Pressing ring of etching machine
By using the combined structure of the press ring body, inner buckle, elastic rubber and lift cylinder in the etching machine press ring, the contact between the inner buckle and the silicon wafer is delayed and the elastic rubber buffer is used to solve the etching process of the silicon wafer. The problems of damage and effective die waste improve uniformity and efficiency of the etching process.
Patent Information
- Application Number
- CN202420545740.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-03-20
AI Technical Summary
The existing etching machine press ring is prone to damage to the silicon wafer when pressing the silicon wafer, affecting the yield rate. The inner convex pressure claw reduces the contact area between the pressure ring and the silicon wafer, resulting in effective die loss and economic loss.
A press ring of an etching machine is designed, using a combined structure of the press ring body, inner buckle, elastic rubber and lifting cylinder. Through the speed and speed of the lifting cylinder, the contact between the inner buckle and the silicon wafer is delayed, and the contact between the inner buckle and the silicon wafer is delayed. Elastic rubber cushion reduces impact force and ensures that the inner convex claws smoothly press the silicon wafer.
It effectively reduces the impact force of the inner convex claw on the silicon wafer, reduces the risk of silicon wafer damage, improves the uniformity and efficiency of the etching process, and reduces effective die waste and economic losses.
Smart Images
Figure CN222281937U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of etching machines, in particular to a pressure ring of an etching machine. Background Art
[0002] An etcher is a device used in the semiconductor manufacturing process to remove specific parts of the material surface in order to form circuit patterns on silicon wafers. In plasma etching equipment, the pressure ring is an important component placed outside the wafer and in direct contact with the wafer. The main function of the pressure ring is to fix the sample during the etching process to ensure that the sample will not move or dislocate due to the impact of plasma or other external forces during the etching process. In addition, the pressure ring can also help optimize the distribution of plasma in the reaction chamber, so that the plasma covers the surface of the sample more evenly, thereby improving the uniformity and efficiency of etching.
[0003] After searching, the Chinese utility model patent with publication number: CN216671556U discloses a pressure ring structure for silicon wafer etching, including an annular plate with a central through hole and a plurality of inner convex pressure claws arranged at the periphery of the central through hole to press the local edge of the silicon wafer. The working principle of the pressure ring structure for silicon wafer etching of the utility model is that by providing a plurality of inner convex pressure claws to press the local edge of the silicon wafer, the contact area of the pressure ring pressing the edge of the silicon wafer is greatly reduced, thereby reducing the loss of effective tube cores, reducing the waste of effective tube cores and economic losses.
[0004] In the above technical solution, an inner convex pressure claw is provided on the pressure ring to press the silicon wafer and reduce the loss of the tube core. However, the inner convex pressure claw reduces the contact area between the pressure ring and the silicon wafer. During the pressing process of the pressure ring, the silicon wafer will be impacted, which may cause the pressure ring to damage the silicon wafer and affect the yield rate of the silicon wafer. To this end, the present application proposes a pressure ring for an etching machine. Utility Model Content
[0005] The utility model aims to provide a pressure ring for an etching machine to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a pressure ring of an etcher, comprising: a pressure ring body, a silicon wafer placing plate and a silicon wafer, a silicon wafer is placed on the top of the silicon wafer placing plate, a pressure ring body is arranged above the silicon wafer, an inner convex pressure claw is arranged on the inner side of the pressure ring body, a mounting ear is arranged on the outer side of the pressure ring body, a connecting plate is arranged at the bottom end of the mounting ear, an elastic rubber is arranged at the bottom of the connecting plate, a contact plate is arranged at the bottom of the elastic rubber, a positioning ring is arranged at the bottom of the pressure ring body, and the inner diameter of the positioning ring is the same as the outer diameter of the silicon wafer.
[0007] Furthermore, a buffer groove is provided at the top of the silicon wafer placement plate below the mounting ear, a lifting cylinder rod is provided inside the buffer groove, and the top end of the lifting cylinder rod is fixedly connected to the mounting ear.
[0008] Furthermore, a positioning groove is provided on the top surface of the silicon wafer placement plate below the positioning ring, and an elastic positioning pin is provided inside the positioning groove, and the outer wall of the elastic positioning pin is in contact with the outer wall of the silicon wafer.
[0009] Furthermore, there are a plurality of the inner convex pressure claws, and the plurality of the inner convex pressure claws are evenly distributed circumferentially on the pressure ring body.
[0010] Furthermore, there are three mounting ears, which are evenly arranged circumferentially on the pressure ring body, and a through hole is provided inside the mounting ear on the outside of the lifting cylinder rod. The connecting plate is fixed to the outer wall of the lifting cylinder rod, and a through hole for the lifting cylinder rod to pass through is provided in the center of the elastic rubber and the contact plate.
