Chip stripping device and chip feeding equipment

Abstract

The utility model provides a chip stripping device and chip feeding equipment, and relates to the technical field of semiconductor packaging. An ejector pin cap in the chip stripping device is located at the top of a shell assembly, an ejector pin assembly is located in the shell assembly, a driving assembly comprises an end face cam and a roller matched with the end face cam, the roller is connected with the shell assembly, and the end face cam is arranged to rotate under control so as to drive the roller to drive the shell assembly to move in the first direction. Therefore, the ejector pin passes through the through hole to jack up the chip, so that the chip is separated from the blue film. Through cooperation of the roller and the end face cam, the roller rolls along the top face of the end face cam, the roller drives the ejector pin cap on the shell assembly to stably move downwards relative to the ejector pin assembly, the ejector pin protrudes out of the ejector pin cap and jacks up the chip, and compared with the scheme that the ejector pin is driven to move upwards, the movement stability of the chip stripping device can be improved; the impact force on the chip is reduced, and the chip is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a chip stripping device and chip loading equipment. Background Art

[0002] In the manufacture of semiconductor integrated circuits, a wafer can usually produce many bare chips, which are neatly arranged on the wafer. Usually, a layer of blue film is attached to the back of the wafer to fix the wafer, and then the wafer is cut into bare chips through the dicing process. The attached blue film can protect the chip to prevent it from being scratched. Before testing the cut chip, the chip must be separated from the blue film.

[0003] When the existing chip packaging equipment uses a pin holder to separate the chip from the blue film, the method of moving the pin to lift the blue film is usually adopted. However, when the pin moves to lift the blue film, the impact force on the chip is large, which is easy to damage the chip. Utility Model Content

[0004] An object of the first aspect of the utility model is to provide a chip peeling device to solve the technical problem in the prior art that the chip is easily damaged when the ejector pin moves to lift the chip.

[0005] A further object of the first aspect of the present invention is to improve the stability of the movement of the housing assembly.

[0006] The second aspect of the present invention aims to provide a chip loading device including the chip peeling device.

[0007] According to the purpose of the first aspect of the present invention, the present invention provides a chip peeling device, comprising:

[0008] The housing assembly extends along a first direction and comprises an ejector cap, wherein the top of the ejector cap is provided with at least one through hole;

[0009] An ejector pin assembly is located inside the housing assembly and extends along the first direction, and at least one ejector pin is provided on the top of the ejector pin assembly;

[0010] The driving assembly includes an end face cam and a roller cooperating with the end face cam, wherein the roller is connected to the shell assembly, and the end face cam is configured to rotate under control to drive the roller to drive the shell assembly to move along the first direction, so that the ejector pin passes through the through hole and lifts the chip, so that the chip is separated from the blue film.

[0011] Optionally, the first direction is a vertical direction;

[0012] The end face cam has a first inclined surface, and the roller is configured to roll along the first inclined surface when the end face cam rotates, thereby driving the housing component to move downward, so that the ejector pin passes through the through hole.

[0013] Optionally, a suction hole for sucking the blue film is provided on the top of the ejector cap, and the ejector cap is configured to suck the blue film and then move downward so that the ejector pin passes through the through hole.

[0014] Optionally, the end face cam has a second inclined surface, and the roller is configured to roll along the second inclined surface when the end face cam rotates, thereby driving the shell assembly to move upward, so that the ejector cap moves upward to a position in contact with the blue film.

[0015] Optionally, the second inclined surface is located upstream of the first inclined surface, and when the end surface cam rotates, the roller rolls along the second inclined surface and the first inclined surface in sequence.

[0016] Optionally, the end face cam has a plane, and the plane is located between the first inclined surface and the second inclined surface. The roller is configured to keep the ejector cap stationary when rolling to the plane to adsorb the blue film.

[0017] Optionally, an air channel is provided inside the ejector pin assembly, and a vent hole for connecting the air channel with the ejector pin cap is provided at the top of the ejector pin assembly to form a vacuum inside the ejector pin cap, so that the ejector pin cap absorbs the blue film.

[0018] Optionally, a guide hole extending along the first direction is provided on the side of the housing assembly;

[0019] The ejector assembly is provided with a guide pin which is opposite to the guide hole. The guide pin cooperates with the guide hole to guide the shell assembly during the movement of the shell assembly.

