Semiconductor laser packaging module and semiconductor laser

Abstract

The utility model discloses a semiconductor laser packaging module and a semiconductor laser, the packaging module comprises a base, a plurality of chip units and a plurality of conductive modules, and the base is provided with a mounting groove; the multiple chip units are installed on the base and located in the installation groove, the multiple chip units are arranged at intervals in the length direction of the base, each chip unit comprises a chip, a heat sink and a metal layer, the chips and the metal layers are installed on the side faces, away from the base, of the heat sinks, and the chips and the metal layers are arranged at intervals; the plurality of conductive modules are installed on the base, each chip unit corresponds to one conductive module, each conductive module comprises a first conductive block and a second conductive block, the first conductive block is connected with a chip of the corresponding chip unit through a wire, and the second conductive block is connected with a metal layer of the corresponding chip unit through a wire. The first conductive blocks and the second conductive blocks of the adjacent conductive modules are connected through wires. The wiring operation is simple, the situation of wrong connection is avoided, and the reliability of the laser is improved.

Description

Technical Field

[0001] The present application belongs to the field of laser technology, and in particular relates to a semiconductor laser packaging module and a semiconductor laser. Background Art

[0002] Semiconductor lasers are widely used in laser cleaning, laser welding, laser printing and other technical fields. In related technologies, semiconductor lasers include multiple COS (chip on submount) chips or chips, which need to be connected in series through a series structure. The series structure is aluminum wire or other wires. As the power of semiconductor lasers becomes higher and higher, the number of COS chips or chips required increases. The series structure has messy wiring, easy to connect incorrectly, and complex wiring operations, which affects the reliability of the laser. Utility Model Content

[0003] The embodiments of the present application provide a semiconductor laser packaging module and a semiconductor laser to solve the problem that the existing semiconductor laser has a series structure with messy wiring and easy connection errors, which leads to complicated wiring operations and affects the reliability of the laser.

[0004] In a first aspect, an embodiment of the present application provides a semiconductor laser packaging module, comprising:

[0005] A base having a mounting slot;

[0006] A plurality of chip units are installed on the base and located in the installation groove. The plurality of chip units are spaced apart along the length direction of the base. The chip unit comprises a chip, a heat sink and a metal layer. The heat sink is installed on the base. The chip and the metal layer are both installed on a side surface of the heat sink away from the base. The chip and the metal layer are spaced apart.

[0007] A plurality of conductive modules are installed on the base and located in the installation groove, each chip unit corresponds to a conductive module, the conductive module is located on one side of the corresponding chip unit, each conductive module includes a first conductive block and a second conductive block, the first conductive block is connected to the chip of the corresponding chip unit through a wire, the second conductive block is connected to the metal layer of the corresponding chip unit through a wire, and the first conductive block and the second conductive block of adjacent conductive modules are connected through the wire.

[0008] Optionally, an insulating sheet is further included, wherein the insulating sheet is arranged on the base, and the conductive module is installed on the insulating sheet.

[0009] Optionally, each of the conductive modules is mounted on a piece of the insulating sheet;

[0010] Alternatively, a plurality of the conductive modules are mounted on one insulating sheet.

[0011] Optionally, the conductive module is connected to the insulating sheet by gluing.

[0012] Optionally, the first conductive block is Character type, the second conductive block is Character type, the first conductive block and the second conductive block are assembled into a rectangle, and a "Z"-shaped gap is formed between the first conductive block and the second conductive block.

[0013] Optionally, it also includes a first electrode connector and a second electrode connector, wherein the first ends of the first electrode connector and the second electrode connector extend through the base into the mounting groove, the first ends of the first electrode connector and the second electrode connector are located outside the base, the first electrode connector and the second electrode connector, the first electrode connector is close to the first side of the base, the first electrode connector is connected to the first conductive block of the conductive module close to the first side through the wire, the second electrode connector is close to the second side of the base, and the second electrode connector is connected to the second conductive block of the conductive module close to the second side through the wire.

[0014] Optionally, both the first electrode connector and the second electrode connector are sleeved with an insulating sleeve, and the first electrode connector and the second electrode connector are fixedly connected to the base via the insulating sleeves.

