Packaging structure with heat dissipation channel
By introducing heat dissipation channels and inclined top surface design into the package structure, the heat accumulation problem caused by 3D chip stacking is solved, and more efficient heat dissipation performance is achieved, ensuring the flowability of the coolant, and improving the thermal management capability of the chip.
Patent Information
- Application Number
- CN202323309987.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-05
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-05
AI Technical Summary
3D chip stacking technology leads to accumulation of heat in the chip, insufficient heat dissipation performance, affecting the thermal reliability of the chip, especially in multi-chip packaging structures, the heat dissipation problem is even more serious.
Design a package structure with a heat dissipation channel, including a substrate, a chip unit, a plastic seal, a cooling cover and a cooling liquid. The heat dissipation channel surrounds the chip unit, the cooling liquid vaporizes in the heat dissipation channel and dissipates heat through the cooling cover, and the top surface of the plastic seal is inclined. Designed to prevent coolant from accumulating and improve coolant flowability.
It effectively improves the heat dissipation performance of the packaging structure, prevents the accumulation of coolant, ensures the coolant flows in the structure, and enhances the thermal management capabilities of the chip.
Smart Images
Figure CN222261031U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging, and in particular to a packaging structure with a heat dissipation channel. Background Art
[0002] As Moore's Law slows down, in order to continue to improve device performance, the industry has turned to 3D chip stacking interconnection technology. 3D chip stacking interconnection technology can both increase the bandwidth between chips and improve computing performance. However, chip stacking poses a great challenge to heat dissipation. Stacking multiple dies in a chip unit leads to heat accumulation, and the heat flux density per unit area is greatly increased. If heat cannot be dissipated through effective means, it will inevitably lead to problems with chip thermal reliability. At the same time, when multiple stacked chips are packaged in a packaging structure, the heat dissipation problem is further exacerbated.
[0003] Therefore, how to improve the heat dissipation performance of the packaging structure has become the focus of current research. Summary of the invention
[0004] The technical problem solved by the utility model is how to improve the heat dissipation performance of the packaging structure.
[0005] In order to solve the above technical problems, an embodiment of the utility model provides a packaging structure with a heat dissipation channel, comprising: a substrate; at least one chip unit, arranged on the substrate; a plastic package body, covering the chip unit, a heat dissipation channel is arranged in the plastic package body and surrounds the chip unit, the opening of the heat dissipation channel is located on the top surface of the plastic package body, and cooling liquid is arranged in the heat dissipation channel; a cooling cover, arranged on the top surface of the plastic package body, the cooling cover and the top surface of the plastic package body enclose a cooling cavity, and the opening is located at the bottom of the cooling cavity, and the top surface of the plastic package body surrounded by the opening has a slope inclined toward the opening.
[0006] In one embodiment, when the packaging structure includes a plurality of the chip units, the heat dissipation channel surrounds each of the chip units, and the top surface of the plastic package body in each area surrounded by the opening has a slope inclined toward the opening.
[0007] In one embodiment, the top surface of the plastic package body surrounded by the opening has a conical configuration.
[0008] In one embodiment, the slope is inclined from one side of the top surface of the plastic package body to the other side.
[0009] In one embodiment, the heat dissipation channel is arranged in the outer edge area of the plastic package body, and all the chip units are located in the area enclosed by the heat dissipation channel.
[0010] In one embodiment, at the bottom of the cooling cavity, the top surface of the plastic package body located between the opening and the side edge of the cooling cover has a slope inclined toward the opening.
[0011] In one embodiment, the liquid level of the coolant is lower than the edge of the opening, or the liquid level of the coolant is flush with the edge of the opening.
[0012] In one embodiment, the heat dissipation channel runs through the plastic package to the substrate.
[0013] In one embodiment, an isolation layer is provided on the surface of the substrate, and the surface of the isolation layer serves as the bottom surface of the heat dissipation channel.
[0014] In one embodiment, a heat conducting layer is provided on the inner surface of the heat dissipation channel and the top surface of the plastic package body.
[0015] In one embodiment, the cooling cover is an inverted concave configuration, and the bottom of the side edge of the cooling cover is arranged on the top surface of the plastic packaging body and connected to the heat conductive layer.
