Notebook computer heat dissipation module with large plate structure

Abstract

The utility model discloses a notebook computer heat dissipation module with a large plate structure. The notebook computer heat dissipation module comprises a heat conduction strip, a large plate assembly, a heat dissipation fin module and a fan module. The two heat conduction strips are laterally connected together, each heat conduction strip is internally provided with a hollow cavity, each hollow cavity is filled with a heat conduction ball and heat absorption liquid, and each heat conduction strip is of an integrated structure and is provided with a heat absorption section attached to a CPU area, a slope section connected with the heat absorption section and a heat dissipation section connected with the slope section; the large plate assembly is used for tightly attaching the heat absorption section to the CPU, and the large plate assembly and the heat absorption section are fixed; the heat dissipation fin module is fixed on the heat dissipation section, and a mounting cavity is formed in one side of the heat dissipation fin module; the fan module is installed in the installation cavity, and an air outlet of the installation cavity is connected with a dustproof net cover in a covering mode. The heat dissipation fin module increases the heat dissipation area, and the fan module improves the heat dissipation efficiency of the whole heat dissipation module. And a dustproof net cover is arranged at the air outlet of the heat dissipation fin module, so that dust is prevented from entering the heat dissipation fin module.

Description

Technical Field

[0001] The utility model relates to a notebook computer, in particular to a notebook computer heat dissipation module with a large plate structure. Background Art

[0002] The laptop motherboard is one of the important parts of the computer. The laptop motherboard is generally a rectangular circuit board on which the main circuit systems and chips that make up the computer are installed. The chips on the motherboard include the CPU (central processing unit), GPU (graphics processing unit), north bridge chip, south bridge chip, etc. These chips consume energy during operation and generate heat due to the working principle of the internal circuit. In particular, the CPU and GPU are the main heat sources in the computer. They are the core components responsible for processing computing tasks and graphics rendering. They require high-frequency operations and data processing, so they will generate higher energy consumption and heat.

[0003] To ensure the stability and high performance of the laptop during use and to avoid CPU overheating, system crashes, performance degradation, or even hardware damage, a corresponding heat dissipation structure will be set up to ensure that the CPU temperature on the motherboard is within a reasonable range.

[0004] In the related art, a heat sink or heat pipe is usually placed on the CPU, and the heat is transferred to the heat sink fins through the heat sink or heat pipe to increase the heat dissipation area, so that the heat can be dissipated to the surrounding air more quickly, and finally the hot air is discharged through the diversion effect of the cooling fan to achieve the heat dissipation effect. However, due to the fixed size of the motherboard, the laying area of ​​the heat sink or heat pipe is relatively fixed, and the effective heat dissipation area that can be provided by the heat sink fins is also relatively fixed, so the heat dissipation effect of the motherboard is not ideal.

[0005] In view of this, a heat dissipation module for a notebook computer is needed to solve the above technical problems. Utility Model Content

[0006] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a laptop computer heat dissipation module with a large plate structure. The purpose of designing the laptop computer heat dissipation module is to improve the heat dissipation efficiency, make the heat dissipation of the laptop computer stable, improve the fixing structure of the laptop computer heat dissipation module, and improve the stability of the laptop computer heat dissipation module.

[0007] In order to solve the above technical problems, the utility model is implemented by the following scheme: The utility model is a notebook computer heat dissipation module with a large plate structure, comprising:

[0008] Two heat-conducting strips connected together at the side, each of which has a hollow cavity filled with a heat-conducting ball and a heat-absorbing liquid, and the heat-conducting strip is an integrated structure, which has a heat-absorbing section mounted on the CPU area, a slope section connected to the heat-absorbing section, and a heat-dissipating section connected to the slope section;

[0009] A large board component for placing the heat absorbing section close to the CPU, the large board component being fixed to the heat absorbing section;

[0010] A heat dissipation fin module is fixed to the heat dissipation section, and one side of the heat dissipation fin module has a mounting cavity;

[0011] The fan module is installed in the installation cavity, and the air outlet cover of the installation cavity is connected to a dustproof mesh cover.

[0012] Furthermore, the two heat-conducting strips are both flat copper strips.

[0013] Furthermore, after the heat-conducting strip is fixed inside the laptop computer and the laptop computer is placed horizontally, the heat dissipation section is higher than the heat absorption section.

[0014] Furthermore, the two heat-conducting strips are both L-shaped structures, and the arc-shaped corner sections of the two heat-conducting strips are sleeved with a reinforcing copper sleeve, which is fixed to the arc-shaped corner section.

[0015] Furthermore, the large plate assembly includes a first metal plate and a second metal plate, and the first metal plate is provided with three legs distributed in a peripheral ring array, and each leg is provided with a through hole;

[0016] One side of the second metal plate is fixed to the reinforced copper sleeve;

[0017] The second metal plate is also fixed to one of the legs via screws.

[0018] Furthermore, the heat-conducting ball is a hollow aluminum ball.

[0019] Furthermore, the heat absorbing liquid is pure water.

