Cooling device

Abstract

The utility model provides a cooling device which comprises a bottom plate, a bottom plate flow channel surrounding the bottom plate in the circumferential direction and arranged in the bottom plate, a confluence inlet channel and a confluence outlet channel communicating with the bottom plate flow channel and a plurality of cooling assembly units communicating with the bottom plate flow channel, and each cooling assembly unit comprises at least one cooling flow channel. And the cooling runners in the same cooling assembly unit are communicated with one another. According to the cooling device, the use number of adapters can be effectively reduced, the overall space of the cooling device is effectively reduced, and the integration degree of the cooling device is improved; the reduction of the use number of the adapters is beneficial to reducing the leakage risk of the cooling device and improving the reliability of the cooling device in a vacuum environment; as the manufacturing cost and the volume of the vacuum cavity are in an exponential relationship, the integration degree of the cooling device is improved, and the overall cost of the vacuum equipment can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit equipment manufacturing, in particular to a cooling device in vacuum environment manufacturing and testing equipment. Background Art

[0002] In the next generation of vacuum semiconductor equipment (for example, in the field of electron beam lithography or wafer inspection), the performance requirements for ultra-precision motion are greatly improved. Not only is the motion stage required to have nanometer-level motion positioning accuracy, but also the overall yield of the equipment, the vacuum applicability of the equipment, vacuum thermal management, small space size and other requirements need to be considered.

[0003] The study found that the above factors have a certain relationship with the cooling device in the vacuum environment. The vacuum cooling device in the prior art usually adopts a contact cooling method, that is, a cooling plate assembly with a flow channel is arranged near the heating element, and each group of cooling plate assemblies needs to be arranged with at least two cooling flow channel joints. If there are a large number of heating elements in the vacuum equipment, the number of cooling flow channel joints required will be more, and the volume of the cooling flow channel joint is relatively large, and the bending radius of the cooling channel connected to it is usually large. Therefore, the vacuum cooling device in the prior art is usually low in integration, with a large number of cooling flow channel joints and a large size space; at the same time, the large number of cooling flow channel joints and the increase in the number of breakpoints in the cooling pipeline will inevitably increase the leakage risk of the cooling device, reduce its reliability in a vacuum environment, and increase the total cost of the cooling device; in addition, the flow channel direction and length of the cooling pipe in the cooling device are difficult to design in advance, and the risk is uncontrollable. On the one hand, it will increase the flow resistance and reduce the cooling efficiency. On the other hand, it will cause uneven heat dissipation of multiple heating elements and excessive local temperature, thereby affecting the performance of the equipment.

[0004] In order to solve the problems of low cooling rate, excessive local temperature, large vacuum leakage rate, poor applicability under high vacuum, low degree of integration, large number of cooling channel joints and large size space of the cooling device in a vacuum environment, the present application provides a cooling device. Utility Model Content

[0005] In view of the problems of low cooling efficiency, excessive local temperature, high vacuum leakage rate, poor applicability under high vacuum, low integration, large number of cooling channel joints, and large size and space in the prior art cooling devices in vacuum environments, the present application provides a cooling device. The cooling device can effectively reduce the number of adapters used, effectively reduce the overall space of the cooling device, and improve the integration of the cooling device by setting a bottom plate flow channel inside the bottom plate, setting a confluence inlet channel and a confluence outlet channel connected to the bottom plate flow channel on the bottom plate, and setting multiple cooling component units connected to the bottom plate flow channel; reducing the number of adapters used is conducive to reducing the leakage risk of the cooling device and improving the reliability of the cooling device in a vacuum environment; since the cost of the vacuum cavity is exponentially related to the volume, the improvement of the integration of the cooling device can effectively reduce the overall cost of the vacuum equipment.

[0006] An embodiment of the present application provides a cooling device, comprising:

[0007] A bottom plate, the bottom plate having a first surface and a second surface arranged opposite to each other;

[0008] A bottom plate flow channel, the bottom plate flow channel surrounds the circumference of the bottom plate and is arranged inside the bottom plate;

[0009] A confluence inlet channel and a confluence outlet channel, wherein the confluence inlet channel and the confluence outlet channel are both arranged on the bottom plate, the first end of the confluence inlet channel is communicated with the bottom plate flow channel, and the second end of the confluence inlet channel opens from the first surface or the second surface; the first end of the confluence outlet channel is communicated with the bottom plate flow channel, and the second end of the confluence outlet channel opens from the first surface or the second surface;

[0010] Multiple cooling component units, each of which includes at least one cooling channel, each of which is connected to the bottom plate channel, and the cooling channel is connected to the bottom plate channel. The medium in the cooling channel and the bottom plate channel is used for heat exchange with the part to be cooled.

