Camera heat dissipation structure and camera module
By adopting a heat-smoothing plate structure in the camera module, the circulation channels of condensate and capillary structures are used to accelerate heat dissipation, which solves the problem of low heat dissipation performance in the prior art, and achieves more efficient heat dissipation and structural strength improvement.
Patent Information
- Application Number
- CN202420997310.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-09
AI Technical Summary
The existing camera modules have low heat dissipation performance during operation, making it difficult to quickly and stably dissipate heat, and cannot meet the chip heat needs with high power consumption.
A camera heat dissipation structure including circuit board and heat-smoothing plate is adopted. The heat-smoothing plate is composed of a top cover, a top wick plate, a copper column, a bottom wick plate and a bottom cover. The inner cavity contains condensate and passes through the capillary on the copper column. The structure and circulation channels accelerate heat dissipation and support the circuit board instead of steel sheets.
It significantly improves the heat dissipation efficiency of the camera module, ensures normal internal temperature, adapts to the working needs of modules with high power consumption, and enhances the structural strength of the circuit board.
Smart Images
Figure CN222283372U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of camera modules, in particular to a camera heat dissipation structure and a camera module. Background Art
[0002] After the camera module is assembled, a steel sheet is generally set at the bottom to support the circuit board and improve the structural strength of the circuit board. At the same time, the steel sheet conducts heat when the camera module is working, thereby dissipating the heat of the camera module.
[0003] However, with the development of camera module technology, the imaging area of the chip is getting larger and larger, and its power consumption is also getting higher and higher. Therefore, the heat generated inside the camera module when it is working is also increasing. It is difficult to meet the heat dissipation needs of the camera module by simply dissipating heat through heat conduction of steel sheets.
[0004] Therefore, it is necessary to provide a technical solution that can optimize and improve the heat dissipation performance of the camera module. Utility Model Content
[0005] The utility model provides a camera heat dissipation structure and a camera module to solve the problem that the existing camera module has low heat dissipation performance and is difficult to dissipate heat quickly and stably during operation.
[0006] The technical solution adopted by the utility model is as follows: a camera heat dissipation structure, including a circuit board and a heat spreader arranged at the lower end surface of the circuit board; the heat spreader includes a top cover, a top wick board, a copper column, a bottom wick board and a bottom cover; the top cover and the bottom cover are fixedly connected and form a sealed inner cavity therebetween, and there is condensate in the inner cavity; the copper column is fixed on the bottom cover and located inside the inner cavity, the top wick board and the bottom wick board are fixed on the copper column at intervals, and the top wick board is located on one side of the copper column close to the top cover; the bottom cover is fitted on the lower end surface of the circuit board.
[0007] In one embodiment, the top wick board and the bottom wick board are both provided with holes penetrating the upper and lower end surfaces, and the copper column is inserted into the holes to connect and fix the top wick board and the bottom wick board.
[0008] In one embodiment, the top cover and the bottom cover are both provided with grooves, and the top cover and the bottom cover are correspondingly connected at the surfaces with the grooves, so that the grooves on the top cover and the bottom cover form the inner cavity.
[0009] In one embodiment, the top wick board is not in contact with the top cover, and the bottom wick board is not in contact with the bottom cover; a capillary structure is provided on the copper column, and the capillary structure can conduct the hot air of the bottom wick board to the top wick board.
[0010] In one embodiment, the height of the condensed liquid is within 1 / 5 of the total thickness of the vapor chamber.
[0011] In one embodiment, the thickness of the vapor chamber is 0.15 mm to 0.25 mm.
[0012] A camera module comprises the camera heat dissipation structure described above.
[0013] In one embodiment, it also includes a lens, a motor, a bracket and a chip; the lens is mounted on the motor, the lower end surface of the motor is connected and fixed to the upper end surface of the bracket, and the upper end surface of the circuit board is connected and fixed to the lower end surface of the bracket; the chip is mounted on the upper end surface of the circuit board and accommodated inside the bracket.
[0014] In one embodiment, the bracket has a through hole penetrating the upper and lower end surfaces thereof, a filter is disposed in the through hole, and the filter is located below the lens.