[0020] Furthermore, the fan module has four groups of fans, and the four groups of fans are connected to the fan driving unit through a relay unit.

[0021] Furthermore, the surface of the thermally conductive strip is sprayed with nano paint.

[0022] Furthermore, the large panel assembly is sprayed with nano paint.

[0023] Compared with the prior art, the beneficial effects of the utility model are:

[0024] 1. The utility model notebook computer heat dissipation module sets the heat conduction strip as a hollow structure, and sets an aluminum sphere and pure water in the hollow structure, thereby improving the heat conduction efficiency. In addition, the heat dissipation section is provided with a heat dissipation fin module and a fan module, the heat dissipation fin module increases the heat dissipation area, and the fan module improves the heat dissipation efficiency of the entire heat dissipation module.

[0025] 2. The aluminum sphere prevents bubbles from appearing in pure water.

[0026] 3. A dustproof mesh cover is provided at the air outlet of the heat dissipation fin module to prevent dust from entering the heat dissipation fin module.

[0027] 4. The large plate assembly of the utility model increases the heat conduction area, thereby also being able to improve the heat dissipation efficiency of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The utility model is a schematic diagram of the structure of the notebook computer heat dissipation module.

[0029] Figure 2 It is a schematic structural diagram of the heat-conducting strip of the utility model.

[0030] Figure 3 The utility model is a side view of the heat dissipation module of a notebook computer.

[0031] Figure 4 for Figure 3 Enlarged view of part A.

[0032] Markings in the attached drawings: first metal plate 1, second metal plate 2, reinforced copper sleeve 3, heat conductive strip 4, air outlet 5, dustproof mesh cover 6, fan module 7, heat dissipation fin module 8, heat dissipation section 41, slope section 42, heat absorption section 43, heat conductive ball 44. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model, so that the advantages and features of the utility model can be more easily understood by those skilled in the art, thereby making a clearer and more explicit definition of the protection scope of the utility model. Obviously, the embodiments described in the utility model are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0034] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] Embodiment 1, the specific structure of the utility model is as follows:

[0036] Please refer to the attached Figure 1-4 The utility model discloses a notebook computer heat dissipation module with a large plate structure, comprising two heat-conducting strips 4 connected together at the side, a large plate assembly, a heat dissipation fin module 8, and a fan module 7.

[0037] The heat-conducting strip 4 has a hollow cavity inside and is filled with a heat-conducting ball 44 and a heat-absorbing liquid. The heat-conducting strip 4 is an integrated structure, which has a heat-absorbing section 43 attached to the CPU area, a slope section 42 connected to the heat-absorbing section 43, and a heat-dissipating section 41 connected to the slope section 42. The large plate assembly is used to attach the heat-absorbing section 43 to the CPU. The large plate assembly is also made of heat-conducting material, generally made of aluminum alloy plate, and the large plate assembly is fixed to the heat-absorbing section 43. The CPU and the heat-absorbing section 43 are coated with thermal paste. Both heat-conducting strips 4 are L-shaped structures, and the arc-shaped corner sections of the two heat-conducting strips 4 are covered with a reinforced copper sleeve 3, and the reinforced copper sleeve 3 is fixed to the arc-shaped corner section. Since the heat-conducting strip 4 is a flat structure, its lateral bending is likely to cause copper fracture, so the reinforced copper sleeve 3 is welded and fixed at the bending position to prevent the heat-conducting strip 4 from breaking when bending.

[0038] The two heat-conducting bars 4 are both flat copper bars. After the heat-conducting bars 4 are fixed inside the laptop computer and the laptop computer is placed horizontally, the heat-dissipating section 41 is higher than the heat-absorbing section 43 .

[0039] The heat absorbing liquid is pure water, which is non-conductive. Even if the hollow heat conducting strip 4 has cracks and the pure water flows out, it will not damage the mainboard. The function of pure water is to conduct heat. The pure water cannot fill the hollow cavity, and a portion must be reserved for the vapor-state pure water. In the process of the heat absorbing section 43 transferring heat to the heat dissipating section 41, the pure water also absorbs heat. After absorbing heat, the pure water will form a vapor state. The vapor-state pure water enters the heat dissipating section 41 along the slope section 42. After the heat dissipating section 41 cools down, the pure water is double-condensed into a liquid state.

[0040] Since the heat dissipation section 41 is higher than the heat absorption section 43 , the condensed pure water will flow back to the heat absorption section 43 .

[0041] The heat-conducting ball 44 is a hollow aluminum ball. The functions of the hollow aluminum ball are to conduct heat and to prevent bubbles from appearing in the middle of the pure water to affect the heat-conducting effect.

[0042] The heat dissipation fin module 8 is fixed to the heat dissipation section 41. One side of the heat dissipation fin module 8 has a mounting cavity. The heat dissipation fin module 8 is also a copper heat dissipation fin, which increases the heat dissipation area.