[0020] Optionally, the ejector cap is provided with a positioning pin extending in a second direction perpendicular to the first direction, and the positioning pin is passed between the ejector cap and the shell assembly to ensure that the ejector cap is concentric with the ejector.

[0021] According to the purpose of the second aspect of the utility model, the utility model also provides a chip loading equipment, and the chip loading equipment includes the above-mentioned chip peeling device.

[0022] The chip stripping device of the utility model includes a shell component, an ejector component and a driving component. The shell component extends along a first direction and includes an ejector cap, and at least one through hole is provided on the top of the ejector cap. The ejector assembly is located inside the shell component and extends along the first direction, and at least one ejector is provided on the top of the ejector assembly. The driving component includes an end face cam and a roller that cooperates with the end face cam, and the roller is connected to the shell component. The end face cam is configured to rotate under control to drive the roller to drive the shell component to move along the first direction, so that the ejector passes through the through hole and lifts the chip, so that the chip is separated from the blue film. The above technical solution cooperates with the roller and the end face cam, and the roller rolls along the top surface of the end face cam, so that the roller drives the ejector cap on the shell component to move downward smoothly relative to the ejector cap, and the ejector protrudes from the ejector cap and lifts the chip. Compared with the solution of driving the ejector to move upward, the stability of the chip stripping device movement can be improved, the impact force on the chip can be reduced, and the chip can be prevented from being damaged.

[0023] Furthermore, in the chip stripping device of the utility model, a guide pin is provided on the ejector assembly, and a guide hole is provided on the side of the shell assembly. The cooperation between the guide hole and the guide pin can effectively guide the movement of the shell assembly relative to the ejector assembly, achieve precise positioning, and improve the stability of the movement of the shell assembly.

[0024] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0026] Figure 1 is a schematic structural diagram of a chip peeling device according to an embodiment of the utility model;

[0027] Figure 2 yes Figure 1 A schematic enlarged view of the middle A;

[0028] Figure 3 is a schematic cross-sectional view of a housing assembly and an ejector pin assembly according to an embodiment of the utility model;

[0029] Figure 4 yes Figure 3 A schematic enlarged view of point B in the middle;

[0030] Figure 5 yes Figure 1A schematic structural diagram of the ejector cap shown;

[0031] Figure 6 yes Figure 2 The schematic structural diagram of the end face cam shown;

[0032] Figure 7 is a schematic structural diagram of an ejector pin assembly according to an embodiment of the utility model;

[0033] Figure 8 is a schematic structural diagram of a housing assembly according to an embodiment of the utility model;

[0034] Fig. 9 It is a schematic structural diagram of a chip peeling device according to another embodiment of the utility model.

[0035] Description of reference numerals:

[0036] 100-chip stripping device, 10-housing assembly, 11-guide hole, 20-throw pin cap, 21-through hole, 22-adsorption hole, 23-positioning pin, 30-throw pin assembly, 31-throw pin, 32-airway, 33-vent, 34-guide pin, 35-vent, 40-drive assembly, 41-end face cam, 411-first inclined surface, 412-second inclined surface, 413-plane, 42-roller, 43-controller, 50-support assembly, 60-screw slide, 70-adjustment assembly. DETAILED DESCRIPTION

[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the terms "up", "down", "clockwise", "counterclockwise", etc., indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0039] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0040] Unless otherwise clearly defined and limited, the term "connection" and other terms should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in this utility model according to the specific circumstances.

[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0042] When the existing SMD packaging equipment uses a pin holder to separate the chip from the blue film, the method of moving the pin to lift the blue film is usually adopted. The blue film is first sucked and fixed, and then the pin mechanism is used to drive the pin upward. The pin lifts the chip from the blue film to achieve the effect of separating the chip from the blue film. However, in this solution where the pin moves but the pin cap does not move, the impact force on the chip when the pin moves to lift the blue film is large, which is easy to damage the chip.

[0043] In view of the above problems, the embodiments of the present invention provide a chip stripping device 100 and a chip loading equipment that overcome the above problems or at least partially solve the above problems, which can improve the stability of stripping the blue film, reduce the impact force on the chip, and protect the chip from damage.

[0044] Figure 1 is a schematic structural diagram of a chip peeling device 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic enlarged view of the middle part, Figure 3 is a schematic cross-sectional view of a housing assembly 10 and an ejector assembly 30 according to an embodiment of the utility model. Figure 4 yes Figure 3 Schematic enlarged diagram of point B in the middle, Figure 5 yes Figure 1The schematic structural diagram of the ejector cap 20 is shown in FIG. Figure 6 yes Figure 2 A schematic structural diagram of the end face cam 41 is shown.

