Semiconductor test equipment capable of collecting defective products
By designing a support table and conveying mechanism, combined with the electromagnetic piston sleeve and rotary plate, efficient detection of semiconductors and defective products are achieved, solving the problem of defective products in traditional detection methods, and improving detection efficiency and equipment adaptability.
Patent Information
- Application Number
- CN202420971289.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-07
AI Technical Summary
Traditional semiconductor detection methods are susceptible to external pressure when the defective products are discharged, resulting in inability to collect effectively and causing damage.
A semiconductor testing equipment including a support table, a conveying mechanism, a detection platform, a rotating plate and an electromagnetic telescopic sleeve are designed. The semiconductor is adsorbed by the electromagnetic piston sleeve and used the rotating plate and power source for detection and position definition to achieve defective products. Efficient collection.
The device adsorbs semiconductors through an electromagnetic piston sleeve and recycles them when detection fails, avoiding damage to defective products, suitable for semiconductors of different sizes, and improving detection efficiency.
Smart Images

Figure CN222267911U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor detection, in particular to a semiconductor testing device capable of collecting defective products. Background Art
[0002] A conductor is a material with an electrical conductivity between that of an insulator and that of a conductor. Its electrical conductivity is easily controlled and it can be used as a component material for information processing. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.
[0003] After the semiconductor is tested, qualified products and defective products need to be separated. The traditional separation method is to mark the test order and discharge the defective products from the conveyor belt in the specified order. This method is efficient, but the discharged defective semiconductors are easily damaged by external force, which makes them unable to be collected. To this end, we provide a semiconductor testing equipment that can collect defective products to solve the above problems. Utility Model Content
[0004] 1) Technical issues solved
[0005] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a semiconductor testing device capable of collecting defective products.
[0006] 2) Technical solution
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor testing equipment capable of collecting defective products, comprising a support table, wherein a feeding station, a detection station, a discharge station and a recovery station are arranged on the edge of the support table in a clockwise order, the feeding station, the discharge station and the recovery station are all provided with a conveying mechanism, an inspection platform is arranged above the inspection station, a support shaft is fixedly installed in the middle of the support table, a rotating plate is rotatably connected to the upper surface of the support shaft, an electromagnetic telescopic sleeve is arranged at the four corners of the bottom end of the rotating plate, a power source for driving the rotating plate to rotate is fixedly installed on the surface of the support shaft, a clamp is fixedly installed on the free end of the electromagnetic telescopic sleeve, and the clamp is control-connected to the inspection platform.
[0008] Furthermore, the conveying mechanism at the feeding station moves counterclockwise, and the conveying mechanisms at the discharging station and the recycling station move clockwise.
[0009] Furthermore, slide grooves are provided on both sides of the conveying mechanism at the feeding station, the interior of the slide grooves is slidably connected to a screw rod, the outer surface of the screw rod is sleeved with a limit frame, the limit frame extends to the top of the conveying mechanism, and one end of the screw rod is threadedly connected to a fastening nut.
[0010] Furthermore, a support plate is fixedly installed on the upper surface of the support shaft, a limiting ring is fixedly installed on the left upper surface of the support plate, a ring groove which is sleeved on the outer side of the limiting ring is opened in the middle of the rotating plate, a positioning stud is fixedly installed in the middle of the support plate, a positioning pressure block is threadedly connected above the positioning stud, and the positioning pressure block is rotatably connected to the rotating plate.
[0011] Furthermore, the clamp includes a fixed sleeve, the bottom end of which is connected to and penetrated by a suction cup, an electromagnetic piston sleeve is arranged on the outer side of the fixed sleeve, and the electromagnetic piston sleeve is connected to and penetrated by the suction cup.
[0012] Furthermore, a gear ring is fixedly mounted on the bottom end of the rotating plate, and the power source includes a motor and a gear at the input end of the motor, and the gear is meshed with the gear ring.