[0011] As an embodiment, the bottom plate flow channel includes a plurality of bottom plate shunt channels arranged at intervals, and along the medium flow direction, the plurality of bottom plate shunt channels are sequentially arranged along the circumference of the bottom plate, and the number of the bottom plate shunt channels is at least the same as the number of the cooling component units; adjacent bottom plate shunt channels are connected through the cooling component units;

[0012] The first end of the confluence inlet channel is communicated with one of the bottom plate branch channels; the first end of the confluence outlet channel is communicated with the other bottom plate branch channel.

[0013] As an embodiment, it also includes multiple groups of cooling convergence channels, which correspond to the cooling component units, and each group of cooling convergence channels includes a cooling convergence inlet channel and a cooling convergence outlet channel. One end of the cooling convergence inlet channel and the cooling convergence outlet channel are both opened from the first surface and extend toward the second surface. The other end of the cooling convergence inlet channel is connected to one of the bottom plate diversion channels; the other end of the cooling convergence outlet channel is connected to another bottom plate diversion channel; the cooling component unit is located above the first surface.

[0014] As an embodiment, the bottom plate includes a plurality of side surfaces arranged between the first surface and the second surface, and the bottom plate flow channel opens from one of the side surfaces, extends in a direction parallel to the first surface, and passes through another side surface;

[0015] The two ends of the bottom plate flow divider close to the side surface are provided with blocking pieces.

[0016] As an implementation manner, the blocking member is welded to the opening of the bottom plate shunt channel at the side surface.

[0017] As an embodiment, it further includes a first adapter and a second adapter, wherein the first adapter is communicated with the confluence inlet channel, and the second adapter is communicated with the confluence outlet channel.

[0018] As an embodiment, the first surface is provided with a first air guide groove; and / or,

[0019] The second surface is provided with a second air guide groove.

[0020] As an embodiment, the bottom plate is provided with a plurality of groups of cooling assembly positioning holes, the cooling assembly positioning holes penetrate the first surface and the second surface, and the cooling assembly positioning holes are arranged along the circumference of the bottom plate.

[0021] As an implementation manner, the second surface is provided with a bottom plate fixing installation hole, and the bottom plate fixing installation hole is arranged along the circumference of the bottom plate.

[0022] As described above, the cooling device of the present application has the following beneficial effects:

[0023] The cooling device of the present application can effectively reduce the number of adapters used, effectively reduce the overall space of the cooling device, and improve the integration level of the cooling device by arranging a bottom plate flow channel surrounding the circumference of the bottom plate inside the bottom plate, arranging a confluence inlet channel and a confluence outlet channel connected to the bottom plate flow channel on the bottom plate, and arranging multiple cooling component units connected to the bottom plate flow channel. The reduction in the number of adapters used is conducive to reducing the leakage risk of the cooling device and improving the reliability of the cooling device in a vacuum environment. At the same time, since the cost of the vacuum chamber is exponentially related to its volume, the improvement in the integration level of the cooling device can effectively reduce the overall cost of the vacuum equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of the bottom plate of the cooling device of the first embodiment of the utility model;

[0025] Figure 2 It is a schematic structural diagram of the first surface of the bottom plate of the first embodiment of the utility model;

[0026] Figure 3 It is a schematic structural diagram of the second surface of the bottom plate of the first embodiment of the utility model;

[0027] Figure 4 Shown is a schematic diagram of the structure of the cooling circuit of the cooling device of the first embodiment of the utility model;

[0028] Figure 5 Shown is a schematic structural diagram of a cooling assembly unit according to a first embodiment of the present utility model;

[0029] Figure 6 It is a schematic cross-sectional structure diagram of a bottom plate (no blocking member is provided in the bottom plate flow channel) in a cooling device according to the second embodiment of the utility model;

[0030] Figure 7 It is a schematic cross-sectional structure diagram of a bottom plate (a blocking member is provided in the bottom plate flow channel) in a cooling device according to the second embodiment of the utility model;

[0031] Figure 8 Shown is a schematic diagram of the overall structure of the cooling device of the second embodiment of the utility model;

[0032] Fig. 9 The figure shows a cross-sectional structural diagram of a bottom plate in a cooling device according to a third embodiment of the present utility model;

[0033] Fig.10 Shown is a schematic diagram of the overall structure of the cooling device of Example 3 of the present utility model.

