Inverted miniaturized camera module structure

Abstract

The utility model provides an inverted miniaturized camera module structure. The inverted miniaturized camera module structure comprises a lens, a carrier, an optical filter, a chip and a circuit board, the carrier is provided with an inner hole penetrating through the upper and lower end faces along the center line. The lens is installed in the inner hole. The circuit board is arranged on the lower end face of the carrier, a through hole penetrating through the upper end face and the lower end face of the circuit board is formed in the circuit board, and a plurality of electronic components are arranged on the lower end face of the circuit board and distributed around the through hole. The lower end face of the circuit board is provided with a packaging layer, and the packaging layer is arranged around the through hole and accommodates the electronic component therein, so as to protect and dissipate heat of the electronic component. The optical filter is arranged above the through hole and is positioned below the lens; the chip is fixed in the packaging layer and located below the through hole; according to the camera module, the overall structure size of the camera module can be reduced, miniaturization design of the camera module is achieved, the heat dissipation performance of the camera module can be improved, and the service life of electronic components and internal elements is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to an inverted miniaturized camera module structure. Background Art

[0002] With the rapid development of the mobile Internet era, the structure of mobile phones is becoming thinner and lighter, and the functions of cameras are becoming more and more. With the increase in functions, more electronic components need to be set inside the camera module, specifically on the circuit board. Therefore, in order to adapt to the assembly of electronic components, the size of the circuit board also needs to be adjusted accordingly, becoming larger and larger. When assembled to the camera module, the overall structural size of the camera module will also become larger. However, this change does not conform to the current trend of thin and light mobile phones.

[0003] As the instruction manual Figure 1 In the present invention, the structure of the existing camera module includes: a lens 1, a carrier 2, a support frame 3, a filter 4, a chip 5, and a circuit board 6; wherein the lens 1 is installed in the inner hole 21 of the carrier 1, the support frame 3 is installed at the lower end surface of the carrier 2, the filter 4 is installed at the middle position of the support frame 3 and is located below the lens 1, the circuit board 6 is arranged below the support frame 3, the chip 5 is installed at the upper end surface of the circuit board 6 and is connected to the circuit board 6 through the gold wire 7, and the chip 5 is located below the filter 4; and each electronic component 8 is installed at the upper end surface of the circuit board 6 and is arranged around the chip 5. Therefore, in the above-mentioned camera module, the circuit board 6 needs to install the chip and the electronic component 8 at the upper end surface at the same time, so its structural size needs to meet certain requirements, so there will be a situation where the structural size is large, and at the same time, after the electronic component 8 is assembled, the overall height of the circuit board 6 will also increase accordingly, and when assembled into a camera module, it is necessary to adjust the structure of other components accordingly, so that the overall structure of the camera module will become larger, which does not conform to the current trend of thin and light mobile phones.

[0004] At the same time, as the number of electronic components 8 increases, the heat generated during operation will also increase accordingly. Therefore, the heat dissipation requirements for the camera module will also increase accordingly. If the internal heat dissipation performance is poor, it will affect the service life of the internal components of the camera module.

[0005] Therefore, it is necessary to provide a technical solution that can optimize the camera module structure to achieve miniaturization design and improve internal heat dissipation performance. Utility Model Content

[0006] The utility model provides a flip-down miniaturized camera module structure to solve the problems of the existing camera module having a large overall structure and poor internal heat dissipation performance.

[0007] The technical solution adopted by the utility model is as follows: a flip-chip miniaturized camera module structure, comprising: a lens, a carrier, a filter, a chip and a circuit board; the carrier is provided with an inner hole penetrating its upper and lower end surfaces along the center line, and the lens is installed in the inner hole; the circuit board is arranged at the lower end surface of the carrier, and the circuit board is provided with a through hole penetrating its upper and lower end surfaces, and a plurality of electronic components are provided at the lower end surface of the circuit board, and the electronic components are distributed around the through hole; a packaging layer is provided at the lower end surface of the circuit board, and the packaging layer is provided around the through hole and the electronic components are placed inside, so as to protect and dissipate heat for the electronic components; the filter is provided above the through hole and is located below the lens; the chip is fixed inside the packaging layer and is located below the through hole.