[0011] Furthermore, when the contact plate contacts the buffer groove, the elastic rubber is in a free state, and a gap is left between the inner convex pressure claw and the top of the silicon wafer.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The utility model realizes that when the pressure ring of the etching machine is used, the pressure ring is lifted and lowered by the lifting cylinder through the setting of the pressure ring main body, the inner convex pressure claw and the elastic rubber, and the silicon wafer is first placed on the silicon wafer placing plate, and the silicon wafer is positioned by the elastic positioning pin protruding from the silicon wafer placing plate, and then the pressure ring main body and its components are driven to descend by the lifting cylinder, and the lifting cylinder rod first descends rapidly, and when the pressure ring descends, the positioning ring first contacts with the elastic positioning pin, and as the pressure ring continues to descend, the positioning ring presses the elastic positioning pin down into the positioning groove until the contact plate and the buffer plate are in contact. After the top surface of the groove is in contact, the lifting cylinder is controlled to descend slowly. At this time, the concave pressure claw has not yet contacted the silicon wafer, and the positioning ring replaces the elastic positioning pin to position the silicon wafer. As the lifting cylinder slowly descends, the impact force of the subsequent convex pressure claw on the silicon wafer can be reduced. When the pressure ring continues to descend, the elastic rubber is compressed until the convex pressure claw contacts the silicon wafer to reach the clamping force. Through the buffering of the elastic rubber, the impact force of the convex pressure claw on the silicon wafer when it descends is further reduced, ensuring that the convex pressure claw is pressed stably on the silicon wafer to reduce damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional diagram of a pressure ring of an etching machine of the utility model;
[0015] Figure 2 A three-dimensional diagram of a pressure ring of an etching machine of the utility model from another perspective;
[0016] Figure 3 This is a schematic diagram of the connection structure between a pressure ring and a silicon wafer placement plate of an etching machine of the utility model;
[0017] Figure 4 The utility model is a cross-sectional view of a pressure ring silicon wafer placement plate connection structure of an etching machine.
[0018] In the figure: 1. Pressing ring body; 2. Inner convex pressing claw; 3. Mounting ear; 4. Connecting plate; 5. Elastic rubber; 6. Contact plate; 7. Positioning ring; 8. Silicon wafer placement plate; 9. Silicon wafer; 10. Buffer groove; 11. Lifting cylinder rod; 12. Elastic positioning pin. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0020] See also Figure 1-Figure 4 The utility model provides a technical solution: a pressure ring of an etching machine, comprising: a pressure ring body 1, a silicon wafer placing plate 8 and a silicon wafer 9, a silicon wafer 9 is placed on the top of the silicon wafer placing plate 8, a pressure ring body 1 is arranged above the silicon wafer 9, an inner convex pressure claw 2 is arranged on the inner side of the pressure ring body 1, a mounting ear 3 is arranged on the outer side of the pressure ring body 1, a connecting plate 4 is arranged at the bottom end of the mounting ear 3, an elastic rubber 5 is arranged at the bottom of the connecting plate 4, a contact plate 6 is arranged at the bottom of the elastic rubber 5, a positioning ring 7 is arranged at the bottom of the pressure ring body 1, and the inner diameter of the positioning ring 7 is the same as the outer diameter of the silicon wafer 9. After the contact plate 6 contacts the top surface of the buffer groove 10, the lifting cylinder is controlled to descend slowly. At this time, the concave pressure claw 2 has not yet contacted the silicon wafer 9, and the positioning ring 7 replaces the elastic positioning pin 12 to position the silicon wafer 9. As the lifting cylinder slowly descends, the impact force of the subsequent convex pressure claw 2 on the silicon wafer 9 can be reduced. When the pressure ring continues to descend, the elastic rubber 5 is compressed until the convex pressure claw 2 contacts the silicon wafer 9 to reach the clamping force. Through the buffering of the elastic rubber 5, the impact force of the convex pressure claw 2 on the silicon wafer 9 when it descends is further reduced, ensuring that the convex pressure claw 2 is stably pressed on the silicon wafer 9, reducing damage to the silicon wafer 9.
[0021] A buffer groove 10 is provided at the top of the silicon wafer placement plate 8 below the mounting ear 3 , and a lifting cylinder rod 11 is provided inside the buffer groove 10 . The top end of the lifting cylinder rod 11 is fixedly connected to the mounting ear 3 .
[0022] The top surface of the silicon wafer placement plate 8 is provided with a positioning groove below the positioning ring 7, and an elastic positioning pin 12 is provided inside the positioning groove, and the outer wall of the elastic positioning pin 12 contacts the outer wall of the silicon wafer 9. The silicon wafer 9 is positioned by the elastic positioning pin 12 protruding from the silicon wafer placement plate 8. When the pressure ring presses the silicon wafer 9, the elastic positioning pin 12 is pressed into the inside of the silicon wafer placement plate 8. When the pressure ring rises, the elastic positioning pin 12 can rise under the action of its own return spring to position the silicon wafer.
[0023] There are several inward convex pressure claws 2, which are evenly distributed circumferentially on the pressure ring body 1, so as to apply force evenly to the silicon wafer 9. There are three mounting ears 3, which are evenly arranged circumferentially on the pressure ring body 1. A through hole is provided inside the mounting ear 3, which is located on the outside of the lifting cylinder rod 11. The connecting plate 4 is fixed to the outer wall of the lifting cylinder rod 11, and a through hole for the lifting cylinder rod 11 to pass through is provided in the center of the elastic rubber 5 and the contact plate 6.
