Wafer conveying mechanism

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer conveying mechanism. The wafer conveying mechanism comprises a fixed seat, a cylinder, a manipulator, a turntable, a rotating shaft, a first limiting piece and a second limiting piece. Wherein a first arc-shaped through groove is formed in the fixed seat. The air cylinder is arranged on the fixing base, the output end of the air cylinder is connected with a rotating shaft, and the end, penetrating through the fixing base, of the rotating shaft is connected with a rotating disc so that the rotating shaft can drive the rotating disc to rotate. And the manipulator is arranged on the turntable and is used for clamping and transferring the wafer. One end of the first limiting piece is connected with the turntable, and the other end penetrates through the first arc-shaped through groove and is positioned on one side of the fixed seat. The second limiting piece is arranged on the fixing base and is configured to limit the first limiting piece. According to the wafer conveying mechanism, the air cylinder is used as a driving source, so that the wafer conveying mechanism has higher response speed and higher environment adaptability, and the reliability and the stability of wafer conveying are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer conveying mechanism. Background Art

[0002] In the process of wafer production and manufacturing, wafer conveying mechanisms are usually required to transport wafers. Most of the drive components used in the wafer conveying mechanisms in the prior art are motor-driven. However, the wafer handling process requires fast and precise handling movements of the manipulator. The current method of using motors to drive the manipulator has a slow response speed and is difficult to apply to wafer handling. At the same time, since the motor drive method needs to rely on the power system, the current motor-driven manipulator has poor environmental adaptability and is prone to large motion errors or even downtime in strong electromagnetic and humid environments.

[0003] Therefore, it is urgent to design a wafer conveying mechanism to solve the above technical problems. Utility Model Content

[0004] The utility model aims to provide a wafer conveying mechanism with higher response speed and higher environmental adaptability, thereby improving the reliability and stability of wafer conveying.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a wafer conveying mechanism, comprising:

[0007] A fixing seat, wherein the fixing seat is provided with a first arc-shaped through groove;

[0008] A cylinder, wherein the cylinder is disposed on the fixing seat, and an output end of the cylinder is connected to a rotating shaft, and one end of the rotating shaft passing through the fixing seat is connected to a rotating disk, so that the rotating shaft can drive the rotating disk to rotate;

[0009] A robot arm, the robot arm is arranged on the turntable, and the robot arm is used to clamp and transport the wafer;

[0010] a first position-limiting member, one end of which is connected to the rotating disk, and the other end of which passes through the first arc-shaped through slot and is located at one side of the fixing seat; the rotating disk can drive the first position-limiting member to rotate along the first arc-shaped through slot;

[0011] A second limiting member, wherein the second limiting member is disposed on the fixing seat, and the second limiting member is configured to limit the first limiting member.

[0012] As an optional technical solution of a wafer conveying mechanism, two second position-limiting members are provided, and the two second position-limiting members are respectively located at two ends of the first arc-shaped through groove.

[0013] As an optional technical solution for a wafer conveying mechanism, an adjusting member is also provided on the second limiting member, and the adjusting member and the second limiting member are respectively located on two opposite sides of the fixed seat, and one end of the adjusting member passes through the first arc-shaped through groove to be connected to the second limiting member and can fix the second limiting member on the fixed seat; the adjusting member is configured to adjust the position of the second limiting member on the fixed seat.

[0014] As an optional technical solution for a wafer conveying mechanism, the wafer conveying mechanism also includes a sensing baffle, a first fixing member and a first position sensor, wherein the sensing baffle is connected to an end of the first limiting member away from the turntable through the first fixing member; the first position sensor is connected to the second limiting member, and the first position sensor is used to detect the position of the sensing baffle.

[0015] As an optional technical solution for a wafer conveying mechanism, two first position sensors are provided, and the first position sensors correspond to the second limit members one by one, so that the two first position sensors can respectively detect the two limit positions of the sensing baffle.

