Positioning device for medium chip pasting

Abstract

The utility model belongs to the technical field of medium chip processing equipment, and particularly relates to a positioning device for medium chip pasting, which comprises a first support frame, a second support frame and a third support frame, wherein the second support frame and the third support frame are arranged on the first support frame; the positioning plate is arranged on the second supporting frame, and a plurality of conical positioning through holes are formed in the surface of the positioning plate; the sheet arranging plate is arranged on the third supporting frame, and a plurality of sheet arranging holes are formed in the surface of the sheet arranging plate; the movable grabbing mechanism is arranged on the first supporting frame and comprises a plurality of suction nozzles; according to the positioning device for medium chip mounting, the suction nozzles in the movable grabbing mechanism are used for sucking and moving the chips in the corresponding chip arranging holes into the corresponding conical positioning through holes, and then the chips are centered through the conical structures, so that the chips in the chip arranging holes are positioned, and the chip mounting efficiency is improved. Therefore, the effects of accurate positioning and improvement of the machining efficiency are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of dielectric chip processing equipment, and in particular relates to a positioning device for dielectric chip patching. Background Art

[0002] When making circuit boards, ceramic dielectric chips (such as varistor chips, ceramic capacitor dielectric chips, etc.) need to be mounted on the surface of the printed circuit board or other substrates and assembled by flow soldering or dispensing.

[0003] The existing technology has the following problems: During the patch processing of the existing circuit board, the dielectric chip is fixed on the circuit board manually. However, the manual fixation method has poor accuracy and is prone to position deviation, which affects the subsequent processing accuracy. At the same time, manual patch can only be pasted once each time, and the processing efficiency is low.

[0004] Therefore, in order to solve the above problems, it is necessary to design a positioning device for dielectric chip patching. Utility Model Content

[0005] The utility model aims to provide a positioning device for a dielectric chip patch to solve the technical problems mentioned in the background technology.

[0006] In order to solve the above technical problems, the utility model provides a positioning device for dielectric chip patch, comprising:

[0007] A first support frame, and a second support frame and a third support frame arranged on the first support frame;

[0008] A positioning plate disposed on the second support frame, with a plurality of conical positioning through holes formed on its surface;

[0009] A sheet discharging plate arranged on the third support frame has a plurality of sheet discharging holes formed on its surface;

[0010] The mobile grasping mechanism arranged on the first supporting frame comprises: a plurality of suction nozzles;

[0011] Each of the suction nozzles is suitable for sucking and moving the chip in the corresponding chip row hole to the corresponding tapered positioning through hole for positioning.

[0012] Furthermore, the mobile grabbing mechanism further comprises: a gas mixing box arranged above the plurality of suction nozzles;

[0013] The gas mixing box is connected to a plurality of suction nozzles; and

[0014] The gas mixing box is suitable for being connected to a vacuum pump so that each suction nozzle can draw air.

[0015] Furthermore, the mobile grasping mechanism further comprises: slide rails arranged at the top of both sides of the first support frame, at least one pair of sliders mounted on the slide rails, a support plate arranged at the top of the sliders, and a first cylinder arranged at the top of the support plate; wherein

[0016] The first cylinder passes through the support plate and is connected to the gas mixing box.

[0017] Furthermore, the mobile grasping mechanism further comprises: a screw rod engaged with the support plate and a motor driving the screw rod to rotate; wherein

[0018] One end of the screw rod is rotatably connected to the first support frame;

[0019] The motor is arranged on the first supporting frame.

[0020] Furthermore, a second cylinder is provided on the first support frame; wherein

[0021] A flat plate is provided on the top of the second cylinder; and

[0022] The flat plate is provided with a plurality of top columns;

[0023] The second cylinder is suitable for driving the plate to rise, so that each lifting column lifts the chip in the conical positioning through hole.