[0015] Optionally, the conductive wire includes a plurality of gold wires, and the plurality of gold wires are arranged at intervals.

[0016] Optionally, the conductive wire includes a first gold wire layer and a second gold wire layer, the first gold wire layer and the second gold wire layer are stacked, and the first gold wire layer is closer to the conductive module than the second gold wire layer.

[0017] In a second aspect, an embodiment of the present application further provides a semiconductor laser, comprising: a semiconductor laser packaging module as described in any one of the above items.

[0018] The semiconductor laser packaging module and semiconductor laser provided in the embodiments of the present application include a base, a plurality of chip units and a plurality of conductive modules. The plurality of chip units and the plurality of conductive modules are all arranged in the mounting groove of the base. Each chip unit corresponds to a conductive module. Each conductive module includes a first conductive block and a second conductive block. When the chip units are connected in series, the conductive module can be first installed on the base, the first conductive block is connected to the chip of the corresponding chip unit through a wire, the second conductive block is connected to the metal layer of the corresponding chip unit through a wire, and then the first conductive block and the second conductive block of the adjacent conductive modules are connected through a wire. The wiring is neat and the wiring operation is convenient. The problem that the existing semiconductor laser has a messy wiring and is easy to connect wrongly due to the series structure, resulting in complicated wiring operation and affecting the reliability of the laser is overcome. The wiring operation is simple, and the occurrence of wrong connection is avoided, thereby improving the reliability of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0020] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0021] Figure 1 A top view of a semiconductor laser packaging module provided in an embodiment of the present application.

[0022] Figure 2 A partial stereoscopic view of a semiconductor laser packaging module provided in an embodiment of the present application.

[0023] Figure 3 for Figure 2 A partial enlarged view of point A in the middle. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0025] The embodiments of the present application provide a semiconductor laser packaging module and a semiconductor laser to solve the problem that the existing semiconductor laser has a series structure with messy wiring and is easy to connect incorrectly, resulting in complicated wiring operations and affecting the reliability of the laser.

[0026] See also Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 A top view of a semiconductor laser packaging module provided in an embodiment of the present application, Figure 2 A partial stereoscopic diagram of a semiconductor laser packaging module provided in an embodiment of the present application, Figure 3 for Figure 2 A partial enlarged view of point A in the middle.

[0027] The semiconductor laser packaging module includes a base 100 , a plurality of chip units 200 and a plurality of conductive modules 300 .

[0028] In this embodiment, the base 100 is a cubic structure. The base 100 is provided with a mounting groove 110 with one side open. The mounting groove 110 is a rectangular groove structure.

[0029] In this embodiment, the number of chip units 200 can be multiple, such as 10, 12, 16 or 20. The specific number of chip units 200 can be set according to the power of the semiconductor laser. A plurality of chip units 200 are installed on the base 100, the plurality of chip units 200 are located in the mounting groove 110, the plurality of chip units 200 are installed on the groove bottom of the mounting groove 110, the plurality of chip units 200 are arranged at intervals along the length direction of the base 100, and the intervals between adjacent chip units 200 are the same. Each chip unit 200 includes a chip 210, a heat sink 220 and a metal layer 230. The heat sink 220 is a rectangular block structure, the heat sink 220 is installed on the base 100, the chip 210 is square or rectangular, the length and width of the chip 210 are both smaller than the length and width of the heat sink 220, the chip 210 is installed on a side surface of the heat sink 220 away from the base 100, the metal layer 230 is rectangular, the metal layer 230 is installed on a side surface of the heat sink 220 away from the base 100, the length of the metal layer 230 is the same as the width of the heat sink 220, and the metal layer 230 is aligned with a side edge of the heat sink 220.