[0008] In one embodiment, the chip can be mounted in the packaging layer and located at any height of the center line of the through hole, and the relative position of the chip and the circuit board can be changed accordingly.

[0009] In one embodiment, the circuit board and the chip are electrically connected via a gold wire, one end of the gold wire is connected to the upper end surface of the circuit board, and the other end passes through the through hole and is connected to the upper end surface of the chip; the gold wire is placed inside the packaging layer.

[0010] In one embodiment, the chip is larger than the through hole, and a welding layer is provided between the side edge of the upper end surface of the chip and the lower end surface of the circuit board, and the welding layer is used to fix the chip and the circuit board.

[0011] In one embodiment, the welding layer is formed of a non-conductive isolation film.

[0012] In one embodiment, a conductive contact is provided between the upper end surface of the chip and the lower end surface of the circuit board; the conductive contact is used to electrically connect the chip and the circuit board.

[0013] In one embodiment, a support plate is disposed on the lower end surface of the packaging layer, and the support plate is used to hide the chip inside the camera module, thereby protecting the chip.

[0014] In one embodiment, the encapsulation layer is an epoxy molding compound layer.

[0015] In one embodiment, a heat dissipation silicone layer is coated on the lower end surface of the chip, and the heat dissipation performance of the chip is improved by the heat dissipation silicone layer.

[0016] In one embodiment, a glue layer is provided between the lower end surface of the carrier and the upper end surface of the circuit board, and the glue layer is used to fix the carrier and the circuit board.

[0017] The beneficial effects of the utility model are:

[0018] 1. In the present application, the camera module structure includes: a lens, a carrier, a filter, a chip and a circuit board; the carrier is provided with an inner hole penetrating its upper and lower end faces along the center line, and the lens is installed in the inner hole; the circuit board is arranged at the lower end face of the carrier, and the circuit board is provided with a through hole penetrating its upper and lower end faces, and the lower end face of the circuit board has a number of electronic components, and the electronic components are distributed around the through hole; a packaging layer is provided at the lower end face of the circuit board, and the packaging layer is provided around the through hole and the electronic components are placed inside, so as to protect and dissipate heat for the electronic components; the filter is provided above the through hole and below the lens; the chip is fixed inside the packaging layer and below the through hole; in the present application, the chip is arranged on the circuit board by using the chip flip-chip technology Below, the assembly method between the chip and the circuit board is adjusted, and the electronic components on the circuit board are designed to be as close to the middle as possible, so that the structural size of the circuit board can be adjusted, and its structural area can be reduced, so that the structures of other components can also be adjusted accordingly, and finally the structural dimensions of the camera module in the horizontal direction are reduced. At the same time, after changing the assembly method between the chip and the circuit board, some component settings can be reduced accordingly, such as reducing the support frame structure, so as to further reduce the height dimension of the camera module, and reduce the original connection structure between the circuit board and the support frame, and further reduce the structural dimensions of the camera module in the horizontal direction. Therefore, through the above settings, the overall structural dimensions of the camera module can be reduced, so that it can be miniaturized.

[0019] 2. In the present application, the packaging layer places the electronic components inside, thereby providing protection for the electronic components. At the same time, the packaging layer is an epoxy molding compound layer, which can dissipate the heat of the electronic components, thereby improving the heat dissipation performance of the camera module and ensuring the service life of the electronic components and internal components of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but should not constitute a limitation to the present invention. In the accompanying drawings:

[0021] Figure 1 It is a structural schematic diagram of a camera module in the prior art;

[0022] Figure 2 This is a schematic structural diagram of a camera module according to an embodiment of the present utility model;

[0023] Figure 3 This is a schematic diagram of a structure in which a chip is mounted at another height of a packaging layer according to an embodiment of the utility model;

[0024] Figure 4 This is a structural schematic diagram of a camera module according to an embodiment of the present utility model, in which a support plate is arranged at the bottom;

[0025] Figure 5 This is a structural schematic diagram of a camera module according to another embodiment of the present invention;

[0026] Figure 6 for Figure 5 A partial enlarged view of .