[0015] In one embodiment, a step portion is protrudingly provided in the through hole along the center line, and the filter is fixedly mounted on the step portion.
[0016] The beneficial effects of the utility model are:
[0017] The camera heat dissipation structure of the present application includes a circuit board and a heat spreader arranged at the lower end surface of the circuit board; the heat spreader includes a top cover, a top wick board, a copper column, a bottom wick board and a bottom cover; the top cover and the bottom cover are fixedly connected and form a sealed inner cavity therebetween, and there is condensate in the inner cavity; the copper column is fixed on the bottom cover and located inside the inner cavity, the top wick board and the bottom wick board are fixed on the copper column at intervals, and the top wick board is located on the side of the copper column close to the top cover; the bottom cover is fitted on the lower end surface of the circuit board; in the application, the circuit board is supported by a heat spreader instead of the steel sheet in the prior art, so as to improve the structural strength of the circuit board. At the same time, the heat dissipation performance of the heat spreader is extremely strong. By using the heat spreader to dissipate heat from the camera module, the heat dissipation efficiency can be improved, thereby ensuring that the internal temperature of the camera module is normal and can adapt to the operation of camera modules with higher power consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but should not constitute a limitation to the present invention. In the accompanying drawings:
[0019] Figure 1 This is a schematic structural diagram of a camera module according to an embodiment of the present utility model;
[0020] Figure 2 This is a schematic diagram of the structure of a heat sink according to an embodiment of the present invention;
[0021] Figure 3 The figure is a working schematic diagram of a vapor chamber according to an embodiment of the present invention.
[0022] Explanation of the accompanying drawings: 1. Lens; 2. Motor; 3. Bracket; 31. Through hole; 32. Step portion; 4. Filter; 5. Chip; 6. Circuit board; 7. Heat spreader; 71. Top cover; 72. Top wick board; 73. Copper column; 74. Bottom wick board; 75. Bottom cover; 76. Groove. DETAILED DESCRIPTION
[0023] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.
[0024] See also Figure 1 - Figure 2 , the present embodiment provides a camera heat dissipation structure, which is arranged in the camera module, the camera heat dissipation structure includes a circuit board 6 and a heat spreader 7, and the camera module includes the above-mentioned camera heat dissipation structure, and the camera module also includes: a lens 1, a motor 2, a bracket 3, and a chip 5, wherein the lens 1 is mounted on the motor 2, the lower end surface of the motor 2 is connected and fixed to the upper end surface of the bracket 3, and the upper end surface of the circuit board 6 is connected and fixed to the lower end surface of the bracket 3; the chip 5 is mounted on the upper end surface of the circuit board 6 and accommodated inside the bracket 3; the heat spreader 7 is arranged at the lower end surface of the circuit board 6; in the present application, the circuit board 6 is supported by the heat spreader 7 instead of the steel sheet in the prior art, so as to improve the structural strength of the circuit board 6. At the same time, the heat dissipation performance of the heat spreader 7 is extremely strong. The heat dissipation efficiency can be improved by dissipating the heat of the camera module through the heat spreader 7, thereby ensuring that the internal temperature of the camera module is normal and can adapt to the operation of the camera module with large power consumption.
[0025] For details, please refer to Figure 2 The heat spreader 7 includes a top cover 71, a top wick plate 72, a copper column 73, a bottom wick plate 74 and a bottom cover 75; the top cover 71 and the bottom cover 75 are fixedly connected and form a sealed inner cavity between the two, and the inner cavity contains condensate; there are multiple copper columns 73, which are fixed on the bottom cover 75 by welding and located inside the inner cavity, the top wick plate 72 and the bottom wick plate 74 are fixed on the copper columns 73 at intervals, and the top wick plate 72 is located on one side of the copper column 73 close to the top cover 71; the bottom cover 75 is fitted and arranged on the lower end surface of the circuit board 6; wherein, please refer to Figure 3 The top wick plate 72 and the bottom wick plate 74 separate a circulation channel in the inner cavity. When the heat spreader 7 is working, the heat of the camera module will enter the circulation channel of the inner cavity along the bottom cover 75. At this time, the condensate on one side of the bottom wick plate 74 will absorb heat and quickly vaporize into steam, and then the steam will flow to the top wick plate 72. Since the temperature of the top wick plate 72 is relatively low, the steam will condense into water droplets here to release heat, and then the heat will be dissipated to the outside through the top cover 71, thereby completing the heat dissipation work of the camera module by the heat spreader 7, and the water droplets condensed on the top wick plate 72 will flow back to the bottom cover 75 to wait for the next heat dissipation work, and the heat dissipation can be repeated in this cycle. Moreover, compared with the heat conduction of steel sheets in the prior art, this heat dissipation mode can greatly improve the heat dissipation efficiency and can adapt to the work of camera modules with higher power consumption.
