Monocrystalline silicon wafer positioning and cutting device
By using a rotary motor to drive the disc and diamond wire cutter in a single crystal silicon wafer cutting device, combining the drive motor and lift motor to drive the threaded rod and lift rod, stable fixation of the silicon rod is achieved, and cutting in the prior art is solved The problem of low accuracy and silicon wafer drop improves cutting efficiency and accuracy.
Patent Information
- Application Number
- CN202420819396.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-19
AI Technical Summary
The existing single-crystal silicon wafer cutting device only fixes the bottom of the silicon wafer, and cannot stably position the cylindrical silicon rod, resulting in a decrease in cutting accuracy and drop of the silicon wafer, increasing costs.
A single crystal silicon wafer positioning and cutting device including a support base, a disc, a fixing device and a lifting device is designed. The disc and a diamond wire cutter are driven by a rotating motor to drive the threaded rod and the lifting motor to drive the threaded rod and the lifting motor. The rod is deflected and lifted, and the fixing clips and rollers stabilize the silicon rod to prevent deviation and fall.
Improves cutting accuracy, minimizes waste of silicon rods, improves cutting efficiency, prevents damage to silicon wafers, and reduces costs.
Smart Images
Figure CN222270831U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single crystal silicon slices, in particular to a single crystal silicon slice positioning and cutting device. Background Art
[0002] Monocrystalline silicon wafer is a kind of silicon wafer, which is a good semiconductor material. Monocrystalline silicon wafer is often used to manufacture semiconductor devices, solar cells, etc. Whether it is used as a semiconductor device or a solar cell, the monocrystalline silicon wafer needs to be cut during the processing. Modern cutting of monocrystalline silicon wafer generally adopts laser cutting machine. Laser cutting machine has high energy density. Because its processing is non-contact, there is no mechanical impact pressure on the workpiece itself, and the workpiece is not easy to deform.
[0003] The Chinese patent with publication number CN218695151U discloses a single crystal silicon wafer for military duty. The utility model relates to the field of single crystal silicon wafer cutting, and discloses a single crystal silicon wafer positioning and cutting device, including a cutting platform and a laser cutting machine, a support seat is provided at the lower end of the cutting platform, a leveling device is provided at the lower end of the support seat, a positioning device is provided on the cutting platform, and the leveling device includes a support tube, and the support tube is provided with four tubes in total, and the four support tubes are respectively fixedly connected to the four corners of the bottom surface of the support seat, and a first forward and reverse motor is fixedly installed in the support tube, and a first threaded rod is fixedly connected to the output shaft of the first forward and reverse motor, and the lower end of the first threaded rod is threadedly connected to a lifting rod, and the outer wall of the lifting rod is slidably connected to the inner wall of the support tube. The utility model can actively level the cutting platform and ensure the positioning stability of the silicon wafer during the cutting process, thereby ensuring the accuracy of the cutting.
[0004] However, when cutting single crystal silicon wafers, the above scheme only fixes the bottom of the single crystal silicon wafer, and is unable to fix the upper end of the cylindrical single crystal silicon rod and stably position the single crystal silicon rod, which may easily cause the single crystal silicon rod to shake slightly during cutting, resulting in a decrease in the precision of the silicon wafer. In addition, the silicon wafer at the cutting position is not fixed, and the silicon wafer that is about to be cut falls, causing damage to the silicon wafer and increasing costs. Therefore, a single crystal silicon wafer positioning and cutting device is proposed to solve the above-mentioned problems. Utility Model Content
[0005] Based on the existing technical problem that when cutting single crystal silicon wafers, only the bottom of the single crystal silicon wafer is fixed, which affects the cutting accuracy, and the silicon wafer at the cutting position is not fixed, the silicon wafer that is about to be cut falls, causing damage to the silicon wafer and increasing costs, the utility model proposes a single crystal silicon wafer positioning and cutting device.
[0006] The utility model proposes a single crystal silicon wafer positioning and cutting device, comprising a support seat, the outer surface of the support seat is rotatably connected with a disc, the outer surface of the disc is provided with a fixing device, the fixing device comprises a circular ring frame and a fixing clamp, the deflection of the circular ring frame drives the fixing clamp to deflect and fix the silicon rod.
[0007] The outer surface of the disk is provided with a lifting device, and the lifting device comprises a lifting rod, and the rotation of the lifting rod drives one of the circular ring frames to be lifted or lowered.