[0016] As an optional technical solution for a wafer conveying mechanism, a mounting hole is provided on the turntable, and the wafer conveying mechanism further includes a second fixing member, and the first limiting member passes through the mounting hole and is connected to the second fixing member.

[0017] As an optional technical solution for a wafer conveying mechanism, a second arc-shaped through slot is provided on the turntable, and the robot arm is connected to the second arc-shaped through slot.

[0018] As an optional technical solution for a wafer conveying mechanism, the robot includes a roller, a connecting rod, a drive frame, a clamp and a frame body, the roller is slidably arranged in the second arc-shaped through groove, one end of the connecting rod is connected to the roller, and the other end is connected to the clamp, and the drive frame is arranged on the connecting rod, one side of the drive frame is slidably connected to the guide rail on the frame body, and the guide rail is vertically arranged.

[0019] As an optional technical solution for a wafer conveying mechanism, the driving frame is provided with a accommodating chamber, and the accommodating chamber is provided with a driving member, a push rod and a clamping block, one end of the push rod is connected to the clamping block, and the other end of the push rod is connected to the driving member, and the clamp has at least two clamping points. The driving member can drive the push rod so that the clamping block and at least the two clamping points can clamp the wafer together.

[0020] As an optional technical solution for a wafer conveying mechanism, the bottom wall of the accommodating chamber is provided with a slide rail and a second position sensor, the push rod is slidably connected to the slide rail, the push rod is provided with a sensor sheet, and the second position sensor is used to detect the position of the sensor sheet.

[0021] As an optional technical solution for a wafer conveying mechanism, a third limiter is provided at one end of the rotating shaft extending out of the turntable, and the third limiter is configured to prevent the bearing on the rotating shaft from falling off.

[0022] As an optional technical solution for a wafer conveying mechanism, an angle mark is also provided on the fixing seat, and the angle mark is located above the first arc-shaped through groove.

[0023] As an optional technical solution of a wafer conveying mechanism, the wafer conveying mechanism further includes a third fixing member, and the third fixing member is penetrated through the fixing seat to fix the fixing seat on the frame.

[0024] The beneficial effects of the utility model include at least:

[0025] The utility model provides a wafer conveying mechanism, which includes a fixed seat, a cylinder, a manipulator, a turntable, a rotating shaft, a first limiter and a second limiter. Among them, a first arc-shaped through groove is arranged on the fixed seat. The cylinder is arranged on the fixed seat, and the output end of the cylinder is connected to the rotating shaft, and the rotating shaft passes through one end of the fixed seat and is connected to the turntable, so that the rotating shaft can drive the turntable to rotate. The manipulator is arranged on the turntable, and the manipulator is used to clamp and transport the wafer. One end of the first limiter is connected to the turntable, and the other end passes through the first arc-shaped through groove and is located on one side of the fixed seat; the turntable can drive the first limiter to rotate along the first arc-shaped through groove. The second limiter is arranged on the fixed seat, and the second limiter is configured to limit the first limiter. The wafer conveying mechanism in the utility model drives the rotating shaft through the cylinder. Compared with the motor drive in the prior art, the utility model uses the cylinder as the driving source, so that the wafer conveying mechanism has a higher response speed and a higher environmental adaptability, and can improve the reliability and stability of wafer conveying. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0027] Figure 1A schematic diagram of the structure of a wafer conveying mechanism (without showing the robot and the frame) provided in an embodiment of the utility model Figure 1 ;

[0028] Figure 2 A schematic diagram of the structure of a wafer conveying mechanism (without showing the robot and the frame) provided in an embodiment of the utility model Figure 2 ;

[0029] Figure 3 A side view of a wafer conveying mechanism (without showing the robot arm and the frame) provided by an embodiment of the utility model;

[0030] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0031] Figure 5 The structure of the wafer conveying mechanism provided by the embodiment of the utility model is shown in FIG. Figure 3 ;

[0032] Figure 6 The structure of the wafer conveying mechanism provided by the embodiment of the utility model is shown in FIG. Figure 4 ;

[0033] Figure 7 A schematic diagram of the structure of a wafer conveying mechanism (without showing the frame) provided by an embodiment of the utility model Figure 5 ;

[0034] Figure 8 The structure of the wafer conveying mechanism provided by the embodiment of the utility model is shown in FIG. Figure 6 .