[0034] Component number description

[0035] 10, bottom plate; 10a, first surface; 10b, second surface; 10c, side; 20, confluence inlet channel; 30, confluence outlet channel; 40, bottom plate flow channel; 50, cooling assembly unit; 60, cooling confluence channel; 60a, cooling confluence inlet channel; 60b, cooling confluence outlet channel; 70, first adapter; 80, second adapter; 110, first air guide groove; 120, second air guide groove; 130, cooling assembly positioning hole; 140, bottom plate fixed mounting hole; 410, bottom plate diversion channel; 420, blocking part; 510, cooling flow channel; 520, part to be cooled; 530, connecting channel; 5101, cooling plate; 5102, cooling plate pressing block; 5103, cooling assembly fixed mounting hole; 5104a, cooling assembly confluence inlet; 5104b, cooling assembly confluence outlet. DETAILED DESCRIPTION

[0036] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] See also Figures 1 to 10 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the utility model in a schematic manner, and the illustrations only show the components related to the utility model rather than the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0038] In the next generation of vacuum semiconductor equipment, such as electron beam lithography or wafer inspection, the performance requirements for ultra-precision motion are greatly increased. Not only is the motion stage required to have nanometer-level motion positioning accuracy, but also the overall yield of the equipment, the vacuum applicability of the equipment, vacuum thermal management, small space size and other requirements need to be considered.

[0039] Research has found that the above requirements are related to the cooling devices used in vacuum environments: (1) Gas molecules in a vacuum environment are relatively thin, and the heat dissipation efficiency of thermal radiation and thermal convection is extremely low. Usually, heat can only be dissipated through heat conduction between the medium in the cooling device and the heat source. However, in a vacuum environment, if the cooling efficiency of the cooling device is not high, heat accumulation will cause the local temperature of the vacuum equipment to be too high. On the one hand, excessive local temperature will cause thermal deformation differences, thereby affecting the overall movement accuracy of the equipment; on the other hand, over time, the generated heat accumulation will affect or even burn the heat source; (2) The vacuum cooling device in the prior art usually arranges a cooling plate assembly with a flow channel near the heat source. Each group of cooling plate assemblies needs to be arranged with at least two cooling flow channel joints. If there are a large number of heat sources in the vacuum equipment, the required The number of cooling channel joints will be greater. The greater the number of cooling channel joints and the greater the number of breakpoints in the cooling pipeline, the greater the risk of leakage of the cooling device and the lower its reliability in a vacuum environment. This will cause the air tightness of the vacuum equipment to decrease during operation and the overall leakage rate to increase, thereby affecting the normal operation of the vacuum equipment. (3) If there are a large number of heating elements in the vacuum equipment, the number of cooling channel joints required will also increase accordingly. The volume of the cooling channel joints is relatively large, and the bending radius of the cooling channel connected to it is usually large. Therefore, the vacuum cooling device in the prior art is usually less integrated, has a large number of cooling channel joints, and has a larger size space. The cost of the vacuum cavity is exponentially related to the volume. Therefore, the vacuum cooling device in the prior art will increase the overall cost of the vacuum equipment.

[0040] In view of the above defects, the present application provides a cooling device, which is now described in detail through the following embodiments.

[0041] Embodiment 1

[0042] This embodiment provides a cooling device, such as Figures 1 to 4 As shown, the cooling device includes a base plate 10 , a base plate flow channel 40 , a converging inlet channel 20 , a converging outlet channel 30 and a plurality of cooling component units 50 .

[0043] like Figure 2 and Figure 3 As shown, the base plate 10 has a first surface 10 a and a second surface 10 b that are opposite to each other, and a plurality of side surfaces 10 c that are disposed between the first surface 10 a and the second surface 10 b .

[0044] like Figure 4 As shown, the bottom plate flow channel 40 is arranged inside the bottom plate 10 ( Figure 1 , Figure 2 and Figure 3 Not shown), and is arranged around the circumference of the base plate 10.

