OLED screen structure and electronic product

Abstract

The utility model discloses an OLED screen structure and an electronic product. The OLED screen structure comprises an upper cover; the screen module is arranged on one surface of the upper cover and comprises a flexible circuit board assembly and a plurality of display chips, the flexible circuit board assembly is bent, and the display chips are arranged on the inner side face of the flexible circuit board assembly at intervals; the heat dissipation piece is bent and forms a first bent part and a second bent part, the first bent part is arranged on the other opposite surface of the upper cover, and the second bent part is suitable for being attached to the outer side face, opposite to the display chip, in the flexible circuit board; the flexible part is arranged on the inner side face of the flexible circuit board assembly and located on the periphery of the display chip. The lower cover and the upper cover are assembled. Heat dissipation processing is conducted on the display chip through the heat dissipation part, heat is prevented from being transmitted to the surface of the screen module, the heat dissipation part is bent to be matched with the flexible circuit board assembly, the flexible part is matched to press the flexible circuit board assembly to prevent the display chip from moving, the display chip can be prevented from being collided as much as possible, and hardware performance and user experience are improved through combination of the heat dissipation part and the flexible part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an OLED screen structure and an electronic product. Background Art

[0002] The display chip of the large-screen OLED screen generates high heat (usually up to 80 degrees Celsius), so it is usually placed on the FPC (also known as flexible circuit board) connected to the screen by the T-CON board (also known as the timing control board). Therefore, there are the following problems:

[0003] 1. The display chip is fragile and the FPC is very soft. The product may collide with the structure due to vibration and cause damage;

[0004] 2. If the heat from the display chip is transferred to the glass cover, it will affect the user experience. Summary of the invention

[0005] The purpose of this application is to at least solve the technical problems of the display chip being damaged and the heat dissipation of the display chip in the prior art. To this end, this application proposes an OLED screen structure that can prevent the display chip from being hit as much as possible, and dissipate heat for the display chip, thereby improving hardware performance and user experience.

[0006] The present application also proposes an electronic product including the above-mentioned OLED screen structure.

[0007] The OLED screen structure according to the first aspect of the present application includes:

[0008] Upper cover;

[0009] A screen module is arranged on a surface of the upper cover, the screen module comprises a flexible circuit board assembly and a plurality of display chips, the flexible circuit board assembly is bent, and the display chips are arranged on the inner side of the flexible circuit board assembly at intervals from each other;

[0010] A heat sink, bent to form a first bent portion and a second bent portion, wherein the first bent portion is disposed on another surface opposite to the upper cover, and the second bent portion is adapted to be attached to an outer surface of the flexible circuit board opposite to the display chip;

[0011] A flexible member, arranged on the inner side of the flexible circuit board assembly and located at the periphery of the display chip;

[0012] A lower cover is assembled with the upper cover.

[0013] The OLED screen structure according to the first aspect embodiment of the present application has at least the following beneficial effects: the display chip is cooled by the heat sink to prevent heat from being transferred to the surface of the screen module, wherein the heat sink is bent to adapt to the structure of the flexible circuit board assembly, and the flexible circuit board assembly is pressed tightly with the flexible component to prevent the display chip from moving, thereby preventing the display chip from being hit as much as possible, and the combination of the two improves hardware performance and user experience.

[0014] According to the OLED screen structure described in the embodiment of the first aspect of the present application, a first chamfer structure is provided between the first bending portion and the second bending portion.

[0015] According to the OLED screen structure described in the embodiment of the first aspect of the present application, the first bending portion includes an extension end and a mounting end, one end of the extension end is connected to the second bending portion through the first chamfer structure, and the mounting end is arranged at the other end of the extension end so that the mounting end can be installed on the upper cover.

[0016] According to the OLED screen structure described in the first aspect embodiment of the present application, a first positioning hole and a first mounting hole are provided on the mounting end, and a positioning rib, a first positioning column and a first mounting column are provided on the upper cover, the positioning rib is used to limit the heat sink, the first positioning column is passed through the first positioning hole, and the mounting end is installed on the upper cover by a first connecting member passing through the first mounting hole and being installed on the first mounting column.