[0035] Reference numerals

[0036] 100, fixing seat; 110, first arc-shaped through groove; 120, angle mark; 130, third fixing member; 200, cylinder; 300, rotating shaft; 310, bearing; 320, third limiting member; 400, rotating disk; 410, mounting hole; 420, second arc-shaped through groove; 500, first limiting member; 600, second limiting member; 610, adjusting member; 700, induction baffle; 800, first fixing member; 900, first position sensor;

[0037] 10. Manipulator; 11. Roller; 12. Connecting rod; 13. Driving frame; 131. Accommodating chamber; 132. Driving member; 133. Push rod; 134. Clamping block; 135. Slide rail; 136. Second position sensor; 137. Induction sheet; 14. Clamp; 141. Clamping point; 20. Frame; 21. Guide rail. DETAILED DESCRIPTION

[0038] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the present invention are further explained below with reference to the accompanying drawings and through specific implementation methods.

[0039] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0041] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0042] In the description of this embodiment, unless otherwise specified, the term "plurality" refers to a quantity of two or more than two.

[0043] This embodiment provides a wafer conveying mechanism, which has a high response speed and a high environmental adaptability, and can improve the reliability and stability of wafer conveying.

[0044] like Figure 1-Figure 4As shown, the wafer conveying mechanism mainly includes a fixed seat 100, a cylinder 200, a manipulator 10, a turntable 400, a rotating shaft 300, a first stopper 500 and a second stopper 600. Among them, a first arc-shaped through groove 110 is arranged on the fixed seat 100. The cylinder 200 is arranged on the fixed seat 100, and the output end of the cylinder 200 is connected to the rotating shaft 300, and the rotating shaft 300 passes through one end of the fixed seat 100 and is connected to the turntable 400, so that the rotating shaft 300 can drive the turntable 400 to rotate. The manipulator 10 is arranged on the turntable 400, and the manipulator 10 is used to clamp and transport wafers (not shown in the figure). One end of the first stopper 500 is connected to the turntable 400, and the other end passes through the first arc-shaped through groove 110 and is located on one side of the fixed seat 100; the turntable 400 can drive the first stopper 500 to rotate along the first arc-shaped through groove 110. The second position-limiting member 600 is disposed on the fixing seat 100 , and the second position-limiting member 600 is configured to limit the first position-limiting member 500 .

[0045] Based on the above design, in this embodiment, the output end of the cylinder 200 is driven and connected to the rotating shaft 300, so that the cylinder 200 can drive the rotating shaft 300 to rotate when working, and a turntable 400 is provided on the rotating shaft 300, which in turn drives the turntable 400 to rotate. The manipulator 10 connected to the turntable 400 clamps the wafer, and the rotation of the turntable 400 can drive the manipulator 10 to move, thereby changing the position of the manipulator 10, that is, changing the position of the wafer on the manipulator 10, thereby realizing the adjustment of the vertical spacing of a group of wafers on the manipulator 10.