[0008] Preferably, a rotating motor is fixedly mounted on the lower surface of the support seat, an output shaft of the rotating motor is fixedly mounted on the lower surface of the disc, and a cutting component is fixedly mounted on the outer surface of the support seat.
[0009] Through the above technical solution, the disc is driven to rotate by a rotating motor, thereby cooperating with the cutting component to better cut the silicon rods on the disc. The cutting component is a diamond wire cutter, which can achieve high-precision cutting, minimize the waste of silicon rods, and improve cutting efficiency.
[0010] Preferably, the fixing device also includes a driving motor, which is fixedly mounted on the upper surface of the disc. The output shaft of the driving motor is fixedly mounted with a threaded rod via a coupling, one end of the threaded rod is fixedly mounted to the upper surface of the disc via a bearing seat, the outer surface of the threaded rod is threadedly connected with a slider, and a support rod is fixedly mounted on the upper surface of the slider.
[0011] Through the above technical solution, the threaded rod is driven to rotate by a driving motor, which drives the slider and the support rod on the slider to deflect, thereby driving the circular frame to deflect, so as to fix the silicon rod and prevent the silicon rod from deflecting during cutting.
[0012] Preferably, a support ring is slidably sleeved on the outer surface of the support rod, and the two circular ring frames are rotatably connected to the support ring and the upper surface of the disc respectively, the lower surface of the slider is hinged to one end of one of the circular frames through a pin, and the upper end of the support rod is hinged to the outer surface of the other circular frame through a pin.
[0013] Through the above technical scheme, the circular frame is fixed by installing the disc and the support ring, the circular frame below is deflected by the offset of the slider, the circular frame above is deflected by the offset of the support rod, the fixing clamp on the circular frame is deflected, and the fixed block and roller rotatably connected to the fixing clamp fix the silicon rod to better cut the silicon rod.
[0014] Preferably, the upper surface of the disc and the upper surface of the support ring are hinged to one end of the fixing clamp through a pin, the interior of the circular ring frame is hinged with a limit block through a pin, one end of the fixing clamp is slidably inserted into the inner wall of the limit block, one end of the fixing clamp located on the disc is rotatably connected to the fixing block, and one end of the fixing clamp located on the support ring is rotatably connected to a roller.
[0015] Through the above technical scheme, the disc and the support ring are hinged with the fixing clamp through the pin shaft, which can fix the fixing clamp without affecting its deflection. The ring frame is hinged to the limit block through the pin shaft, which can fix the limit block without affecting its deflection and limit the fixing clamp at the same time. By rotating the connected fixing block at one end of the fixing clamp on the disc, the fixing block can fix the silicon rod and deflect according to the curvature of the fixing rod to better fix it. By rotating the connected roller at one end of the fixing clamp on the support ring, the silicon rod can be fixed without affecting the taking of the cut silicon wafer.
[0016] Preferably, the lifting device also includes a lifting motor, which is fixedly mounted on the outer surface of the disc through a support plate, and the lifting rod is fixedly mounted on the outer surface of the disc through a bearing. The output shaft of the lifting motor drives the lifting rod to rotate through a bevel gear set, and a limit rod is fixedly mounted on the upper surface of the disc.
[0017] Through the above technical solution, the driving bevel gear fixedly installed on the output shaft of the lifting motor is driven by the lifting motor to rotate, which drives the transmission bevel gear meshing with the driving bevel gear to rotate, thereby driving the lifting rod on the transmission bevel gear to rotate, so as to drive the support ring to lift and lower. By installing a limit rod, the support ring is limited to prevent the lifting and lowering of the support ring from affecting the support ring, thereby affecting the cutting of the silicon rod.
[0018] Preferably, the upper end of the lifting rod is threadedly connected to the outer surface of the support ring through a connecting block, and the support ring is slidably sleeved on the outer surface of the limiting rod.
[0019] Through the above technical solution, the lifting rod is threadedly connected to the support rod, so that the rotation of the lifting rod drives the support ring to lift and lower, so as to fix the silicon rod without affecting the cutting. The support ring is slidably sleeved on the outer surface of the limiting rod to limit the support ring, preventing the lifting of the support ring from affecting the support ring and thus affecting the cutting of the silicon rod.