[0017] According to the OLED screen structure described in the embodiment of the first aspect of the present application, heat dissipation holes are respectively provided at positions in the lower cover corresponding to each of the heat dissipation elements.

[0018] According to the OLED screen structure described in the embodiment of the first aspect of the present application, the flexible member includes a first side edge, the first side edge is provided with a clearance position for avoiding the display chip, and the first side edge is provided with a second chamfer structure.

[0019] According to the OLED screen structure described in the first aspect of the embodiment of the present application, second positioning holes are respectively provided on both ends of the first side in the flexible member, and a second positioning column is provided on the upper cover, and the second positioning column is passed through the second positioning hole.

[0020] According to the OLED screen structure described in the embodiment of the first aspect of the present application, the screen module also includes a cover plate and a display screen, the display screen is arranged on a surface of the cover plate, and the flexible circuit board assembly is connected to the display screen.

[0021] According to the OLED screen structure described in the first aspect embodiment of the present application, the OLED screen structure also includes a screen adhesive backing, a handwriting antenna, a silicon steel sheet and a back plate, the other relative surface of the cover plate is connected to the upper cover through the screen adhesive backing, the display screen is arranged on the other relative surface of the cover plate, the upper cover, the handwriting antenna, the silicon steel sheet, the back plate and the lower cover are arranged in sequence, one end of the flexible circuit board assembly is connected to the display screen, the other end of the flexible circuit board assembly is bent and extended and installed on the other surface of the back plate relatively away from the display screen, and the other end of the flexible circuit board assembly is provided with a timing control board assembly.

[0022] The electronic product according to the embodiment of the second aspect of the present application includes: the OLED screen structure as described in the embodiment of the first aspect of the present application.

[0023] It is not difficult to understand that the electronic product in the second aspect embodiment of the present application has the technical effect of the OLED screen structure in the first aspect embodiment described above, and therefore will not be elaborated on.

[0024] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present application is further described below with reference to the accompanying drawings and embodiments;

[0026] Figure 1 An exploded diagram of an embodiment of the present application;

[0027] Figure 2 This is a schematic diagram of a screen module in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of an upper cover in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a heat sink in an embodiment of the present application;

[0030] Figure 5 is a schematic diagram of a flexible member in an embodiment of the present application;

[0031] Figure 6 This is a schematic diagram of the lower cover in the embodiment of the present application;

[0032] Figure 7 This is a schematic diagram of the heat sink, the flexible member and the flexible circuit board assembly in the embodiment of the present application after being assembled from the first viewing angle;

[0033] Figure 8 This is a schematic diagram of the heat sink, flexible component and flexible circuit board assembly in the embodiment of the present application at a second viewing angle after assembly.

[0034] Reference numerals:

[0035] 100, upper cover; 110, first positioning column; 120, first mounting column; 130, second positioning column; 140, positioning rib;

[0036] 200, screen module; 210, flexible circuit board assembly; 220, display chip; 230, cover plate; 240, display screen; 250, timing control board assembly;

[0037] 300, heat sink; 310, first bending portion; 311, extension end; 312, mounting end; 313, first positioning hole; 314, first mounting hole; 320, second bending portion; 330, first chamfer structure;

[0038] 400, flexible member; 410, first side edge; 420, avoidance position; 430, second chamfer structure; 440, second positioning hole;

[0039] 500, lower cover; 510, heat dissipation hole;

[0040] 610, screen backing glue; 620, handwritten antenna; 630, silicon steel sheet; 640, back panel. DETAILED DESCRIPTION

[0041] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0042] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In the description of this application, "several" means one or more, "more" means at least two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0044] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application after combining the specific content of the technical solution.

[0045] Reference Figures 1 to 8 The OLED screen structure of the first embodiment of the present application includes an upper cover 100, a screen module 200, a heat sink 300, a flexible component 400 and a lower cover 500.

[0046] The screen module 200 is arranged on a surface of the upper cover 100, and the screen module 200 includes a flexible circuit board assembly 210 and a plurality of display chips 220. The flexible circuit board assembly 210 is bent, and each display chip 220 is arranged on the inner side of the flexible circuit board assembly 210 at intervals from each other; the heat sink 300 is bent to form a first bending portion 310 and a second bending portion 320, the first bending portion 310 is arranged on the other opposite surface of the upper cover 100, and the second bending portion 320 is suitable for fitting on the outer side of the flexible circuit board opposite to the display chip 220; the flexible member 400 is arranged on the inner side of the flexible circuit board assembly 210 and is located at the periphery of the display chip 220; the lower cover 500 is assembled with the upper cover 100.