[0046] Compared with the prior art, the wafer conveying mechanism in this embodiment drives the rotating shaft 300 through the cylinder 200. Compared with the motor drive in the prior art, the cylinder 200 is used as the driving source in this embodiment, which has the following advantages: First, the cylinder 200 drive has a faster response speed. In the process of the robot 10 carrying the wafer, fast and precise movements are often required. Therefore, the cylinder 200 is used as the driving source to improve work efficiency and save time. Secondly, the drive system of the cylinder 200 is relatively simple, consisting of an air source, a cylinder 200, an air circuit control element, etc., and is relatively easy to install and maintain. Thereby, the failure point can be reduced and the reliability of the wafer conveying mechanism can be improved. Thirdly, the environmental adaptability of the cylinder 200 is strong. In some harsh environments, such as dusty, humid, and strong electromagnetic interference environments, the cylinder 200 drive has more advantages than the motor drive. Because the cylinder 200 drive does not rely on electricity and is not easily affected by electromagnetic interference, it can improve the reliability and stability of wafer conveying, while the motor drive is easily affected in these environments. In addition, the cylinder 200 drive is easy to control. That is to say, the cylinder 200 drive can achieve precise position and speed control through air circuit control elements (proportional valves), etc., thereby improving the accuracy and reliability of wafer conveying by the robot 10. Finally, the cylinder 200 drive movement has better stability, and the cylinder 200 drive can provide smooth motion characteristics, which is very important for the handling and transportation of high-precision components such as wafers. However, the motor drive may require more complex control algorithms and hardware support when moving at high speed or high precision, but the cylinder 200 drive only needs simple air circuit control elements to achieve smooth movement.

[0047] The provision of the first limiting member 500 and the second limiting member 600 in this embodiment can prevent the turntable 400 from rotating at an excessively large angle, thereby achieving a limiting effect on the turntable 400 and improving the reliability and stability of the wafer conveying mechanism.

[0048] Exemplarily, in this embodiment, two second stoppers 600 are provided, and the two second stoppers 600 are respectively located at the two ends of the first arc-shaped through slot 110. When the first stopper 500 rotates to one end of the first arc-shaped through slot 110, one of the second stoppers 600 limits the first stopper 500, and when the first stopper 500 rotates to the other end of the first arc-shaped through slot 110, the other second stopper 600 limits the first stopper 500, thereby preventing the turntable 400 from rotating too much and exceeding the preset angle range.

[0049] Optionally, the second position limiting member 600 is detachably connected to the fixing seat 100 via screws, thereby facilitating the replacement and maintenance of the second position limiting member 600 at a later stage.

[0050] like Figure 2As shown, in this embodiment, an adjusting member 610 is further provided on the second position-limiting member 600. The adjusting member 610 and the second position-limiting member 600 are respectively located on two opposite sides of the fixing seat 100. The adjusting member 610 passes through the first arc-shaped through slot 110 and is connected to the second position-limiting member 600 and can fix the second position-limiting member 600 on the fixing seat 100. The adjusting member 610 is configured to adjust the position of the second position-limiting member 600 on the fixing seat 100. The setting of the adjusting member 610 can adjust the position of the second position-limiting member 600, thereby improving the flexibility and applicability, and can also facilitate the disassembly of the second position-limiting member 600, facilitate the later replacement and maintenance, and save costs.

[0051] Optionally, the adjusting member 610 in this embodiment is connected to the second limiting member 600 by screws.

[0052] like Figure 1-Figure 4 As shown, in this embodiment, the wafer conveying mechanism further includes an inductive baffle 700, a first fixing member 800 and a first position sensor 900. The inductive baffle 700 is connected to one end of the first limiting member 500 away from the turntable 400 through the first fixing member 800; the first position sensor 900 is connected to the second limiting member 600, and the first position sensor 900 is used to detect the position of the inductive baffle 700. Optionally, two first position sensors 900 are provided in this embodiment, and the first position sensors 900 correspond to the second limiting member 600 one by one, so that the two first position sensors 900 can respectively detect the two limit positions of the inductive baffle 700, and then indirectly feedback the two limit positions of the turntable 400 during the rotation process. It can be understood that the first position sensor 900 in this embodiment is electrically connected to an external controller, and the controller is also electrically connected to the cylinder 200.

[0053] Through the positions of the above-mentioned sensing baffle 700 and the first position sensor 900, when the turntable 400 rotates to one end of the first arc-shaped through groove 110, the turntable 400 has the largest rotation angle, and the robot 10 can perform operations such as transporting and conveying the wafer. At this time, the sensing baffle 700 is located at the first position sensor 900, and the first position sensor 900 can detect the specific position of the sensing baffle 700, and then the first position sensor 900 feeds back the signal to the controller, and the controller controls the output end of the cylinder 200 to move in the reverse direction, so that the turntable 400 can rotate in the reverse direction, so as to facilitate other operations on the wafer.