[0027] Explanation of the accompanying drawings: 1. Lens; 2. Carrier; 21. Inner hole; 3. Support frame; 4. Filter; 5. Chip; 6. Circuit board; 61. Through hole; 7. Gold wire; 8. Electronic components; 9. Glue layer; 10. Packaging layer; 11. Support plate; 12. Conductive contact; 13. Welding layer. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0029] See also Figure 2-Figure 4 The present embodiment provides a flip-chip miniaturized camera module structure, comprising: a lens 1, a carrier 2, a filter 4, a chip 5 and a circuit board 6; the carrier 2 is provided with an inner hole 21 penetrating the upper and lower end surfaces thereof along the center line, and the lens 1 is installed in the inner hole 21; the circuit board 6 is arranged at the lower end surface of the carrier 2, and the circuit board 6 is provided with a through hole 61 penetrating the upper and lower end surfaces thereof, and a plurality of electronic components 8 are arranged at the lower end surface of the circuit board 6, and the electronic components 8 are distributed around the through hole 61; a packaging layer 10 is arranged at the lower end surface of the circuit board 6, and the packaging layer 10 is arranged around the through hole 61 and houses the electronic components 8 It is placed inside to protect and dissipate heat for the electronic components 8; the filter 4 is arranged above the through hole 61 and below the lens 1; the chip 5 is fixed inside the packaging layer 10 and is located below the through hole 61 and correspondingly below the filter 4; wherein, when the camera module is working, the lens 1 converges the light of the observed target and transmits it to the filter 4, filters the light at the filter 4, and then the light passes through the through hole 61 of the circuit board 6 and is projected to the chip 5, and the light source is calculated and imaged at the chip 5, thereby completing the camera work, and the circuit board 6 provides power for each component.

[0030] In this embodiment, the chip 5 flip-chip technology is adopted to set the chip 5 below the circuit board 6, so as to adjust the assembly method between the chip 5 and the circuit board 6, and make the electronic components 8 on the circuit board 6 as close to the middle as possible, so that the structure size of the circuit board 6 can be adjusted to reduce its structural area, and the other component structures of the camera module can also be adjusted accordingly, and finally the structural size of the camera module in the horizontal direction (XY direction) can be reduced. At the same time, after changing the assembly method between the chip 5 and the circuit board 6, some component settings can be reduced accordingly, such as reducing the support frame 3 structure in the prior art (comparable Figure 1 , Figure 2 ), thereby further reducing the height (Z-axis direction) of the camera module, and reducing the connection structure that the circuit board 6 originally needs to have with the support frame 3, further reducing the structural dimensions of the camera module in the horizontal direction. Therefore, through the above-mentioned setting, the overall structural dimensions of the camera module are finally reduced, so that it can be miniaturized. In addition, by dissipating the heat of the electronic components 8 through the encapsulation layer 10, the internal heat dissipation performance of the camera module can be improved, ensuring the internal temperature of the camera module to be stable.

[0031] For further information, see Figure 2-Figure 3 In this embodiment, the upper end surface of the chip 5 is smaller than the cross-sectional size of the through hole 61, and the chip 5 can be installed in the packaging layer 10 and located at any height of the center line of the through hole, and the relative position of the chip 5 and the circuit board 6 can be changed accordingly (compare Figure 2 , Figure 3 ), therefore, in the specific installation process, the installation position of the chip 5, that is, the height of the chip 5 relative to the circuit board 6, can be adjusted according to the actual situation, so as to meet the height requirements of the chip 5 in different mobile phone camera modules, and the chip 5 can be placed inside the packaging layer 10, so as to further reduce the height of the camera module. Preferably, the packaging layer 10 is an epoxy molding material layer, which can dissipate the heat of the electronic components 8, thereby improving the heat dissipation performance of the camera module and ensuring the service life of the electronic components 8 and the internal components of the camera module.