[0043] The fan module 7 is installed in the installation cavity, and the air outlet 5 of the installation cavity is covered with a dustproof mesh cover 6. When installing the heat dissipation module of the notebook computer of the utility model, the air outlet 5 is directly opposite to the air outlet of the notebook computer shell. In order to prevent dust from entering the inside of the notebook computer, a dustproof mesh cover 6 is set at the air outlet 5. The dustproof mesh cover 6 is a fine mesh plate, which is detachably installed in the installation cavity, such as screw fixation or buckle fixation. Preferably, buckle fixation is adopted in this embodiment 1. The operation of the fan module 7 also improves the heat dissipation efficiency of the heat dissipation module.

[0044] Embodiment 2:

[0045] The large plate assembly includes a first metal plate 1 and a second metal plate 2. The first metal plate 1 has three legs distributed in a peripheral ring array, each leg is provided with a through hole. The first metal plate 1 and the second metal plate 2 are both aluminum alloy plates, which also have good thermal conductivity. One side of the second metal plate 2 is fixed to the reinforcing copper sleeve 3. The second metal plate 2 is also fixed to one of the legs by a screw.

[0046] Embodiment 3:

[0047] The fan module 7 has four sets of fans, and the four sets of fans are connected to the fan driving unit through the relay unit. Among the four sets of fans of the utility model, any set of fans can be started separately. Since the notebook computer consumes a lot of power when not charged, it can only last for about 4 hours. In order to make the notebook computer last longer, a fan driving unit is set to control the on and off of the relay unit, thereby controlling the on and off of the four sets of fans.

[0048] The processor of the fan drive unit detects the current working temperature of the laptop computer and determines how many sets of fans need to be turned on based on the temperature.

[0049] The surface of the heat conducting strip 4 is sprayed with nano paint, and the large panel assembly is sprayed with nano paint, and the function of the nano paint is to prevent oxidation.

[0050] In summary, the heat dissipation module of the notebook computer of the utility model sets the heat conduction strip as a hollow structure, and sets an aluminum sphere and pure water in the hollow structure, thereby improving the heat conduction efficiency. In addition, the heat dissipation section is provided with a heat dissipation fin module and a fan module. The heat dissipation fin module increases the heat dissipation area, and the fan module improves the heat dissipation efficiency of the entire heat dissipation module. The aluminum sphere prevents bubbles from appearing in the pure water. A dustproof mesh cover is set at the air outlet of the heat dissipation fin module to prevent dust from entering the heat dissipation fin module. The large plate assembly of the utility model increases the heat conduction area, thereby also being able to improve the heat dissipation efficiency of the heat dissipation module.

[0051] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A notebook computer heat dissipation module with a large plate structure, characterized in that: include: Two heat-conducting strips (4) connected together at the side, the heat-conducting strip (4) having a hollow cavity inside and a heat-conducting ball (44) and a heat-absorbing liquid filled in the hollow cavity, the heat-conducting strip (4) being an integrated structure, comprising a heat-absorbing section (43) attached to the CPU area, a slope section (42) connected to the heat-absorbing section (43), and a heat-dissipating section (41) connected to the slope section (42); Used to place the heat absorbing section (43) close to a large board assembly of a CPU, wherein the large board assembly is fixed to the heat absorbing section (43); A heat dissipation fin module (8) is fixed to the heat dissipation section (41), and one side of the heat dissipation fin module (8) has a mounting cavity; The fan module (7) is installed in the installation cavity, and the air outlet (5) of the installation cavity is covered with a dustproof mesh cover (6).

2. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The two heat-conducting strips (4) are both flat copper strips.

3. A notebook computer heat dissipation module with a large plate structure according to claim 1 or 2, characterized in that: After the heat-conducting strip (4) is fixed inside the laptop computer and the laptop computer is placed horizontally, the heat-dissipating section (41) is higher than the heat-absorbing section (43).

4. The notebook computer heat dissipation module with a large plate structure according to claim 2, characterized in that: The two heat-conducting strips (4) are both L-shaped structures. The arc-shaped corner sections of the two heat-conducting strips (4) are sleeved with a reinforcing copper sleeve (3), and the reinforcing copper sleeve (3) is fixed to the arc-shaped corner section.

5. The notebook computer heat dissipation module with a large plate structure according to claim 4, characterized in that: The large plate assembly comprises a first metal plate (1) and a second metal plate (2), wherein the first metal plate (1) is provided with three legs in a peripheral ring array, and each leg is provided with a through hole; One side of the second metal plate (2) is fixed to the reinforcing copper sleeve (3); The second metal plate (2) is also fixed to one of the legs via screws.

6. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The heat-conducting ball (44) is a hollow aluminum ball.

7. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The heat absorbing liquid is pure water.

8. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The fan module (7) has four groups of fans, and the four groups of fans are connected to the fan driving unit via a relay unit.

9. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The surface of the heat-conducting strip (4) is sprayed with nano-paint.

10. The notebook computer heat dissipation module with a large plate structure according to claim 1, characterized in that: The large panel assembly is sprayed with nano paint.

Images