High-stability crystal oscillator

Abstract

The utility model provides a high-stability crystal oscillator. The high-stability crystal oscillator comprises an electronic element, an electrical cavity is formed in the shell and is used for accommodating the electronic element; the patch pins comprise a power supply pin and an output pin, and the power supply pin and the output pin are arranged in the electric appliance cavity and extend out of the shell; the welding plate is arranged outside the shell and is connected with the patch pins, and one side, deviating from the shell, of the welding plate is welded with a circuit board; wherein a heat insulation layer is formed between the welding plate and the shell, and is used for isolating heat of the circuit board from being transferred to the shell. According to the high-stability crystal oscillator provided by the utility model, the welding plate is arranged on the patch pins, so that the heat insulation layer is formed between the welding plate and the shell, and the heat insulation layer can prevent the heat of the circuit board from being directly transferred to the oscillator, thereby reducing the change of the working temperature of the oscillator. The temperature stability of the crystal oscillator is improved, and the frequency stability and performance of the crystal oscillator are maintained.

Description

Technical Field

[0001] The present application relates to the technical field of crystal oscillators, and in particular to a high-stability crystal oscillator. Background Art

[0002] Applicable to crystal oscillators in the high-frequency range. In order to provide a shorter signal path for greater stability, the patch method is often used. However, the patch method reduces the heat dissipation efficiency and cannot effectively reduce the heat of the oscillator, resulting in inaccurate and unstable frequency.

[0003] Crystal oscillators are key components commonly used in electronic systems to generate stable clock signals or frequency references. They play an important role in many applications, such as communication equipment, computer systems, precision measurement, etc. The stability of the crystal oscillator is critical to the performance and accuracy of the system, so the requirements for its stability are very high.

[0004] Traditional crystal oscillator designs have some heat transfer issues. In some applications, the heat generated by the oscillator during operation may affect the temperature stability of the crystal, thereby affecting the frequency stability and performance of the oscillator. Existing technical solutions usually solve this problem through heat dissipation design, such as installing heat sinks or radiators to help dissipate heat, or improving heat dissipation efficiency through circuit board layout.

[0005] However, in order to provide a shorter signal path, the patch connection is often used, and the heat dissipation design of the existing technical solution still cannot prevent the heat generated by the circuit board from being transferred to the housing of the crystal oscillator, thereby affecting the temperature of the crystal and causing inaccuracy and instability of the oscillator. Therefore, a new solution is needed to reduce the impact of heat on the performance of the crystal oscillator. Utility Model Content

[0006] In view of this, it is necessary to provide a design that prevents heat from affecting the stable operation of the crystal oscillator to solve the above problems.

[0007] An embodiment of the present application provides a high stability crystal oscillator, comprising:

[0008] Electronic components;

[0009] The housing is provided with an electrical cavity for accommodating the electronic components;

[0010] SMD pins, including power pins and output pins, the power pins and the output pins are both arranged in the electrical cavity and extend out of the housing;

[0011] A welding plate, arranged outside the housing and connected to the SMD pins, and welded to the circuit board on a side away from the housing;

[0012] Wherein, a heat insulation layer is formed between the welding plate and the shell to prevent the heat of the circuit board from being transferred to the shell.

[0013] In at least one embodiment of the present application, the electronic component includes an electrode sheet, a baffle, and an amplifier, and the electrode sheet and the amplifier are electrically connected to the power pin and the output pin, respectively;

[0014] The baffle is arranged between the electrode sheet and the amplifier, and two ends of the baffle abut against the inner wall of the electrical cavity to prevent heat interaction between the electrode sheet and the amplifier.

[0015] In at least one embodiment of the present application, the electronic component also includes an oscillator crystal, which is disposed in the electrical cavity. The oscillator crystal is located above the electrode sheet, the baffle and the amplifier, and is electrically connected to the electrode sheet and the amplifier through conductive glue.