[0045] like Figure 1-Figure 6 As shown, the chip stripping device 100 of the embodiment of the utility model includes a shell component 10, an ejector pin component 30 and a driving component 40. The shell component 10 extends along a first direction and includes an ejector pin cap 20, and at least one through hole 21 is provided on the top of the ejector pin cap 20. The ejector pin component 30 is located inside the shell component 10 and extends along the first direction. At least one ejector pin 31 is provided on the top of the ejector pin component 30. The driving component 40 includes an end face cam 41 and a roller 42 matched with the end face cam 41. The roller 42 is connected to the shell component 10. The end face cam 41 is configured to rotate under control to drive the roller 42 to drive the shell component 10 to move along the first direction, so that the ejector pin 31 passes through the through hole 21, lifts the chip, and separates the chip from the blue film.

[0046] Here, it can be understood that the ejector assembly 30 and the housing assembly 10 extend in the same direction and the ejector assembly 30 is located inside the housing assembly 10. The convex portion of the end face cam 41 is arc-shaped and contacts the roller 42 located above it. The roller 42 cooperates with the contour line on the end face cam 41. When the end face cam 41 is controlled to rotate, the roller 42 is always in contact with the surface of the end face cam 41 and rolls along the contour line of the end face cam 41, realizing the conversion from the rotational movement of the end face cam 41 to the linear movement of the roller 42 along the first direction.

[0047] When the end cam 41 rotates, the roller 42 contacts different positions on the surface of the end cam 41 by rolling, which can effectively transmit force and energy and effectively reduce energy loss caused by friction. The roller 42 moves up and down along the first direction as the height of the protrusion on the surface of the end cam 41 changes, and drives the housing assembly 10 to move up and down relative to the ejector assembly 30.

[0048] After the ejector cap 20 contacts the blue film, it absorbs the blue film, and the roller 42 drives the ejector cap 20 on the housing assembly 10 to move downward relative to the ejector assembly 30, and the ejector pin 31 gradually protrudes from the through hole 21 on the ejector cap 20 until the ejector pin 31 contacts the blue film and lifts up the chip, thereby separating the chip from the blue film. This can effectively reduce the impact force of the ejector pin 31 on the chip and prevent the ejector pin 31 from damaging the chip.

[0049] The cooperation of the roller 42 and the end cam 41 has good load-bearing capacity and durability. The design of the roller 42 can bear a large load, and the solid structure of the end cam 41 can also improve stability and durability. The cooperation of the roller 42 and the end cam 41 also has the advantage of convenient maintenance and replacement.

[0050] Since the roller 42 and the end cam 41 are independent components, when one of the components of the drive assembly 40 is damaged or needs to be replaced, it can be replaced individually without large-scale disassembly and repair of the entire drive assembly 40, which facilitates maintenance and repair and saves costs.

[0051] In addition, compared with the disc cam, the raised portion of the end face cam 41 has a smaller surface area, so it has smaller inertia and higher precision during movement, which can improve the stability and accuracy of the drive component 40 in driving the housing component 10 to move.

[0052] In the embodiment of the utility model, the roller 42 cooperates with the end face cam 41, and the roller 42 rolls along the top surface of the end face cam 41, so that the roller 42 drives the ejector cap 20 on the housing assembly 10 to move downward smoothly relative to the ejector assembly 30, and the ejector 31 protrudes from the ejector cap 20 and lifts the chip. Compared with the solution of driving the ejector 31 to move upward, the stability of the chip stripping device 100 can be improved, the impact force on the chip can be reduced, and the chip can be prevented from being damaged.

[0053] In some embodiments, a needle plate is provided on the top of the ejector pin assembly 30 , and the ejector pin 31 is interference fit with the plastic needle plate, so that the ejector pin 31 can be accurately and quickly removed and replaced.

[0054] In some embodiments, the first direction is a vertical direction. The end cam 41 has a first inclined surface 411, and the roller 42 is configured to roll along the first inclined surface 411 when the end cam 41 rotates, thereby driving the housing assembly 10 to move downward, so that the ejector pin 31 passes through the through hole 21. Here, the axis of the roller 42 assembly is in the horizontal direction. When the end cam 41 rotates, the roller 42 rolls around the axis and moves up and down as the height of the protrusion on the surface of the end cam 41 changes. In fact, the roller 42 does not move in the horizontal direction.