[0045] like Figure 2 and Figure 4 As shown, the confluence inlet channel 20 and the confluence outlet channel 30 are both disposed on the bottom plate 10, the first end of the confluence inlet channel 20 is communicated with the bottom plate flow channel 40, and the second end of the confluence inlet channel 20 opens from the first surface 10a or the second surface 10b ( Figure 2 Only the second end of the confluence inlet channel 20 is shown to open from the first surface 10a of the bottom plate 10); the first end of the confluence outlet channel 30 is connected to the bottom plate flow channel 40, and the second end of the confluence outlet channel 30 is opened from the first surface 10a or the second surface 10b ( Figure 2 Only the second end of the confluence outlet channel 30 is shown to open from the first surface 10a of the bottom plate 10). It can be understood that the opening of the second end of the confluence inlet channel 20 on the bottom plate 10 and the opening of the second end of the confluence outlet channel 30 on the bottom plate 10 can be located on the same side surface of the bottom plate 10, or on different sides. It should be noted that the confluence inlet channel 20 and the confluence outlet channel 30 are located on the same side surface of the bottom plate 10. Figure 2 or Figure 4 The positions in the figure can be reversed. The numbering of the drawings in this application is only for the convenience of explaining the flow direction of the medium in the cooling device, but should not be limited to the numbering shown in this embodiment. The following description of the inlet or outlet should be understood in the same way.

[0046] like Figure 4 As shown, each cooling component unit 50 includes at least one cooling channel 510, each cooling channel 510 in the same cooling component unit 50 is connected, the cooling component unit 50 is connected to the bottom plate channel 40, and the medium in the cooling channel 510 and the bottom plate channel 40 is used for heat exchange with the part to be cooled 520.

[0047] In this embodiment, the medium in the cooling assembly unit 50 and the bottom plate flow channel 40 is a fluid, which can be a gas or a liquid.

[0048] The cooling device provided in the present embodiment is configured with a bottom plate flow channel 40 which surrounds the bottom plate 10 in a circumferential direction inside the bottom plate 10, and a confluence inlet channel 20 and a confluence outlet channel 30 which are connected to the bottom plate flow channel 40 are configured on the bottom plate 10, the second end of the confluence inlet channel 20 and the second end of the confluence outlet flow channel 30 are opened from the first surface 10a or the second surface 10b, and a plurality of cooling component units 50 which are connected to the bottom plate flow channel 40 are configured. This can effectively reduce the number of adapters used, effectively reduce the overall space of the cooling device, and improve the degree of integration of the cooling device. Reducing the number of adapters used is conducive to reducing the leakage risk of the cooling device and improving the reliability of the cooling device in a vacuum environment. At the same time, since the cost of the vacuum chamber is exponentially related to its volume, improving the degree of integration of the cooling device can effectively reduce the overall cost of the vacuum equipment.

[0049] In an optional embodiment, if Figure 4 As shown, the bottom plate flow channel 40 includes a plurality of bottom plate shunt channels 410 arranged at intervals. Along the medium flow direction, the plurality of bottom plate shunt channels 410 are arranged in sequence along the circumference of the bottom plate 10. Generally, the number of bottom plate shunt channels 410 is the same as the number of cooling assembly units 50; in some cases, the number of bottom plate shunt channels 410 is greater than the number of cooling assembly units 50. Adjacent bottom plate shunt channels 410 are connected through the cooling assembly units 50; the first end of the confluence inlet channel 20 is connected to one of the bottom plate shunt channels 410; and the first end of the confluence outlet channel 30 is connected to another bottom plate shunt channel 410. The bottom plate shunt channels 410 are connected to the cooling assembly units 50, and the bottom plate shunt channels 410 penetrate the adjacent cooling assembly units 50 arranged along the circumference of the bottom plate 10, and together constitute the overall medium flow channel of the cooling device.

[0050] In an optional embodiment, if Figure 4 As shown, the cooling device also includes a plurality of groups of cooling confluence channels 60, the number of groups of cooling confluence channels 60 is the same as the number of cooling assembly units 50, each group of cooling confluence channels 60 includes a cooling confluence inlet channel 60a and a cooling confluence outlet channel 60b, one end of the cooling confluence inlet channel 60a and the cooling confluence outlet channel 60b are both opened from the first surface 10a and extend toward the second surface 10b, the other end of the cooling confluence inlet channel 60a is connected to one of the bottom plate shunt channels 410, and the other end of the cooling confluence outlet channel 60b is connected to another bottom plate shunt channel 410, and the bottom plate shunt channel 410 connected to the cooling confluence inlet channel 60a and the bottom plate shunt channel 410 connected to the cooling confluence outlet channel 60b are arranged adjacent to each other. In order to achieve the connection between the cooling assembly unit 50 and the cooling confluence channel 60, a connecting channel 530 is arranged between the cooling assembly unit 50 and the cooling confluence channel 60. The cooling channels 510 in each cooling assembly unit 50 are also connected through the connecting channel 530. The connecting channel 530 at the inlet end of the cooling assembly unit 50 is connected to the cooling confluence inlet channel 60a, and the connecting channel 530 at the outlet end of the cooling assembly unit 50 is connected to the cooling confluence outlet channel 60b. The cooling assembly unit 50 is located above the first surface 10a.