[0054] It should be noted that the first position sensor 900 and the controller in this embodiment are standard components in the prior art, and this embodiment will not elaborate on their specific structures and working principles.

[0055] Optionally, the first fixing member 800 in this embodiment can be configured as conventional parts such as bolts, screws, and screws.

[0056] like Figure 2 As shown, in the present embodiment, a mounting hole 410 is opened on the turntable 400, and the wafer conveying mechanism also includes a second fixing member (not shown in the figure), and the first limiting member 500 passes through the mounting hole 410 and is connected to the second fixing member, thereby realizing a stable connection between the first limiting member 500 and the turntable 400, avoiding relative sliding or displacement between the first limiting member 500 and the turntable 400 when the turntable 400 rotates.

[0057] Optionally, the mounting hole 410 in this embodiment can be provided in plurality, for example, two, three, four or the like mounting holes 410 are provided, thereby improving the stability and reliability of the connection between the first limiting member 500 and the turntable 400.

[0058] Optionally, the second fixing member in this embodiment can be configured as a nut, a bolt or other parts.

[0059] like Figure 2 As shown, in this embodiment, a second arc-shaped slot 420 is provided on the turntable 400, and the manipulator 10 is connected to the second arc-shaped slot 420. The setting of the second arc-shaped slot 420 enables the manipulator 10 to move in the second arc-shaped slot 420, thereby changing the actual position of the wafer. For example, the second arc-shaped slot 420 in this embodiment can be set to multiple, and a manipulator 10 is set in each second arc-shaped slot 420, so that during the rotation of the turntable 400, multiple manipulators 10 can independently move in each second arc-shaped slot 420 to achieve the change of the actual position of multiple wafers and realize the transportation of multiple wafers. It should be noted that the process and principle of the movement of the manipulator 10 in the second arc-shaped slot 420 in this embodiment belong to the prior art. For example, the manipulator 10 can be set to a conventional connecting rod structure with multiple degrees of freedom to achieve the purpose of moving in the second arc-shaped slot 420.

[0060] like Figure 5-Figure 7As shown, in this embodiment, the manipulator 10 includes a roller 11, a connecting rod 12, a driving frame 13 and a clamp 14, the roller 11 is slidably arranged in the second arc-shaped through groove 420, one end of the connecting rod 12 is connected to the roller 11, and the other end is connected to the clamp 14, and the driving frame 13 is arranged on the connecting rod 12, and the driving frame 13 is slidably connected to the guide rail 21 on the external frame 20, and the guide rail 21 is arranged vertically. In this way, when the turntable 400 rotates, the rotation can drive the roller 11 to rotate, and then the roller 11 can drive the connecting rod 12 and the clamp 14 on the connecting rod 12 to rotate together, because the driving frame 13 is slidably connected to the guide rail 21 on the frame 20, so that the connecting rod 12 can only move along the extension direction of the guide rail 21, that is, the connecting rod 12 can only move in the vertical direction, thereby achieving the purpose of changing the distance between multiple manipulators 10, and then the actual position of the wafer on the clamp 14 can be changed (that is, the distance between multiple wafers is changed).

[0061] Furthermore, if Figure 8 As shown, the drive frame 13 is provided with a receiving chamber 131, and the receiving chamber 131 is provided with a driving member 132, a push rod 133 and a clamping block 134, one end of the push rod 133 is connected to the clamping block 134, and the other end of the push rod 133 is connected to the driving member 132. The fixture 14 has at least two clamping points 141, and the driving member 132 can drive the push rod 133 to make the clamping block 134 and at least two clamping points 141 clamp the wafer together, so that the manipulator 10 can clamp the wafer to a determined unique position, improve the stability and accuracy of the wafer clamping, so that the position where the manipulator 10 places the wafer in the material box is more neat and consistent, and improves work efficiency. At the same time, when the manipulator 10 moves at high speed, the wafer will not move or fall.