[0055] It can be understood that when the end face cam 41 rotates and its surface height gradually increases relative to the roller 42, it can exert an upward force on the roller 42, so that the housing assembly 10 moves upward relative to the ejector assembly 30, and the ejector 31 is stored in the ejector cap 20. When the end face cam 41 rotates and its surface height gradually decreases relative to the roller 42, the roller 42 moves downward under its own gravity, so that the housing assembly 10 moves downward relative to the ejector assembly 30, and the ejector 31 passes through the through hole 21 of the ejector cap 20, lifts the chip, and separates the chip from the blue film. In this way, the ejector cap 20 can be smoothly lowered, the impact force of the ejector 31 on the chip can be reduced, and the ejector 31 can be prevented from damaging the chip.

[0056] In one embodiment, when the end face cam 41 rotates in a counterclockwise direction, the roller 42 moves clockwise relative to the end face cam 41, and the height of the first inclined surface 411 gradually decreases in the clockwise direction. The roller 42 moves downward under the action of its own gravity and drives the shell assembly 10 to move downward relative to the ejector pin assembly 30. The ejector pin 31 protrudes from the ejector cap 20. At this time, the ejector pin 31 can lift the chip to separate the chip from the blue film.

[0057] In some embodiments, the top of the ejector cap 20 is provided with an adsorption hole 22 for adsorbing the blue film, and the ejector cap 20 is configured to move downward after adsorbing the blue film so that the ejector pin 31 passes through the through hole 21. Here, the adsorption hole 22 of the ejector cap 20 is located on the outer peripheral side of the through hole 21, and the adsorption hole 22 forms an adsorption force formed by the pressure difference between the vacuum system and the atmosphere, so that the ejector cap 20 and the blue film can be tightly combined, ensuring the stability of adsorption during the peeling process.

[0058] After the surface of the ejector cap 20 contacts the blue film, the chip peeling device 100 is evacuated so that the ejector cap 20 adsorbs the surface of the blue film. Then, when the end face cam 41 rotates, the housing assembly 10 is driven to move downward in the first direction. The ejector cap 20 adsorbs the blue film and moves downward, so that the blue film forms a cone, reducing the contact area between the chip and the blue film. Then, the ejector pin 31 protrudes from the surface of the ejector cap 20, and the ejector pin 31 lifts the chip to separate the chip from the blue film.

[0059] Through the design of the adsorption hole 22 of the ejector cap 20, the low-pressure adsorption force formed by the pressure difference between the vacuum system and the atmosphere can be utilized, so that the blue film is tightly adsorbed during the stripping process and is not easy to fall off or shift, thereby ensuring the stability and reliability of the stripping process.

[0060] The presence of the adsorption hole 22 increases the contact area between the ejector cap 20 and the blue film, thereby enhancing the adsorption effect, thereby making the adsorption more uniform and reducing the possibility of uneven adsorption or local shedding.

[0061] Since the adsorption is tight and stable, it can effectively prevent the chip from being damaged due to loose adsorption during the stripping process. Stable adsorption can also reduce the downtime adjustment time during the stripping process, avoid interruption of the stripping process due to adsorption problems, and thus improve the stripping efficiency. The design of the adsorption hole 22 of the ejector cap 20 also makes the adsorption process simpler, reduces the difficulty of operation, and improves the stripping efficiency.

[0062] In some embodiments, the end face cam 41 has a second inclined surface 412, and the roller 42 is configured to roll along the second inclined surface 412 when the end face cam 41 rotates, thereby driving the shell assembly 10 to move upward, so that the ejector cap 20 moves upward to a position in contact with the blue film.

[0063] In one embodiment, when the end face cam 41 rotates in a counterclockwise direction, the moving direction of the roller 42 relative to the end face cam 41 is clockwise, and the height of the second inclined surface 412 gradually increases in the clockwise direction. The roller 42 moves upward under the drive of the end face cam 41, and drives the shell assembly 10 to move upward relative to the ejector assembly 30. The ejector 31 is stored in the ejector cap 20. At this time, the top of the ejector cap 20 can contact the blue film, and the ejector cap 20 can adsorb the blue film.