[0051] In an optional embodiment, if Figure 1As shown, the cooling device further includes a first adapter 70 and a second adapter 80, which can be connected to the first surface 10a or the second surface 10b of the bottom plate 10 by welding or mechanical fixing, so as to realize that the first adapter 70 is connected to the confluence inlet channel 20, and the second adapter 80 is connected to the confluence outlet channel 30. The first adapter 70 is an adapter for introducing the medium of the external channel of the cooling device into the internal medium channel of the cooling device, and the second adapter 80 is an adapter for exporting the medium of the internal medium channel of the cooling device to the external channel of the cooling device. The internal medium channel of the cooling device is connected to the external medium channel through the first adapter 70 and the second adapter 80. Generally, according to the leakage rate requirements of the cooling device, the first adapter 70 and the second adapter 80 can be fixed to the bottom plate 10 by welding or by mechanical fixing. Generally, the welding method can meet the lower vacuum leakage rate index, but it is necessary to ensure that the first adapter 70, the second adapter 80 and the bottom plate 10 are made of the same material. It should be noted that the selection of the type and material of the first adapter 70 and the second adapter 80 is also related to the type and material of the external pipeline connected to the cooling device.

[0052] In an optional embodiment, if Figure 1 and Figure 2 As shown, the bottom plate 10 is provided with a plurality of groups of cooling assembly positioning holes 130, the cooling assembly positioning holes 130 penetrate the first surface 10a and the second surface 10b, and the cooling assembly positioning holes 130 are arranged along the circumference of the bottom plate 10. The cooling assembly positioning holes 130 are installation holes for mechanically connecting the part to be cooled 520 with the bottom plate 10, a group of cooling assembly positioning holes 130 corresponds to one part to be cooled 520, and the number of a group of cooling assembly positioning holes 130 is at least 2.

[0053] In an optional embodiment, if Figure 3 As shown, the second surface 10b of the bottom plate 10 is provided with bottom plate fixing holes 140, and the bottom plate fixing holes 140 are arranged along the circumference of the bottom plate 10. The bottom plate fixing holes 140 are fixing holes for the bottom plate 10 and the connecting plate thereunder, and according to the size and shape of the bottom plate, at least three bottom plate fixing holes 140 are usually evenly distributed in an array along the circumference of the bottom plate 10.

[0054] In an optional embodiment, if Figure 1 and Figure 2 As shown, the first surface 10a of the bottom plate 10 is provided with a first air guide groove 110. Optionally, as Figure 3As shown, the second surface 10b of the bottom plate 10 is provided with a second air guide groove 120. Since the cooling device of the present embodiment is suitable for use in a vacuum environment, in order to reduce the gas storage and dead zone area, processing the first air guide groove 110 on the first surface 10a and processing the second air guide groove 120 on the second surface 10b can reduce the vacuum pumping time of the cooling device and improve the vacuum applicability of the bottom plate 10. According to the type and number of the parts 520 to be cooled, the first air guide grooves 110 are usually distributed in a circumferential array along the first surface 10a of the bottom plate 10 in an area other than the second end of the confluence inlet channel 20, the second end of the confluence outlet channel 30, the inlet of the cooling confluence channel 60, the cooling assembly positioning hole 130 and the bottom plate fixed installation hole 140. The shape, size and number of the second air guide grooves 120 distributed on the second surface 10b are consistent with the shape, size and number of the first air guide grooves 110 distributed on the first surface 10a.

