PCB with processing fool-proof structure

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a PCB with a processing fool-proof structure, which comprises a substrate, the surface of the substrate is provided with a large-hole-surface outer layer, the large-hole-surface outer layer is provided with at least one round original hole, and the periphery of the original hole is provided with a circular truncated cone processing area. The circular truncated cone processing area is of an inverted circular truncated cone-shaped structure, the center of the inverted circular truncated cone-shaped structure is penetrated by an original hole, so that the circular truncated cone processing area and the original hole jointly form the shape of a conical hole, at least one fool-proof wire is arranged on the annular surface of the circular truncated cone processing area, and two ends of the fool-proof wire are connected with a first bonding pad and a second bonding pad respectively to form an annular conducting circuit. According to the utility model, the conduction line with the lead and the bonding pad is preset on the surface of the PCB, the fool-proof structure is formed before the taper hole is processed and manufactured, and after the taper hole is processed, an unprocessed area can be conveniently detected by utilizing an electrical test, so that the fool-proof structure is very suitable for the processing fool-proof test of the NPTH hole on the surface of the PCB.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB circuit boards, in particular to a PCB circuit board with a processing fool-proof structure. Background Art

[0002] PCB is the support of electronic components and the carrier of electrical connection between electronic components. It presses layers of different materials together through heat and adhesive. When loading and fixing PCB, in order to better stabilize, tapered holes with a certain angle are usually designed, with screws (such as Figure 1 and Figure 2 ), or the carrier PCB needs to be loaded with snap-on components, and a controlled depth groove is milled in the PCB to clamp the fixed components (such as Figure 3 and Figure 4 ).

[0003] In the process of PCB circuit board processing, how to avoid the missed processing of tapered holes or controlled depth milling grooves is a technical issue that technicians have been studying. Based on this, the utility model proposes a PCB circuit board with a processing fool-proof structure. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a PCB circuit board with a processing fool-proof structure. A conductive circuit with a wire and a pad is preset on the surface of the PCB circuit board. The fool-proof structure is formed before the tapered hole is processed. After the tapered hole is processed, the unprocessed area can be easily detected by electrical testing.

[0005] The PCB circuit board with a processing fool-proof structure in the present scheme includes a substrate with a large hole surface outer layer on the surface, at least one circular original opening is opened on the large hole surface outer layer, a truncated cone processing area is arranged on the periphery of the original opening, the truncated cone processing area is an inverted truncated cone structure with the original opening passing through the center, so that the truncated cone processing area and the original opening together form the shape of a tapered hole, and at least one fool-proof wire with a first pad and a second pad connected to its two ends is arranged on the circular surface of the truncated cone processing area to form a ring-shaped conductive circuit.

[0006] The technical solution further defined in the utility model is:

[0007] Furthermore, at least one rectangular milling groove processing area is provided on the outer layer of the large hole surface, and at least one conducting circuit is also provided on the surface of the milling groove processing area.

[0008] Furthermore, the fool-proof wires on the surface of the slot milling processing area are arranged along the length direction thereof, and the conducting circuits are in a straight line.

[0009] Furthermore, the distance from the conductive line of the milling groove processing area to its outer edge is not less than 15 mil.

[0010] Furthermore, the width of the fool-proof wire is 15 mil, and the diameters of the first pad and the second pad are 15 mil.

[0011] Furthermore, the fool-proof wire on the surface of the truncated cone processing area is arranged concentrically with the original opening.

[0012] Furthermore, the fool-proof wire on the surface of the truncated cone processing area is located at halfway between the original opening and the outer peripheral edge of the truncated cone processing area.

[0013] The beneficial effects of the utility model are as follows: the utility model presets a conducting circuit with a conducting wire and a pad on the surface of the PCB circuit board, forms a fool-proof structure before the tapered hole is processed and manufactured, and the unprocessed area can be conveniently detected by electrical testing after the tapered hole is processed. At the same time, the fool-proof structure is also suitable for the processing and manufacturing of controlled depth milling grooves, and is very suitable for the fool-proof testing of the processing of NPTH holes on the surface of the PCB circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A top view of a tapered hole on a PCB circuit board;

[0015] Figure 2 This is a structural cross-sectional view of a tapered hole on a PCB circuit board;

[0016] Figure 3 This is a top view of the depth-controlled milling groove on the PCB circuit board;

[0017] Figure 4 This is a structural cross-sectional diagram of the depth-controlled milling groove on the PCB circuit board;

[0018] Figure 5 This is a schematic diagram of the structure of a PCB circuit board with a fool-proof processing structure in an embodiment of the utility model;

[0019] Figure 6 for Figure 5 Enlarged view of part A in the middle;

[0020] Figure 7 for Figure 5 Enlarged view of part B;

[0021] Figure 8 for Figure 5 Enlarged view of part C in the middle;

[0022] Among them: 10, substrate; 11, outer layer of large hole surface; 20, original opening; 21, frustum processing area; 30, milling groove processing area; 31, controlled depth milling groove; 40, foolproof wire; 41, first pad; 42, second pad. DETAILED DESCRIPTION

[0023] The PCB circuit board with a foolproof structure provided in this embodiment is as follows: Figure 5 As shown, there is a substrate 10, on the surface of the substrate 10 is a large-hole outer layer 11, and the substrate 10 needs to be processed and manufactured with a tapered hole and a depth-controlled milling groove 31 respectively.