[0013] (III) Beneficial effects:
[0014] Compared with the prior art, the semiconductor testing equipment capable of collecting defective products has the following beneficial effects:
[0015] 1. The utility model uses an electromagnetic piston sleeve to suck air so that the suction cup absorbs the semiconductor, and drives the rotating plate to rotate one station through a power source, so that the semiconductor is placed above the detection platform and tested. When the detection is normal, the suction cup is exhausted when it moves to the discharge station. When the detection is abnormal, the suction cup is exhausted at the recovery station, so that the semiconductor is away from the device on the support and conveying mechanism to achieve defective collection.
[0016] 2. The utility model provides slide grooves on both sides of the conveying mechanism at the feeding station, the interior of the slide groove is slidably connected to a screw, the outer surface of the screw is sleeved with a limit frame, the limit frame extends to the top of the conveying mechanism, one end of the screw is threadedly connected to a fastening nut, through such an arrangement, the position of the semiconductor can be limited, and by adjusting the position of the limit frame, semiconductors of different sizes can stop moving at the same position. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the connection of the rotating plate of the utility model;
[0019] Figure 3 This is a schematic diagram of the connection of the support platform of the utility model;
[0020] Figure 4 It is a schematic diagram of the connection of the conveying mechanism of the utility model.
[0021] In the figure: 1. support platform; 2. conveying mechanism; 3. detection platform; 4. support shaft; 5. electromagnetic telescopic sleeve; 6. power source; 7. clamp; 8. slide groove; 9. screw; 10. limit frame; 11. fastening nut; 12. support plate; 13. limit ring; 14. ring groove; 15. positioning stud; 16. positioning pressure block; 17. fixing sleeve; 18. suction cup; 19. electromagnetic piston sleeve; 20. gear ring; 21. rotating plate. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] like Figure 1-4 As shown, the utility model provides a technical solution: a semiconductor testing equipment that can collect defective products, including a support table 1, the edge of the support table 1 is provided with a feeding station, a detection station, a discharge station and a recovery station in clockwise order, the feeding station, the discharge station and the recovery station are all provided with a conveying mechanism 2, a detection platform 3 is provided above the detection station, a support shaft 4 is fixedly installed in the middle of the support table 1, the upper surface of the support shaft 4 is rotatably connected to a rotating plate 21, and electromagnetic telescopic sleeves 5 are provided at the four corners of the bottom end of the rotating plate 21, a power source 6 for driving the rotating plate 21 to rotate is fixedly installed on the surface of the support shaft 4, a clamp 7 is fixedly installed on the free end of the electromagnetic telescopic sleeve 5, and the clamp 7 is control-connected to the detection platform 3.
[0024] The conveying mechanism 2 at the feeding station moves counterclockwise, and the conveying mechanism 2 at the discharging station and the recycling station moves clockwise. Through such an arrangement, the semiconductor to be inspected can be conveyed to the designated position.
[0025] Slide grooves 8 are provided on both sides of the conveying mechanism 2 at the feeding station. The interior of the slide grooves 8 is slidably connected to a screw rod 9. The outer surface of the screw rod 9 is sleeved with a limit frame 10. The limit frame 10 extends to the top of the conveying mechanism 2. One end of the screw rod 9 is threadedly connected to a fastening nut 11. Through such an arrangement, the position of the semiconductor can be limited. By adjusting the position of the limit frame 10, semiconductors of different sizes can be stopped at the same position.
[0026] A support plate 12 is fixedly installed on the upper surface of the support shaft 4, a limit ring 13 is fixedly installed on the left upper surface of the support plate 12, a ring groove 14 is provided in the middle of the rotating plate 21 and is sleeved on the outside of the limit ring 13, a positioning stud 15 is fixedly installed in the middle of the support plate 12, a positioning pressure block 16 is threadedly connected to the upper part of the positioning stud 15, a ball is arranged at the bottom end of the positioning pressure block 16, and the positioning pressure block 16 is rotatably connected to the rotating plate 21. Through such an arrangement, the rotating plate 21 can be positioned and supported.