[0047] It is understandable that the flexible circuit board assembly 210 includes a bent flexible circuit board, and the display chip 220, the display screen 240 and the timing control board assembly 250 are located on the front and back surfaces based on the bending, thereby making full use of the installation space enclosed by the upper cover 100 and the lower cover 500. Among them, the heat sink 300 is also set as a bent piece. On the one hand, it can cooperate with the structure of the flexible circuit board assembly 210 to fully dissipate heat, and on the other hand, it is also convenient for the installation of the heat sink 300. The heat is transferred from the flexible circuit board assembly 210 to the first bent portion 310 through the second bent portion 320, and then the upper cover 100 dissipates the heat, thereby solving the problem of heat dissipation of the display chip 220 as much as possible.

[0048] In some embodiments, after all structures in the OLED screen structure are reliably installed, the flexible member 400 can be provided to achieve a shock-absorbing and buffering effect, so as to solve the problem that the display chip 220 may be damaged as much as possible. In some embodiments, the heat sink 300 can be an aluminum plate, or a structural member made of other metal materials that are easy to dissipate heat. In some embodiments, the flexible member 400 is a silicone member or a hard foam, which plays a buffering and shock-absorbing role, reducing the damage to the flexible circuit board assembly 210 and the display chip 220 caused by collision.

[0049] Reference Figures 1 to 8The OLED screen structure of the first embodiment of the present application performs heat dissipation treatment on the display chip 220 through the heat sink 300 to prevent heat from being transferred to the surface of the screen module 200, wherein the heat sink 300 is bent to adapt to the structure of the flexible circuit board assembly 210, and cooperates with the flexible component 400 to press the flexible circuit board assembly 210 to prevent the display chip 220 from moving, which can prevent the display chip 220 from being hit as much as possible. The combination of the two improves hardware performance and user experience.

[0050] In some embodiments of the present application, a first chamfer structure 330 is provided between the first bending portion 310 and the second bending portion 320. It is understandable that the first chamfer structure 330 facilitates the bending of the FPC and prevents the FPC from being crushed. In some embodiments, the first chamfer structure 330 is a guide R angle on the heat sink 300. In some embodiments, the first bending portion 310, the second bending portion 320 and the first chamfer structure 330 are an integrated structure. In some embodiments, the first chamfer structure 330 is fitted with the inner side of the bending portion of the flexible circuit board assembly 210, thereby facilitating the bending of the flexible circuit board assembly 210 while making the overall structure compact.

[0051] In some embodiments of the present application, the first bent portion 310 includes an extension end 311 and a mounting end 312, one end of the extension end 311 is connected to the second bent portion 320 through a first chamfered structure 330, and the mounting end 312 is arranged at the other end of the extension end 311, so that the mounting end 312 can be mounted on the upper cover 100. It can be understood that the extension end 311 is used to ensure that the mounting end 312 can be located in the structure of the upper cover 100 for mounting and matching with the heat sink 300, and the mounting end 312 is used to connect with the upper cover 100.

[0052] In some embodiments, the extension end 311 and the second bent portion 320 are disposed perpendicular to each other, and the extension end 311 and the mounting end 312 are disposed perpendicular to each other, and the heat sink 300 is in a “Z” shape as a whole.

[0053] In some embodiments of the present application, the mounting end 312 is provided with a first positioning hole 313 and a first mounting hole 314, and the upper cover 100 is provided with a positioning rib 140, a first positioning column 110 and a first mounting column 120, the positioning rib 140 is used to limit the heat sink 300, the first positioning column 110 is penetrated in the first positioning hole 313, and the mounting end 312 is installed on the upper cover 100 by passing through the first mounting hole 314 and being installed on the first mounting column 120 through the first connecting member. It can be understood that during specific assembly, the first positioning hole 313 is first matched with the first mounting column 120 to achieve positioning, and then the heat sink 300 is reliably installed on the upper cover 100 by using the first connecting member. Among them, the first mounting column 120 is used to support the mounting end 312 so that the heat sink 300 can be stably installed.