[0016] In at least one embodiment of the present application, the oscillator is further provided with a heat insulation plate, and the four sides of the heat insulation plate are in contact with the inner circumference of the electrical cavity, so as to separate the electrical cavity into a first cavity and a second cavity.

[0017] In at least one embodiment of the present application, the oscillating crystal is disposed in the second cavity, and the electrode sheet, the baffle and the amplifier are disposed in the first cavity to prevent heat from affecting the oscillating crystal.

[0018] In at least one embodiment of the present application, the oscillator further comprises a heat absorbing block, which is disposed in the second cavity, one side of the heat absorbing block is disposed on the shell, and the other side of the heat absorbing block is in contact with the oscillating crystal, for absorbing heat generated by the oscillating crystal.

[0019] In at least one embodiment of the present application, the oscillator further includes a heat sink, which is disposed on the housing and is used to absorb heat from the housing and dissipate it.

[0020] In at least one embodiment of the present application, the heat absorption block extends out of the shell and fits with the heat dissipation element.

[0021] In at least one embodiment of the present application, the heat sink is a metal sheet.

[0022] In at least one embodiment of the present application, the temperature sensor is disposed on the housing and extends into the electrical cavity, so as to control the temperature in the electrical cavity.

[0023] The high-stability crystal oscillator provided above has a layer of welding plate on the SMD pin, so that a heat insulation layer is formed between the welding plate and the housing, and the heat insulation layer can prevent the heat of the circuit board from being directly transferred to the oscillator, thereby reducing the operating temperature change of the oscillator. This helps to improve the temperature stability of the crystal oscillator and maintain its frequency stability and performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional diagram of a high-stability crystal oscillator in one embodiment of the present application.

[0025] Figure 2 for Figure 1 A back perspective view of the high stability crystal oscillator.

[0026] Figure 3 for Figure 1 A cross-sectional view of a high stability crystal oscillator.

[0027] Figure 4 for Figure 1 A cross-sectional view of a high stability crystal oscillator.

[0028] Figure 5 for Figure 1 A cross-sectional view of a high stability crystal oscillator.

[0029] Main component symbols

[0030] 100. A high-stability crystal oscillator; 10. Electronic component; 11. Electrode sheet; 12. Baffle; 13. Amplifier; 14. Oscillation crystal; 20. Shell; 21. Electrical cavity; 211. First cavity; 212. Second cavity; 30. SMD pin; 31. Power pin; 32. Output pin; 40. Welding board; 40a. Thermal insulation layer; 50. Thermal insulation board; 60. Heat absorption block; 70. Heat sink; 80. Temperature sensor. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0032] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0033] An embodiment of the present application provides a high stability crystal oscillator, comprising:

[0034] Electronic components;

[0035] The housing is provided with an electrical cavity for accommodating the electronic components;

[0036] SMD pins, including power pins and output pins, the power pins and the output pins are both arranged in the electrical cavity and extend out of the housing;

[0037] A welding plate, arranged outside the housing and connected to the SMD pins, and welded to the circuit board on a side away from the housing;

[0038] Wherein, a heat insulation layer is formed between the welding plate and the shell to prevent the heat of the circuit board from being transferred to the shell.

[0039] The high-stability crystal oscillator provided above has a layer of welding plate on the SMD pin, so that a heat insulation layer is formed between the welding plate and the housing, and the heat insulation layer can prevent the heat of the circuit board from being directly transferred to the oscillator, thereby reducing the operating temperature change of the oscillator. This helps to improve the temperature stability of the crystal oscillator and maintain its frequency stability and performance.

[0040] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0041] See also Figure 1-Figure 5 , an embodiment of the present application provides a high stability crystal oscillator 100, comprising an electronic component 10, a patch pin 30, and a welding plate 40;

[0042] The shell 20 is provided with an electrical cavity 21 for accommodating the electronic component 10; the SMD pin 30 includes a power pin 31 and an output pin 32, and the power pin 31 and the output pin 32 are both arranged in the electrical cavity and extend out of the shell 20; the welding plate 40 is arranged outside the shell 20 and connected to the SMD pin 30, and is welded to the circuit board on the side away from the shell 20; wherein a heat insulation layer 40a is formed between the welding plate 40 and the shell 20, which is used to isolate the heat of the circuit board from being transferred to the shell 20.