[0032] For further information, see Figure 2-Figure 3 In this embodiment, a gold wire 7 is provided between the circuit board 6 and the chip 5. One end of the gold wire 7 is connected to the upper end surface of the circuit board 6, and the other end is connected to the upper end surface of the chip 5 after passing through the through hole 61. The circuit board 6 and the chip 5 are electrically connected through the gold wire 7 to perform signal transmission and power supply. At the same time, the gold wire 7 is placed inside the packaging layer 10, so that the gold wire 7 is cooled through the packaging layer 10, thereby further improving the heat dissipation performance of the camera module.

[0033] For further information, see Figure 4In this embodiment, a support plate 11 is provided on the lower end surface of the encapsulation layer 10. Preferably, the support plate 11 is set as a steel sheet. The support plate 11 is used to hide the chip 5 inside the camera module to prevent the chip 5 from being exposed, thereby protecting the chip 5.

[0034] Furthermore, in this embodiment, a heat dissipation silicone layer (not shown) is coated on the lower end surface of the chip 5 to improve the heat dissipation performance of the chip 5 and thereby further improve the heat dissipation performance of the camera module.

[0035] For further information, see Figure 2-Figure 6 In this embodiment, a glue layer 9 is provided between the lower end surface of the carrier 2 and the upper end surface of the circuit board 6 , and the glue layer 9 is used to fix the carrier 2 and the circuit board 6 .

[0036] Of course, in other embodiments, the connection between the carrier 2 and the circuit board 6 may also be achieved by other means, such as welding, as long as the carrier 2 and the circuit board 6 can be stably connected.

[0037] In another embodiment, see Figure 5-Figure 6 , the chip 5 is larger than the through hole 61, and the side edge of the upper end surface of the chip 5 is fixed to the lower end surface of the circuit board 6 by welding, and a welding layer 13 is formed between the two. At the same time, a conductive contact 12 is arranged between the upper end surface of the chip 5 and the lower end surface of the circuit board 6, and the conductive contact 12 passes through the welding layer 13. The conductive contact 12 is used to electrically connect the chip 5 and the circuit board 6, and the welding layer 13 is formed by a non-conductive isolation film through a welding process (NCF process), so the welding layer 13 does not affect the signal transmission and conductive performance of the conductive contact 12.

[0038] Of course, in other embodiments, the connection between the chip 5 and the circuit board 6 can be carried out by using conductive methods such as unidirectional conductive tape, unidirectional conductive glue, tin implantation, gold implantation, etc.

[0039] Compared with existing technologies:

[0040] 1. In the present application, the camera module structure includes: a lens 1, a carrier 2, a filter 4, a chip 5 and a circuit board 6; the carrier 2 is provided with an inner hole 21 penetrating the upper and lower end surfaces thereof along the center line, and the lens 1 is installed in the inner hole 21; the circuit board 6 is arranged at the lower end surface of the carrier 2, and the circuit board 6 is provided with a through hole 61 penetrating the upper and lower end surfaces thereof, and a plurality of electronic components 8 are provided at the lower end surface of the circuit board 6, and the electronic components 8 are distributed around the through hole 61; a packaging layer 10 is provided at the lower end surface of the circuit board 6, and the packaging layer 10 is provided around the through hole 61 and the electronic components 8 are placed inside, so as to protect and dissipate heat for the electronic components 8; the filter 4 is provided above the through hole 61 and is located below the lens 1; the chip 5 is fixed inside the packaging layer 10 and is located below the through hole 61; in the present application, the chip 5 is flip-chip mounted Technology, the chip 5 is set below the circuit board 6, thereby adjusting the assembly method between the chip 5 and the circuit board 6, and making the electronic components 8 on the circuit board 6 as close to the middle as possible, so that the structural size of the circuit board 6 can be adjusted, and its structural area can be reduced, so that the structures of other components can also be adjusted accordingly, and finally the structural dimensions of the camera module in the horizontal direction are reduced. At the same time, after changing the assembly method between the chip 5 and the circuit board 6, some component settings can be reduced accordingly, such as reducing the support frame 3 structure, so as to further reduce the height dimension of the camera module, and reduce the connection structure that the circuit board 6 originally needs to connect with the support frame 3, and further reduce the structural dimensions of the camera module in the horizontal direction. Therefore, through the above-mentioned settings, the overall structural dimensions of the camera module are finally reduced, so that it can be miniaturized.