[0026] Among them, the top wick plate 72 does not contact the top cover 71, and the bottom wick plate 74 does not contact the bottom cover 75. Therefore, a channel is formed between the top wick plate 72 and the top cover 71, and a channel is formed between the bottom wick plate 74 and the bottom cover 75, and the upper and lower channels are connected at both sides to form a circulation channel. In this circulation channel, the condensate absorbs heat at the bottom and vaporizes into steam, and then moves along the copper column 73 to the upper channel, and then contacts the top wick plate 72 and the top cover 71 to condense into water droplets and flow back to the bottom cover 75 along the side channel. Further, the copper column 73 has a capillary structure inside or outside. During the working process, because the condensate is heated in the vacuum ultra-low pressure environment in the heat spreader 7, it will quickly evaporate into hot air. The hot air will rise along the capillary structure in the copper column 73 when heated, and dissipate heat after encountering the top wick plate 72 above, which is a cold source, and condense into liquid again, and return to the bottom wick plate 74 below, which is a heat source area, and then perform heat dissipation again.
[0027] Therefore, in this embodiment, the circulation channel structure and the capillary structure on the copper column 73 can provide a channel for the liquid to vaporize and rise, thereby accelerating the conversion efficiency of vaporization and liquefaction, thereby correspondingly improving the heat dissipation efficiency.
[0028] The thickness of the heat spreader is 0.15mm to 0.25mm, ensuring that the camera module structure can be miniaturized, and the height of the condensate is within 1 / 5 of the total thickness of the heat spreader 7. At the same time, the top cover 71 and the bottom cover 75 are both stainless steel components, and the camera module can be further cooled by the stainless steel material. That is, after the top cover 71 and the bottom cover 75 are set as stainless steel plates, the heat dissipation capacity of the heat spreader 7 is enhanced, and the support function of the camera module can be ensured.
[0029] It is worth mentioning that in this application, after testing, the thermal conductivity of the heat spreader 7 is 12 times that of conventional graphene. At the same time, after setting the heat spreader 7, the conductive materials such as copper film that originally need to conduct heat in the camera module structure can be removed, so the camera module structure can be further optimized.
[0030] For further information, see Figure 2 The top wick board 72 and the bottom wick board 74 are both provided with holes penetrating the upper and lower end surfaces, and there are multiple holes, and the copper pillars 73 are inserted into the holes one by one, so that the top wick board 72 and the bottom wick board 74 are installed on the copper pillars 73, and the top wick board 72 and the bottom wick board 74 are spaced and stably placed in the inner cavity.
[0031] For further information, see Figure 2 The top cover 71 and the bottom cover 75 are both provided with grooves 76 , and the top cover 71 and the bottom cover 75 are correspondingly connected at the surfaces having the grooves 76 , so that the grooves 76 on the top cover 71 and the bottom cover 75 form an inner cavity.
[0032] For further information, see Figure 1 The bracket 3 has a through hole 31 penetrating the upper and lower end surfaces thereof, and a filter 4 is disposed in the through hole 31, and the filter 4 is located below the lens 1, and the filter 4 is used to filter stray light. Specifically, a step portion 32 is protruding along the center line in the through hole 31, and the step portion 32 is used to support the filter 4, so that the filter 4 can be fixedly mounted on the step portion 32 by glue.