[0043] Specifically, the electronic component 10 includes a crystal, an amplifier 13, etc., and is a core component of a crystal oscillator. The crystal is used to generate a stable oscillation signal, and the amplifier 13 is used to amplify the signal to ensure the quality of the output signal. The housing 20 is the outer shell of the crystal oscillator, which is used to accommodate and protect the electronic component 10. An electrical cavity 21 is provided inside the housing 20 to ensure that the electronic component 10 can operate normally while being protected. The housing 20 can effectively protect the electronic component 10 from the influence of the external environment, such as dust, moisture, etc. At the same time, the design of the housing 20 can also affect the thermal management and electromagnetic interference control of the oscillator, and improve the stability and anti-interference ability of the oscillator.

[0044] Furthermore, the pin is the interface for connecting the oscillator to the external circuit. The power pin 31 is used to provide power supply, and the output pin 32 is used to output the signal generated by the oscillator. The design of the patch pin 30 can ensure the stable supply of power and the reliable output of the signal, ensuring the normal operation of the oscillator. The reasonable design of the pin can also reduce the interference with the external circuit and improve the anti-interference ability of the oscillator. The welding plate 40 connects the pin and the circuit board of the oscillator, and is the key connection part between the oscillator and the external circuit.

[0045] Furthermore, the design of the welding plate 40 can ensure reliable connection between the pins and the circuit board, making the signal transmission between the oscillator and the external circuit more stable. At the same time, the heat insulation layer 40a between the welding plate 40 and the housing 20 can prevent the heat of the circuit board from being directly transferred to the oscillator, thereby reducing the operating temperature change of the oscillator. This helps to improve the temperature stability of the crystal oscillator and maintain its frequency stability and performance.

[0046] In a specific embodiment, the electronic component 10 includes an electrode sheet 11, a baffle 12 and an amplifier 13, and the electrode sheet 11 and the amplifier 13 are electrically connected to the power pin 31 and the output pin 32 respectively;

[0047] The baffle 12 is disposed between the electrode sheet 11 and the amplifier 13 , and two ends of the baffle 12 abut against the inner wall of the electrical cavity 21 to prevent heat interaction between the electrode sheet 11 and the amplifier 13 .

[0048] Specifically, the electronic component 10 is a key component of the crystal oscillator, wherein the electrode sheet 11 is used to connect the crystal and the amplifier 13, and the amplifier 13 is used to amplify the signal generated by the oscillator. The baffle 12 is located between the electrode sheet 11 and the amplifier 13, and plays the role of heat insulation and isolation.

[0049] Beneficial effects: The connection between the electrode sheet 11 and the amplifier 13 ensures the transmission of the signal, and the presence of the baffle 12 can effectively prevent the heat exchange between the electrode sheet 11 and the amplifier 13, and maintain the stable performance of the oscillator. The baffle 12 is located between the electrode sheet 11 and the amplifier 13 as a heat insulation layer 40a, and is used to prevent the transfer of heat between the two components. The presence of the baffle 12 effectively isolates the heat exchange between the electrode sheet 11 and the amplifier 13, ensures the stable operating temperature of each component of the oscillator, and improves the stability and reliability of the oscillator.

[0050] In summary, the reasonable design and layout of the electronic component 10 and the setting of the baffle 12 as the heat insulation layer 40a can ensure the performance and stability of the crystal oscillator. In various application scenarios, these features can ensure the normal operation of the oscillator and provide a reliable oscillation signal.

[0051] In a specific embodiment, the electronic component 10 also includes an oscillating crystal 14, which is disposed in the electrical cavity 21. The oscillating crystal 14 is located above the electrode sheet 11, the baffle 12 and the amplifier 13, and is electrically connected to the electrode sheet 11 and the amplifier 13 through conductive glue.