[0062] Optionally, two clamping points 141 are provided on the clamp 14 in this embodiment, and the two clamping points 141 and the clamping block 134 together form a three-point structure for clamping the wafer.

[0063] Optionally, the driving member 132 in this embodiment can be configured as a conventional motor or cylinder, etc.

[0064] Furthermore, if Figure 8 As shown, the bottom wall of the accommodating chamber 131 in this embodiment is provided with a slide rail 135 and a second position sensor 136 , and the push rod 133 is slidably connected to the slide rail 135 , thereby improving the stability and reliability of the movement of the push rod 133 .

[0065] The push rod 133 is provided with a sensing sheet 137, and the second position sensor 136 is used to detect the position of the sensing sheet 137. For example, after the robot 10 clamps the wafer, if the second position sensor 136 cannot sense the sensing sheet 137, it can be considered that there is a wafer in the robot 10; if the second position sensor 136 senses the sensing sheet 137, it can be considered that there is no wafer in the robot 10.

[0066] It should be noted that the robot 10 in this embodiment is not limited to Figure 5-Figure 8 The operator can flexibly set the number of manipulators 10 according to actual needs, which will not be described here one by one.

[0067] like Figure 2-Figure 4 As shown, in this embodiment, a third limiter 320 is provided at one end of the rotating shaft 300 extending out of the turntable 400, and the third limiter 320 is configured to prevent the bearing 310 on the rotating shaft 300 from falling off, thereby improving the stability and reliability of the wafer conveying mechanism.

[0068] like Figure 1 As shown, in this embodiment, the fixing seat 100 is further provided with an angle mark 120, and the angle mark 120 is located above the first arc-shaped through groove 110. The setting of the angle mark 120 can facilitate the operator to intuitively observe the angle of rotation of the turntable 400, thereby indirectly reflecting the actual position of the wafer.

[0069] like Figure 1-Figure 2 As shown, in this embodiment, the wafer conveying mechanism further includes a third fixing member 130, and the third fixing member 130 is penetrated on the fixing seat 100 to fix the fixing seat 100 on the frame 20. Optionally, the third fixing member 130 in this embodiment can be provided in plurality, and the plurality of third fixing members 130 are arranged at equal intervals, which can improve the stability and reliability of the connection between the fixing seat 100 and the frame 20 and avoid the phenomenon of stress concentration on the fixing seat 100.

[0070] Optionally, the third fixing member 130 in this embodiment can be configured as conventional parts such as bolts, screws, and screws.

[0071] Optionally, the fixed base 100 and the turntable 400 in this embodiment are both metal parts, that is, the fixed base 100 and the turntable 400 are both made of metal materials, for example, they can be made of stainless steel or aluminum alloy, so as to improve the mechanical strength of the wafer conveying mechanism and extend its service life.

[0072] Obviously, the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

[0073] Note that in the description of this specification, the reference terms "some embodiments", "other embodiments", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A wafer conveying mechanism, characterized in that: include: A fixing seat (100), wherein a first arc-shaped through groove (110) is provided on the fixing seat (100); A cylinder (200), wherein the cylinder (200) is arranged on the fixing seat (100), and an output end of the cylinder (200) is connected to a rotating shaft (300), and one end of the rotating shaft (300) passing through the fixing seat (100) is connected to a rotating disk (400), so that the rotating shaft (300) can drive the rotating disk (400) to rotate; A robot (10), the robot (10) being arranged on the turntable (400), and the robot (10) being used for clamping and transporting wafers; a first limiting member (500), one end of the first limiting member (500) being connected to the rotating disk (400), and the other end of the first limiting member (500) passing through the first arc-shaped through slot (110) and being located on one side of the fixing seat (100); the rotating disk (400) can drive the first limiting member (500) to rotate along the first arc-shaped through slot (110); A second limiting member (600), wherein the second limiting member (600) is arranged on the fixing seat (100), and the second limiting member (600) is configured to limit the first limiting member (500).