[0055] In an optional embodiment, if Figure 5As shown, the cooling component 520 to be cooled in the cooling component unit 50 is an actuator component, and the cooling component unit 50 also includes a cooling plate 5101, a cooling plate block 5102, a cooling component confluence inlet 5104a, a cooling component confluence outlet 5104b and a cooling component fixed installation hole 5103. Optionally, in the cooling component unit 50, the direction parallel to the long side of the cooling plate block 5102 is defined as the X direction, the array direction of the cooling component unit 50 is defined as the Y direction, and the direction parallel to the hole depth direction of the cooling component fixed installation hole 5103 is defined as the Z direction; the actuator component is defined as an actuator component that can generate forces in the X direction, Y direction, and Z direction, or can generate torques in the Rx direction, Ry direction, and Rz direction. The actuator component generates heat due to the generation of forces or torques, and the actuator component or its surrounding components are sensitive to heat, and the heat generated by the actuator component needs to be removed through a cooling medium to reduce the impact of the temperature rise of the actuator component on the environment or other components. Optionally, the cooling plate 5101 is a thin plate having at least one cooling channel 510 formed therein. The cooling channels 510 in the two cooling plates 5101 are connected through a connecting channel 530. The actuator assembly is arranged between the two cooling plates 5101. The connecting channel 530 can be arranged in the cooling plate block 5102. The connecting channel 530 is connected to the cooling confluence channel 60. The cooling confluence channel 60 is connected to the bottom plate channel 40. The bottom plate channel 40 is connected to the first adapter 70 through the confluence inlet channel 20 and to the second adapter 80 through the confluence outlet channel 30. The first adapter 70 and the second adapter 80 are connected to external pipelines, thereby realizing the connection between the cooling channel 510 inside the cooling plate 5101 and the external pipeline. The cooling medium flows in the cooling channel 510 to transfer the heat generated inside the actuator assembly to the external area to control the temperature of the actuator assembly. It should be noted that, based on the temperature control, size constraints and application scenario requirements of the actuator assembly, each actuator assembly is usually equipped with at least one set of cooling plates 5101 (a set of cooling plates 5101 includes at least two thin plates), and the shape of the cooling plate 5101 is not limited to a flat plate, and can be set according to the shape of the actuator assembly, and can also be an arc shape, a cylinder shape or other shapes.The cooling plate block 5202 is matched with the cooling plate 5101 for use. The cooling plate block 5202 is usually distributed on the outside of the cooling plate 5101. The cooling assembly confluence inlet 5104a and the cooling assembly confluence outlet 5104b are arranged at the bottom of the cooling plate block 5102. The inlet end of the cooling assembly confluence inlet 5104a is connected to the cooling confluence inlet channel 60a, and the outlet end of the cooling assembly confluence inlet 5104a is connected to the inlet end of the communication channel 530. The cooling assembly confluence outlet 5104a is connected to the cooling assembly confluence inlet channel 60a. The inlet end of 4b is connected to the outlet end of the connecting channel 530, and the outlet end of the cooling assembly confluence outlet 5104b is connected to the cooling confluence outlet channel 60b; the cooling assembly fixed installation hole 5103 is arranged at the bottom of the cooling plate block 5102, corresponding to the cooling assembly positioning hole 130 arranged on the bottom plate 10; the cooling plate block 5102 serves as a flow channel connecting the cooling channel 510 and the cooling assembly and the bottom plate flow channel 40, and as a fixed connection between the cooling plate 5101 and the bottom plate 10. It should be noted that the material of the cooling plate 5101 and the cooling plate block 5102 is not limited. According to the different cooling media introduced into the cooling device, and the processing technology differences of the different materials of the cooling plate 5101 and the cooling plate block 5102, the above-mentioned components can be selected from materials with lower degassing rate and relatively higher thermal conductivity, such as aluminum alloy, titanium alloy, stainless steel, oxygen-free copper, etc.

[0056] Embodiment 2

[0057] This embodiment also provides a cooling device, which includes a bottom plate 10, a bottom plate flow channel 40, a converging inlet channel 20, a converging outlet channel 30 and a plurality of cooling component units 50. The difference from the first embodiment is that:

[0058] like Figure 6 As shown, the bottom plate flow divider 410 opens from one of the side surfaces 10c, extends in a direction parallel to the first surface 10a or the second surface 10b, and passes through the other side surface 10c; blocking members 420 are provided at both ends of the bottom plate flow divider 410 close to the side surface 10c.

[0059] In an optional embodiment, if Figure 6 , Figure 7 and Figure 8 As shown, the cross-sectional shape of the bottom plate 10 is hexagonal as an example for explanation. It can be understood that the shape of the bottom plate 10 in this embodiment can be designed according to actual needs. Therefore, it is not limited to the cross-sectional shape of the bottom plate 10 listed in this embodiment.