[0020] The beneficial effects of the present invention are:
[0021] 1. By setting a fixing device, the silicon rod can be fixed, and the disc is driven to rotate by a rotating motor, so as to cooperate with the diamond wire cutter to improve the cutting efficiency. The threaded rod is driven by a driving motor to rotate, which drives the slider and the support rod on the slider to deviate, thereby driving the fixing clamp to deflect. The fixing block and the roller on the fixing clamp fix the silicon rod without affecting the removal of the cut silicon wafer. This solves the existing technical problem that when cutting single crystal silicon wafers, only the bottom of the single crystal silicon wafer is fixed, which affects the cutting accuracy, and the silicon wafer at the cutting position is not fixed, and the silicon wafer that is about to be cut falls, resulting in damage to the silicon wafer and increased costs.
[0022] 2. By setting up a lifting device, the support ring can be lifted and lowered. The lifting motor drives the bevel gear set to rotate, which drives the lifting rod to rotate, thereby driving the support ring to lift and lower. The limit rod limits the support ring, which solves the existing technical problem that when cutting single crystal silicon wafers, only the bottom of the single crystal silicon wafer is fixed, affecting the cutting accuracy, and the silicon wafer at the cutting position is not fixed, and the silicon wafer that is about to be cut falls, causing damage to the silicon wafer and increasing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of a single crystal silicon wafer positioning and cutting device proposed by the utility model;
[0024] Figure 2 A three-dimensional diagram of a support base structure of a single crystal silicon wafer positioning and cutting device proposed by the utility model;
[0025] Figure 3 A three-dimensional diagram of a disk structure of a single crystal silicon wafer positioning and cutting device proposed by the utility model;
[0026] Figure 4 This is a three-dimensional diagram of the circular frame structure of a single crystal silicon wafer positioning and cutting device proposed by the utility model.
[0027] In the figure: 1. support seat; 11. disc; 2. rotating motor; 21. cutting part; 3. driving motor; 31. threaded rod; 32. slider; 33. support rod; 4. support ring; 41. ring frame; 5. fixing clamp; 51. limit block; 52. fixing block; 53. roller; 6. lifting motor; 61. lifting rod; 62. bevel gear set; 63. limit rod. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0029] Reference Figure 1-Figure 4 A single crystal silicon wafer positioning and cutting device includes a support base 1, the outer surface of the support base 1 is rotatably connected to a disc 11, the outer surface of the disc 11 is provided with a fixing device, the fixing device includes a circular frame 41 and a fixing clamp 5, the deflection of the circular frame 41 drives the fixing clamp 5 to deflect and fix the silicon rod.
[0030] In order to drive the disc 11 to rotate, a rotating motor 2 is fixedly installed on the lower surface of the support seat 1, and the output shaft of the rotating motor 2 is fixedly installed on the lower surface of the disc 11. A cutting component 21 is fixedly installed on the outer surface of the support seat 1. The rotating motor 2 drives the disc 11 to rotate, so that it cooperates with the cutting component 21 to better cut the silicon rods on the disc 11. The cutting component 21 is a diamond wire cutter, which can achieve high-precision cutting, minimize the waste of silicon rods, and improve cutting efficiency.
[0031] In order to drive the threaded rod 31 to rotate, the fixing device also includes a driving motor 3, which is fixedly mounted on the upper surface of the disk 11. The output shaft of the driving motor 3 is fixedly mounted with the threaded rod 31 through a coupling. One end of the threaded rod 31 is fixedly mounted to the upper surface of the disk 11 through a bearing seat. The outer surface of the threaded rod 31 is threadedly connected with a slider 32, and the upper surface of the slider 32 is fixedly mounted with a support rod 33. The driving motor 3 drives the threaded rod 31 to rotate, driving the slider 32 and the support rod 33 on the slider 32 to deflect, thereby driving the annular frame 41 to deflect, so as to fix the silicon rod and prevent the silicon rod from deflecting during cutting.
[0032] In order to deflect the annular frame 41, the outer surface of the support rod 33 is slidably sleeved with a support ring 4, and the two annular frames 41 are rotatably connected to the support ring 4 and the upper surface of the disc 11 respectively. The lower surface of the slider 32 is hinged to one end of an annular frame 41 through a pin, and the upper end of the support rod 33 is hinged to the outer surface of the other annular frame 41 through a pin. The annular frames 41 are fixed by installing the disc 11 and the support ring 4, and the displacement of the slider 32 drives the lower annular frame 41 to deflect, and the displacement of the support rod 33 drives the upper annular frame 41 to deflect, driving the fixing clamp 5 on the annular frame 41 to deflect, and the fixing block 52 and the roller 53 rotatably connected to the fixing clamp 5 fix the silicon rod to better cut the silicon rod.