[0064] In some embodiments, the second inclined surface 412 is located upstream of the first inclined surface 411, and when the end surface cam 41 rotates, the roller 42 rolls sequentially along the second inclined surface 412 and the first inclined surface 411. It can be understood that when the end surface cam 41 rotates in the counterclockwise direction, the moving direction of the roller 42 relative to the end surface cam 41 is clockwise, and the height of the second inclined surface 412 gradually increases in the clockwise direction, so that the ejector pin 31 can be stored in the ejector cap 20, and the height of the first inclined surface 411 gradually decreases in the clockwise direction, so that the ejector pin 31 can protrude from the ejector cap 20.

[0065] The end face cam 41 rotates counterclockwise, the roller 42 first contacts the second inclined surface 412, and then contacts the first inclined surface 411, the ejector pin 31 is first stored in the ejector cap 20, and then gradually protrudes from the ejector cap 20. The roller 42 first rolls along the second inclined surface 412, the ejector cap 20 moves upward until its top contacts the blue film, and the ejector cap 20 absorbs the blue film. Then the roller 42 rolls along the first inclined surface 411, the ejector cap 20 moves downward until the ejector pin 31 protrudes from the ejector cap 20, and the ejector pin 31 lifts the chip, so that the chip is separated from the blue film.

[0066] In some embodiments, the length of the first inclined surface 411 is greater than the length of the second inclined surface 412, so that when the roller 42 rolls along the surface of the end face cam 41, the path of the downward movement is longer than the path of the upward movement, so that the downward movement speed is smoother, which is beneficial to improving the stability of the driving component 40 when driving the ejector cap 20 to move downward. The ejector 31 smoothly lifts the chip, reducing the impact force of the chip stripping device 100 on the chip to avoid damage to the chip.

[0067] In some embodiments, the end face cam 41 has a plane 413, and the plane 413 is located between the first inclined surface 411 and the second inclined surface 412. The roller 42 is configured to keep the ejector cap 20 stationary when rolling to the plane 413 to adsorb the blue film.

[0068] In one embodiment, when the end face cam 41 rotates in the counterclockwise direction, the roller 42 moves clockwise relative to the end face cam 41, the height of the plane 413 remains unchanged, and the roller 42 does not move in the first direction. When the end face cam 41 rotates continuously, the roller 42 first contacts the second inclined surface 412, then contacts the plane 413, and finally contacts the first inclined surface 411, so that the ejector pin 31 is first stored in the ejector cap 20, and after the ejector cap 20 absorbs the blue film, the ejector cap 20 moves downward along the first inclined surface 411 until the ejector pin 31 protrudes from the ejector cap 20, and the ejector pin 31 lifts the chip. In this way, it can be ensured that when the end face cam 41 rotates continuously, the ejector cap 20 can stably absorb the blue film, thereby improving the continuity of the chip peeling device 100 during operation.

[0069] In some embodiments, an air passage 32 is provided inside the ejector assembly 30, and a vent hole 33 for connecting the air passage 32 with the ejector cap 20 is provided at the top of the ejector assembly 30, so as to form a vacuum inside the ejector cap 20, so that the ejector cap 20 adsorbs the blue film. Here, the top of the ejector assembly 30 is connected to the pin plate on which the ejector 31 is installed, and a vent hole 33 is provided on the side of the top of the ejector assembly 30, so that the air passage 32 inside the ejector assembly 30 can be connected with the ejector cap 20 through the vent hole 33. The bottom of the air passage 32 is connected to the vacuum generating assembly. When the vacuum generating assembly evacuates the chip peeling device 100, a vacuum is formed inside the ejector cap 20 and the ejector assembly 30 through the air passage 32 and the vent hole 33, and the blue film is adsorbed through the adsorption hole 22 on the ejector cap 20.

[0070] In some embodiments, the chip stripping device 100 also includes a vent 35, which is connected to the bottom of the ejector pin assembly 30. A vacuum channel connected to the airway 32 is provided in the vent 35, and is connected to the vacuum generating assembly through the vacuum channel so that the ejector pin cap 20 can adsorb the blue film.

[0071] Figure 7 is a schematic structural diagram of an ejector pin assembly 30 according to an embodiment of the utility model. Figure 8 It is a schematic structural diagram of a housing assembly 10 according to an embodiment of the utility model.

