Backboard assembly, backlight module and display device

Abstract

The utility model provides a back plate assembly, a backlight module and a display device. The back plate assembly comprises a metal back plate; the conducting strip is electrically connected with the metal back plate; the circuit board comprises an aluminum substrate, an insulating layer arranged on the aluminum substrate and a metal layer arranged on the side, away from the aluminum substrate, of the insulating layer. The conducting strip is arranged on the side, away from the insulating layer, of the aluminum substrate and pierces a surface oxide layer of the aluminum substrate to penetrate into the aluminum substrate so as to make contact with the interior of the aluminum substrate. The circuit board aims to solve the technical problem that charge aggregation of a circuit board in the prior art is difficult to release.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a back panel assembly, a backlight module and a display device. Background Art

[0002] In large-size display products, many high-current LED light beads are concentrated on the circuit board. In order to effectively dissipate heat, the circuit board is composed of an aluminum substrate, an insulating layer, and a metal layer in the thickness direction. The LED light beads are arranged on the metal layer. The LED light beads on the metal layer have a large working voltage. Because a capacitor structure is formed between the aluminum substrate and the metal layer, the aluminum substrate accumulates charges. In addition, the surface layer of the aluminum substrate is a dense oxide layer, which makes it difficult to release the charge. When the accumulated charge is suddenly released by contacting a nearby conductor, it will cause abnormal function of electronic components, affecting product reliability and user experience. Utility Model Content

[0003] The main purpose of the present application is to provide a backplane assembly, a backlight module and a display device, aiming to solve the technical problem in the prior art that charge accumulation on the circuit board is difficult to release.

[0004] The present application proposes a backplane assembly, comprising:

[0005] Metal back panel;

[0006] A conductive sheet, the conductive sheet being electrically connected to the metal back plate;

[0007] A circuit board, comprising an aluminum substrate, an insulating layer arranged on the aluminum substrate, and a metal layer arranged on a side of the insulating layer away from the aluminum substrate; the conductive sheet is arranged on a side of the aluminum substrate away from the insulating layer, and a spike portion is provided at the end of the conductive sheet, the spike portion is used to pierce the surface oxide layer of the aluminum substrate to penetrate into the aluminum substrate so as to contact the inside of the aluminum substrate.

[0008] Optionally, the conductive sheet and the metal back plate are integrally formed.

[0009] Optionally, the conductive sheet is disposed in a gap between the circuit board and the metal back plate.

[0010] Optionally, the spike portion is a sawtooth having a sharp corner, and the sharp corner pierces the surface oxide layer of the aluminum substrate to penetrate into the aluminum substrate.

[0011] Optionally, there are multiple saw teeth, and the multiple saw teeth are arranged in sequence and spaced apart along the circumference of the conductive sheet.

[0012] Optionally, the sawtooth has an extension direction, the extension direction is toward the aluminum substrate, and the cross section of the sawtooth gradually decreases along the extension direction and converges at one end of the sawtooth close to the aluminum substrate to form the sharp corner.

[0013] Optionally, the circuit board has a through hole, and the through hole passes through the aluminum substrate, the insulating layer and the metal layer;

[0014] A conductive member is arranged in the through hole, the conductive member contacts the aluminum substrate and the metal layer, and extends out of the through hole to contact the metal back plate.

[0015] Optionally, the conductive member is connected to the conductive sheet.

[0016] In a second aspect, the present application also proposes a backlight module, comprising the back panel assembly as described above.

[0017] In a third aspect, the present application further proposes a display device, comprising the backlight module as described above.

[0018] In the technical solution of the embodiment of the present application, the surface oxide layer of the aluminum substrate on the circuit board is pierced by a conductive sheet electrically connected to the metal backplane, so that the charge on the aluminum substrate can be guided to the metal backplane through the conductive sheet, thereby avoiding the charge accumulation of the capacitor formed by the metal layer, insulating layer and aluminum substrate on the circuit board, so that the charge can be effectively released, thereby improving the functional reliability of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the structure of a backplane assembly provided in an embodiment of the present application;

[0021] Figure 2 for Figure 1 A partial enlarged view of the middle part;

[0022] Figure 3 is a partial enlarged view of another cross section of the back panel assembly;

[0023] Figure 4 A partial enlarged view of a cross section of another backplane assembly provided in an embodiment of the present application;

[0024] Figure 5A schematic diagram of the structure of a conductive sheet provided in an embodiment of the present application.

