Light-emitting device

By adding an absorbing plate and a high thermal heat sink module at the tongue of the light emitting device, the low efficiency and unstable light color problems caused by stray light in the light emitting device are solved, and higher luminous efficiency and stable light color are achieved.

CN222261730UActive Publication Date: 2024-12-27GEN SEMICONDUCTOR (ANHUI) CO LTD
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Patent Information

Application Number
CN202323362947.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-11
Publication Date
2024-12-27
Estimated Expiration
2033-12-11

AI Technical Summary

Technical Problem

Existing light emitting devices have low luminous efficiency and unstable light color due to stray light.

Method used

Add an absorbing plate at the tongue of the light emitting device to absorb stray light emitted from the non-active region, and use a metal layer on the high-thermal conductivity substrate to form a heat sink module. The chip and the heat sink module are eutectic and solid crystals on the tongue. , improve the transmission efficiency of optical signals.

Benefits of technology

Effectively suppress stray light, improve luminous efficiency, and enhance light color stability.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222261730U_ABST
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Abstract

The light-emitting device comprises a tube cap, a tube seat, a heat sink module and a chip, the tube seat comprises a base, pins and a tube tongue, the pins and the tube tongue are respectively located at two sides of the base and are correspondingly arranged, the number of the pins is two, the pins are arranged in parallel, one pin is arranged corresponding to the tube tongue, the other pin penetrates through the base and is arranged in parallel with the tube tongue, and the heat sink module is arranged on the heat sink module. The pipe cap is arranged on one side of the pipe tongue, the pipe tongue is located on the inner side of the pipe cap, and an opening corresponding to the pipe tongue is formed in the pipe cap; a heat sink module is arranged on the tube tongue, the heat sink module is formed by evaporating a metal layer with a high heat conduction coefficient on a high heat conduction substrate, a chip is arranged on the heat sink module, and the chip and the heat sink module are subjected to eutectic and then are subjected to die bonding on the tube tongue; an absorption plate for absorbing stray light is added on one side of the tube tongue far away from the base, and the absorption plate is arranged perpendicular to the tube tongue. The light emitting efficiency of the laser is improved, stray light generated by laser is absorbed, and the light color is more stable.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronic component packaging, in particular to a light-emitting device. Background Art

[0002] like Figure 1 As shown in the figure, when current passes through a semiconductor laser, the number of particles formed by spontaneous radiation and stimulated radiation is reversed to generate light. Due to the reflection of the resonant cavity, photons pass through the particle number inversion zone many times, resulting in multiplication and output of laser. The laser is mainly emitted in the active area, but some photons will diffuse to the non-active areas at both ends of the active area, generating stray light, resulting in low luminous efficiency and unstable light color. Utility Model Content

[0003] The utility model provides a light-emitting device, which improves the light-emitting efficiency of the laser, absorbs the stray light generated by the laser, and makes the light color more stable.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A light-emitting device comprises a tube cap, a tube base, a heat sink module and a chip. The tube base comprises a base, pins and a tube tongue. The pins and the tube tongue are respectively located on both sides of the base and are arranged correspondingly. There are two pins and they are arranged in parallel, one of which is arranged correspondingly to the tube tongue, and the other pin passes through the base and is arranged parallel to the tube tongue. The tube cap is arranged on one side of the tube tongue, and the tube tongue is located on the inner side of the tube cap, and the tube cap is provided with an opening arranged correspondingly to the tube tongue; a heat sink module is arranged on the tube tongue, and the heat sink module is formed by evaporating a metal layer with a high thermal conductivity coefficient on a high thermal conductivity substrate; a chip is arranged on the heat sink module, and the chip is solidified on the tube tongue after eutectic with the heat sink module; an absorption plate for absorbing stray light is added on the side of the tube tongue away from the base, and the absorption plate is arranged perpendicular to the tube tongue.

[0006] Preferably, the chip is close to one side of the absorption plate, the absorption plate has a height of 10-100 um, and absorbs stray light emitted by the non-active area.

[0007] Preferably, the base, pins and tongue are made of metal foil formed by a thermoforming method.

[0008] Preferably, the tube cap is made of metal and optical glass.

[0009] Preferably, the chip and the pins are connected by gold wire ball welding to complete the connection of the internal and external leads.

[0010] Preferably, a groove for accommodating the chip is provided on the heat sink module, and the groove passes through the side wall of the heat sink module, and the chip is inserted into the groove for eutectic formation.

[0011] Compared with the existing technology, the advantages of the utility model are: effectively suppressing stray light and improving the luminous efficiency of the device; specifically, adding a stray light absorption plate on the side of the tube tongue close to the chip to absorb the stray light emitted by the non-active area; at the same time, a metal layer with a high thermal conductivity coefficient is evaporated on a high thermal conductivity substrate to form a heat sink module, and after the chip and the heat sink module are eutectic, they are solidified on the tube tongue. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 Schematic diagram of laser reflection in the prior art.

[0013] Figure 2 It is a structural schematic diagram of the utility model.

