Cooling device for processing oxygen-free copper rod

Abstract

The utility model discloses a cooling device for processing an oxygen-free copper rod, which comprises a cooling pool, the surface of the cooling pool is fixedly connected with a support, the inner wall of the support is fixedly connected with an electric push rod, the output end of the electric push rod is fixedly connected with a connecting frame, and cooling liquid is injected into the cooling pool and a water tank through a connecting pipe. A copper rod is placed on the bearing mechanism, the electric push rod is started to drive the copper rod to enter the cooling liquid through the connecting frame, the fixing frame and the bearing mechanism, the cooling liquid enters the fixing frame through the through hole in the bottom plate for cooling work, a falling oxide layer is reserved on the top face of the bottom plate, and the refrigeration mechanism is started to reduce the temperature of the cooling liquid through the water tank. And the water circulation assembly is started to send the cooled cooling liquid into the cooling pool for cooling, so that the goals of conveniently collecting and cleaning the fallen oxide layer and circularly cooling the cooling liquid are achieved, and the problems that the oxide layer fallen in the cooling device is difficult to clean and the cooling effect is reduced due to temperature rise of the cooling liquid are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of oxygen-free copper rod processing, in particular to a cooling device for oxygen-free copper rod processing. Background Art

[0002] The main use of copper rods is as raw materials for the production of wires and cables. Oxygen-free copper rods are generally produced from electrolytic copper, and their resistivity is lower than that of low-oxygen copper rods. Therefore, oxygen-free copper rods are more economical in the production of products with strict resistance requirements. The manufacture of oxygen-free copper rods requires higher quality raw materials. During the forging process of oxygen-free copper rods, the copper rods usually need to be cooled.

[0003] When cooling the copper rod, the copper rod is usually immersed in the coolant in the cooling device for cooling. When the copper rod is immersed, the oxide on the surface of the copper rod will fall off in the cooling device, which is difficult to clean. In addition, the temperature of the coolant will also increase during the cooling process. If the coolant is not cooled, the cooling effect will be reduced. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a cooling device for processing oxygen-free copper rods, which is used to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A cooling device for processing oxygen-free copper rods, comprising a cooling pool, a bracket fixedly connected to the surface of the cooling pool, an electric push rod fixedly connected to the inner wall of the bracket, a connecting frame fixedly connected to the output end of the electric push rod, a fixing frame fixedly connected to the bottom end of the connecting frame, a bottom plate fixedly connected to the bottom surface of the fixing frame, a through hole penetrated through the top surface of the bottom plate, a water tank fixedly connected to the left side of the cooling pool, a supporting mechanism arranged inside the fixing frame, a water circulation component arranged on the top surface of the water tank, and a refrigeration mechanism arranged inside the water tank.

[0007] Preferably, the supporting mechanism consists of a fixing plate and a supporting rod, the fixing plate is fixedly connected to the fixing frame, the supporting rod is slidably connected to the inner wall of the fixing frame, and the supporting rod overlaps the inner wall of the fixing plate.

[0008] Preferably, the water circulation component consists of a water pump, a liquid inlet pipe, a liquid outlet pipe, a water outlet hole and a connecting pipe, the water pump is fixedly connected to the water tank, the liquid inlet pipe is fixedly connected to the inner wall of the water tank, and the liquid outlet end of the liquid inlet pipe is fixedly connected to the liquid inlet end of the water pump, the liquid outlet pipe is fixedly connected to the inner wall of the cooling pool, and the liquid inlet end of the liquid outlet pipe is fixedly connected to the liquid outlet end of the water pump, the water outlet hole is opened through the surface of the liquid outlet pipe, the connecting pipe is fixedly connected to the inner wall of the cooling pool, and the connecting pipe is fixedly connected to the inner wall of the water tank.

[0009] Preferably, the refrigeration mechanism is composed of a semiconductor refrigeration sheet and a heat dissipation fan, the semiconductor refrigeration sheet is fixedly connected to the inner wall of the water tank, and the heat dissipation fan is fixedly connected to the water tank.

[0010] Preferably, there are multiple through holes, and the multiple through holes are all opened through the top surface of the bottom plate.

[0011] Preferably, the water tank is rectangular and made of stainless steel.

[0012] Preferably, there are multiple semiconductor refrigeration plates, and the multiple semiconductor refrigeration plates are all located on the inner wall of the water tank.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the cooling device for oxygen-free copper rod processing injects coolant into the cooling pool and the water tank through the connecting pipe, the copper rod is placed on the supporting mechanism, the electric push rod is started to drive the copper rod into the coolant through the connecting frame, the fixing frame and the supporting mechanism, the coolant enters the fixing frame through the through hole on the bottom plate for cooling, the detached oxide layer is retained on the top surface of the bottom plate, the refrigeration mechanism is started to reduce the temperature of the coolant through the water tank, and the water circulation component is started to send the cooled coolant into the cooling pool for cooling; the purpose of facilitating the collection and cleaning of the detached oxide layer and circulating the coolant for cooling is achieved, and the problem that the detached oxide layer is difficult to clean in the cooling device and the temperature rise of the coolant reduces the cooling effect is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the structural survey drawing of the utility model;

[0015] Figure 2 This is an enlarged view of the structure A of the utility model;

[0016] Figure 3 It is a rear cross-sectional view of the structure of the utility model;

[0017] Figure 4 This is an enlarged view of the structure B of the utility model.