[0030] In this embodiment, a plurality of conductive modules 300 are installed on the base 100. The conductive modules 300 are located in the mounting groove 110. Each chip unit 200 corresponds to a conductive module 300. The conductive module 300 is located on one side of the corresponding chip unit 200. The conductive module 300 is close to a groove wall on one side of the mounting groove 110. The plurality of conductive modules 300 are arranged in sequence along the length direction of the base 100. The plurality of conductive modules 300 are arranged in sequence at intervals. The intervals between adjacent conductive modules 300 are the same. Each conductive module 300 includes a first conductive block 310 and a second conductive block 320. The first conductive blocks 310 and the second conductive blocks 320 of all conductive modules 300 are arranged alternately. The first conductive block 310 is connected to the chip 210 of the corresponding chip unit 200 through a wire 330. The second conductive block 320 is connected to the metal layer 230 of the corresponding chip unit 200 through a wire 330. The first conductive blocks 310 and the second conductive blocks 320 of adjacent conductive modules 300 are connected through a wire 330.

[0031] It can be understood that when the chip units 200 are connected in series, the conductive module 300 can be first installed on the base 100, the first conductive block 310 is connected to the chip 210 of the corresponding chip unit 200 through the wire 330, the second conductive block 320 is connected to the metal layer 230 of the corresponding chip unit 200 through the wire 330, and then the first conductive block 310 and the second conductive block 320 of the adjacent conductive modules 300 are connected through the wire 330. The wiring inside the base 100 is neat and convenient for wiring operation, which overcomes the problem that the existing semiconductor laser has a messy wiring structure and is easy to connect incorrectly, resulting in complicated wiring operation and affecting the reliability of the laser. The wiring operation is simple, avoids the occurrence of wrong connection, and improves the reliability of the laser.

[0032] In some embodiments, see Figure 3 As shown, the semiconductor laser packaging module also includes an insulating sheet 400, which is arranged on the base 100, and the conductive module 300 is installed on the insulating sheet 400. The insulating sheet 400 is made of ceramic material, and the ceramic material has high insulation performance and high temperature resistance. The insulating sheet 400 is provided to avoid the short circuit between the conductive module 300 and the chip unit 200.

[0033] In some embodiments, see Figure 2 As shown, each conductive module 300 is mounted on an insulating sheet 400. For example, the bottom of the mounting groove 110 is a step structure, and each step is provided with a chip unit 200, a conductive module 300 and an insulating sheet 400, and the chip unit 200, the conductive module 300 and the insulating sheet 400 correspond to each other.

[0034] In some embodiments, multiple conductive modules 300 are installed on an insulating sheet 400. If the bottom of the installation groove 110 is a planar structure, a whole insulating sheet 400 can be set. All conductive modules 300 are installed on the same insulating sheet 400, and the installation operation of the insulating sheet 400 is convenient.

[0035] In the above embodiment, the conductive module 300 and the insulating sheet 400 are connected by gluing, and the insulating sheet 400 and the base 100 are also connected by gluing.

[0036] In some embodiments, see Figure 2 and Figure 3 As shown, the first conductive block 310 is Character type, the second conductive block 320 is The first conductive block 310 and the second conductive block 320 are assembled into a rectangle, and a “Z”-shaped gap is formed between the first conductive block 310 and the second conductive block 320 .

[0037] Understandably, see Figure 3 As shown, the first conductive block 310 includes a first horizontal section 311 and a first vertical section 312 connected, the first horizontal section 311 extends along the length direction of the base 100, and the first vertical section 312 extends along the width direction of the base 100. The second conductive block 320 includes a second horizontal section 321 and a second vertical section 322 connected, the second horizontal section 321 extends along the length direction of the base 100, and the second vertical section 322 extends along the width direction of the base 100. The first conductive block 310 and the second conductive block 320 are connected. The blocks 320 have the same size, the first vertical section 312 and the second horizontal section 321 are spaced apart from each other, the first horizontal section 311 and the second vertical section 322 are spaced apart from each other, the first conductive block 310 and the second conductive block 320 are spliced ​​into a rectangular block, the chip 210 and the first horizontal section 311 are connected via a wire 330, the metal layer 230 and the second vertical section 322 are connected via a wire 330, and the second vertical section 322 and the first vertical section 312 of the adjacent conductive module 300 are connected via a wire 330. Each area has a predetermined connection component, which is not easy to connect incorrectly and is convenient for users to perform wiring operations.