[0054] In some embodiments, the first connecting member is a threaded fastener such as a screw, and the first mounting column 120 is formed with a screw hole.

[0055] In some embodiments of the present application, heat dissipation holes 510 are respectively provided at positions corresponding to the heat dissipation elements 300 in the lower cover 500. It is understandable that there is a large enough heat dissipation space inside the structure, and it is also possible not to open the heat dissipation holes 510 for the heat dissipation of the display chip 220. Opening the heat dissipation holes 510 can improve the heat dissipation efficiency of the display chip 220. The heat dissipation holes 510 and the heat dissipation elements 300 can quickly dissipate the heat inside the structure.

[0056] In some embodiments of the present application, the flexible member 400 includes a first side edge 410, the first side edge 410 is provided with a clearance position 420 for avoiding the display chip 220, and a second chamfer structure 430 is provided on the first side edge 410. It can be understood that the clearance position 420 can prevent the chip from being crushed, and when the flexible member 400 is installed, the clearance position 420 faces the display chip 220, and the first side edge 410 has an R angle to facilitate the bending of the FPC and prevent the FPC from being crushed, so that the setting of the flexible member 400 will not affect the flexible circuit board assembly 210.

[0057] In some embodiments of the present application, the flexible member 400 is provided with second positioning holes 440 at both ends of the first side 410, and the upper cover 100 is provided with second positioning posts 130, which are passed through the second positioning holes 440. It can be understood that reliable positioning is achieved through the cooperation of the second positioning holes 440 and the second positioning posts 130, and the flexible member 400 is reliably installed by coordinating the assembly of the upper cover 100 and the lower cover 500.

[0058] In some embodiments, the flexible member 400 may also be connected and installed by means including but not limited to screw connection, snap connection, bonding or welding.

[0059] In some embodiments of the present application, the screen module 200 further includes a cover plate 230 and a display screen 240, the display screen 240 is disposed on one surface of the cover plate 230, and the flexible circuit board assembly 210 is connected to the display screen 240. It is understood that the cover plate 230 and the display screen 240 are bonded together by a bonding process and can be regarded as a component. In some embodiments, the cover plate 230 is a glass cover plate 230.

[0060] In some embodiments of the present application, the OLED screen structure further includes a screen adhesive 610, a handwriting antenna 620, a silicon steel sheet 630 and a back plate 640. The other surface of the cover plate 230 is connected to the upper cover 100 through the screen adhesive 610. The display screen 240 is arranged on the other surface of the cover plate 230. The upper cover 100, the handwriting antenna 620, the silicon steel sheet 630, the back plate 640 and the lower cover 500 are arranged in sequence. One end of the flexible circuit board assembly 210 is connected to the display screen 240. The other end of the flexible circuit board assembly 210 is bent and extended to be installed on the other surface of the back plate 640 relatively far away from the display screen 240, and the other end of the flexible circuit board assembly 210 is provided with a timing control board assembly 250. It can be understood that the silicon steel sheet 630 is glued on one side to prevent handwriting interference, and positioning holes and screw holes are provided on the back plate 640 to facilitate the installation and positioning of various components.

[0061] In some embodiments of the present application, the assembly process includes:

[0062] 1) Install the heat sink 300: Install the heat sink 300 on the upper cover 100 and fix it with 2 screws, a total of 6 sets;

[0063] 2) Adhesive backing: Adhere the screen adhesive backing 610 to the adhesive backing area of ​​the upper cover 100;

[0064] 3) Installing the screen module 200: installing the screen module 200 on the upper cover 100;

[0065] 4) Install the silicone parts: Lay the FPC of the screen module 200 flat on the heat sink 300, place the silicone parts on the FPC, align the two positioning holes with the positioning columns of the upper cover 100, and the gap to avoid air is facing the display chip 220, a total of 6 groups;

[0066] 5) Paste the silicon steel sheet 630: Paste the silicon steel sheet 630 on the handwriting antenna 620 (the side away from the screen module 200);