[0072] In some embodiments, Figure 7 and Figure 8 As shown, the side of the housing assembly 10 is provided with a guide hole 11 extending in the first direction, and the ejector assembly 30 is provided with a guide pin 34 opposite to the guide hole 11, and the guide pin 34 cooperates with the guide hole 11 to guide the housing assembly 10 during the movement of the housing assembly 10. Here, the guide pin 34 is provided on the side of the ejector assembly 30, and the guide pin 34 is located in the guide hole 11. When the housing assembly 10 moves relative to the ejector assembly 30, the guide hole 11 moves relative to the guide pin 34.

[0073] The cooperation between the guide pin 34 and the guide hole 11 can align the shell assembly 10 with the ejector assembly 30, and can effectively guide the movement of the shell assembly 10 relative to the ejector assembly 30, ensure that the shell assembly 10 moves along the first direction, and improve the accuracy and stability of the movement of the shell assembly 10.

[0074] The cooperation between the guide pin 34 and the guide hole 11 helps to ensure that the housing assembly 10 and the ejector assembly 30 remain concentric, so that the ejector 31 can vertically lift the blue film, and also helps to reduce the error generated during the assembly of the housing assembly 10 and the ejector assembly 30. Through the guidance of the positioning pin 23 and the guide hole 11, the housing assembly 10 and the ejector assembly 30 can be assembled together more easily, simplifying the assembly process.

[0075] In some embodiments, Figure 5 As shown, the ejector cap 20 is provided with a positioning pin 23 extending in a second direction perpendicular to the first direction, and the positioning pin 23 is penetrated between the ejector cap 20 and the housing assembly 10 to ensure that the ejector cap 20 is concentric with the ejector pin 31. Here, the housing assembly 10 and the ejector pin assembly 30 are concentric through the cooperation of the guide pin 34 and the guide hole 11, and the positioning pin 23 can keep the ejector cap 20 and the housing assembly 10 concentric, thereby ensuring that the ejector cap 20 is concentric with the ejector pin 31 on the ejector pin assembly 30. In this way, it can be ensured that when the ejector cap 20 moves downward, the ejector pin 31 can pass through the through hole 21 of the ejector cap 20 to lift the chip.

[0076] The design of the locating pin 23 on the shell component 10 and the ejector cap 20 can ensure that the shell component 10, the ejector cap 20 and the ejector 31 maintain a relatively correct position during the assembly process. Through precise positioning, the locating pin 23 is conducive to ensuring that the ejector cap 20 and the ejector 31 are concentric, thereby preventing concentricity problems caused by assembly deviation.

[0077] In some embodiments, the ejector cap 20 is detachably mounted on the top of the shell assembly 10, and the positioning pin 23 can also simplify the disassembly and assembly process of the ejector cap 20 and the shell assembly 10, improve the disassembly and assembly efficiency of the ejector cap 20 and the shell assembly 10, and ensure the assembly quality of the ejector cap 20 and the shell assembly 10.

[0078] Fig. 9 is a schematic structural diagram of a chip peeling device 100 according to another embodiment of the present invention.

[0079] In some embodiments, Fig. 9As shown, the chip stripping device 100 also includes a support assembly 50, which is connected to the ejector assembly 30 through a vent, and the support assembly 50 is also connected to the shell assembly 10 through a drive assembly 40, so that the support assembly 50 can support the ejector assembly 30 and the shell assembly 10, thereby improving the stability of the chip stripping device 100.

[0080] In some embodiments, the chip stripping device 100 further includes a controller 43 connected to the end cam 41 to control the rotation of the end cam 41. Here, the controller 43 is a stepper motor. In other embodiments, the controller 43 can also be set as other driving components with driving functions.

[0081] In some embodiments, the chip stripping device 100 further includes a screw slide 60 extending along the first direction, and the support assembly 50 is connected to the slide of the screw slide 60, so that the screw slide 60 can drive the ejector pin 31 and the housing assembly 10 to move upward to the position where the ejector cap 20 contacts the blue film. In other embodiments, the screw slide 60 can also be set as other components with driving functions.

[0082] In some embodiments, the chip peeling device 100 also includes an adjustment component 70 connected to the support component 50, and the adjustment component 70 includes two layers of adjustment plates. The support component 50 can be used to adjust the freedom of the ejector component 30 and the shell component 10 in the front and back, left and right, and up and down directions to ensure that the top surface of the ejector cap 20 is aligned with the blue film, thereby ensuring the adsorption and separation effects of the chip peeling device 100.

[0083] The embodiment of the utility model further provides a chip loading device, which includes the above-mentioned chip stripping device 100. The chip stripping device 100 will not be described in detail here.