[0025] Reference numerals list

[0026]

[0027] DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] At present, for large-size display products, direct-down type has cost advantages and is the mainstream design; high-current LEDLB based on MCPCB substrate is the mainstream product. Since the aluminum substrate in the MCPCB substrate mainly plays the role of heat dissipation, there is an insulating layer and a crystalline oxide layer between the aluminum substrate and the copper foil layer with conductive function as isolation. Although the aluminum substrate and the copper foil are not electrically connected to each other, the copper foil layer and the aluminum substrate actually form a capacitor; because there are a large number of LED lamp beads working on the copper foil layer, there is a large voltage. Due to the existence of this voltage, charges will be accumulated at the corresponding positions of the corresponding aluminum substrate to form a corresponding negative pressure and accumulate energy; at the same time, since the aluminum base contacts oxygen, a dense oxide layer will be formed, producing an insulating layer, even if it contacts the metal backplane, it cannot be conductively connected, resulting in the inability to release the accumulated charges. When the accumulated energy is released when it suddenly contacts the nearby conductor, it will cause abnormal functions of electronic components, affecting product reliability and user experience.

[0033] For this purpose, refer to Figure 1 and Figure 2 As shown, the embodiment of the present application provides a backplane assembly, including:

[0034] Metal back plate 100;

[0035] A conductive sheet 300 , wherein the conductive sheet 300 is electrically connected to the metal back plate 100 ;

[0036] The circuit board 200 comprises an aluminum substrate 210, an insulating layer 220 disposed on the aluminum substrate 210, and a metal layer 230 disposed on the insulating layer 220 away from the aluminum substrate 210; the conductive sheet 300 is disposed on the side of the aluminum substrate 210 away from the insulating layer, and the end of the conductive sheet has a spike portion, the spike portion is used to pierce the surface oxide layer of the aluminum substrate 210 to penetrate into the aluminum substrate 210, so as to contact the inside of the aluminum substrate 210.

[0037] In the technical solution of the embodiment of the present application, the surface oxide layer of the aluminum substrate 210 on the circuit board 200 is pierced by the spike portion at the end of the conductive sheet 300 electrically connected to the metal back plate 100, so that the charge on the aluminum substrate 210 can be guided to the metal back plate 100 through the conductive sheet 300, thereby avoiding the charge accumulation of the capacitor formed by the metal layer 230, the insulating layer 220 and the aluminum substrate 210 on the circuit board 200, so that the charge can be effectively released, thereby improving the functional reliability of the electronic components. To this end, the technical solution of the embodiment of the present application can effectively release the charge in the circuit board while achieving heat dissipation of the circuit board, and it is difficult for the charge to accumulate inside the circuit board.

[0038] As an optional implementation of the embodiment of the present application, the conductive sheet 300 is integrally formed with the metal back plate 100. In this embodiment, the spike portion of the conductive sheet 300 is a protruding structure with a blade on the metal back plate 100. When the circuit board 200 is arranged on the metal back plate 100, under the action of the assembly force, the protruding structure with a blade cuts through the surface oxide layer of the aluminum substrate 210 to penetrate into the aluminum substrate 210.

[0039] In a specific embodiment, refer to Figure 3 As shown, there may be multiple protruding structures with blades, and the multiple protruding structures with blades may be arranged according to a certain pattern, such as a circular arrangement, a square arrangement, etc.

[0040] In an embodiment, Figure 2 As shown, the metal back plate 100 has a side facing the circuit board 200, the protruding structure with the blade extends from the side toward the circuit board 200, and the end far away from the side is the tip of the conductive sheet 300, so as to penetrate into the aluminum substrate 210. In the embodiment, the distance between the tip and the side is determined according to the gap between the metal back plate 100 and the circuit board 200 and the thickness of the aluminum substrate 210. Generally speaking, it is suitable for the tip to penetrate the middle position of the aluminum substrate 210.

[0041] As an optional implementation of the embodiment of the present application, refer to Figure 4 As shown, the conductive sheet 300 is disposed in the gap between the circuit board 200 and the metal back plate 100. In this embodiment, the conductive sheet 300 and the metal back plate 100 are separate structures. The conductive sheet 300 and the metal back plate 100 can be fixed by screws, welded, riveted, etc. The height of the conductive sheet 300 is slightly larger than the thickness of the gap between the circuit board 200 and the metal back plate 100, so that the conductive sheet 300 pierces the oxide layer of the aluminum substrate 210. In an embodiment, the conductive sheet 300 can be multiple, and the multiple conductive sheets 300 can be arranged according to a certain rule, such as a ring arrangement, a square arrangement, etc.

[0042] As an optional implementation of the embodiment of the present application, refer to Figure 5As shown, the spike portion is a sawtooth 310. The conductive sheet 300 includes a main body and a sawtooth 310 disposed on the main body, the sawtooth 310 having a sharp corner, and the sharp corner pierces the surface oxide layer of the aluminum substrate 210 to penetrate into the aluminum substrate 210. In this embodiment, the main body is fixed on the metal back plate 100 to achieve electrical connection with the metal back plate 100. The main body can be plugged, welded or riveted on the metal back plate 100. The sawtooth 310 is disposed on the main body, usually integrally disposed on the main body, or welded on the main body. The sharp corner of the sawtooth 310 pierces the surface oxide layer of the aluminum substrate 210 to penetrate into the aluminum substrate 210, thereby introducing the charge in the aluminum substrate 210 into the metal back plate 100 through the conductive sheet 300, and then exporting the circuit board 200.