[0027] The clamp 7 includes a fixed sleeve 17, the bottom end of which is connected to and penetrated by a suction cup 18, an electromagnetic piston sleeve 19 is arranged on the outside of the fixed sleeve 17, and the electromagnetic piston sleeve 19 is connected to and penetrated by the suction cup 18. Through such an arrangement, the suction cup 18 can be used to adsorb the semiconductor when the electromagnetic piston sleeve 19 inhales air, thereby facilitating the transportation of the semiconductor.
[0028] A gear ring 20 is fixedly mounted on the bottom end of the rotating plate 21 . The power source 6 includes a motor and a gear at the input end of the motor. The gear is meshed with the gear ring 20 . This arrangement can drive the rotating plate 21 to rotate.
[0029] Working principle: Place the semiconductor above the conveying mechanism 2 at the feeding station and move it. When it moves to the limit frame 10 and contacts, it stops moving. The electromagnetic telescopic sleeve 5 is unfolded to make the suction cup 18 close to the semiconductor. The suction cup 18 adsorbs the semiconductor through the electromagnetic piston sleeve 19, and the power source 6 drives the rotating plate 21 to rotate one station, so that the semiconductor is placed above the detection platform 3 and tested. When the detection is normal, the suction cup 18 is exhausted when it moves to the discharge station. When the detection is abnormal, the suction cup 18 is exhausted at the recovery station, so that the semiconductor is away from the device on the supporting conveying mechanism 2 to achieve defective collection.
Claims
1. A semiconductor testing device capable of collecting defective products, comprising a support table (1), characterized in that: The edge of the support platform (1) is provided with a feeding station, a detection station, a discharging station and a recycling station in clockwise order, and the feeding station, the discharging station and the recycling station are all provided with a conveying mechanism (2). A detection platform (3) is provided above the detection station. A support shaft (4) is fixedly installed in the middle of the support platform (1), and a rotating plate (21) is rotatably connected to the upper surface of the support shaft (4). Electromagnetic telescopic sleeves (5) are provided at the four corners of the bottom end of the rotating plate (21). A power source (6) for driving the rotating plate (21) to rotate is fixedly installed on the surface of the support shaft (4), and a clamp (7) is fixedly installed at the free end of the electromagnetic telescopic sleeve (5), and the clamp (7) is controllably connected to the detection platform (3).
2. A semiconductor testing device capable of collecting defective products according to claim 1, characterized in that: The conveying mechanism (2) at the feeding station moves counterclockwise, and the conveying mechanisms (2) at the discharging station and the recycling station move clockwise.
3. A semiconductor testing device capable of collecting defective products according to claim 2, characterized in that: A slide groove (8) is provided on both sides of the conveying mechanism (2) at the feeding station. The interior of the slide groove (8) is slidably connected to a screw rod (9). The outer surface of the screw rod (9) is sleeved with a limit frame (10). The limit frame (10) extends to the top of the conveying mechanism (2). One end of the screw rod (9) is threadedly connected to a fastening nut (11).
4. The semiconductor testing device capable of collecting defective products according to claim 1, characterized in that: A support plate (12) is fixedly mounted on the upper surface of the support shaft (4), a limit ring (13) is fixedly mounted on the left upper surface of the support plate (12), a ring groove (14) sleeved on the outer side of the limit ring (13) is provided in the middle of the rotating plate (21), a positioning stud (15) is fixedly mounted on the middle of the support plate (12), a positioning pressure block (16) is threadedly connected above the positioning stud (15), and the positioning pressure block (16) is rotatably connected to the rotating plate (21).
5. The semiconductor testing device capable of collecting defective products according to claim 1, characterized in that: The clamp (7) comprises a fixed sleeve (17), the bottom end of which is connected to and penetrated by a suction cup (18), an electromagnetic piston sleeve (19) is arranged on the outside of the fixed sleeve (17), and the electromagnetic piston sleeve (19) is connected to and penetrated by the suction cup (18).
6. The semiconductor testing device capable of collecting defective products according to claim 1, characterized in that: A gear ring (20) is fixedly mounted on the bottom end of the rotating plate (21), and the power source (6) comprises a motor and a gear at the input end of the motor, and the gear is meshed with the gear ring (20).