2. The wafer conveying mechanism according to claim 1, characterized in that: The number of the second limiting members (600) is two, and the two second limiting members (600) are respectively located at two ends of the first arc-shaped through groove (110).

3. The wafer conveying mechanism according to claim 2, characterized in that: An adjusting member (610) is also provided on the second limiting member (600); the adjusting member (610) and the second limiting member (600) are respectively located on two opposite side surfaces of the fixing seat (100); one end of the adjusting member (610) passes through the first arc-shaped through groove (110) to be connected to the second limiting member (600) and is capable of fixing the second limiting member (600) on the fixing seat (100); the adjusting member (610) is configured to adjust the position of the second limiting member (600) on the fixing seat (100).

4. The wafer conveying mechanism according to claim 2, characterized in that: The wafer conveying mechanism further comprises an inductive baffle (700), a first fixing member (800) and a first position sensor (900); the inductive baffle (700) is connected to an end of the first limiting member (500) away from the turntable (400) via the first fixing member (800); the first position sensor (900) is connected to the second limiting member (600), and the first position sensor (900) is used to detect the position of the inductive baffle (700).

5. The wafer conveying mechanism according to claim 4, characterized in that: The number of the first position sensors (900) is two, and the first position sensors (900) correspond to the second position limiting members (600) in a one-to-one manner, so that the two first position sensors (900) can respectively detect the two limit positions of the sensing baffle (700).

6. The wafer conveying mechanism according to claim 1, characterized in that: The turntable (400) is provided with a mounting hole (410), the wafer conveying mechanism further comprises a second fixing member, and the first limiting member (500) passes through the mounting hole (410) and is connected to the second fixing member.

7. The wafer conveying mechanism according to claim 1, characterized in that: The rotating disk (400) is provided with a second arc-shaped through slot (420), and the robot (10) is connected to the second arc-shaped through slot (420).

8. The wafer conveying mechanism according to claim 7, characterized in that: The manipulator (10) comprises a roller (11), a connecting rod (12), a driving frame (13), a clamp (14) and a frame body (20), wherein the roller (11) is slidably arranged in the second arc-shaped through groove (420), one end of the connecting rod (12) is connected to the roller (11), and the other end is connected to the clamp (14), and the driving frame (13) is arranged on the connecting rod (12), one side of the driving frame (13) is slidably connected to a guide rail (21) on the frame body (20), and the guide rail (21) is arranged vertically.

9. The wafer conveying mechanism according to claim 8, characterized in that: The drive frame (13) is provided with a accommodating chamber (131), and the accommodating chamber (131) is provided with a driving member (132), a push rod (133) and a clamping block (134), one end of the push rod (133) is connected to the clamping block (134), and the other end of the push rod (133) is connected to the driving member (132), and the clamp (14) has at least two clamping points (141), and the driving member (132) can drive the push rod (133) to make the clamping block (134) and at least the two clamping points (141) clamp the wafer together.

10. The wafer conveying mechanism according to claim 9, characterized in that: The bottom wall of the accommodating chamber (131) is provided with a slide rail (135) and a second position sensor (136); the push rod (133) is slidably connected to the slide rail (135); a sensing sheet (137) is provided on the push rod (133); and the second position sensor (136) is used to detect the position of the sensing sheet (137).

11. The wafer conveying mechanism according to claim 1, characterized in that: A third stopper (320) is provided at one end of the rotating shaft (300) extending out of the rotating disk (400), and the third stopper (320) is configured to prevent the bearing (310) on the rotating shaft (300) from falling off.

12. The wafer conveying mechanism according to claim 1, characterized in that: The fixing seat (100) is also provided with an angle mark (120), and the angle mark (120) is located above the first arc-shaped through groove (110).

13. The wafer conveying mechanism according to claim 1, characterized in that: The wafer conveying mechanism further comprises a third fixing member (130), wherein the third fixing member (130) is penetrated through the fixing seat (100) so as to fix the fixing seat (100) on the frame (20).

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