LED packaging structure and lighting device

Abstract

The utility model provides an LED packaging structure and a lighting device. The LED packaging structure comprises a support, a light-emitting chip, a packaging glue layer and a fluorescent ceramic glass sheet. Wherein the bracket is provided with an open accommodating cavity; a light-emitting chip is arranged at the bottom of the accommodating cavity; the light-emitting chip is fixed through fluorescent silica gel arranged at the bottom of the containing cavity. The fluorescent ceramic glass sheet is arranged at the opening of the accommodating cavity and can seal the accommodating cavity; the fluorescent ceramic glass sheet and the packaging glue layer are arranged at an interval, and a space is formed between the fluorescent ceramic glass sheet and the packaging glue layer. The LED packaging structure provided by the utility model can be suitable for a relatively severe external environment, ensures long-term stable work, prolongs the service life, and is strong in practicability.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED lighting equipment, and specifically relates to an LED packaging structure and a lighting device. Background Art

[0002] LED lighting equipment is a semiconductor solid-state light-emitting device with the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, environmental benefits, etc. As for the use scenario, outdoor LED lighting equipment has a relatively harsh use environment, high unit price of finished products, and high maintenance costs, so the requirements for performance, service life and failure rate of outdoor LED lighting equipment are much higher than those of household LED lighting equipment.

[0003] In the prior art, in order to ensure high energy efficiency and low cost of LED lighting equipment, SMD (surface mount) lamp beads are often used, that is, the LED chip is encapsulated by covering it with encapsulation glue (fluorescent silicone). However, the working temperature of outdoor LED lighting equipment (high temperature and temperature difference change), pollutant gas, ultraviolet radiation, etc. will accelerate the aging of the bracket, and the silicone is prone to cracking, causing disconnection, open circuit and dead lamps. At the same time, the bracket turns yellow and the silver layer corrodes, resulting in early and significant light decay. The long-term stable operation of the lamp beads cannot be guaranteed, and thus the service life of the outdoor lighting equipment cannot be guaranteed, and the practicality is poor. Utility Model Content

[0004] The embodiments of the utility model provide an LED packaging structure and a lighting device, aiming to solve the problem of poor practicality of existing outdoor LED lighting equipment due to its inability to adapt to the outdoor environment for a long time.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: to provide an LED packaging structure, including:

[0006] A bracket having an open receiving cavity;

[0007] A light emitting chip is arranged at the bottom of the accommodating cavity;

[0008] A packaging glue layer, arranged at the bottom of the accommodating cavity, for fixing the light-emitting chip;

[0009] A fluorescent ceramic glass sheet is arranged at the open portion of the accommodating cavity and is used to seal the accommodating cavity; the fluorescent ceramic glass sheet is spaced apart from the packaging glue layer.

[0010] In a possible implementation, the support includes:

[0011] A base having a first electrode region and a second electrode region electrically connected to the light-emitting chip;

[0012] The side wall has a through opening, and the side wall is fixedly connected to the base and encloses the base to form the accommodating cavity.

[0013] In a possible implementation, the thickness of the packaging glue layer is less than or equal to one half of the depth of the accommodating cavity.

[0014] In a possible implementation, the bracket is provided with an embedding groove communicating with the accommodating cavity, the embedding groove is located at an open portion of the accommodating cavity, and the bottom of the embedding groove forms an annular platform arranged around the accommodating cavity;

[0015] Wherein, the fluorescent ceramic glass sheet is adapted to the embedding groove and connected to the annular platform.

[0016] In a possible implementation manner, the fluorescent ceramic glass sheet and the annular platform are bonded.

[0017] In a possible implementation, the mounting groove is a square groove.

[0018] In a possible implementation manner, the embedding groove is a circular groove.

[0019] The utility model also provides a lighting device, comprising:

[0020] a housing having an open cavity;

[0021] A reflector, disposed in the open cavity;

[0022] An aluminum substrate, disposed in the reflector;

[0023] The above-mentioned LED packaging structure is provided in plurality, each of which is evenly distributed on the aluminum substrate and electrically connected to the driver provided in the housing;

[0024] The sealing cover is located at the opening of the opening cavity and is detachably connected to the housing. The sealing cover has a light-transmitting portion adapted to the reflector.

[0025] In a possible implementation, a silicone sealing ring is provided between the sealing cover and the housing.

[0026] In a possible implementation, the light-transmitting portion is made of tempered glass.