[0038] In some embodiments, see Figure 1As shown, the first electrode connector 340 and the second electrode connector 350, the first ends of the first electrode connector 340 and the second electrode connector 350 extend through the base 100 into the mounting groove 110, the first ends of the first electrode connector 340 and the second electrode connector 350 are located outside the base 100, the first electrode connector 340 and the second electrode connector 350, the first electrode connector 340 is close to the first side of the base 100, the first electrode connector 340 is connected to the first conductive block 310 of the conductive module 300 close to the first side through the wire 330, the second electrode connector 350 is close to the second side of the base 100, and the second electrode connector 350 is connected to the second conductive block 320 of the conductive module 300 close to the second side through the wire 330.

[0039] In the embodiment of the present application, the first electrode connector 340 is a negative electrode connector, the first conductive block 310 is a negative electrode conductive block, the second electrode connector 350 is a positive electrode connector, and the second conductive block 320 is a positive electrode conductive block. The laser is connected to an external power supply through the first electrode connector 340 and the second electrode connector 350, and the appearance and structure of the laser are beautiful, which facilitates wiring operations.

[0040] In some embodiments, see Figure 2 As shown, the first electrode connector 340 and the second electrode connector 350 are both sleeved with an insulating sleeve 360 ​​, and the first electrode connector 340 and the second electrode connector 350 are respectively fixedly connected to the base 100 through the insulating sleeve 360 ​​.

[0041] The first electrode connector 340 and the second electrode connector 350 are fixed by the insulating sleeve 360 ​​to prevent the first electrode connector 340 and the second electrode connector 350 from loosening and causing breakage, thereby improving the reliability of the semiconductor laser. The insulating sleeve 360 ​​is made of an insulating material, such as insulating rubber, to prevent the first electrode connector 340 and the second electrode connector 350 from directly contacting the base 100 and causing a short circuit, which is safe and reliable.

[0042] In some embodiments, see Figure 3 As shown, the conductor 330 includes a plurality of gold wires 331 , and the plurality of gold wires 331 are arranged at intervals. The number of the gold wires 331 is considered according to the power density that the conductor 330 needs to withstand. The greater the power density, the greater the number of the gold wires 331 .

[0043] In some embodiments, see Figure 3As shown, the conductor 330 includes a first gold wire layer 332 and a second gold wire layer 333. The first gold wire layer 332 and the second gold wire layer 333 are stacked. The first gold wire layer 332 is closer to the conductive module 300 than the second gold wire layer 333. The first gold wire layer 332 includes a plurality of spaced gold wires 331. The second gold wire layer 333 includes a plurality of spaced gold wires 331. By stacking the first gold wire layer 332 and the second gold wire layer 333, the conductor 330 is reasonably arranged, the limited space is fully utilized, and the gold wire 331 is neat and beautiful.

[0044] A semiconductor laser is also provided in an embodiment of the present application, including any one of the semiconductor laser packaging modules described above.

[0045] See also Figure 1 , Figure 2 and Figure 3As shown, the semiconductor laser packaging module includes a base 100, a plurality of chip units 200 and a plurality of conductive modules 300. The base 100 is a cubic structure, and the base 100 is provided with a mounting groove 110 with one side opening, and the mounting groove 110 is a rectangular groove structure. The number of chip units 200 can be set to multiple, such as 10, 12, 16 or 20, and the specific number of chip units 200 can be set according to the power of the semiconductor laser. A plurality of chip units 200 are installed on the base 100, the plurality of chip units 200 are located in the mounting groove 110, the plurality of chip units 200 are installed on the groove bottom of the mounting groove 110, the plurality of chip units 200 are arranged at intervals along the length direction of the base 100, and the intervals between adjacent chip units 200 are the same. Each chip unit 200 includes a chip 210, a heat sink 220 and a metal layer 230. The heat sink 220 is a rectangular block structure, the heat sink 220 is installed on the base 100, the chip 210 is square or rectangular, the length and width of the chip 210 are both smaller than the length and width of the heat sink 220, the chip 210 is installed on a side surface of the heat sink 220 away from the base 100, the metal layer 230 is rectangular, the metal layer 230 is installed on a side surface of the heat sink 220 away from the base 100, the length of the metal layer 230 is the same as the width of the heat sink 220, and the metal layer 230 is aligned with a side edge of the heat sink 220. A plurality of conductive modules 300 are installed on the base 100, and the conductive modules 300 are located in the mounting groove 110. Each chip unit 200 corresponds to a conductive module 300, and the conductive module 300 is located on one side of the corresponding chip unit 200. The conductive module 300 is close to a side groove wall of the mounting groove 110. The plurality of conductive modules 300 are arranged in sequence along the length direction of the base 100, and the plurality of conductive modules 300 are arranged in sequence at intervals, and the distance between adjacent conductive modules 300 is the same. Each conductive module 300 includes a first conductive block 310 and a second conductive block 320. The first conductive blocks 310 and the second conductive blocks 320 of all conductive modules 300 are alternately arranged. The first conductive block 310 is connected to the chip 210 of the corresponding chip unit 200 through a wire 330, and the second conductive block 320 is connected to the metal layer 230 of the corresponding chip unit 200 through a wire 330. The first conductive blocks 310 and the second conductive blocks 320 of adjacent conductive modules 300 are connected through a wire 330.