[0033] In order to make the fixing clamp 5 deflect, the upper surface of the disc 11 and the upper surface of the support ring 4 are hinged to one end of the fixing clamp 5 through a pin shaft, the interior of the ring frame 41 is hinged to a limit block 51 through a pin shaft, one end of the fixing clamp 5 is slidably plugged into the inner wall of the limit block 51, one end of the fixing clamp 5 located on the disc 11 is rotatably connected to a fixing block 52, and one end of the fixing clamp 5 located on the support ring 4 is rotatably connected to a roller 53, and the disc 11 and the support ring 4 are hinged to the fixing clamp 5 through a pin shaft, so that the fixing of the fixing clamp 5 is not affected The deflection of the fixing clamp 5, the circular ring frame 41 is hinged to the limit block 51 through a pin shaft, while fixing the limit block 51, it does not affect its deflection, and at the same time limits the fixing clamp 5, by rotating the connected fixing block 52 at one end of the fixing clamp 5 on the disk 11, the fixing block 52 can fix the silicon rod and deflect according to the curvature of the fixing rod to better fix it, and by rotating the connected roller 53 at one end of the fixing clamp 5 on the support ring 4, the silicon rod can be fixed without affecting the taking of the cut silicon wafer.
[0034] By setting up a fixing device, the silicon rod can be fixed, and the disc 11 is driven to rotate by the rotating motor 2, so as to cooperate with the diamond wire cutter to improve the cutting efficiency. The threaded rod 31 is driven to rotate by the driving motor 3, so as to drive the slider 32 and the support rod 33 on the slider 32 to deviate, thereby driving the fixing clamp 5 to deflect. The fixing block 52 and the roller 53 on the fixing clamp 5 fix the silicon rod without affecting the taking of the cut silicon wafer, thereby solving the technical problem that when cutting single crystal silicon wafers, only the bottom of the single crystal silicon wafer is fixed, which affects the cutting accuracy, and the silicon wafer at the cutting position is not fixed, and the silicon wafer that is about to be cut falls, resulting in damage to the silicon wafer and increased cost.
[0035] In order to drive a circular frame 41 to be lifted and lowered, a lifting device is disposed on the outer surface of the disk 11. The lifting device includes a lifting rod 61. The rotation of the lifting rod 61 drives a circular frame 41 to be lifted and lowered.
[0036] In order to drive the lifting rod 61 to rotate, the lifting device also includes a lifting motor 6, which is fixedly installed on the outer surface of the disc 11 through a support plate, and the lifting rod 61 is fixedly installed on the outer surface of the disc 11 through a bearing. The output shaft of the lifting motor 6 drives the lifting rod 61 to rotate through a bevel gear set 62. A limiting rod 63 is fixedly installed on the upper surface of the disc 11. The lifting motor 6 drives the driving bevel gear fixedly installed on the output shaft of the lifting motor 6 to rotate, and drives the transmission bevel gear meshing with the driving bevel gear to rotate, thereby driving the lifting rod 61 on the transmission bevel gear to rotate, so as to drive the support ring 4 to lift and lower. By installing the limiting rod 63, the support ring 4 is limited to prevent the lifting and lowering of the support ring 4 from affecting the support ring 4, thereby affecting the silicon rod cutting.
[0037] In order to limit the support ring 4, the upper end of the lifting rod 61 is threadedly connected to the outer surface of the support ring 4 through a connecting block, and the support ring 4 is slidably sleeved on the outer surface of the limiting rod 63. The lifting rod 61 is threadedly connected to the support rod 33, so that the rotation of the lifting rod 61 drives the support ring 4 to be lifted and lowered, so as to fix the silicon rod without affecting the cutting. The support ring 4 is slidably sleeved on the outer surface of the limiting rod 63 to limit the support ring 4, preventing the lifting of the support ring 4 from affecting the support ring 4, thereby affecting the cutting of the silicon rod.