[0027] In the LED packaging structure provided by the present implementation, the packaging glue layer is arranged at the bottom of the accommodating cavity, which can ensure the fixation and protection of the light-emitting chip. At the same time, its thickness is reduced and the amount used is small, which can avoid the debonding or inability to return to the original state due to long-term thermal expansion and contraction. On the other hand, it can also ensure the stability of the light-emitting chip and the bonding wire. The fluorescent ceramic glass sheet is arranged at intervals from the packaging glue layer, which can prevent the fluorescent ceramic glass sheet from being pushed out by the thermally expanded packaging glue layer. At the same time, the fluorescent ceramic glass sheet has the characteristics of high temperature resistance and light radiation resistance, which can avoid high-temperature yellowing. The fluorescent ceramic glass has good thermal conductivity, which can ensure that the heat generated by the light-emitting chip is promptly discharged. In addition, the fluorescent ceramic glass and the packaging glue layer are arranged at intervals with a certain distance, and there is no cold or hot bridge between the two, which can ensure that it is in a relatively low temperature environment for a long time, and the reliability is higher. The LED packaging structure provided by the present implementation can be applied to relatively harsh external environments, ensure long-term stable operation, extend service life, and is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic cross-sectional view of an LED packaging structure provided by an embodiment of the utility model;

[0029] Figure 2 for Figure 1 A schematic diagram of a top view of one embodiment of an LED packaging structure provided in the embodiment Figure 1 ;

[0030] Figure 3 for Figure 1 A schematic diagram of a top view of another embodiment of the LED packaging structure provided in the embodiment Figure 2 ;

[0031] Figure 4 Schematic diagram of the explosion structure of the lighting device provided in the embodiment of the utility model Figure 1 ;

[0032] Figure 5 Schematic diagram of the explosion structure of the lighting device provided in the embodiment of the utility model Figure 2 ;

[0033] Description of reference numerals:

[0034] 10. Bracket; 11. Base; 12. Side wall; 13. Accommodating cavity; 14. Mounting groove; 15. Annular platform; 20. Light-emitting chip; 30. Packaging glue layer; 40. Fluorescent ceramic glass sheet; 50. Housing; 51. Connecting part; 60. Reflector; 71. Lens; 70. Aluminum substrate; 80. Sealing cover; 81. Light-transmitting part; 82. Silicone sealing ring; 90. Driver. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0036] Please also read Figure 1 , the LED packaging structure provided by the utility model is now described.

[0037] Because the encapsulation glue used in the previous LED packaging structure will fill the accommodating cavity in the bracket, and the expansion coefficient difference between the encapsulation glue and the bracket is more than 5 times, the gap between the bracket and the glue will increase and peel off when the LED chip works at high temperature for a long time. After peeling, oxygen, halogen elements and other related gases will enter the inside of the bracket and react with the silver layer to oxidize, brominate or sulfide. In addition, the encapsulation glue often expands and contracts due to long-term changes in temperature, and long-term changes will not be able to restore the original state, and the stress of the wire is relatively large, which is easy to cause the bonding wire to open.

[0038] In this regard, the present embodiment provides an LED packaging structure, including a bracket 10, a light-emitting chip 20, a packaging glue layer 30, and a fluorescent ceramic glass sheet 40. The bracket 10 has an open receiving cavity 13. The light-emitting chip 20 is arranged at the bottom of the receiving cavity 13. The light-emitting chip 20 is fixed by the fluorescent silica gel arranged at the bottom of the receiving cavity 13.

[0039] Specifically, the fluorescent ceramic glass sheet 40 is disposed at the open portion of the accommodating cavity 13 to seal the accommodating cavity 13. The fluorescent ceramic glass sheet 40 is spaced apart from the packaging glue layer 30 to form a space between the fluorescent ceramic glass sheet 40 and the packaging glue layer 30.