[0018] In the figure: 1. Cooling pool; 2. Bracket; 3. Electric push rod; 4. Connecting frame; 5. Fixed frame; 6. Bottom plate; 7. Through hole; 8. Water tank; 9. Fixed plate; 10. Support rod; 11. Water pump; 12. Liquid inlet pipe; 13. Liquid outlet pipe; 14. Water outlet hole; 15. Connecting pipe; 16. Semiconductor refrigeration plate; 17. Cooling fan. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Reference Figure 1-4A cooling device for processing oxygen-free copper rods comprises a cooling pool 1, a bracket 2 is fixedly connected to the surface of the cooling pool 1, an electric push rod 3 is fixedly connected to the inner wall of the bracket 2, an output end of the electric push rod 3 is fixedly connected to a connecting frame 4, a fixing frame 5 is fixedly connected to the bottom end of the connecting frame 4, a bottom surface of the fixing frame 5 is fixedly connected to a bottom plate 6, a through hole 7 is penetrated through the top surface of the bottom plate 6, a plurality of through holes 7 are provided, and a plurality of through holes 7 are penetrated through the top surface of the bottom plate 6 for circulating coolant and filtering the fallen oxide layer, a water tank 8 is fixedly connected to the left side of the cooling pool 1, the water tank 8 is rectangular, and the water tank 8 is made of stainless steel, the water tank 8 made of stainless steel has higher strength, is not easy to rust, deform or damage, and is more durable, the fixing frame 5 A supporting mechanism is provided inside, and the supporting mechanism consists of a fixed plate 9 and a supporting rod 10. The fixed plate 9 is fixedly connected to the fixed frame 5, and the supporting rod 10 is slidably connected to the inner wall of the fixed frame 5, and the supporting rod 10 overlaps the inner wall of the fixed plate 9, which is used to support the copper rod for cooling work, and is convenient for cleaning the oxide layer after quick disassembly. A water circulation component is provided on the top surface of the water tank 8, and the water circulation component consists of a water pump 11, a liquid inlet pipe 12, a liquid outlet pipe 13, a water outlet hole 14 and a connecting pipe 15. The water pump 11 is fixedly connected to the water tank 8, the liquid inlet pipe 12 is fixedly connected to the inner wall of the water tank 8, and the liquid outlet end of the liquid inlet pipe 12 is fixedly connected to the liquid inlet end of the water pump 11, the liquid outlet pipe 13 is fixedly connected to the inner wall of the cooling pool 1, and the liquid inlet end of the liquid outlet pipe 13 is connected to the water pump 11 is fixedly connected to the liquid outlet end, the water outlet hole 14 is opened through the surface of the liquid outlet pipe 13, the connecting pipe 15 is fixedly connected to the inner wall of the cooling pool 1, and the connecting pipe 15 is fixedly connected to the inner wall of the water tank 8, which is used for water circulation, so as to drive the coolant to circulate and cool down. A refrigeration mechanism is arranged inside the water tank 8, and the refrigeration mechanism is composed of a semiconductor refrigeration sheet 16 and a heat dissipation fan 17. There are multiple semiconductor refrigeration sheets 16, and multiple semiconductor refrigeration sheets 16 are located on the inner wall of the water tank 8, which are used to reduce the temperature of the coolant in the water tank 8 and improve the cooling speed. The semiconductor refrigeration sheet 16 is fixedly connected to the inner wall of the water tank 8, and the heat dissipation fan 17 is fixedly connected to the water tank 8, which is used to reduce the temperature of the coolant in the water tank 8 and avoid the coolant The temperature rises and the cooling effect is reduced. The coolant is injected into the cooling pool 1 and the water tank 8 through the connecting pipe 15, and the copper rod is placed on the supporting mechanism. The electric push rod 3 is started to drive the copper rod into the coolant through the connecting frame 4, the fixed frame 5 and the supporting mechanism. The coolant enters the fixed frame 5 through the through hole 7 on the bottom plate 6 for cooling. The detached oxide layer is retained on the top surface of the bottom plate 6. The refrigeration mechanism is started to reduce the coolant temperature through the water tank 8, and the water circulation component is started to send the cooled coolant into the cooling pool 1 for cooling. The purpose of facilitating the collection and cleaning of the detached oxide layer and circulating the coolant for cooling is achieved, and the problem of the oxide layer being difficult to clean in the cooling device and the coolant heating reducing the cooling effect is avoided.