[0016] In one embodiment, the bottom of the side edge of the cooling cover is bent toward the cooling cavity to form a connecting portion, and the connecting portion is welded to the heat conducting layer.
[0017] In one embodiment, the chip unit includes one chip or a plurality of stacked chips, or the chip unit includes a combination of one chip and a plurality of stacked chips.
[0018] In the packaging structure provided by the embodiment of the utility model, the heat dissipation channel surrounds the chip unit, and the opening of the heat dissipation channel is located at the bottom of the cooling cavity. The heat dissipation channel and the cooling cavity constitute a heat dissipation space surrounding the chip unit. When the heat inside the packaging structure, such as the heat of the chip unit, is transferred to the coolant, the coolant absorbs the heat and vaporizes. The vaporized coolant rises into the cooling cavity and condenses at the cooling cover, thereby dissipating the heat through the cooling cover to achieve heat dissipation of the packaging structure. At the same time, the top surface of the plastic package surrounded by the opening has a slope inclined toward the opening. After the coolant condensed at the cooling cover drips, it will flow back into the heat dissipation channel and will not remain on the top surface of the plastic package, so that the coolant can flow better inside the packaging structure, further improving the heat dissipation performance of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 It is a top view of a packaging structure with a heat dissipation channel provided by an embodiment of the utility model;
[0021] Figure 2 is along Figure 1 A-A1 cross-sectional view;
[0022] Figure 3 is a top view schematic diagram of a packaging structure with a heat dissipation channel provided by another embodiment of the utility model;
[0023] Figure 4 is along Figure 3 A-A1 cross-sectional view;
[0024] Figure 5 A packaging structure with a heat dissipation channel provided by another embodiment of the utility model Figure 3 Schematic diagram of the cross section along the A-A1 axis. DETAILED DESCRIPTION
[0025] The specific implementation of the packaging structure with heat dissipation channel provided by the utility model is described in detail below with reference to the accompanying drawings.
[0026] Figure 1 1 is a top view of a packaging structure with a heat dissipation channel provided by an embodiment of the utility model. Figure 2 is along Figure 1 For a schematic diagram of the cross section along the A-A1 axis, please refer to Figure 1 and Figure 2 , the packaging structure includes a substrate 100, at least one chip unit 110, a plastic package 120 and a cooling cover 130. The chip unit 110 is arranged on the substrate 100; the plastic package 120 covers the chip unit 110, a heat dissipation channel 140 is arranged in the plastic package 120 and surrounds the chip unit 110, the opening 141 of the heat dissipation channel 140 is located on the top surface of the plastic package 120, and a coolant 160 is arranged in the heat dissipation channel 140; the cooling cover 130 is arranged on the top surface of the plastic package 120, the cooling cover 130 and the top surface of the plastic package 120 enclose a cooling cavity 170, and the opening 141 is located at the bottom of the cooling cavity 170, and the top surface of the plastic package 120 surrounded by the opening 141 has a slope 180 inclined toward the opening 141. Wherein, Figure 1 The cooling cover 130 is removed.
[0027] In the packaging structure of the present invention, the heat dissipation channel 140 surrounds the chip unit 110, and the opening 141 of the heat dissipation channel 140 is located at the bottom of the cooling cavity 170. The heat dissipation channel 140 and the cooling cavity 170 constitute a heat dissipation space surrounding the chip unit 110. When the heat inside the packaging structure, such as the heat of the chip unit 110, is transferred to the coolant 160, the coolant 160 absorbs the heat and then vaporizes. The vaporized coolant 160 rises into the cooling cavity 170 and condenses at the cooling cover 130, thereby dissipating the heat through the cooling cover 130 to achieve heat dissipation of the packaging structure. At the same time, the top surface of the plastic package body 120 surrounded by the opening 141 has a slope 180 inclined toward the opening 141. After the coolant 160 condensed on the cooling cover 130 drips, it will flow back into the heat dissipation channel 140 and will not remain on the top surface of the plastic package body 120, so that the coolant 160 can flow better inside the packaging structure, further improving the heat dissipation performance of the packaging structure.