[0060] In one embodiment, the number of the components to be cooled 520 is 6, and each bottom plate flow channel 410 may be composed of two straight flow channels, and the angle between the two straight flow channels is 90 degrees.

[0061] The bottom plate flow channel 410 of the cooling device in this embodiment is formed by machining. When the bottom plate flow channel 410 is composed of two straight flow channels, and the angle between the two straight flow channels is 90 degrees, one of the straight flow channels in the bottom plate flow channel 410 is processed into a channel of a certain depth along one of the side surfaces 10c of the bottom plate 10 in the circumferential direction toward the inside of the bottom plate 10, and the other straight flow channel is processed into a channel of a certain depth along the side surface 10c of the bottom plate 10 in the circumferential direction and adjacent to the side surface 10c toward the inside of the bottom plate 10, and the two straight flow channels are connected inside the bottom plate 10, and the depths of the two straight flow channels inside the bottom plate 10 may be the same or different.

[0062] In an optional embodiment, if Figure 7 As shown, the plugging member 420 is welded to the opening of the bottom plate shunt channel 410 at the side 10c. The aperture of the plugging member 420 is consistent with the diameter of the bottom plate shunt channel 410. Welding the plugging member 420 to the bottom plate shunt channel 410 at the opening of the side 10c is not only simple to operate, but also can meet a lower vacuum leakage rate index (the vacuum leakage rate refers to the rate at which gas enters a relatively negative pressure closed space. Usually, the total maximum allowable leakage rate of the entire device can be determined based on the process requirements of the semiconductor device, and the maximum allowable leakage rate of each component can be determined by the total maximum leakage rate). Optionally, as Figure 7 and Figure 8 As shown, the confluence inlet channel 20 and the confluence outlet channel 30 are located on different bottom plate diversion channels 410, and there are two bottom plate diversion channels 410 between the confluence inlet channel 20 and the confluence outlet channel 30 when rotated 180 degrees in the clockwise direction or 180 degrees in the counterclockwise direction. The straight line where the confluence inlet channel 20 and the confluence outlet channel 30 are located is taken as the axis of symmetry. The medium entering the bottom plate diversion channel 410 from the confluence inlet channel 20 can flow to the confluence outlet channel 30 along the two branch flow channels on both sides of the axis of symmetry. The cooling component units 50 located on both sides of the axis of symmetry are at equal distances from the confluence inlet channel 20. Therefore, the medium temperatures of the cooling component units 50 located on both sides of the axis of symmetry are basically the same, and the cooling effects are consistent, which will not cause the local temperature of a certain cooling component unit 50 to be too high.

[0063] Embodiment 3

[0064] This embodiment also provides a cooling device, which includes a bottom plate 10, a bottom plate flow channel 40, a converging inlet channel 20, a converging outlet channel 30 and a plurality of cooling component units 50. The difference from the first embodiment or the second embodiment is that:

[0065] like Fig. 9 and Fig.10As shown, the cross-sectional shape of the bottom plate 10 is a hexagon as an example for explanation. It can be understood that the shape of the bottom plate 10 in this embodiment can be designed according to actual needs, and therefore is not limited to the cross-sectional shape of the bottom plate 10 listed in this embodiment. Three parts to be cooled 520 are arranged on the bottom plate 10, and four bottom plate diverter channels 410 are arranged in the bottom plate 10, and the four bottom plate diverter channels 410 are all straight flow channels, two of which are located on the same straight line, and are distributed in a 120-degree array along the circumference of the bottom plate 10 with the other two bottom plate diverter channels 410. The two bottom plate branch channels 410 located on the same straight line are not directly connected to each other, and one of the bottom plate branch channels 410 is directly connected to the confluence inlet channel 20, and the confluence inlet channel 20 is connected to the first adapter 70, and the other bottom plate branch channel 410 is directly connected to the confluence outlet channel 30, and the confluence outlet channel 30 is connected to the second adapter 80, and the first adapter 70 and the second adapter 80 are located on the same edge of the bottom plate 10.

[0066] The two bottom plate diversion channels 410 are located on the same straight line, and each bottom plate diversion channel 410 is formed by machining, specifically, a side surface 10c of the bottom plate 10 is machined toward the inside of the bottom plate 10 along a direction parallel to the first surface 10a to form a channel; the other two bottom plate diversion channels 410 are machined toward the inside of the bottom plate 10 along one of the side surfaces 10c of the bottom plate 10 and penetrate the other side surface 10c to form a channel.

