includes a second exhaust pipe 72, on which a seventh valve body 721 and a needle valve 722 are provided, and both ends of the second exhaust pipe 72 are connected to the vacuum pump and the feeding chamber 1, respectively, and the seventh valve body 721 and the needle valve 722 are both connected to the controller for communication. When evacuating, first, the vacuum pump evacuates air into the upper feeding chamber 1 through the first exhaust pipe 71 to achieve rapid exhaust. When the pressure of the feeding chamber 1 reaches the second preset pressure, the controller controls the sixth valve body 711 to break the circuit and the seventh valve body 721 to open the circuit. The vacuum pump evacuates air into the upper feeding chamber 1 through the second exhaust pipe 72. The needle valve 722 can adjust the gas flow rate, achieve slow backfilling, and improve the adjustment accuracy of the vacuum degree.
[0047] Preferably, the second exhaust pipe 72 is also provided with a vacuum gauge 723 which is in communication with the controller, and the controller can obtain the vacuum degree of the loading chamber 1 through the vacuum gauge 723 .
[0048] Further preferably, the loading chamber 1, the first gate valve 41, the first air inlet pipe 51, the first exhaust pipe 53 and the exhaust system 7 are multiple and one-to-one corresponding, and the two loading chambers 1 can independently control the exhaust, backfilling or purging, and can both transport wafers to the transport chamber 2, thereby improving the loading efficiency of the wafers.
[0049] In this embodiment, the sixth valve body 711 is an angle valve, and the first valve body 511 , the second valve body 521 , the third valve body 531 , the fourth valve body 541 , the fifth valve body 571 , the sixth valve body 711 and the eighth valve body 551 are all diaphragm valves.
[0050] This embodiment also provides the working principle and working steps of the semiconductor processing equipment, which are as follows:
[0051] like Figure 1 and Figure 2 As shown, whenever the robot or the human hand places the whole box of wafers into the loading chamber 1, during the loading process, the loading chamber 1 is in the same environment as the atmosphere, and oxygen or particulate matter will enter the loading chamber 1. Therefore, after the loading process is completed, the first gate valve 41 is always kept closed to isolate the transport chamber 2 from the outside atmosphere.
[0052] Open the quick pumping system. To open the quick pumping system, you need to close the first valve body 511 and the eighth valve body 551, that is, close the air inlet pipeline of the loading chamber 1; close the second valve body 521, that is, close the air inlet pipeline of the transport chamber 2; close the third valve body 531, that is, close the exhaust pipeline of the loading chamber 1; close the fourth valve body 541, that is, close the exhaust pipeline of the transport chamber 2; open the first gate valve 41 to connect the loading chamber 1 with the transport chamber 2, keep the sixth valve body 711 open, the seventh valve body 721 closed, and turn on the vacuum pump to use the first exhaust pipeline 71 to vacuum the loading chamber 1 and the transport chamber 2. Usually, the two loading chambers 1 are loaded and unloaded separately, so they are also pumped and filled separately.
[0053] When the vacuum degree of the loading chamber 1 reaches the second preset pressure, the slow pumping system is turned on. When the slow pumping system is turned on, the air inlet and exhaust pipes of the loading chamber 1 are closed, and the air inlet and exhaust pipes of the conveying chamber 2 are closed; the sixth valve body 711 is closed, the seventh valve body 721 is opened, and the vacuum pump is turned on to use the second exhaust pipe 72 to evacuate the loading chamber 1 and the conveying chamber 2, and the exhaust rate is adjusted by the needle valve 722 to improve the adjustment accuracy of the vacuum degree.
[0054] When the loading chamber 1 and the transport chamber 2 are evacuated, the quick-pump system is usually turned on first. When the second preset pressure (about 280 torr) is reached, the pressure value set by the first pressure detection unit 61 is triggered. At this time, the controller automatically controls the closing of the sixth valve body 711, opens the seventh valve body 721, and switches from the first exhaust pipe 71 to the second exhaust pipe 72. At the same time, the needle valve 722 set on the second exhaust pipe 72 can control the vacuum rate by adjusting the opening size of the needle valve 722. The semiconductor processing equipment can also perform vacuum treatment on the loading chamber 1 separately by closing the first gate valve 41 to achieve a separate enhanced cleaning effect.
[0055] When the vacuum system draws the air pressure in the loading chamber 1 and the transport chamber 2 to the ultimate vacuum state (about 100 torr), the pressure value set by the vacuum gauge 723 will be triggered. At this time, the vacuum process ends, the vacuum pump is turned off, the sixth valve body 711 and the seventh valve body 721 are closed, and the backfilling operation of the loading chamber 1 begins.
[0056] The backfill system is divided into a fast backfill line and a slow backfill line. The first air inlet pipe 51 forms a fast backfill line, and the first air inlet branch 55 forms a slow backfill line. After the vacuum treatment is completed, the loading chamber 1 and the transport chamber 2 need to be quickly backfilled first. At this time, the first valve body 511 and the second valve body 521 need to be opened, that is, the first air inlet pipe 51 of the loading chamber 1 and the second air inlet pipe 52 of the transport chamber 2 are opened to perform gas backfilling operations. When the pressure in the chamber exceeds the first preset pressure (0.8PSI), the third valve body 531 and the eighth valve body 551 are opened, the first valve body 511 is closed, and the slow backfill state is turned on until the pressure in the loading chamber 1 remains constant, and the slow backfill state is maintained, and the gas in the loading chamber 1 is continuously purged and slowly replaced.
