Glue-free Mini LED double-sided flexible copper-clad plate

Abstract

The utility model discloses a glue-free Mini LED double-sided flexible copper-clad plate, which comprises a substrate, the substrate is composed of a central layer and metal layers, the metal layers are respectively arranged at the upper end and the lower end of the central layer, the upper end and the lower end of the substrate are also provided with metal plating layers, and photosensitive film layers are also arranged outside the metal plating layers; the double-sided LED circuit board is simple in structure and convenient to use, the pp prepreg made of prepreg is adopted as the center layer, the copper foils are arranged at the upper end and the lower end of the center layer respectively, the center layer and the copper foils are pressed into the substrate, and the metal coatings and the photosensitive film layers are arranged on the upper end face and the lower end face of the substrate in sequence, so that the complete double-sided LED circuit board is machined and formed. And the PP prepreg is adopted as the center layer of the substrate, so that the performance of the substrate is superior to that of a traditional pi substrate, a large-size effect can be formed in a MiniLED circuit board, deviation can be prevented, MiniLED patch processing is accurate, errors are avoided, and the substrate has good stability, reliability and safety.

Description

Technical Field

[0001] The utility model relates to the technical field of double-sided copper-clad laminates, and in particular to a glue-free MiniLED double-sided flexible copper-clad laminate. Background Art

[0002] Flexible copper clad laminate is also called flexible copper clad laminate. Traditional products are mainly composed of three different functional layers: copper foil, film and adhesive. In recent years, electronic products have gradually developed in the direction of miniaturization and thinness. The requirements for flexible circuit boards are getting higher and higher, and the wiring requirements are becoming more and more intensive. They also need to have good reliability and stability. Therefore, the pi copper foil substrate was born.

[0003] However, when the pi copper foil substrate is used in MiniLED lamps, its installation accuracy cannot be guaranteed and it is prone to deviation, which leads to the use of MiniLED lamps.

[0004] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0005] In view of this, the present invention aims to solve the deficiencies in the prior art, and its main purpose is to provide a glue-free MiniLED double-sided flexible copper clad laminate.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A glue-free MiniLED double-sided flexible copper-clad laminate includes a substrate, which is composed of a central layer and a metal layer. The metal layers are respectively arranged at the upper and lower ends of the central layer. The upper and lower ends of the substrate are also provided with metal plating layers, and a photosensitive film layer is also provided outside the metal plating layer.

[0008] As a preferred solution, the central layer is made of prepreg material, which is formed by soaking glass fiber cloth in resin to form a PP prepreg, and the metal layer is arranged at the upper and lower ends of the PP prepreg and pressed into one body.

[0009] As a preferred solution, the metal layer is a copper foil made of copper material, and the copper foil is placed on the upper and lower ends of the prepreg material and pressed together to form a substrate.

[0010] As a preferred solution, the metal plating layer is a copper plating layer, and the copper plating layer is respectively arranged at the upper and lower ends of the substrate and is in contact with the substrate to achieve conduction.

[0011] As a preferred solution, the photosensitive film layer is a photosensitive dry film, and the photosensitive dry film is respectively arranged outside the metal plating layer at the upper and lower ends to play a protective and stabilizing effect.

[0012] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0013] The utility model has a simple structure and is easy to use. A pp semi-cured sheet made of prepreg material is used as the central layer, and copper foils are respectively arranged at the upper and lower ends thereof to press them into a substrate, and metal plating layers and photosensitive film layers are arranged on the upper and lower end surfaces thereof in turn, so that they can be processed and formed into a complete double-sided LED circuit board. Moreover, since the pp semi-cured sheet is used as the central layer of the substrate, its performance is better than that of the traditional pi substrate. Moreover, it can form a large-size effect in the MiniLED circuit board and can prevent deviation, so that the MiniLED patch processing is accurate and errors are avoided. It has good stability, reliability and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0016] Among them, the reference numerals in the figure are:

[0017] 10. Substrate; 11. Core layer; 12. Metal layer; 20. Metal plating layer; 30. Photosensitive film layer. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0020] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Reference Figure 1 As shown: A glue-free MiniLED double-sided flexible copper clad laminate includes a substrate 10, wherein the substrate 10 is composed of a central layer 11 and a metal layer 12, the metal layer 12 is respectively arranged at the upper and lower ends of the central layer 11, and a metal plating layer 20 is also provided at the upper and lower ends of the substrate 10, and then a photosensitive film layer 30 is also provided outside the metal plating layer 20, for preventing interference and damage by external light, and for improving brightness and stability.

[0024] In this embodiment, the central layer 11 is made of prepreg material, wherein the prepreg material is formed by glass fiber cloth soaked in resin to form a PP prepreg, and the metal layer 12 is arranged at the upper and lower ends of the PP prepreg to be pressed into one body.

[0025] Specifically, the metal layer 12 used is a copper foil made of copper material. The copper foil is placed on the upper and lower ends of the prepreg material, and they are pressed together to form the substrate 10, so that it has better stability and reliability.

[0026] Furthermore, the metal plating layer 20 is a copper plating layer, which is disposed at the upper and lower ends of the substrate 10 respectively, and is brought into contact with the substrate 10 to achieve conduction, and then processed.

[0027] In this embodiment, the photosensitive film layer 30 is a photosensitive dry film, and the photosensitive dry film is disposed outside the metal plating layer 20 at the upper and lower ends, respectively, to achieve a protective and stable effect, thereby improving the brightness of the MiniLED.

[0028] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A non-glue MiniLED double-sided flexible copper-clad laminate, comprising a substrate, characterized in that: The substrate is composed of a central layer and a metal layer. The metal layers are respectively arranged at the upper and lower ends of the central layer. The upper and lower ends of the substrate are also provided with metal plating layers, and a photosensitive film layer is also arranged outside the metal plating layers.

2. The adhesive-free MiniLED double-sided flexible copper clad laminate according to claim 1, characterized in that: The central layer is made of prepreg material, which is formed by soaking glass fiber cloth in resin to form a PP prepreg sheet, and the metal layer is arranged at the upper and lower ends of the PP prepreg sheet and pressed into one body.

3. The adhesive-free MiniLED double-sided flexible copper clad laminate according to claim 2, characterized in that: The metal layer is a copper foil made of copper material, and the copper foil is placed on the upper and lower ends of the prepreg material and pressed together to form a substrate.

4. The adhesive-free MiniLED double-sided flexible copper clad laminate according to claim 1, characterized in that: The metal plating layer is a copper plating layer, which is respectively arranged at the upper and lower ends of the substrate and is in contact with the substrate to achieve conduction.

5. The adhesive-free MiniLED double-sided flexible copper clad laminate according to claim 1, characterized in that: The photosensitive film layer is a photosensitive dry film, which is respectively arranged outside the metal plating layer at the upper and lower ends to play a protective and stabilizing role.

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