[0040] Compared with the prior art, the LED packaging structure provided by this embodiment has a packaging glue layer 30 arranged at the bottom of the accommodating cavity 13, which can ensure the fixation and protection of the light-emitting chip 20. At the same time, its thickness is reduced and the amount used is small, which can avoid the debonding or inability to return to the original state due to long-term thermal expansion and contraction. On the other hand, it can also ensure the stability of the light-emitting chip 20 and the bonding wire. The fluorescent ceramic glass sheet 40 is arranged at intervals from the packaging glue layer 30, which can avoid the fluorescent ceramic glass sheet 40 being pushed out by the thermally expanded packaging glue layer 30. At the same time, the fluorescent ceramic glass sheet 40 has the characteristics of high temperature resistance and light radiation resistance, which can avoid high temperature yellowing. The fluorescent ceramic glass has good thermal conductivity, which can ensure that the heat generated by the light-emitting chip 20 is timely discharged. In addition, the fluorescent ceramic glass is arranged at intervals from the packaging glue layer 30, with a certain distance, and there is no cold or hot bridge between the two, which can ensure that it is in a relatively low temperature environment for a long time, and the reliability is higher. The LED packaging structure provided by this embodiment can adapt to relatively harsh external environments, ensure long-term stable operation, extend service life, and has strong practicality.

[0041] It should be noted that the fluorescent ceramic glass sheet 40 is a fully inorganic composite fluorescent material made by sintering fluorescent powder and ceramic glass material, which can receive the blue light spectrum emitted by the light-emitting chip 20, convert it into excitation and emit the white light spectrum. The fluorescent ceramic glass sheet 40 itself has small thermal deformation and is airtight, which can prevent external polluted gas from entering the accommodating cavity 13.

[0042] In some embodiments, the bracket 10 may be used as follows: Figure 1 See the structure shown. Figure 1 The bracket 10 includes a base 11 and a side wall 12. The base 11 has a first electrode region and a second electrode region electrically connected to the light emitting chip 20. The side wall 12 has a through hole, and the side wall 12 is fixedly connected to the base 11, and the side wall 12 and the base 11 are enclosed to form a receiving cavity 13.

[0043] The structure of the connection between the support and the bracket 10 is simple and easy to manufacture, and can ensure the fixed connection between the light emitting chip 20 and the fluorescent ceramic glass sheet 40.

[0044] In this embodiment, the light-emitting chip 20 can be fixed in the first electrode area or the second electrode area through the packaging glue layer 30, and the light-emitting chip 20 is respectively connected to the first electrode area and the second electrode area through electrical connecting wires, and the electrical connecting wires are also covered by the packaging glue layer 30. This technology is existing technology and will not be repeated here.

[0045] In some embodiments, the encapsulation glue layer 30 may be formed by Figure 1 See the structure shown. Figure 1 The thickness of the encapsulation glue layer 30 is less than or equal to half of the depth of the accommodating cavity 13. This structure can ensure that there is a large gap between the encapsulation glue layer 30 and the fluorescent ceramic glass sheet 40, thereby preventing the fluorescent ceramic glass from being disturbed by the thermal expansion of the encapsulation glue layer 30, ensuring the stability of the fluorescent ceramic glass, and ensuring stable operation.

[0046] In some embodiments, the bracket 10 may be used as follows: Figure 1 See the structure shown. Figure 1 The bracket 10 is provided with an embedding groove 14 which is connected with the accommodating cavity 13 . The embedding groove 14 is located at the open portion of the accommodating cavity 13 . The bottom of the embedding groove 14 forms an annular platform 15 which is arranged around the accommodating cavity 13 .

[0047] The fluorescent ceramic glass sheet 40 is matched with the embedding groove 14 and connected with the annular platform 15 .

[0048] The embedding groove 14 can ensure the embedding of the fluorescent ceramic glass sheet 40, and the annular platform 15 formed at the bottom of the embedding groove 14 can ensure the abutment with the fluorescent ceramic glass sheet 40, thereby increasing the contact area between the two, thereby ensuring the sealing of the accommodating cavity 13 and preventing external gas from entering the accommodating cavity 13. It has a simple structure and strong practicality.

[0049] In some embodiments, the fluorescent ceramic glass sheet 40 and the embedding groove 14 can be formed as follows: Figure 1 See the structure shown. Figure 1 The fluorescent ceramic glass sheet 40 and the annular platform 15 are bonded together. This structure is convenient for connection and operation.

[0050] In some embodiments, the above-mentioned embedding groove 14 can be adopted as follows Figure 2 See the structure shown. Figure 2 The embedding groove 14 is a square groove. When the embedding groove 14 is a square groove, it is easy to manufacture. The corresponding fluorescent ceramic glass sheet 40 is a rectangular sheet adapted to the square groove.