[0043] As an optional implementation of the embodiment of the present application, the number of the saw teeth 310 is multiple, and the multiple saw teeth 310 are sequentially spaced along the circumference of the conductive sheet 300. In the embodiment, the body can be annular, square or other shapes. The saw teeth 310 are sequentially spaced along the circumference of the conductive sheet 300 so that as many saw teeth 310 as possible penetrate into the aluminum substrate 210.

[0044] As an optional implementation of the embodiment of the present application, the sawtooth 310 has an extension direction, the extension direction is toward the aluminum substrate 210, and the cross section of the sawtooth 310 gradually decreases along the extension direction and converges at the end of the sawtooth 310 away from the body to form the sharp corner. In this way, during the assembly process, the sharp corner can generate a sufficient stress level at the contact position with the aluminum substrate 210, so that it can pierce the surface oxide layer of the aluminum substrate 210 and penetrate into the interior of the aluminum substrate 210.

[0045] As an optional implementation of the embodiment of the present application, Figure 2 and Figure 4 As shown, the circuit board 200 has a through hole, which passes through the aluminum substrate 210, the insulating layer 220 and the metal layer 230; a conductive member 400 is provided in the through hole, and the conductive member 400 contacts the aluminum substrate 210 and the metal layer 230, and extends out of the through hole to contact the metal back plate 100. In this embodiment, the metal layer 230 and the aluminum substrate 210 are connected by the conductive member 400, which can also guide the charge into the metal back plate 100 to avoid the accumulation of charge.

[0046] In an embodiment, the metal layer 230 is generally a copper foil layer. In some embodiments, the copper foil layer is used for grounding the lamp beads 500 on the circuit board 200, thereby guiding the charge release when the lamp beads 500 are grounded.

[0047] As an optional implementation of the embodiment of the present application, the conductive member 400 is connected to the conductive sheet 300. In some embodiments, the conductive sheet 300 has a through hole, and the conductive member 400 is connected to the metal back plate 100 through the through hole, thereby realizing the release of charge.

[0048] In some embodiments, the conductive member 400 is a metal threaded member structure such as a metal screw or a metal stud.

[0049] The embodiment of the present application also provides a backlight module, including a backplane assembly. The specific structure of the backplane assembly refers to the above embodiment. Since the backplane assembly adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0050] The embodiment of the present application also proposes a display device, including a backlight module. The specific structure of the backlight module refers to the above embodiment. Since the backlight module adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. The embodiment of the present application does not specifically limit the applicability of the display device, which can be a handheld device (smartphone, tablet computer, etc.), wearable device (smart bracelet, wireless headset, smart watch, smart glasses, etc.), vehicle-mounted equipment (navigator, auxiliary reversing system, driving recorder, car refrigerator, etc.), virtual reality equipment, augmented reality equipment, terminal equipment (Terminal Device), etc., without limitation here.

[0051] The above description is only an optional embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the application concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A backplane assembly, characterized in that: include: Metal back panel; A conductive sheet, the conductive sheet being electrically connected to the metal back plate; A circuit board, the circuit board comprising an aluminum substrate, an insulating layer arranged on the aluminum substrate, and a metal layer arranged on a side of the insulating layer away from the aluminum substrate; the conductive sheet is arranged on a side of the aluminum substrate away from the insulating layer, a spike portion is provided at the end of the conductive sheet, the spike portion is used to pierce the surface oxide layer of the aluminum substrate to penetrate into the aluminum substrate so as to contact the inside of the aluminum substrate.

2. The back plate assembly according to claim 1, characterized in that: The conductive sheet and the metal back plate are integrally formed.

3. The back plate assembly according to claim 1, characterized in that: The conductive sheet is arranged in the gap between the circuit board and the metal back plate.

4. The back plate assembly according to claim 1, characterized in that: The spike portion is a sawtooth having a sharp corner, and the sharp corner pierces the surface oxide layer of the aluminum substrate to penetrate into the aluminum substrate.

5. The back plate assembly according to claim 4, characterized in that: The number of the saw teeth is multiple, and the multiple saw teeth are sequentially spaced along the circumferential direction of the conductive sheet.

6. The back plate assembly according to claim 4, characterized in that: The sawtooth has an extension direction, which is toward the aluminum substrate. The cross section of the sawtooth gradually decreases along the extension direction and converges at one end of the sawtooth close to the aluminum substrate to form the sharp corner.

7. The back plate assembly according to claim 1, characterized in that: The circuit board has a through hole, and the through hole passes through the aluminum substrate, the insulating layer and the metal layer; A conductive member is arranged in the through hole, the conductive member contacts the aluminum substrate and the metal layer, and extends out of the through hole to contact the metal back plate.

8. The back plate assembly according to claim 7, characterized in that: The conductive member is connected to the conductive sheet.

9. A backlight module, characterized in that: A back plate assembly comprising any one of claims 1 to 8.

10. A display device, characterized in that: Including the backlight module described in claim 9.

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