[0057] In addition, the semiconductor processing equipment can make each chamber independent by closing the first gate valve 41 between the loading chamber 1 and the transport chamber 2 and the second gate valve 42 between the transport chamber 2 and the reaction chamber 3, and by separately setting the pressure values of the first pressure detection unit 61, the second pressure detection unit 62 and the third pressure detection unit, the pressure state of the loading chamber 1 after backfilling is greater than the pressure state of the transport chamber 2 after backfilling is greater than the pressure state of the reaction chamber 3, thereby preventing the chemical gas in the reaction chamber 3 from overflowing into the transport chamber 2 and the loading chamber 1. Furthermore, at the moment when the second gate valve 42 between the reaction chamber 3 and the transport chamber 2 is opened, the fourth valve body 541 can be closed for a few seconds and then opened again. This operation can prevent the exhaust gas of the reaction chamber 3 from flowing back to the transport chamber 2 at the moment when the second gate valve 42 is opened, thereby preventing the exhaust gas of the reaction chamber 3 from flowing back to the transport chamber 2 and affecting the surface state of the wafer.
[0058] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims
1. A semiconductor processing equipment, characterized in that: include: A loading chamber (1), a transport chamber (2) and a reaction chamber (3) which are connected in sequence, a first gate valve (41) being provided between the loading chamber (1) and the transport chamber (2), and a second gate valve (42) being provided between the transport chamber (2) and the reaction chamber (3); An air circuit system (5), comprising an air intake device, a first air intake pipeline (51), a second air intake pipeline (52), a first exhaust pipeline (53) and a second exhaust pipeline (54), wherein the first air intake pipeline (51) is provided with a first valve body (511), the second air intake pipeline (52) is provided with a second valve body (521), the first exhaust pipeline (53) is provided with a third valve body (531), and the second exhaust pipeline (54) is provided with a fourth valve body (541); The two ends of the first air intake pipe (51) are respectively connected to the air intake device and the loading chamber (1), and the air intake end of the first air exhaust pipe (53) is connected to the loading chamber (1); the two ends of the second air intake pipe (52) are respectively connected to the air intake device and the transport chamber (2), and the air intake end of the second air exhaust pipe (54) is connected to the transport chamber (2); A controller, wherein the first gate valve (41), the second gate valve (42), the first valve body (511), the second valve body (521), the third valve body (531) and the fourth valve body (541) are all communicatively connected to the controller.
2. The semiconductor processing equipment according to claim 1, characterized in that Also includes: A first pressure detection unit (61) for detecting the gas pressure in the loading chamber (1); a second pressure detection unit (62), which is used to detect the gas pressure in the transport chamber (2); The first pressure detection unit (61) and the second pressure detection unit (62) are both communicatively connected to the controller.
3. The semiconductor processing equipment according to claim 1, characterized in that It also comprises a third pressure detection unit, which is used to detect the gas pressure in the reaction chamber (3); the third pressure detection unit is communicatively connected with the controller.
4. The semiconductor processing equipment according to claim 1, characterized in that The gas circuit system (5) further comprises a first air intake branch (55), the two ends of which are respectively connected to the air intake device and the feeding chamber (1), and the first air intake branch (55) is provided with an eighth valve body (551) and a flow limiting adjustment member (552) which are communicatively connected to the controller.
5. The semiconductor processing equipment according to claim 1, characterized in that The gas circuit system (5) further comprises a first main pipeline (56) and a first safety branch pipeline (57); one end of the first main pipeline (56) is connected to the air intake device, and the other end is connected to the first air intake pipeline (51) and the second air intake pipeline (52); A first back-pressure valve (561) is provided on the first main pipeline (56); one end of the first safety branch (57) is connected to the inlet of the first back-pressure valve (561), and the other end is connected to the outlet of the first back-pressure valve (561); and a fifth valve body (571) is provided on the first safety branch (57).
6. The semiconductor processing equipment according to claim 1, characterized in that The gas circuit system (5) further comprises a second safety branch (58), a one-way pressure relief valve (581) being arranged on the second safety branch (58), a second back pressure valve (542) being arranged on the second exhaust pipe (54), an inlet of the one-way pressure relief valve (581) being connected to an inlet of the second back pressure valve (542) at one end, and an outlet of the one-way pressure relief valve (581) being connected to an outlet of the second back pressure valve (542).
7. The semiconductor processing equipment according to claim 1, characterized in that It also includes an exhaust system (7), the exhaust system (7) includes a vacuum pump and a first exhaust pipe (71), a sixth valve body (711) is provided on the first exhaust pipe (71), and the two ends of the first exhaust pipe (71) are respectively connected to the vacuum pump and the loading chamber (1); the sixth valve body (711) is communicatively connected to the controller.
8. The semiconductor processing equipment according to claim 7, characterized in that: The exhaust system (7) further comprises a second exhaust pipe (72), on which a seventh valve body (721) and a needle valve (722) are provided, and two ends of the second exhaust pipe (72) are respectively connected to the vacuum pump and the loading chamber (1), and the seventh valve body (721) and the needle valve (722) are both communicatively connected to the controller.
9. The semiconductor processing equipment according to claim 8, characterized in that The second air extraction pipeline (72) is also provided with a vacuum gauge (723) which is in communication connection with the controller.
10. The semiconductor processing equipment according to claim 7, characterized in that The loading chamber (1), the first gate valve (41), the first air intake pipe (51), the first air exhaust pipe (53) and the air extraction system (7) are multiple and correspond to each other one by one.