[0028] The substrate 100 includes a substrate and a conductive interconnection layer disposed in the substrate. The chip unit 110 is connected to the conductive interconnection layer via a solder pad on the surface of the substrate 100, thereby realizing interconnection between the chip units 110 or electrical connection between the chip units 110 and external devices.
[0029] The package structure includes at least one chip unit 110. For example, in this embodiment, the package structure includes two chip units 110. In another embodiment, the package structure includes one chip unit 110 or three or more chip units 110, which is not limited in the present invention.
[0030] When the package structure includes a plurality of chip units 110, the heat dissipation channel 140 surrounds each chip unit 110, and the top surface of the plastic package body 120 in each area surrounded by the opening 141 has a slope 180 inclined toward the opening 141. For example, in this embodiment, the heat dissipation channel 140 is arranged at the periphery of the plastic package body 120 and between two chip units 110, and all the heat dissipation channels 140 are connected, so that the heat dissipation channel 140 can surround each chip unit 110. The top surface of the plastic package body 120 in each area surrounded by the opening 141 has a slope 180 inclined toward the opening 141. For example, in this embodiment, the area where each chip unit 110 is located is surrounded by the opening 141, and the top surface of the plastic package body 120 corresponding to each chip unit 110 has a slope 180 inclined toward the opening 141, so as to further avoid the accumulation of the cooling liquid 160.
[0031] In other embodiments, when the packaging structure includes a plurality of the chip units 110, the heat dissipation channel 140 is disposed in the outer edge region of the plastic package 120, and all of the chip units 110 are located within the region enclosed by the heat dissipation channel 140, that is, the heat dissipation channel 140 is only located in the outer edge region of the plastic package 120, and is not disposed between adjacent chip units 110.
[0032] When the package structure includes one chip unit 110, Figure 3 and Figure 4 As shown, Figure 3 1 is a top view of a packaging structure with a heat dissipation channel 140 provided by another embodiment of the present invention. Figure 4 is along Figure 3 A schematic cross-sectional view of the A-A1 direction, wherein: Figure 3 The cooling cover 130 is removed, the heat dissipation channel 140 is arranged at the edge of the plastic package 120 and surrounds the chip unit 110. The top surface of the plastic package 120 corresponding to the chip unit 110 has a slope 180 inclined toward the opening 141.
[0033] The chip unit 110 includes one chip or a plurality of stacked chips, or the chip unit 110 includes a combination of one chip and a plurality of stacked chips.
[0034] For example, in this embodiment, the chip unit 110 includes a plurality of stacked chips, specifically, Figure 1As shown, a plurality of chips 111 stacked in a direction perpendicular to the substrate 100 constitute a chip unit 110. The stacked chips 111 may be chips of the same type or chips of different types. The stacked chips 111 may all be memory chips, or may include memory chips and control chips.
[0035] For another example, in another embodiment, the chip unit 110 includes a combination of one chip and a plurality of stacked chips. Specifically, Figure 4 As shown, the top chip 112 and the two groups of stacked chips 111 thereunder constitute the chip unit 110 .
[0036] The slope 180 of the top surface of the plastic package body 120 may be a conical configuration or a slope with a slope. Specifically, in some embodiments, the top surface of the plastic package body 120 surrounded by the opening 141 is a conical configuration, for example, please continue to refer to Figure 1 and Figure 2 The top surface of the plastic package body 120 surrounded by the opening 141 has a high center and a low edge, presenting a conical configuration, so that the top surface of the plastic package body 120 has a slope 180 inclined from the center of the top surface of the plastic package body 120 toward the opening 141.
[0037] In other embodiments, the slope 180 may also be inclined from one side of the top surface of the plastic package body 120 to the other side, that is, an inclined surface with a slope. Figure 5 As shown, it is a packaging structure with a heat dissipation channel 140 provided by another embodiment of the utility model. Figure 3 The cross-sectional diagram along the A-A1 axis shows that in this embodiment, the slope 180 is inclined from one side of the top surface of the plastic package body 120 to the other side, that is, the top surface of the plastic package body 120 is inclined from the opening 141 on one side thereof toward the opening 141 on one side thereof.