[0084] The chip stripping device 100 of this embodiment includes a housing component 10, an ejector component 30 and a driving component 40. The housing component 10 extends along a first direction and includes an ejector cap 20, and at least one through hole 21 is provided at the top of the ejector cap 20. The ejector component 30 is located inside the housing component 10 and extends along the first direction, and at least one ejector 31 is provided at the top of the ejector component 30. The driving component 40 includes an end face cam 41 and a roller 42 matched with the end face cam 41, the roller 42 is connected to the housing component 10, and the end face cam 41 is configured to rotate under control to drive the roller 42 to drive the housing component 10 to move along the first direction, so that the ejector 31 passes through the through hole 21, lifts the chip, and separates the chip from the blue film.

[0085] The above technical solution cooperates with the roller 42 and the end face cam 41. The roller 42 rolls along the top surface of the end face cam 41, so that the roller 42 drives the ejector cap 20 on the shell assembly 10 to move downward smoothly relative to the ejector assembly 30. The ejector 31 protrudes from the ejector cap 20 and lifts the chip. Compared with the solution of driving the ejector 31 to move upward, the stability of the chip stripping device 100 can be improved, the impact force on the chip can be reduced, and the chip can be prevented from being damaged.

[0086] In addition, in the chip stripping device 100 of this embodiment, a guide pin 34 is provided on the ejector assembly 30, and a guide hole 11 is provided on the side of the shell assembly 10. The cooperation between the guide hole 11 and the guide pin 34 can effectively guide the movement of the shell assembly 10 relative to the ejector assembly 30, realize precise positioning, and improve the stability of the movement of the shell assembly 10.

[0087] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip peeling device, characterized in that: include: The housing assembly extends along a first direction and comprises an ejector cap, wherein the top of the ejector cap is provided with at least one through hole; An ejector pin assembly is located inside the housing assembly and extends along the first direction, and at least one ejector pin is provided on the top of the ejector pin assembly; The driving assembly includes an end face cam and a roller cooperating with the end face cam, wherein the roller is connected to the shell assembly, and the end face cam is configured to rotate under control to drive the roller to drive the shell assembly to move along the first direction, so that the ejector pin passes through the through hole and lifts the chip, so that the chip is separated from the blue film.

2. The chip peeling device according to claim 1, characterized in that: The first direction is a vertical direction; The end face cam has a first inclined surface, and the roller is configured to roll along the first inclined surface when the end face cam rotates, thereby driving the housing component to move downward, so that the ejector pin passes through the through hole.

3. The chip peeling device according to claim 2, characterized in that: The top of the ejector cap is provided with an adsorption hole for adsorbing the blue film, and the ejector cap is configured to move downward after adsorbing the blue film so that the ejector pin passes through the through hole.

4. The chip peeling device according to claim 3, characterized in that: The end face cam has a second inclined surface, and the roller is configured to roll along the second inclined surface when the end face cam rotates, thereby driving the shell assembly to move upward, so that the ejector cap moves upward to a position where it contacts the blue film.

5. The chip peeling device according to claim 4, characterized in that: The second inclined surface is located upstream of the first inclined surface, and when the end surface cam rotates, the roller rolls along the second inclined surface and the first inclined surface in sequence.

6. The chip peeling device according to claim 5, characterized in that: The end face cam has a plane, and the plane is located between the first inclined surface and the second inclined surface. The roller is configured to keep the ejector cap stationary when rolling to the plane, so as to adsorb the blue film.

7. The chip peeling device according to claim 3, characterized in that: An air channel is arranged inside the ejector pin assembly, and a vent hole for connecting the air channel with the ejector pin cap is arranged on the top of the ejector pin assembly to form a vacuum inside the ejector pin cap, so that the ejector pin cap can absorb the blue film.

8. The chip peeling device according to claim 1, characterized in that: A guide hole extending along a first direction is provided on a side surface of the housing component; The ejector assembly is provided with a guide pin which is opposite to the guide hole. The guide pin cooperates with the guide hole to guide the shell assembly during the movement of the shell assembly.

9. The chip peeling device according to claim 1, characterized in that: The ejector cap is provided with a positioning pin extending in a second direction perpendicular to the first direction, and the positioning pin is passed between the ejector cap and the shell assembly to ensure that the ejector cap is concentric with the ejector.

10. A chip loading device, characterized in that: The invention comprises a chip peeling device as claimed in any one of claims 1 to 9.

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