[0021] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0022] When in use: first, inject coolant into the cooling pool 1, and at the same time, the coolant enters the water tank 8 through the connecting pipe 15, and the copper rod is placed on the multiple supporting rods 10 in the fixed frame 5. Start the electric push rod 3 to drive the connecting rod fixing plate 9, the supporting rod 10 and the copper rod to move downward into the coolant through the connecting frame 4 and the fixed frame 5. The coolant enters the fixed frame 5 through the through hole 7 on the bottom plate 6 to soak the copper rod, and the cooling work can be carried out. The oxide layer that falls off the surface of the copper tube is filtered through the through hole 7 and retained on the top surface of the bottom plate 6. Take out the multiple supporting rods 10 along the inner wall of the fixed plate 9 to clean the oxide layer on the bottom plate 6. When the temperature of the coolant rises, start the multiple semiconductor refrigeration sheets 16 to reduce the internal coolant temperature through the water tank 8, and at the same time start the multiple heat dissipation fans 17 to dissipate heat at the heat dissipation ends of the multiple semiconductor refrigeration sheets 16. Start the water pump 11 to draw the cooled coolant into the outlet pipe 13 through the liquid inlet pipe 12 and then discharge it from the water outlet 14 to reduce the temperature of the coolant in the cooling pool 1.

[0023] In summary, the cooling device for oxygen-free copper rod processing injects coolant into the cooling pool 1 and the water tank 8 through the connecting pipe 15, places the copper rod on the supporting mechanism, starts the electric push rod 3 to drive the copper rod into the coolant through the connecting frame 4, the fixed frame 5 and the supporting mechanism, and the coolant enters the fixed frame 5 through the through hole 7 on the bottom plate 6 for cooling. The detached oxide layer remains on the top surface of the bottom plate 6, and the refrigeration mechanism is started to reduce the coolant temperature through the water tank 8. The water circulation component is started to send the cooled coolant into the cooling pool 1 for cooling, which achieves the goal of facilitating the collection and cleaning of the detached oxide layer and circulating the coolant for cooling, avoids the problem that the oxide layer is difficult to clean in the cooling device after it detaches, and the problem that the coolant temperature rises and reduces the cooling effect, and is used to solve the problems raised in the above-mentioned background technology.

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for processing oxygen-free copper rods, comprising a cooling pool (1), characterized in that: The surface of the cooling pool (1) is fixedly connected to a bracket (2), the inner wall of the bracket (2) is fixedly connected to an electric push rod (3), the output end of the electric push rod (3) is fixedly connected to a connecting frame (4), the bottom end of the connecting frame (4) is fixedly connected to a fixing frame (5), the bottom surface of the fixing frame (5) is fixedly connected to a bottom plate (6), the top surface of the bottom plate (6) is penetrated by a through hole (7), the left side of the cooling pool (1) is fixedly connected to a water tank (8), a supporting mechanism is arranged inside the fixing frame (5), a water circulation component is arranged on the top surface of the water tank (8), and a refrigeration mechanism is arranged inside the water tank (8).

2. A cooling device for processing oxygen-free copper rods according to claim 1, characterized in that: The supporting mechanism is composed of a fixing plate (9) and a supporting rod (10); the fixing plate (9) is fixedly connected to the fixing frame (5); the supporting rod (10) is slidably connected to the inner wall of the fixing frame (5); and the supporting rod (10) overlaps the inner wall of the fixing plate (9).

3. The cooling device for processing oxygen-free copper rod according to claim 1, characterized in that: The water circulation assembly comprises a water pump (11), a liquid inlet pipe (12), a liquid outlet pipe (13), a water outlet hole (14) and a connecting pipe (15); the water pump (11) is fixedly connected to the water tank (8); the liquid inlet pipe (12) is fixedly connected to the inner wall of the water tank (8); the liquid outlet end of the liquid inlet pipe (12) is fixedly connected to the liquid inlet end of the water pump (11); the liquid outlet pipe (13) is fixedly connected to the inner wall of the cooling pool (1); the liquid inlet end of the liquid outlet pipe (13) is fixedly connected to the liquid outlet end of the water pump (11); the water outlet hole (14) is formed through the surface of the liquid outlet pipe (13); the connecting pipe (15) is fixedly connected to the inner wall of the cooling pool (1); and the connecting pipe (15) is fixedly connected to the inner wall of the water tank (8).

4. The cooling device for processing oxygen-free copper rod according to claim 1, characterized in that: The refrigeration mechanism is composed of a semiconductor refrigeration sheet (16) and a heat dissipation fan (17); the semiconductor refrigeration sheet (16) is fixedly connected to the inner wall of the water tank (8); and the heat dissipation fan (17) is fixedly connected to the water tank (8).

5. The cooling device for processing oxygen-free copper rod according to claim 1, characterized in that: There are a plurality of through holes (7), and the plurality of through holes (7) are all opened through the top surface of the bottom plate (6).

6. The cooling device for processing oxygen-free copper rod according to claim 1, characterized in that: The water tank (8) is rectangular in shape and is made of stainless steel.

7. The cooling device for processing oxygen-free copper rod according to claim 4, characterized in that: There are multiple semiconductor cooling sheets (16), and the multiple semiconductor cooling sheets (16) are all located on the inner wall of the water tank (8).

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