[0038] In some embodiments, at the bottom of the cooling cavity 170, the top surface of the plastic package body 120 between the opening 141 and the side of the cooling cover 130 has a slope 181 inclined toward the opening 141. The slope 181 is inclined from the side of the cooling cover 130 toward the opening 141, which can prevent the coolant 160 from accumulating at the edge area of the cooling cavity 170, thereby further allowing the coolant 160 to flow better inside the packaging structure. Figure 1 and Figure 2 .
[0039] In some embodiments, the liquid level of the coolant 160 is lower than the edge of the opening 141 to ensure that the coolant 160 is only located in the heat dissipation channel 140, thereby preventing the coolant 160 from accumulating in the cooling cavity 170. Figure 1 and Figure 2 In other embodiments, the liquid surface of the coolant is flush with the edge of the opening to increase the amount of the coolant and improve the cooling effect.
[0040] In some embodiments, the heat dissipation channel 140 passes through the plastic package 120 to the substrate 100 to improve the heat dissipation performance of the packaging structure. Figure 1 and Figure 2 In other embodiments, in order to avoid reducing the bonding between the plastic package body 120 and the substrate 100 , the heat dissipation channel 140 may also only extend from the top surface of the plastic package body 120 to a certain height inside the plastic package body 120 , but not penetrate the plastic package body 120 .
[0041] In some embodiments, when the heat dissipation channel 140 penetrates the plastic package 120 to the substrate 100, in order to isolate the cooling liquid 160 in the heat dissipation channel 140 from the substrate 100 and prevent the cooling liquid 160 from having an adverse effect on the substrate 100, an isolation layer 200 is provided on the surface of the substrate 100, and the surface of the isolation layer 200 serves as the bottom surface of the heat dissipation channel 140. The isolation layer 200 can isolate the cooling liquid 160 in the heat dissipation channel 140 from the substrate 100, please refer to Figure 1 and Figure 2 In some embodiments, the isolation layer 200 includes but is not limited to a metal layer, which not only plays an isolating role, but also acts as a good thermal conductor to further conduct the heat of the coolant 160 to the substrate 100, thereby assisting the packaging structure in heat dissipation.
[0042] In some embodiments, a heat conducting layer 210 is provided on the inner surface of the heat dissipation channel 140 and the top surface of the plastic package 120. The heat conducting layer 210 has high thermal conductivity, which can further increase the heat exchange between the plastic package 120 and the coolant 160, thereby improving the heat dissipation performance of the packaging structure. Figure 1 and Figure 2 In some embodiments, the heat conductive layer 210 is a metal layer, which covers the entire inner surface of the heat dissipation channel 140. The heat conductive layer 210 is also used to isolate the plastic package 120 from the coolant 160 to prevent the coolant 160 from having adverse effects on the plastic package 120. Figure 1 and Figure 3 Only the heat conducting layer 210 located on the inner surface of the heat dissipation channel 140 is shown.
[0043] The cooling cover 130 is buckled on the top surface of the plastic package body 120, and encloses the cooling cavity 170 with the top surface of the plastic package body 120. The cooling cover 130 has good thermal conductivity. When the vaporized coolant 160 contacts the cooling cover 130, the heat of the vaporized coolant 160 is transferred to the cooling cover 130 and dissipated. The coolant 160 condenses and falls back into the heat dissipation channel 140, so that the heat of the packaging structure is dissipated through the cooling cover 130, thereby achieving heat dissipation of the packaging structure. In some embodiments, the cooling cover 130 is a metal cover.
[0044] In some embodiments, the cooling cover 130 is an inverted concave configuration, and the side bottom of the cooling cover 130 is arranged on the top surface of the plastic package 120 and connected to the heat conductive layer 210, so that the heat dissipation channel 140 and the cooling cavity 170 form a closed structure, and the coolant 160 does not contact the plastic package 120 or the outside world, further avoiding the adverse effects of the coolant 160 on the plastic package 120 and preventing the coolant 160 from diffusing to the outside world, please refer to Figure 1 and Figure 2 .
[0045] In some embodiments, the bottom side of the cooling cover 130 is bent toward the cooling cavity 170 to form a connecting portion 131, and the connecting portion 131 is welded to the thermal conductive layer 210, thereby increasing the contact area between the cooling cover 130 and the thermal conductive layer 210, thereby increasing the firmness of the connection between the cooling cover 130 and the plastic package body 120, and improving the reliability of the packaging structure.