[0014] Figure 3 It is a schematic diagram of the enlarged structure of the tube tongue of the utility model.

[0015] In the figure: 1. tube cap; 2. tube socket; 21. base; 22. pin; 23. tube tongue; 3. heat sink module; 4. chip; 5. absorption plate. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0017] Reference Figure 2-3 A light emitting device comprises a tube cap 1, a tube base 2, a heat sink module 3, and a chip 4. The tube base 2 comprises a base 21, a pin 22, and a tube tongue 23. The pins 22 and the tube tongue 23 are respectively located on both sides of the base 21. The pins 22 are two and arranged in parallel. One of the pins 22 is arranged corresponding to the tube tongue 23, and the other pin 22 penetrates the base 21 and is arranged in parallel with the tube tongue 23. The tube cap 1 is arranged on one side of the tube tongue 23. The base 21, the pins 22, and the tube tongue 23 are composed of a metal foil formed by a hot forming method. The tube cap 1 is made of metal (can be The tube tongue 23 is located on the inner side of the tube cap 1, and the tube cap 1 is provided with an opening corresponding to the tube tongue 23; a heat sink module 3 is provided on the tube tongue 23, and the heat sink module 3 is formed by evaporating a metal layer with a high thermal conductivity coefficient on a high thermal conductivity substrate, and a chip 4 is provided on the heat sink module 3. After the chip 4 and the heat sink module 3 are eutectic, they are solid-crystallized on the lower tube tongue 23; an absorption plate 5 for absorbing stray light is added on the side of the tube tongue 23 away from the base 21, and the absorption plate 5 is arranged perpendicular to the tube tongue 23.

[0018] In a specific embodiment, a stray light absorbing plate 5 is added at the position of the tube tongue 23 to absorb the stray light emitted by the non-active area, effectively suppress the stray light, and improve the luminous efficiency of the device; Figure 3As shown, the light in the active area is indicated by a solid arrow, and the stray light is indicated by a dotted arrow, and the stray light is absorbed by the absorption plate 5. A metal layer with a high thermal conductivity coefficient is evaporated on a high thermal conductivity substrate to form a heat sink module 3, and a groove for accommodating a chip 4 is provided on the heat sink module 3, and the groove runs through the side wall of the heat sink module 3, and the chip 4 is inserted into the groove for eutecticization; after the chip 4 and the heat sink module 3 are eutectic, they are solidified on the tube tongue 23; the chip 4 and the pin 22 are connected by gold wire ball welding to complete the connection of the internal and external leads; finally, the tube cap 1 is covered to realize the transmission of optical signals.

[0019] After the utility model is powered on, when current passes through the chip 4, some photons will diffuse to the inactive areas at both ends of the active area. Due to the addition of a stray light absorption plate 5, the stray light is absorbed, so that the luminous efficiency is high. Specifically, the chip 4 is close to the side of the absorption plate 5, and the height of the absorption plate 5 is 10 to 100 um, which absorbs the stray light emitted by the inactive area and makes the light color more stable.

[0020] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A light emitting device, comprising a tube cap (1), a tube base (2), a heat sink module (3), and a chip (4), characterized in that: The tube base (2) comprises a base (21), pins (22), and a tube tongue (23); the pins (22) and the tube tongue (23) are respectively located on both sides of the base (21); there are two pins (22) and they are arranged in parallel, one of which is arranged corresponding to the tube tongue (23); the other pin (22) passes through the base (21) and is arranged in parallel with the tube tongue (23); the tube cap (1) is arranged on one side of the tube tongue (23), and the tube tongue (23) is arranged on the other side of the tube tongue (23). Located inside a tube cap (1), the tube cap (1) is provided with an opening corresponding to the tube tongue (23); a heat sink module (3) is provided on the tube tongue (23), a chip (4) is provided on the heat sink module (3), and the chip (4) and the heat sink module (3) are eutectic and then solid-crystallized on the tube tongue (23); an absorption plate (5) for absorbing stray light is added on a side of the tube tongue (23) away from the base (21), and the absorption plate (5) is arranged perpendicular to the tube tongue (23).

2. A light emitting device according to claim 1, characterized in that: The chip (4) is close to one side of the absorption plate (5), the absorption plate (5) has a height of 10 to 100 μm and absorbs stray light emitted by the non-active area.

3. A light emitting device according to claim 1, characterized in that: The base (21), the pins (22) and the tube tongue (23) are made of metal foil formed by a thermoforming method.

4. A light emitting device according to claim 1, characterized in that: The tube cap (1) is composed of metal and optical glass.

5. A light emitting device according to claim 1, characterized in that: The chip (4) and the pin (22) are connected by gold wire ball welding to complete the connection of the lead wire of the tube seat.

6. A light emitting device according to claim 1, characterized in that: The heat sink module (3) is provided with a groove for accommodating the chip (4), and the groove penetrates the side wall of the heat sink module (3), and the chip (4) is inserted into the groove for eutecticization.

Citation Information

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