[0024] When the contact plate 6 contacts the buffer groove 10, the elastic rubber 5 is in a free state, and a gap is left between the inner convex pressure claw 2 and the top of the silicon wafer 9. After the contact plate 6 contacts the top surface of the buffer groove 10, the lifting cylinder is controlled to slowly descend. At this time, the inner concave pressure claw 2 has not yet contacted the silicon wafer 9. The positioning ring 7 replaces the elastic positioning pin 12 to position the silicon wafer 9. As the lifting cylinder slowly descends, the impact force of the subsequent inner convex pressure claw 2 on the silicon wafer 9 can be reduced.
[0025] When the pressure ring of the etching machine is used, the pressure ring is lifted by the lifting cylinder. First, the silicon wafer 9 is placed on the silicon wafer placement plate 8. The silicon wafer 9 is positioned by the elastic positioning pin 12 protruding from the silicon wafer placement plate 8, and then the lifting cylinder drives the pressure ring body 1 and its components to descend. The lifting cylinder rod 11 first descends rapidly. When the pressure ring descends, the positioning ring 7 first contacts the elastic positioning pin 12. As the pressure ring continues to descend, the positioning ring 7 presses the elastic positioning pin 12 down into the positioning groove until the contact plate 6 contacts the top surface of the buffer groove 10. Then, the lifting cylinder is controlled to descend slowly. The speed of the cylinder can be controlled by a throttle valve, and a gas-liquid damping cylinder can be used if higher precision is required. Two solenoid valves are used to control the fast air path and the slow air path respectively. The controller switches the two solenoid valves respectively to realize the control of fast and slow movements. The contact plate 6 is a contact switch to control the switching between the two solenoid valves.
[0026] At this time, the concave pressure claw 2 has not yet contacted the silicon wafer 9, and the positioning ring 7 replaces the elastic positioning pin 12 to position the silicon wafer 9. As the lifting cylinder slowly descends, the impact force of the subsequent convex pressure claw 2 on the silicon wafer 9 can be reduced. When the pressure ring continues to descend, the elastic rubber 5 is compressed until the convex pressure claw 2 contacts the silicon wafer 9 to reach the clamping force. Through the buffering of the elastic rubber 5, the impact force of the convex pressure claw 2 on the silicon wafer 9 when it descends is further reduced, ensuring that the convex pressure claw 2 is stably pressed on the silicon wafer 9, reducing damage to the silicon wafer 9.
[0027] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.
Claims
1. A pressure ring for an etching machine, comprising: A pressure ring body (1), a silicon wafer placement plate (8) and a silicon wafer (9), characterized in that: a silicon wafer (9) is placed on the top of the silicon wafer placement plate (8), a pressure ring body (1) is arranged above the silicon wafer (9), an inner convex pressure claw (2) is arranged on the inner side of the pressure ring body (1), a mounting ear (3) is arranged on the outer side of the pressure ring body (1), a connecting plate (4) is arranged at the bottom end of the mounting ear (3), an elastic rubber (5) is arranged at the bottom of the connecting plate (4), a contact plate (6) is arranged at the bottom of the elastic rubber (5), a positioning ring (7) is arranged at the bottom of the pressure ring body (1), and the inner diameter of the positioning ring (7) is the same as the outer diameter of the silicon wafer (9).
2. The pressure ring of an etching machine according to claim 1, characterized in that: A buffer groove (10) is provided at the top of the silicon wafer placement plate (8) below the mounting ear (3), a lifting cylinder rod (11) is provided inside the buffer groove (10), and the top end of the lifting cylinder rod (11) is fixedly connected to the mounting ear (3).
3. The pressure ring of an etching machine according to claim 1, characterized in that: A positioning groove is provided on the top surface of the silicon wafer placement plate (8) below the positioning ring (7), and an elastic positioning pin (12) is provided inside the positioning groove. The outer wall of the elastic positioning pin (12) contacts the outer wall of the silicon wafer (9).
4. The pressure ring of an etching machine according to claim 1, characterized in that: There are a plurality of the inner convex pressure claws (2), and the plurality of the inner convex pressure claws (2) are evenly distributed in the circumferential direction on the pressure ring body (1).
5. The pressure ring of an etching machine according to claim 2, characterized in that: There are three mounting ears (3), and the three mounting ears (3) are evenly arranged in the circumferential direction on the pressure ring body (1). A through hole is provided inside the mounting ears (3) and located outside the lifting cylinder rod (11). The connecting plate (4) is fixed to the outer wall of the lifting cylinder rod (11). A through hole for the lifting cylinder rod (11) to pass through is provided in the center of the elastic rubber (5) and the contact plate (6).
6. The pressure ring of an etching machine according to claim 1, characterized in that: When the contact plate (6) is in contact with the buffer groove (10), the elastic rubber (5) is in a free state, and a gap is left between the inner convex pressure claw (2) and the top of the silicon chip (9).