[0046] In some embodiments, in order to further improve the connection reliability between the cooling cover 130 and the plastic package body 120 and to prevent the coolant 160 from accumulating at the edge of the cooling cavity 170, the shape of the connecting portion 131 is consistent with the shape of the top surface of the plastic package body 120. Specifically, in some embodiments, the top surface of the plastic package body 120 located between the opening 141 and the side of the cooling cover 130 has a slope 181 inclined toward the opening 141, and the surface of the connecting portion 131 is an inclined surface inclined from the side of the cooling cover 130 toward the opening 141.
[0047] In the packaging structure with the heat dissipation channel 140 provided by the utility model, when the heat inside the packaging structure is transferred to the coolant 160, the coolant 160 absorbs the heat and then vaporizes, and the vaporized coolant 160 rises into the cooling cavity 170 and condenses at the cooling cover 130, thereby dissipating the heat through the cooling cover 130 to achieve heat dissipation of the packaging structure. At the same time, since the top surface of the plastic package 120 surrounded by the opening 141 has a slope 180 inclined toward the opening 141, the condensed coolant 160 will not remain on the top surface of the plastic package 120, so that the coolant 160 can flow better inside the packaging structure, further improving the heat dissipation performance of the packaging structure.
[0048] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A packaging structure with a heat dissipation channel, characterized in that: include: substrate; At least one chip unit is disposed on the substrate; A plastic package body, covering the chip unit, a heat dissipation channel is arranged in the plastic package body and surrounds the chip unit, the opening of the heat dissipation channel is located on the top surface of the plastic package body, and cooling liquid is arranged in the heat dissipation channel; The cooling cover is arranged on the top surface of the plastic sealing body, the cooling cover and the top surface of the plastic sealing body enclose a cooling cavity, and the opening is located at the bottom of the cooling cavity. The top surface of the plastic sealing body surrounded by the opening has a slope inclined toward the opening.
2. The packaging structure according to claim 1, characterized in that: When the packaging structure includes a plurality of the chip units, the heat dissipation channel surrounds each of the chip units, and the top surface of the plastic package body in each area surrounded by the opening has a slope inclined toward the opening.
3. The packaging structure according to claim 1 or 2, characterized in that: The top surface of the plastic package body surrounded by the opening is in a conical configuration.
4. The packaging structure according to claim 1 or 2, characterized in that: The slope is inclined from one side of the top surface of the plastic package body to the other side.
5. The packaging structure according to claim 1, characterized in that: The heat dissipation channel is arranged at the outer edge area of the plastic package body, and all the chip units are located in the area surrounded by the heat dissipation channel.
6. The packaging structure according to claim 1, characterized in that: At the bottom of the cooling cavity, the top surface of the plastic package body located between the opening and the side edge of the cooling cover has a slope inclined toward the opening.
7. The packaging structure according to claim 1, characterized in that: The liquid level of the coolant is lower than the edge of the opening, or the liquid level of the coolant is flush with the edge of the opening.
8. The packaging structure according to claim 1, characterized in that: The heat dissipation channel passes through the plastic package body to the substrate.
9. The packaging structure according to claim 1, characterized in that: An isolation layer is provided on the surface of the substrate, and the surface of the isolation layer serves as the bottom surface of the heat dissipation channel.
10. The packaging structure according to claim 1, characterized in that: A heat-conducting layer is provided on the inner surface of the heat dissipation channel and the top surface of the plastic package body.
11. The packaging structure according to claim 10, characterized in that: The cooling cover is of an inverted concave configuration, and the bottom of the side edge of the cooling cover is arranged on the top surface of the plastic package body and connected to the heat conducting layer.
12. The packaging structure according to claim 11, characterized in that: The bottom of the side edge of the cooling cover is bent toward the cooling cavity to form a connecting portion, and the connecting portion is welded to the heat conducting layer.
13. The packaging structure according to claim 1, characterized in that: The chip unit includes one chip or a plurality of stacked chips, or the chip unit includes a combination of one chip and a plurality of stacked chips.