[0033] It is worth noting that in this application, when the camera module is performing a video recording operation, the lens 1 converges the light of the observed target and transmits it to the filter 4, where the light is filtered, and then the light is projected to the chip 5 after passing through the filter 4, where the light source is calculated and imaged, thereby completing the video recording operation. The motor 2 is used to drive the lens 1 to move for focusing.
[0034] Furthermore, glue layers are provided between the lower end surface of the motor 2 and the upper end surface of the bracket 3, and between the lower end surface of the bracket 3 and the upper end surface of the circuit board 6, and the motor 2, the bracket 3 and the circuit board 6 are connected and fixed in sequence through the glue layer.
[0035] Furthermore, the circuit board 6 includes a connector (not shown in the figure), which is used to connect to external components, such as an external power supply or electronic device, so as to provide power or transmit signals to various electronic components in the camera module.
[0036] Compared with the prior art: In the present application, the circuit board 6 is supported by a heat spreader 7 instead of the steel sheet in the prior art, which can improve the structural strength of the circuit board 6. At the same time, the heat dissipation performance of the heat spreader 7 is extremely strong. The heat dissipation efficiency can be improved by dissipating the heat of the camera module through the heat spreader 7, thereby ensuring that the internal temperature of the camera module is normal and can adapt to the operation of camera modules with higher power consumption.
[0037] As long as it does not violate the creative idea of the utility model, any combination of various different embodiments of the utility model should be regarded as the content disclosed by the utility model; within the technical concept of the utility model, any simple modification of the technical solution and any combination of different embodiments that do not violate the creative idea of the utility model should be within the protection scope of the utility model.
Claims
1. A camera heat dissipation structure, characterized in that: It comprises a circuit board and a heat spreader arranged at the lower end surface of the circuit board; the heat spreader comprises a top cover, a top wick board, a copper column, a bottom wick board and a bottom cover; the top cover and the bottom cover are fixedly connected and form a sealed inner cavity therebetween, and the inner cavity contains condensate; the copper column is fixed on the bottom cover and located inside the inner cavity, the top wick board and the bottom wick board are fixed on the copper column at intervals, and the top wick board is located on one side of the copper column close to the top cover; the bottom cover is arranged at the lower end surface of the circuit board in a fit.
2. The camera heat dissipation structure according to claim 1, characterized in that: The top wick board and the bottom wick board are both provided with holes penetrating the upper and lower end surfaces, and the copper columns are inserted into the holes to connect and fix the top wick board and the bottom wick board.
3. The camera heat dissipation structure according to claim 1, characterized in that: The top cover and the bottom cover are both provided with grooves, and the top cover and the bottom cover are correspondingly connected at the surfaces with the grooves, so that the grooves on the top cover and the bottom cover form the inner cavity.
4. The camera heat dissipation structure according to claim 1, characterized in that: The top wick board is not in contact with the top cover, and the bottom wick board is not in contact with the bottom cover; a capillary structure is arranged on the copper column, and the capillary structure can guide the hot air of the bottom wick board to the top wick board.
5. The camera heat dissipation structure according to claim 1, characterized in that: The height of the condensate is within 1 / 5 of the total thickness of the vapor chamber.
6. The camera heat dissipation structure according to claim 1, characterized in that: The thickness of the heat spreader is 0.15 mm to 0.25 mm.
7. A camera module, characterized in that: The camera heat dissipation structure comprises the one described in any one of claims 1 to 6.
8. The camera module according to claim 7, characterized in that: It also includes a lens, a motor, a bracket and a chip; the lens is mounted on the motor, the lower end surface of the motor is connected and fixed to the upper end surface of the bracket, and the upper end surface of the circuit board is connected and fixed to the lower end surface of the bracket; the chip is mounted on the upper end surface of the circuit board and accommodated inside the bracket.
9. The camera module according to claim 8, characterized in that: The bracket has a through hole penetrating the upper and lower end surfaces thereof, a filter is arranged in the through hole, and the filter is located below the lens.
10. The camera module according to claim 9, characterized in that: A step portion is protrudingly provided in the through hole along the center line, and the filter is fixedly mounted on the step portion.