[0052] Specifically, the oscillation crystal 14 is a key component for generating an oscillation signal in a crystal oscillator, and it generates a stable oscillation frequency through the physical properties of the crystal. The stability of the oscillation crystal 14 determines the frequency stability of the oscillator. Selecting a high-quality oscillation crystal 14 can improve the frequency accuracy and stability of the oscillator, so that it can work reliably in various application scenarios. Placing the oscillation crystal 14 in the electrical cavity 21 and above the electrode sheet 11, the baffle 12 and the amplifier 13 can protect the oscillation crystal 14 from the electronic component 10 and enable the oscillation signal to be transmitted to the amplifier 13 more stably. Such a layout design can reduce the impact of the external environment on the oscillation crystal 14, improve the stability and reliability of the oscillator, and ensure that it can work normally in various working environments.

[0053] Furthermore, conductive glue is used to connect the oscillating crystal 14 to the electrode sheet 11 and the amplifier 13, thereby ensuring a stable electrical connection between the oscillating crystal 14 and the electronic component 10. The conductive glue has good conductivity and mechanical properties, can provide a reliable electrical connection, and can maintain stability when the oscillator vibrates or the temperature changes, thereby improving the performance and reliability of the oscillator.

[0054] In a specific embodiment, the oscillator further includes a heat insulation plate 50 , and the four sides of the heat insulation plate 50 are in contact with the inner circumference of the electrical cavity 21 , so as to separate the electrical cavity 21 into a first cavity 211 and a second cavity 212 .

[0055] Specifically, the heat shield 50 is located inside the oscillator and is used to separate the electrical cavity 21 into two independent cavities. Its four sides are in contact with the inner circumference of the electrical cavity 21, ensuring effective isolation between the two cavities. The existence of the heat shield 50 effectively isolates the heat transfer inside the oscillator and prevents heat exchange between different components. In this way, the temperature inside the oscillator can be kept stable, and the performance and reliability of the oscillator can be improved.

[0056] Furthermore, the heat shield 50 separates the electrical cavity 21 into two independent cavities, each containing an oscillating crystal 14 and other electronic components 10. This can effectively isolate the heat exchange between the oscillating crystal 14 and other electronic components 10 to avoid mutual interference. Separating the electrical cavity 21 into two cavities helps reduce internal heat accumulation and interference, and improves the stability and reliability of the oscillator. At the same time, this design can also make the oscillator easier to maintain and adjust, thereby improving production efficiency.

[0057] In a specific embodiment, the oscillating crystal 14 is disposed in the second cavity 212 , and the electrode sheet 11 , the baffle 12 and the amplifier 13 are disposed in the first cavity 211 to prevent heat from affecting the oscillating crystal 14 .

[0058] Specifically, the oscillating crystal 14 is placed in the second cavity 212, which can be isolated from other electronic components 10, reducing the impact of the external environment on the oscillating crystal 14. By placing the oscillating crystal 14 in the second cavity 212, the impact of external environmental factors on the oscillating crystal 14 can be reduced, the frequency stability and reliability of the oscillator can be improved, and it can be ensured that it can work normally in various working environments. The electrode sheet 11, the baffle 12 and the amplifier 13 are placed in the first cavity 211, working together with other electronic components 10, but isolated from the oscillating crystal 14 to prevent heat from being directly transferred to the oscillating crystal 14.

[0059] Furthermore, by placing the electrode sheet 11, the baffle 12 and the amplifier 13 in the first cavity 211, the heat transfer between them and the oscillating crystal 14 can be effectively isolated, and the heat generated by the external ambient temperature change or the operation of the electronic component 10 itself can be prevented from affecting the stability of the oscillating crystal 14. Placing the oscillating crystal 14 in the second cavity 212 and placing other electronic components 10 in the first cavity 211 can effectively isolate the heat transfer between the oscillating crystal 14 and other components, thereby improving the stability and reliability of the oscillator.