[0038] By setting up a lifting device, the support ring 4 can be lifted and lowered. The lifting motor 6 drives the bevel gear set 62 to rotate, which drives the lifting rod 61 to rotate, thereby driving the support ring 4 to lift and lower. The limit rod 63 limits the support ring 4, which solves the existing technical problem that when cutting single crystal silicon wafers, only the bottom of the single crystal silicon wafer is fixed, which affects the cutting accuracy, and the silicon wafer at the cutting position is not fixed, and the silicon wafer that is about to be cut falls, resulting in damage to the silicon wafer and increased cost.
[0039] Working principle: By starting the rotating motor 2, the disc 11 is driven to rotate, and the cutting component 21 is installed to cut the silicon rod. The cutting component 21 is a diamond wire cutter. By starting the driving motor 3, the threaded rod 31 is driven to rotate, thereby driving the slider 32 and the support rod 33 on the threaded rod 31 to deviate, and then the circular ring frame 41 is deflected, so that the fixing block 52 and the roller 53 installed at one end of the fixing clamp 5 on the circular ring frame 41 fix the silicon rod, and by starting the lifting motor 6, the bevel gear set 62 is driven to rotate, driving the lifting rod 61 to rotate, thereby driving the support ring 4 to lift and lower, and the limit rod 63 limits the support ring 4.
[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A single crystal silicon wafer positioning and cutting device, comprising a support base (1), characterized in that: The outer surface of the support seat (1) is rotatably connected to a disk (11), and the outer surface of the disk (11) is provided with a fixing device, the fixing device comprising a circular ring frame (41) and a fixing clamp (5), and the deflection of the circular ring frame (41) drives the fixing clamp (5) to deflect and fix the silicon rod; The fixing device further comprises a driving motor (3), the driving motor (3) being fixedly mounted on the upper surface of the disc (11), the output shaft of the driving motor (3) being fixedly mounted with a threaded rod (31) via a coupling, one end of the threaded rod (31) being fixedly mounted with the upper surface of the disc (11) via a bearing seat, the outer surface of the threaded rod (31) being threadedly connected with a slider (32), and the upper surface of the slider (32) being fixedly mounted with a support rod (33); The outer surface of the disk (11) is provided with a lifting device, which comprises a lifting rod (61). The rotation of the lifting rod (61) drives one of the circular ring frames (41) to be lifted or lowered.
2. The single crystal silicon wafer positioning and cutting device according to claim 1, characterized in that: A rotating motor (2) is fixedly mounted on the lower surface of the support seat (1), an output shaft of the rotating motor (2) is fixedly mounted on the lower surface of the disc (11), and a cutting component (21) is fixedly mounted on the outer surface of the support seat (1).
3. The single crystal silicon wafer positioning and cutting device according to claim 1, characterized in that: The outer surface of the support rod (33) is slidably sleeved with a support ring (4), and the two circular ring frames (41) are rotatably connected to the support ring (4) and the upper surface of the disc (11) respectively. The lower surface of the slider (32) is hinged to one end of one of the circular frames (41) through a pin, and the upper end of the support rod (33) is hinged to the outer surface of the other circular frame (41) through a pin.
4. The single crystal silicon wafer positioning and cutting device according to claim 3, characterized in that: The upper surface of the disc (11) and the upper surface of the support ring (4) are both hinged to one end of the fixing clamp (5) via a pin shaft, the interior of the circular ring frame (41) is hinged to a limit block (51) via a pin shaft, one end of the fixing clamp (5) is slidably plugged into the inner wall of the limit block (51), one end of the fixing clamp (5) located on the disc (11) is rotatably connected to a fixing block (52), and one end of the fixing clamp (5) located on the support ring (4) is rotatably connected to a roller (53).
5. The single crystal silicon wafer positioning and cutting device according to claim 4, characterized in that: The lifting device further comprises a lifting motor (6), wherein the lifting motor (6) is fixedly mounted on the outer surface of the disc (11) via a support plate, and the lifting rod (61) is fixedly mounted on the outer surface of the disc (11) via a bearing, and the output shaft of the lifting motor (6) drives the lifting rod (61) to rotate via a bevel gear set (62), and a limit rod (63) is fixedly mounted on the upper surface of the disc (11).
6. The single crystal silicon wafer positioning and cutting device according to claim 5, characterized in that: The upper end of the lifting rod (61) is threadedly connected to the outer surface of the support ring (4) via a connecting block, and the support ring (4) is slidably sleeved on the outer surface of the limiting rod (63).