[0051] In some embodiments, the above-mentioned embedding groove 14 can be adopted as follows Figure 3 See the structure shown. Figure 3 The embedding groove 14 is a circular groove. When the embedding groove 14 is a circular groove, it is easy to manufacture. The corresponding fluorescent ceramic glass sheet 40 is a circular sheet that fits the square groove.

[0052] See also Figure 4 and Figure 5 The embodiment of the present application further provides a lighting device, comprising a housing 50, a reflector 60, an aluminum substrate 70, the above-mentioned LED packaging structure and a sealing cover 80. The housing 50 has an open cavity. The reflector 60 is disposed in the open cavity. The aluminum substrate 70 is disposed in the reflector 60. There are a plurality of LED packaging structures, each of which is evenly distributed on the aluminum substrate 70 and is electrically connected to a driver 90 disposed in the housing 50. The sealing cover 80 is located at the open portion of the open cavity and is detachably connected to the housing 50. The sealing cover 80 has a light-transmitting portion 81 adapted to the reflector 60.

[0053] Compared with the prior art, the lighting device provided in this embodiment has a sealed space enclosed by the housing 50 and the sealing cover 80, which can protect the internal reflector 60, the aluminum substrate 70, the LED packaging unit and the driver 90, while the reflector 60 and the light-transmitting portion 81 can ensure the light emission effect. In addition, the lighting device provided in this embodiment also has all the technical effects of the LED packaging structure.

[0054] It should be noted that the housing 50 may be provided with a connecting portion 51 for connection.

[0055] It should be noted that the housing 50 may also be provided with a lens covering each LED packaging structure.

[0056] In some embodiments, the sealing cover 80 and the housing 50 may be formed by Figure 4 See the structure shown. Figure 4 A silicone sealing ring 82 is provided between the sealing cover 80 and the housing 50, and the silicone sealing ring 82 can ensure the sealed connection between the sealing cover 80 and the housing 50, thereby preventing external gas from entering the reflector 60, and further preventing external gas from entering the LED packaging structure.

[0057] In some embodiments, the sealing cover 80 may be Figure 4 See the structure shown. Figure 4 The light-transmitting portion 81 is made of tempered glass, which has good light-transmitting effect and high strength, and can ensure service life.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. LED packaging structure, characterized in that: include: A bracket having an open receiving cavity; A light emitting chip is arranged at the bottom of the accommodating cavity; A packaging glue layer, arranged at the bottom of the accommodating cavity, for fixing the light-emitting chip; A fluorescent ceramic glass sheet is arranged at the open portion of the accommodating cavity and is used to seal the accommodating cavity; the fluorescent ceramic glass sheet is spaced apart from the packaging glue layer.

2. The LED packaging structure according to claim 1, characterized in that: The support comprises: A base having a first electrode region and a second electrode region electrically connected to the light-emitting chip; The side wall has a through opening, and the side wall is fixedly connected to the base and encloses the base to form the accommodating cavity.

3. The LED packaging structure according to claim 1, characterized in that: The thickness of the packaging glue layer is less than or equal to two-thirds of the depth of the accommodating cavity.

4. The LED packaging structure according to any one of claims 1 to 3, characterized in that: The bracket is provided with an embedding groove communicating with the accommodating cavity, the embedding groove is located at the open portion of the accommodating cavity, and the bottom of the embedding groove forms an annular platform arranged around the accommodating cavity; Wherein, the fluorescent ceramic glass sheet is adapted to the embedding groove and connected to the annular platform.

5. The LED packaging structure according to claim 4, characterized in that: The fluorescent ceramic glass sheet is bonded to the annular platform.

6. The LED packaging structure according to claim 4, characterized in that: The embedding groove is a square groove.

7. The LED packaging structure according to claim 4, characterized in that: The embedding groove is a circular groove.

8. A lighting device, characterized in that include: a housing having an open cavity; A reflector, disposed in the open cavity; An aluminum substrate, disposed in the reflector; The LED packaging structure according to any one of claims 4 to 7, wherein a plurality of the LED packaging structures are provided, each of the LED packaging structures is evenly distributed on the aluminum substrate and is electrically connected to a driver provided in the housing; The sealing cover is located at the opening of the opening cavity and is detachably connected to the housing. The sealing cover has a light-transmitting portion adapted to the reflector.

9. The lighting device according to claim 8, characterized in that: A silicone sealing ring is provided between the sealing cover and the shell.

10. The lighting device according to claim 8, characterized in that: The light-transmitting portion is made of tempered glass.

Images