[0060] In a specific embodiment, the oscillator also includes a heat absorption block 60, which is disposed in the second cavity 212, one side of the heat absorption block 60 is disposed on the shell 20, and the other side is against the oscillation crystal 14, for absorbing the heat generated by the oscillation crystal 14.

[0061] Specifically, the heat absorption block 60 is placed in the second cavity 212, and one side of the heat absorption block 60 is in contact with the oscillation crystal 14 to absorb the heat generated by the oscillation crystal 14. The presence of the heat absorption block 60 can effectively absorb the heat generated by the oscillation crystal 14 and prevent the heat from affecting the oscillation crystal 14, thereby improving the stability and reliability of the oscillator. One side of the heat absorption block 60 is in contact with the shell 20, which can promote the conduction and heat dissipation of heat. Connecting one side of the heat absorption block 60 to the shell 20 can accelerate the conduction and heat dissipation of heat, effectively transfer the heat generated by the oscillation crystal 14 from the second cavity 212 to the external environment, and further improve the stability of the oscillator.

[0062] Furthermore, the other side of the heat absorbing block 60 is in contact with the oscillating crystal 14, so that heat can be directly transferred from the oscillating crystal 14 to the heat absorbing block 60. The direct contact between the heat absorbing block 60 and the oscillating crystal 14 can maximize the heat transfer and ensure the stable working temperature of the oscillating crystal 14. As a part of the crystal oscillator, the heat absorbing block 60 can effectively absorb and conduct the heat generated by the oscillating crystal 14, thereby maintaining the stable performance of the oscillator.

[0063] In a specific embodiment, the oscillator further includes a heat sink 70 , which is disposed on the housing 20 and is used to absorb the heat on the housing 20 and dissipate it.

[0064] Specifically, the heat sink 70 is installed on the housing 20 of the oscillator to absorb the heat generated on the housing 20 and dissipate it to the external environment. Through the action of the heat sink 70, the oscillator can dissipate heat more effectively, keep the temperature of the oscillator within an appropriate range, avoid the influence of overheating on the performance of the oscillator, and ensure the stability and reliability of the oscillator. The combination of the heat absorption block 60 and the heat sink 70 can effectively control the temperature of the oscillator and prevent the oscillating crystal 14 from being affected by overheating.

[0065] In a specific embodiment, the heat absorption block 60 extends out of the housing 20 and fits with the heat dissipation element 70 .

[0066] Specifically, the heat absorbing block 60 extends out of the shell 20 and fits with the heat sink 70, which expands the heat dissipation area and improves the heat transfer efficiency. By expanding the heat dissipation area, the oscillator can more effectively dissipate heat to the external environment, reduce the operating temperature of the oscillator, and maintain the stability and reliability of the oscillator. The heat absorbing block 60 fits with the heat sink 70, ensuring effective contact for heat transfer and improving the heat dissipation efficiency. By fitting with the heat sink 70, the heat absorbing block 60 can transfer the absorbed heat to the heat sink 70 more quickly, and then dissipate it to the external environment, effectively reducing the temperature of the oscillator and improving its stability and reliability.

[0067] In a specific embodiment, the heat sink 70 is a metal sheet.

[0068] Specifically, the metal sheet has good thermal conductivity and heat dissipation performance, can effectively absorb and conduct heat, and dissipate it to the external environment. Selecting the metal sheet as the heat sink 70 can improve the heat dissipation efficiency of the oscillator, effectively reduce the operating temperature of the oscillator, and maintain its stability and reliability.

[0069] Furthermore, when the oscillator is working, the oscillating crystal 14 and other components will generate heat. The metal sheet, as a heat sink 70, contacts the heat absorbing block 60 and absorbs the heat transferred from the heat absorbing block 60. As the heat is absorbed, the metal sheet quickly conducts the heat to the entire surface of the metal sheet and quickly dissipates it to the external environment, completing the heat dissipation process. Due to the excellent thermal conductivity of the metal sheet, the heat dissipation process is very efficient, which can effectively reduce the operating temperature of the oscillator and improve its stability and reliability.