[0024] The beneficial effects of the utility model are:

[0025] (I) The utility model controls the first cylinder to extend, and the first cylinder drives the mixing box and the suction nozzle to move downward, so that the suction nozzle extends into the chip row hole. At this time, the mixing box is evacuated and the suction nozzle adsorbs the chip. At this time, the first cylinder is controlled to retract and the motor is controlled to rotate. The motor drives the screw rod to rotate, so that the support plate drives the slider to slide on the slide rail to the top of the conical positioning through hole, and then the first cylinder is controlled to extend and stop evacuating the mixing box. At this time, the chip falls naturally and is centered in the conical positioning through hole. Through the above steps, accurate positioning can be achieved, and a large number of chips can be positioned at the same time, improving the processing efficiency.

[0026] (ii) The utility model controls the second cylinder to extend, and the second cylinder drives the flat plate and the top column to move upward to lift the chip in the conical positioning through hole; controls the second cylinder to retract, and the second cylinder drives the flat plate and the top column to move downward to lay the chip in the conical positioning through hole flat and position it; controls the second cylinder to extend, and the second cylinder drives the flat plate and the top column to move upward to lift the chip in the conical positioning through hole so that the nozzle can adsorb it; through the above steps, the chip can be laid flat, and the chip can be prevented from tilting when the nozzle adsorbs it, resulting in inaccurate positioning.

[0027] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by practicing the utility model. The purpose and other advantages of the utility model are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a three-dimensional preferred embodiment of the overall utility model. Figure 1 ;

[0031] Figure 2 It is a three-dimensional preferred embodiment of the overall utility model. Figure 2 ;

[0032] Figure 3 It is a cross-sectional view of a preferred embodiment of the positioning plate of the utility model.

[0033] In the figure:

[0034] A first support frame 1, a second support frame 11, and a third support frame 12;

[0035] Positioning plate 2, tapered positioning through hole 21;

[0036] Slice plate 3, slice holes 31;

[0037] Mobile grabbing mechanism 4, suction nozzle 41, gas mixing box 42, slide rail 43, slider 44, support plate 45, first cylinder 46, screw rod 47, motor 48;

[0038] The second cylinder 5, the flat plate 6, and the top column 7. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example 1

[0040] like Figures 1 to 3 As shown, this embodiment provides a positioning device for dielectric chip patch, including:

[0041] A first support frame 1 and a second support frame 11 and a third support frame 12 arranged on the first support frame 1; a positioning plate 2 arranged on the second support frame 11, a surface of which is provided with a plurality of conical positioning through holes 21; a sheet arrangement plate 3 arranged on the third support frame 12, a surface of which is provided with a plurality of sheet arrangement holes 31; a mobile grasping mechanism 4 arranged on the first support frame 1, comprising: a plurality of suction nozzles 41; each of the suction nozzles 41 is suitable for sucking and moving the chip in the corresponding sheet arrangement hole 31 to the corresponding conical positioning through hole 21 for positioning; wherein the second support frame 11 and the third support frame 12 are arranged adjacent to each other; wherein the conical positioning through hole 21 is arranged with an upper diameter larger than a lower diameter as the most preferred configuration, so as to facilitate the placement and positioning of the chip.

[0042] The mobile grasping mechanism 4 also includes: a gas mixing box 42 arranged above the plurality of suction nozzles 41; wherein the gas mixing box 42 is connected to the plurality of suction nozzles 41; and the gas mixing box 42 is suitable for being connected to an air pump so that each suction nozzle 41 can draw air; wherein a cavity is provided in the gas mixing box 42 so as to connect the plurality of suction nozzles 41.

[0043] The mobile grasping mechanism 4 also includes: slide rails 43 arranged on the top of both sides of the first support frame 1, at least one pair of sliders 44 mounted on the slide rails 43, a support plate 45 arranged on the top of the sliders 44, and a first cylinder 46 arranged on the top of the support plate 45; wherein the first cylinder 46 penetrates the support plate 45 and is connected to the mixing box 42.

[0044] The mobile grasping mechanism 4 further comprises: a screw rod 47 meshing with the support plate 45 and a motor 48 driving the screw rod 47 to rotate; wherein one end of the screw rod 47 is rotatably connected to the first support frame 1; and the motor 48 is disposed on the first support frame 1.

