The invention relates to the technical field of substrate material surface plating, in particular to a method for electrochemical plating of a
perovskite thin film through an ionic
electrolyte, and the method comprises the following steps: S1, preparing the ionic
electrolyte containing a double-complexing agent
system and a two-dimensional nano filler; s2, the
ion electrolyte and the substrate are placed in a
rotating magnetic field for a pulse electrodeposition process, and ultrasonic
waves are applied to the bottom of the
rotating magnetic field; s3, adopting an asymmetric third-order
pulse waveform in the pulse electrodeposition process; s4, in the pulse electrodeposition process,
synchronizing terahertz time-domain
spectroscopy and
confocal Raman imaging to monitor
grain boundary defects of the deposition layer; and S5, entering an annealing stage after the process is ended, and introducing pyrrolidone steam to form a C-N bond
passivation layer. According to the method, the
ion electrolyte containing the specific double complexing agent
system and the two-dimensional nano filler is accurately prepared, so that the uniformity and efficiency of the plating process are improved, and the stability of the
ion electrolyte is ensured.