[0070] In a specific embodiment, the oscillator further includes a temperature sensor 80 , which is disposed on the housing 20 and extends into the electrical cavity 21 , and is used to control the temperature in the electrical cavity 21 .

[0071] Specifically, the temperature sensor 80 is used to monitor the temperature change inside the oscillator and control the temperature inside the oscillator according to the real-time temperature data. By monitoring the temperature inside the oscillator in real time, the temperature sensor 80 can detect temperature abnormalities in time and take corresponding measures to adjust the operating temperature of the oscillator to ensure its stability and reliability.

[0072] Furthermore, the temperature sensor 80 is mounted on the housing 20 of the oscillator and extends into the interior of the electrical cavity 21 so as to sense the temperature change inside the electrical cavity 21 in real time. By mounting the temperature sensor 80 on the housing 20 of the oscillator and extending into the interior of the electrical cavity 21, it can be ensured that the temperature sensor 80 can accurately sense the temperature change inside the electrical cavity 21, thereby achieving accurate control of the oscillator temperature. According to the temperature data monitored in real time by the temperature sensor 80, the temperature inside the oscillator can be adjusted by the control system to keep it within a suitable operating temperature range.

[0073] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A high stability crystal oscillator, characterized in that: include: Electronic components; The housing is provided with an electrical cavity for accommodating the electronic components; SMD pins, including power pins and output pins, wherein the power pins and the output pins are both arranged in the electrical cavity and extend out of the housing; A welding plate, arranged outside the housing and connected to the patch pins, and welded to the circuit board on a side away from the housing; Wherein, a heat insulation layer is formed between the welding plate and the shell to prevent the heat of the circuit board from being transferred to the shell.

2. A high stability crystal oscillator according to claim 1, characterized in that: The electronic component comprises an electrode sheet, a baffle and an amplifier, wherein the electrode sheet and the amplifier are electrically connected to the power pin and the output pin respectively; The baffle is arranged between the electrode sheet and the amplifier, and two ends of the baffle abut against the inner wall of the electrical cavity to prevent heat interaction between the electrode sheet and the amplifier.

3. A high stability crystal oscillator according to claim 2, characterized in that: The electronic component also includes an oscillating crystal, which is arranged in the electrical cavity, located above the electrode sheet, the baffle and the amplifier, and is electrically connected to the electrode sheet and the amplifier through conductive glue.

4. A high stability crystal oscillator according to claim 3, characterized in that: The oscillator further comprises a heat insulating plate, the four sides of which are in contact with the inner circumference of the electrical cavity, and are used to separate the electrical cavity into a first cavity and a second cavity.

5. A high stability crystal oscillator according to claim 4, characterized in that: The oscillating crystal is arranged in the second cavity, and the electrode sheet, the baffle and the amplifier are arranged in the first cavity, so as to prevent heat from affecting the oscillating crystal.

6. A high stability crystal oscillator according to claim 4, characterized in that: The oscillator further comprises a heat absorbing block, which is arranged in the second cavity, with one side of the heat absorbing block arranged on the shell and the other side contacting the oscillating crystal for absorbing heat generated by the oscillating crystal.

7. A high stability crystal oscillator according to claim 6, characterized in that: The oscillator further comprises a heat sink, which is arranged on the housing and is used to absorb the heat on the housing and dissipate it.

8. A high stability crystal oscillator according to claim 7, characterized in that: The heat absorbing block extends out of the shell and fits with the heat dissipating element.

9. A high stability crystal oscillator according to claim 7, characterized in that: The heat sink is a metal sheet.

10. The high stability crystal oscillator according to claim 1, characterized in that: The oscillator further comprises a temperature sensor, which is arranged on the housing and extends into the electrical cavity, and is used for controlling the temperature in the electrical cavity.

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