[0041] 2. In the present application, the packaging layer 10 places the electronic components 8 inside, thereby providing protection for the electronic components 8. At the same time, the packaging layer 10 is an epoxy molding compound layer, which can dissipate the heat of the electronic components 8, thereby improving the heat dissipation performance of the camera module and ensuring the service life of the electronic components 8 and the internal components of the camera module.

[0042] 3. In the present application, the chip 5 is arranged under the circuit board 6 by using epoxy molding material through a full sink packaging process (FSP process), while in other embodiments, the chip 5 can also be packaged by a chip molding process (Molding on Chip), an injection molding process or other processes.

[0043] As long as it does not violate the creative idea of ​​the utility model, any combination of various different embodiments of the utility model should be regarded as the content disclosed by the utility model; within the technical concept of the utility model, any simple modification of the technical solution and any combination of different embodiments that do not violate the creative idea of ​​the utility model should be within the protection scope of the utility model.

Claims

1. A flip-chip miniaturized camera module structure, characterized in that: include: A lens, a carrier, a filter, a chip and a circuit board; the carrier is provided with an inner hole penetrating the upper and lower end surfaces thereof along the center line, and the lens is installed in the inner hole; the circuit board is arranged at the lower end surface of the carrier, and the circuit board is provided with a through hole penetrating the upper and lower end surfaces thereof, and a plurality of electronic components are arranged at the lower end surface of the circuit board, and the electronic components are distributed around the through hole; a packaging layer is arranged at the lower end surface of the circuit board, and the packaging layer is arranged around the through hole and the electronic components are placed inside, so as to protect and dissipate heat for the electronic components; the filter is arranged above the through hole and is located below the lens; the chip is fixed inside the packaging layer and is located below the through hole.

2. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: The chip can be installed in the packaging layer and located at any height of the center line of the through hole, and the relative position of the chip and the circuit board can be changed accordingly.

3. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: The circuit board and the chip are electrically connected via a gold wire, one end of the gold wire is connected to the upper end surface of the circuit board, and the other end passes through the through hole and is connected to the upper end surface of the chip; the gold wire is placed inside the packaging layer.

4. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: The chip is larger than the through hole, and a welding layer is arranged between the side edge of the upper end surface of the chip and the lower end surface of the circuit board, and the welding layer is used to fix the chip and the circuit board.

5. The flip-chip miniaturized camera module structure according to claim 4, characterized in that: The soldering layer is formed of a non-conductive isolation film.

6. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: A conductive contact is arranged between the upper end surface of the chip and the lower end surface of the circuit board; the conductive contact is used to electrically connect the chip and the circuit board.

7. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: A support plate is provided on the lower end surface of the packaging layer, and the support plate is used to hide the chip inside the camera module, thereby protecting the chip.

8. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: The packaging layer is an epoxy molding compound layer.

9. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: The lower end surface of the chip is coated with a heat dissipation silicone layer, and the heat dissipation performance of the chip is improved by the heat dissipation silicone layer.

10. The flip-chip miniaturized camera module structure according to claim 1, characterized in that: A glue layer is arranged between the lower end surface of the carrier and the upper end surface of the circuit board, and the glue layer is used to fix the carrier and the circuit board.

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