[0024] See also Figure 6-7 A circular original opening 20 is provided on the outer layer 11 of the large hole surface, and a truncated cone processing area 21 is arranged on the periphery of the original opening 20, specifically, it is in the shape of an inverted truncated cone, so as to cooperate with the original opening 20 to form a tapered hole to be processed, the surface of the truncated cone processing area 21 is in the shape of a circular ring and is concentric with the original opening 20, and an annular fool-proof wire 40 is arranged on its surface, and the two ends of the fool-proof wire 40 are respectively connected to a first pad 41 and a second pad 42, so that the fool-proof wire 40, the first pad 41 and the second pad 42 form a ring-shaped conductive circuit.

[0025] It should be noted that the fool-proof wire 40 in this embodiment is concentrically arranged with the outer peripheral edge of the original opening 20, the fool-proof wire 40 is 10 mils wide, the diameters of the first solder pad 41 and the second solder pad 42 are both 15 mils, and the entire annular conductive circuit formed is located in the middle position between the outer periphery of the original opening 20 and the outer peripheral edge of the surface of the frustum processing area 21, that is, one-half. In some other implementations, it can also be arranged in other positions, and it is only necessary to connect the two ends of the fool-proof wire 40 to the first solder pad 41 and the second solder pad 42 respectively.

[0026] like Figure 8 As shown, it is a schematic diagram of the processing and manufacturing of the controlled depth milling groove 31 in this embodiment, the left side is the unprocessed state, and the right side is the processed state. A milling groove processing area 30 is set on the outer layer 11 of the large hole surface. The milling groove processing area 30 in this embodiment is rectangular, and the specific shape can be designed according to actual needs. An anti-fool wire 40 and a first solder pad 41 and a second solder pad 42 connected to its two ends are also set on the surface of the milling groove processing area 30. The anti-fool wire 40 is arranged along the length direction of the milling groove processing area 30, and the distance between the conductive line formed by the anti-fool wire 40, the first solder pad 41 and the second solder pad 42 and the outer edge of the milling groove processing area 30 is not less than 15 mil.

[0027] Specifically, after the PCB circuit board with the processing fool-proof structure in this embodiment is processed and manufactured with the tapered holes and the controlled depth milling grooves 31, a conventional electrical test is performed to add test points at the positions of the first solder pads 41 and the second solder pads 42 of each tapered hole and the controlled depth milling groove 31. If there is any missing processing, the electrical test needle will pierce the solder pad and report a short circuit abnormality NG. When the test needle is left floating normally, it will PASS. In this way, the problem of missing processing of tapered holes and controlled depth milling grooves is solved by adding a processing fool-proof structure.

[0028] In addition to the above embodiments, the present invention may also have other implementation modes; any technical solutions formed by equivalent replacement or equivalent transformation shall fall within the protection scope required by the present invention.

Claims

1. A PCB circuit board with a processing foolproof structure, characterized in that: The invention comprises a substrate (10) having a large-hole outer layer (11) on its surface, wherein at least one circular original opening (20) is formed on the large-hole outer layer (11), and a truncated cone processing area (21) is formed on the periphery of the original opening (20), wherein the truncated cone processing area (21) is an inverted truncated cone-shaped structure with the original opening (20) passing through the center, so that the truncated cone processing area (21) and the original opening (20) together form a tapered hole shape, and at least one foolproof wire (40) having two ends respectively connected to a first solder pad (41) and a second solder pad (42) is formed on the annular surface of the truncated cone processing area (21), forming an annular conductive circuit.

2. The PCB circuit board according to claim 1, characterized in that: At least one rectangular milling groove processing area (30) is also provided on the outer layer (11) of the large hole surface, and at least one conductive line is also provided on the surface of the milling groove processing area (30).

3. The PCB circuit board according to claim 2, characterized in that: The foolproof wire (40) on the surface of the slot milling processing area (30) is arranged along its length direction, and the conducting line is in a straight line.

4. The PCB circuit board according to claim 3, characterized in that: The distance from the conducting line of the slot milling processing area (30) to its outer edge is not less than 15 mil.

5. The PCB circuit board according to claim 1, characterized in that: The width of the foolproof wire (40) is 15 mil, and the diameters of the first solder pad (41) and the second solder pad (42) are 15 mil.

6. The PCB circuit board according to claim 1, characterized in that: The foolproof wire (40) on the surface of the truncated cone processing area (21) is arranged concentrically with the original opening (20).

7. The PCB circuit board according to claim 6, characterized in that: The foolproof wire (40) on the surface of the truncated cone processing area (21) is located at halfway between the original opening (20) and the outer peripheral edge of the truncated cone processing area (21).

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