[0045] In this embodiment, by controlling the first cylinder 46 to extend, the first cylinder 46 drives the mixing box 42 and the suction nozzle 41 to move downward, so that the suction nozzle 41 extends into the chip row hole 31, and the mixing box 42 is evacuated at this time, and the suction nozzle 41 adsorbs the chip. At this time, the first cylinder 46 is controlled to retract and the motor 48 is controlled to rotate. The motor 48 drives the screw rod 47 to rotate, so that the support plate 45 drives the slider 44 to slide on the slide rail 43 to the top of the conical positioning through hole 21, and then the first cylinder 46 is controlled to extend, and the mixing box 42 is stopped from being evacuated. At this time, the chip falls naturally and is centered in the conical positioning through hole 21. Through the above steps, accurate positioning can be achieved, and a large number of chips can be positioned at the same time, providing processing efficiency. Example 2

[0046] like Figure 1 , Figure 2 As shown, based on Example 1, this Example 2 includes:

[0047] A second cylinder 5 is provided on the first support frame 1; a flat plate 6 is provided on the top of the second cylinder 5; and a plurality of top pillars 7 are provided on the flat plate 6; the second cylinder 5 is suitable for driving the flat plate 6 to rise so that each top pillar 7 can lift the chip in the conical positioning through hole 21; by controlling the second cylinder 5 to extend, the second cylinder 5 drives the flat plate 6 and the top pillars 7 to move upward to lift the chip in the conical positioning through hole 21, by controlling the second cylinder 5 to retract, the second cylinder 5 drives the flat plate 6 and the top pillars 7 to move downward to lay the chip in the conical positioning through hole 21 flat and position it, and then by controlling the second cylinder 5 to extend, the second cylinder 5 drives the flat plate 6 and the top pillars 7 to move upward to lift the chip in the conical positioning through hole 21 so that the suction nozzle 41 can adsorb it. Through the above steps, the chip can be laid flat to prevent the suction nozzle 41 from tilting the chip during adsorption, resulting in inaccurate positioning.

[0048] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0049] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0051] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without departing from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A positioning device for dielectric chip patching, characterized in that: include: A first support frame (1), and a second support frame (11) and a third support frame (12) arranged on the first support frame (1); A positioning plate (2) disposed on the second support frame (11), the surface of which is provided with a plurality of conical positioning through holes (21); A sheet discharging plate (3) disposed on a third support frame (12), the surface of which is provided with a plurality of sheet discharging holes (31); A movable grasping mechanism (4) arranged on the first support frame (1), comprising: a plurality of suction nozzles (41); Each suction nozzle (41) is suitable for sucking and moving the chip in the corresponding chip row hole (31) to the corresponding tapered positioning through hole (21) for positioning.

2. The dielectric chip mounting positioning device according to claim 1, characterized in that: The mobile grabbing mechanism (4) further comprises: a gas mixing box (42) arranged above the plurality of suction nozzles (41); wherein The gas mixing box (42) is connected to a plurality of suction nozzles (41); and The gas mixing box (42) is suitable for being connected to a vacuum pump so that each suction nozzle (41) can draw air.

3. The dielectric chip mounting positioning device according to claim 2, characterized in that: The mobile grasping mechanism (4) further comprises: slide rails (43) arranged at the top of both sides of the first support frame (1), at least one pair of sliders (44) mounted on the slide rails (43), a support plate (45) arranged at the top of the sliders (44), and a first cylinder (46) arranged at the top of the support plate (45); wherein The first cylinder (46) passes through the support plate (45) and is connected to the gas mixing box (42).

4. The dielectric chip mounting positioning device according to claim 3, characterized in that: The mobile grasping mechanism (4) further comprises: a screw rod (47) meshing with the support plate (45) and a motor (48) driving the screw rod (47) to rotate; wherein One end of the screw rod (47) is rotatably connected to the first support frame (1); The motor (48) is arranged on the first support frame (1).

5. The dielectric chip mounting positioning device according to claim 1, characterized in that: A second cylinder (5) is provided on the first support frame (1); wherein A flat plate (6) is provided on the top of the second cylinder (5); and The flat plate (6) is provided with a plurality of top columns (7); The second cylinder (5) is suitable for driving the flat plate (6) to rise, so that each lifting column (7) lifts the chip in the conical positioning through hole (21).

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