[0046] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0047] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0048] The semiconductor laser packaging module and semiconductor laser provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A semiconductor laser packaging module, characterized in that: include: A base having a mounting slot; A plurality of chip units are installed on the base and located in the installation groove. The plurality of chip units are spaced apart along the length direction of the base. The chip unit comprises a chip, a heat sink and a metal layer. The heat sink is installed on the base. The chip and the metal layer are both installed on a side surface of the heat sink away from the base. The chip and the metal layer are spaced apart. A plurality of conductive modules are installed on the base and located in the installation groove, each chip unit corresponds to a conductive module, the conductive module is located on one side of the corresponding chip unit, each conductive module includes a first conductive block and a second conductive block, the first conductive block is connected to the chip of the corresponding chip unit through a wire, the second conductive block is connected to the metal layer of the corresponding chip unit through a wire, and the first conductive block and the second conductive block of adjacent conductive modules are connected through the wire.

2. The semiconductor laser packaging module according to claim 1, characterized in that: It also includes an insulating sheet, which is arranged on the base, and the conductive module is installed on the insulating sheet.

3. The semiconductor laser packaging module according to claim 2, characterized in that: Each of the conductive modules is mounted on a piece of the insulating sheet; Alternatively, a plurality of the conductive modules are mounted on one insulating sheet.

4. The semiconductor laser packaging module according to claim 2, characterized in that: The conductive module is connected to the insulating sheet by gluing.

5. The semiconductor laser packaging module according to claim 1, characterized in that: The first conductive block is Character type, the second conductive block is Character type, the first conductive block and the second conductive block are assembled into a rectangle, and a "Z"-shaped gap is formed between the first conductive block and the second conductive block.

6. The semiconductor laser packaging module according to claim 1, characterized in that: It also includes a first electrode connector and a second electrode connector, wherein the first ends of the first electrode connector and the second electrode connector extend through the base into the mounting groove, and the first ends of the first electrode connector and the second electrode connector are located outside the base. The first electrode connector and the second electrode connector, the first electrode connector is close to the first side of the base, and the first electrode connector is connected to the first conductive block of the conductive module close to the first side through the wire, and the second electrode connector is close to the second side of the base, and the second electrode connector is connected to the second conductive block of the conductive module close to the second side through the wire.

7. The semiconductor laser packaging module according to claim 6, characterized in that: The first electrode connector and the second electrode connector are both covered with insulating sleeves, and the first electrode connector and the second electrode connector are respectively fixedly connected to the base through the insulating sleeves.

8. The semiconductor laser packaging module according to claim 1, characterized in that: The conductive wires include a plurality of gold wires, and the plurality of gold wires are arranged at intervals.

9. The semiconductor laser packaging module according to claim 1, characterized in that: The conductive wire comprises a first gold wire layer and a second gold wire layer, the first gold wire layer and the second gold wire layer are stacked, and the first gold wire layer is closer to the conductive module than the second gold wire layer.

10. A semiconductor laser, characterized in that: include: A semiconductor laser packaging module as claimed in any one of claims 1 to 9.

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