[0067] The cooling device of the third embodiment has a different number of components to be cooled than the cooling device of the second embodiment, so the distribution and shape of the bottom plate flow channels 410 are different. The shape of the bottom plate 10 and the shape and distribution of the bottom plate flow channels 410 can be set according to the actual number of components to be cooled.

[0068] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A cooling device, characterized in that: include: A bottom plate (10), the bottom plate (10) having a first surface (10a) and a second surface (10b) arranged opposite to each other; A bottom plate flow channel (40), the bottom plate flow channel (40) surrounding the circumference of the bottom plate (10) and arranged inside the bottom plate (10); A confluence inlet channel (20) and a confluence outlet channel (30), wherein the confluence inlet channel (20) and the confluence outlet channel (30) are both arranged on the bottom plate (10), the first end of the confluence inlet channel (20) is in communication with the bottom plate flow channel (40), and the second end of the confluence inlet channel (20) opens from the first surface (10a) or the second surface (10b); the first end of the confluence outlet channel (30) is in communication with the bottom plate flow channel (40), and the second end of the confluence outlet channel (30) opens from the first surface (10a) or the second surface (10b); A plurality of cooling component units (50), each of the cooling component units (50) comprising at least one cooling channel (510), each of the cooling channels (510) in the same cooling component unit (50) being connected, the cooling channel (510) being connected to the bottom plate channel (40), and the medium in the cooling channel (510) and the bottom plate channel (40) being used for heat exchange with a part to be cooled (520).

2. The cooling device according to claim 1, characterized in that: The bottom plate flow channel (40) comprises a plurality of bottom plate flow channels (410) arranged at intervals, and along the medium flow direction, the plurality of bottom plate flow channels (410) are arranged in sequence along the circumference of the bottom plate (10), and the number of the bottom plate flow channels (410) is at least the same as the number of the cooling component units (50); adjacent bottom plate flow channels (410) are connected via the cooling component units (50); The first end of the converging inlet channel (20) is in communication with one of the bottom plate branch channels (410); and the first end of the converging outlet channel (30) is in communication with the other bottom plate branch channel (410).

3. The cooling device according to claim 2, characterized in that: It also includes a plurality of groups of cooling confluence channels (60), the cooling confluence channels (60) corresponding to the cooling component unit (50), each group of the cooling confluence channels (60) including a cooling confluence inlet channel (60a) and a cooling confluence outlet channel (60b), one end of the cooling confluence inlet channel (60a) and the cooling confluence outlet channel (60b) both opening from the first surface (10a) and extending toward the second surface (10b), the other end of the cooling confluence inlet channel (60a) communicating with one of the bottom plate shunt channels (410), and the other end of the cooling confluence outlet channel (60b) communicating with another of the bottom plate shunt channels (410); the cooling component unit (50) is located above the first surface (10a).

4. The cooling device according to claim 2 or 3, characterized in that: The bottom plate (10) comprises a plurality of side surfaces (10c) arranged between the first surface (10a) and the second surface (10b); the bottom plate flow channel (410) opens from one of the side surfaces (10c), extends in a direction parallel to the first surface (10a), and passes through another side surface (10c); The bottom plate flow divider (410) is provided with blocking pieces (420) at both ends close to the side surface (10c).

5. The cooling device according to claim 4, characterized in that: The blocking member (420) is welded to the opening of the bottom plate flow divider (410) on the side surface (10c).

6. The cooling device according to claim 1, characterized in that: It also includes a first adapter (70) and a second adapter (80), wherein the first adapter (70) is in communication with the confluence inlet channel (20), and the second adapter (80) is in communication with the confluence outlet channel (30).

7. The cooling device according to claim 1, characterized in that: The first surface (10a) is provided with a first air guide groove (110); and / or The second surface (10b) is provided with a second air guide groove (120).

8. The cooling device according to claim 1, characterized in that: The base plate (10) is provided with a plurality of groups of cooling component positioning holes (130), the cooling component positioning holes (130) penetrate the first surface (10a) and the second surface (10b), and the cooling component positioning holes (130) are arranged along the circumference of the base plate (10).

9. The cooling device according to claim 1, characterized in that: The second surface (10b) is provided with a bottom plate fixing installation hole (140), and the bottom plate fixing installation hole (140) is arranged along the circumference of the bottom plate (10).

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