[0067] 6) Install the handwriting antenna 620: Install the handwriting antenna 620 with the silicon steel sheet 630 attached to the upper cover 100, align the three positioning holes of the handwriting antenna 620 with the three positioning posts on the upper cover 100, and fix them with multiple screws;

[0068] 7) Install the back plate 640: Install the back plate 640 onto the upper cover 100, align the three positioning holes of the back plate 640 with the three positioning posts on the upper cover 100, and fix them with multiple screws;

[0069] 8) Fix the T-CON board, fold the T-CON board of the screen module 200 onto the back plate 640, align the screw holes on the T-CON board with the screw columns on the back plate 640, and fix them with multiple screws;

[0070] 9) Install the lower cover 500: Put the lower cover 500 and the upper cover 100 together and fix them with multiple screws.

[0071] Reference Figures 1 to 8 The electronic product of the second aspect embodiment of the present application may be an electronic product with a handwriting screen such as a hand-drawn board, a handwriting board, etc. The electronic product includes the OLED screen structure of the first aspect embodiment of the present application, which can solve the problem of possible damage and heat dissipation of the display chip 220 as much as possible, and improve hardware performance and user experience.

[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. An OLED screen structure, characterized in that: include: Upper cover; A screen module is arranged on a surface of the upper cover, the screen module comprises a flexible circuit board assembly and a plurality of display chips, the flexible circuit board assembly is bent, and the display chips are arranged on the inner side of the flexible circuit board assembly at intervals from each other; A heat sink, bent to form a first bent portion and a second bent portion, wherein the first bent portion is disposed on another surface opposite to the upper cover, and the second bent portion is adapted to be attached to an outer surface of the flexible circuit board opposite to the display chip; A flexible member, arranged on the inner side of the flexible circuit board assembly and located at the periphery of the display chip; A lower cover is assembled with the upper cover.

2. The OLED screen structure according to claim 1, characterized in that: A first chamfer structure is provided between the first bending portion and the second bending portion.

3. The OLED screen structure according to claim 2, characterized in that: The first bending portion includes an extension end and a mounting end, one end of the extension end is connected to the second bending portion through the first chamfer structure, and the mounting end is arranged at the other end of the extension end so that the mounting end can be mounted on the upper cover.

4. The OLED screen structure according to claim 3, characterized in that: The mounting end is provided with a first positioning hole and a first mounting hole, the upper cover is provided with a positioning rib, a first positioning column and a first mounting column, the positioning rib is used to limit the heat sink, the first positioning column is passed through the first positioning hole, and the mounting end is installed on the upper cover by a first connecting member passing through the first mounting hole and being installed on the first mounting column.

5. The OLED screen structure according to claim 1, characterized in that: Heat dissipation holes are respectively arranged at positions of the lower cover corresponding to the heat dissipation elements.

6. The OLED screen structure according to claim 1, characterized in that: The flexible member comprises a first side edge, the first side edge is provided with a clearance position for avoiding the display chip, and a second chamfer structure is provided on the first side edge.

7. The OLED screen structure according to claim 6, characterized in that: The flexible member is provided with second positioning holes at both ends of the first side, and the upper cover is provided with a second positioning column, which is inserted into the second positioning hole.

8. The OLED screen structure according to claim 1, characterized in that: The screen module also includes a cover plate and a display screen. The display screen is arranged on a surface of the cover plate, and the flexible circuit board assembly is connected to the display screen.

9. The OLED screen structure according to claim 8, characterized in that: The OLED screen structure also includes screen adhesive backing, a handwriting antenna, a silicon steel sheet and a back plate. The other relative surface of the cover plate is connected to the upper cover through the screen adhesive backing. The display screen is arranged on the other relative surface of the cover plate. The upper cover, the handwriting antenna, the silicon steel sheet, the back plate and the lower cover are arranged in sequence. One end of the flexible circuit board assembly is connected to the display screen, and the other end of the flexible circuit board assembly is bent and extended to be installed on the other surface of the back plate relatively away from the display screen, and the other end of the flexible circuit board assembly is provided with a timing control board assembly.

10. An electronic product, characterized in that: include: The OLED screen structure according to any one of claims 1 to 9.

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